JP4032821B2 - Cutting method of ceramic laminate - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for cutting a ceramic laminate, in particular, a ceramic laminate in which a predetermined number of ceramic green sheets having a plurality of internal electrodes are laminated is held on a cut table in a heated state, and the ceramic laminate is provided at one end. The present invention relates to a cutting method for cutting a laminated chip body with a cutting blade from one end to the other end.
[0002]
[Prior art and issues]
Conventionally, in the manufacture of multilayer chip electronic components such as multilayer inductors and multilayer capacitors, as shown in FIG. 7A, a ceramic multilayer body in which a predetermined number of ceramic green sheets on which a plurality of internal electrodes 2 are formed are laminated. Cutting 1 with a cutting line a using a cutting blade is performed.
[0003]
In this cutting step, for example, as disclosed in JP-A-2-126621, the ceramic laminate 1 is held on a cut table, and the laminate 1 is kept at about 30 to 70 ° C. (depending on the ceramic material). Heating. Heating is a process necessary to improve cutting performance and reduce damage to the cutting blade.
[0004]
However, the ceramic laminate 1 expands by heating as shown in FIG. 7B, and is deformed into a substantially drum shape when cut. This deformation is greater as it is closer to the periphery of the ceramic laminate 1. That is, there is a deviation in the linear positional relationship along the cut line a between the central internal electrode 2a and the internal electrodes 2b and 2c on both sides (see FIGS. 8A and 8B). Therefore, when cut along the cut line a, the internal electrode 2a located at the center of the laminated body 1 has a problem that the distance b between the cut end face of the laminated chip body 3 is smaller than the standard. FIG. 8A is a cross section of the internal electrodes 2b and 2c located on both sides of the multilayer body 1, and the distance b here is normally within the standard.
[0005]
Conventionally, as shown in, for example, Japanese Patent Application Laid-Open No. 2000-254910, a guide is brought into contact with a side surface of a multilayer body in order to prevent displacement of the ceramic multilayer body on a cut table. It was broken. However, such a guide is for preventing the positional deviation of the ceramic laminate due to the cutting blade at the time of cutting, and does not regulate deformation due to thermal expansion of the ceramic laminate.
[0006]
Accordingly, an object of the present invention is to provide a cutting capable of preventing the uneven distribution of the internal electrodes in each cut-out multilayer chip body as much as possible when the multilayer chip body is cut out from the ceramic laminated body in which the green sheets having the internal electrodes are laminated. It is to provide a method.
[0007]
[Means and Actions for Solving the Problems]
In order to achieve the above object, the present invention holds a ceramic laminate in which a predetermined number of ceramic green sheets having a plurality of internal electrodes are laminated on a cut table in a heated state, and the ceramic laminate is held from one end. in cutting method for cutting a laminated chip body by cutting blade toward the other end, towards the other end of the laminate from one end while holding while pressing the one end surface of the product layer body regulating member stack It is characterized by cutting into chip bodies .
[0008]
In the cutting method according to the present invention, since the end face is a cutting start portion of the ceramic laminate is pressed by the restricting member, the deformation of the laminated body due to thermal expansion is corrected, it cuts out in each of the laminated chip body The uneven distribution of internal electrodes is prevented as much as possible.
[0009]
Since deformation due to thermal expansion of the ceramic laminate is significant at the peripheral portion of the laminate, it is not always necessary to press the laminate with a regulating member when cutting an intermediate portion in the cutting progress direction. Accordingly, when cutting the one end portion, only the one end surface is cut while being pressed by the restricting member, and when cutting the other end portion, only the other end surface is cut while being pressed by the restricting member.
[0010]
Moreover, it is preferable to press in the direction orthogonal to a cutting line with a control member with respect to the one end surface and other end surface of a ceramic laminated body. Furthermore, it is preferable to cut | disconnect a ceramic laminated body in the state hold | maintained by the suction force on the cut table. The suction holding method has an advantage that the mechanism is simple and the operation is easy.
Moreover, it is preferable that the pressing force by the regulating member is larger than the suction force.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of a method for cutting a ceramic laminate according to the present invention will be described with reference to the accompanying drawings.
[0012]
(See the cutting device, Fig. 1)
First, an outline of an apparatus used for the cutting method according to the present invention will be described. As shown in FIG. 1, the cutting device includes a cut table 10, a cutting blade 15, and regulation plates 21 and 22. The ceramic laminated body 1 to be cut is a so-called mother laminated body in which a predetermined number of ceramic green sheets on which a plurality of internal electrodes 2 are formed are laminated and pressed. After cutting, a multilayer inductor, a multilayer capacitor, a composite part, etc. A plurality of laminated chip bodies.
[0013]
FIG. 1 shows an example of a multilayer capacitor, and a plurality of internal electrodes 2 are provided via ceramic green sheets in the stacking direction although details are not shown.
[0014]
The cut table 10 sucks and holds the ceramic laminate 1 through, for example, filter paper 12 from a number of air suction ports (not shown) formed on the surface thereof. Moreover, the cut table 10 incorporates a heat source such as a heater, and heats the ceramic laminate 1 to a predetermined temperature suitable for cutting (60 to 100 ° C., depending on the ceramic material).
[0015]
The ceramic laminate 1 may not be heated on the cut table 10. For example, the ceramic laminate 1 may be heated in advance in a place with another heating means and then supplied to the cut table 10 in that state.
[0016]
The cutting blade 15 is linear and moves the ceramic laminated body 1 on the cut table 10 from one end portion 1a to the other end portion while moving in the direction of arrow c (cutting progress direction, width direction of the cut laminated chip body). Cut out into a laminated chip body of a predetermined width toward 1b.
[0017]
The regulating plate 21 is for pressing one end surface of the ceramic laminate 1 in a direction d orthogonal to the cut line a. The other regulating plate 22 is for pressing the other end surface of the ceramic laminate 1 in a direction d ′ perpendicular to the cut line a. Each regulating plate 21, 22 presses the ceramic laminate 1 using a motor, a cylinder, or the like (not shown) as a drive source. The pressing force of these regulating plates 21 and 22 is such that the internal electrode 2 of the ceramic laminate 1 returns to the position before thermal expansion.
[0018]
(Cutting operation)
In the cutting apparatus having the above-described configuration, at the start of cutting, in the state where the ceramic laminate 1 is heated and held on the table 10, the regulating plate 21 is moved in the direction of the arrow d to move the ceramic laminate 1. One end face is pressed, and the ceramic laminate 1 is moved about 0.1 to 3 mm (see FIG. 2). At this time, if the suction holding force by the table 10 is too strong or the pressing force of the regulating plate 21 is weak, the ceramic laminate 1 does not move. In this case, the pressing force of the regulating plate 21 is made larger than the suction holding force by the table 10, or the suction force is temporarily weakened. In this state, the ceramic laminated body 1 is cut into a strip-like laminated chip body with the width of the cut line a up to the middle portion by the cutting blade 15.
[0019]
When the middle part is cut out, the cutting is temporarily stopped, the pressing by the restriction plate 21 is released, and the other restriction plate 22 is moved in the direction of the arrow d ′ to press the other end face of the ceramic laminate 1. The ceramic laminate 1 is moved about 0.1 to 3 mm (see FIG. 3). In this state, the cutting blade 15 cuts the remaining part of the ceramic laminated body 1 into a strip-shaped laminated chip body with the width of the cut line a to the other end part 1b.
[0020]
Note that when the pressure on the ceramic laminate 1 is switched from the regulating plate 21 to the regulating plate 22 at the intermediate portion, the pressing of the regulating plate 21 may be continued as it is. However, as described above, it is easier to move the ceramic laminate 1 by the restriction plate 22 when the pressing of the restriction plate 21 is released. Thereafter, in order to turn the strip-shaped laminated chip body into individual laminated chip bodies (not shown), the cutting operation is performed in the same manner in the direction orthogonal to the direction of the arrow c (the length direction of the cut laminated chip body). Do.
[0021]
(Heating deformation of laminate, see FIG. 4)
By the way, the ceramic laminate 1 heated on the cut table 10 is deformed into a substantially drum shape as schematically shown in FIG. 4 at the time of cutting. In FIG. 4, the size of the arrow is approximately proportional to the size of the deformation.
[0022]
Since such a deformation appears remarkably at the peripheral portion of the ceramic laminate 1, the positional deviation is corrected by pressing by the restriction plates 21 and 22 in accordance with the positional deviation state of the internal electrode incorporated therein. The correction of the positional deviation needs to be performed at least in the region L1 at the start of cutting and the region L3 at the end of cutting. When cutting the intermediate region L2 with almost no displacement, pressing by the regulation plates 21 and 22 is not necessarily required.
[0023]
Moreover, the direction pressed by the regulation plates 21 and 22 is a direction orthogonal to the cut line a normally. However, when the deformation of the ceramic laminate 1 due to thermal expansion is other than the state schematically shown in FIG. 4, it is preferable to press in a direction or angle that can best correct the displacement of the internal electrodes.
[0024]
(Internal electrode displacement data, see FIG. 5)
Below, the data of the position shift of the internal electrode in the laminated chip body cut out from the ceramic laminated body are shown.
[0025]
FIG. 5A is a graph showing the displacement amount of the internal electrode in the laminated chip body cut without pressing by the regulating plate (conventional example) over the entire region L (see FIG. 4) in the cutting progress direction. FIG. 5B is a graph showing the shift amount of the internal electrode in the laminated chip body cut by pressing with the regulating plate (invention example) over the entire region L in the cutting progress direction.
[0026]
The misregistration data shown here is implemented in the form of being pressed by the restriction plate 21 or the restriction plate 22 even in the intermediate region L2 (see FIG. 4).
[0027]
In any graph, the curve A is the ratio of the deviation from the distance b between the cut start side end face of the cut laminated chip body 3 and the reference position Y shown in FIG. The case where it is shifted to is indicated by-. Similarly, the curve B is the ratio of the deviation from the distance b between the end surface on the cutting end side and the reference position Y. The deviation B is indicated by +, and the deviation B is indicated by-.
[0028]
In the conventional example shown in FIG. 5A, a deviation amount exceeding ± 25% occurred on the cutting start side and the cutting end side. On the other hand, in the example of the invention shown in FIG. 5B, the deviation amount is approximately ± 25% even on the cutting start side and the cutting end side.
[0029]
In this embodiment, an example in which the ceramic laminated body is cut along the width direction of the laminated chip body is shown. However, the ceramic laminated body may be cut along the length direction of the laminated chip body. Good. Since the deformation of the laminated chip body in the width direction is larger due to thermal expansion than in the length direction, it is particularly effective for cutting in the width direction.
[0030]
(Other embodiments)
In addition, the cutting method of the ceramic laminated body which concerns on this invention is not limited to the said embodiment, It can change variously within the range of the summary.
[0031]
In particular, the configuration and shape of the cut table, the cutting blade, and the regulation plate, or the configuration for holding the ceramic laminate on the table are arbitrary.
[0032]
【The invention's effect】
As is clear from the above description, according to the present invention, when cutting at least one end portion of the ceramic laminate, one end surface of the laminate is cut while being pressed with a regulating member, and at least the other of the ceramic laminate is cut. When cutting the end portion, the ceramic laminated body is cut while pressing the other end surface of the laminated body with a regulating member, so that uneven distribution of internal electrodes in each cut-out laminated chip body is prevented as much as possible. As a result, the incidence of defective products decreases.
[Brief description of the drawings]
1A and 1B are perspective views showing an outline of a cutting apparatus used in a cutting method according to the present invention, FIG. 1A shows a state in which one end part is cut, and FIG.
FIG. 2 is an explanatory view at the start of cutting in the cutting method according to the present invention.
FIG. 3 is an explanatory view at the time of switching a regulation plate in the cutting method according to the present invention.
FIG. 4 is a schematic diagram showing a deformed state of a ceramic laminate due to thermal expansion.
FIGS. 5A and 5B are graphs showing the displacement amount of the internal electrode in the cut-out laminated chip body, FIG. 5A shows the case where there is no pressing by the regulating member, and FIG.
FIG. 6 is an explanatory diagram showing a positional relationship between the cut-out laminated chip body and internal electrodes.
7A is a plan view showing the positional relationship of internal electrodes of a ceramic laminate, FIG. 7A shows a room temperature, and FIG. 7B shows a heating time.
FIGS. 8A and 8B are explanatory views showing the positional relationship between the cut-out laminated chip body and the internal electrodes, FIG. 8A shows when the internal electrodes are at the reference position, and FIG. 8B shows when the internal electrodes are displaced. .
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Ceramic laminated body 1a ... One end part 1b ... Other end part 2 (2a, 2b, 2c) ... Internal electrode 10 ... Cut table 15 ... Cutting blade 21, 22 ... Restriction board

Claims (5)

A ceramic laminate in which a predetermined number of ceramic green sheets having a plurality of internal electrodes are laminated is held on a cut table in a heated state, and the ceramic laminate is laminated by cutting blades from one end to the other end. In the cutting method to cut into
That it cuts the laminated chip body from one end to the other end of the laminate while maintaining in a state of being pressed by the restriction member one end face of the laminate,
A method for cutting a ceramic laminate, comprising:   When cutting one end portion of the ceramic laminate, only the one end surface is pressed while being pressed with a regulating member, and when cutting the other end portion of the ceramic laminate, only the other end surface is pressed with a regulating member. The method for cutting a ceramic laminate according to claim 1, wherein the cutting is performed while cutting.   3. The method for cutting a ceramic laminate according to claim 1, wherein the one end surface and the other end surface are pressed in a direction orthogonal to a cutting line by the restriction member.   4. The method for cutting a ceramic laminate according to claim 1, wherein the ceramic laminate is cut while being held on a cut table by suction. The method for cutting a ceramic laminate according to claim 4, wherein the pressing force by the regulating member is larger than the suction force.

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