JP4019852B2 - Semiconductor circuit measurement equipment - Google Patents

Description

[0001]
[Industrial application fields]
The present invention relates to a semiconductor circuit measurement apparatus, and more particularly to an apparatus for simultaneously measuring a semiconductor circuit formed in a chip area defined on a semiconductor wafer for a plurality of chip areas on the semiconductor wafer.
[0002]
[Prior art]
As seen in a typical example of a mobile phone, there is an increasing demand for space saving when mounting a semiconductor circuit having multiple functions and high performance on a device. As one solution, a method of completing a semiconductor circuit into a final package at the stage of a semiconductor wafer, such as a chip size package, has been put into practical use. According to this method, a semiconductor circuit separated into several to 5 mm square semiconductor chips is the final product. This semiconductor chip is directly connected to the printed wiring board by solder bumps or the like without using a connecting means such as a lead frame or TAB (Tape-Automated Bonding). Therefore, the installation space can be reduced because there are no external connection leads or resin molds.
[0003]
By the way, also in the manufacture of a conventional general semiconductor device, performance and characteristics are measured for a semiconductor circuit in a chip region in a wafer state. In this measurement, only a chip region having a semiconductor circuit that satisfies the required items is selected and packaged by a resin mold or the like, and then a final test is performed.
[0004]
[Problems to be solved by the invention]
However, in the case of a chip size package type semiconductor circuit, as described above, since the package as the final product is small, the performance and characteristics of the semiconductor circuit in each are measured after the individual chip regions are separated. Is inefficient. Therefore, it is desirable to measure the performance and characteristics of the semiconductor circuit in each chip region at the stage of the semiconductor wafer. In such measurement, it is preferable in terms of efficiency that semiconductor circuits in as many chip regions as possible can be simultaneously measured.
[0005]
However, on the other hand, the dimensions of each chip region differ depending on the type of the semiconductor circuit, and the arrangement of the external connection terminals of the semiconductor circuit and the mutual interval (arrangement pitch) differ. Therefore, an apparatus for simultaneously measuring semiconductor circuits formed in a plurality of chip areas on a semiconductor wafer needs to be able to cope with changes in the dimensions of the chip areas and the arrangement of external connection terminals of the semiconductor circuits. Specifically, it is necessary that the electrical connection means (so-called prober) for measurement provided on the side of such a semiconductor circuit measurement apparatus can cope with changes in semiconductor circuit products. .
[0006]
Conventionally, as disclosed in, for example, Japanese Patent Laid-Open No. 9-114244, an apparatus for measuring a semiconductor circuit on a semiconductor wafer for each chip region has been proposed. In this apparatus, a large number of probe card probes that make electrical contact with a semiconductor device are arranged in advance at regular intervals, and only the probes required for each product are arranged in the direction of the pellet to be measured by the adapter. It has a protruding structure. In this apparatus, the probe is slidable in the x direction (longitudinal direction). With these, only one probe card is used and the adapter can be changed to support measurement of products with different pad layouts and chip sizes. That is, according to the disclosed invention, it is not necessary to prepare a probe card for each product type, and it is possible to reduce the cost.
[0007]
However, the prior art including the above is intended to measure a semiconductor circuit in a single chip region on a semiconductor wafer, and is required for a semiconductor device having a chip size package as described above. There is currently no semiconductor circuit measuring device that can simultaneously measure semiconductor circuits in each of a plurality of chip regions.
[0008]
The present invention provides an electrical connection means that can cope with a change in the position of an external connection terminal in a semiconductor circuit product, in particular, movement of the external connection terminal accompanying a reduction in the size of the chip area, and can simultaneously measure semiconductor circuits in a plurality of chip areas. It is an object of the present invention to provide a semiconductor circuit measuring apparatus having the same.
[0009]
[Means for Solving the Problems]
The object is to enable contact with a plurality of contact modules arranged corresponding to each of a plurality of chip regions defined on a semiconductor wafer and an external connection terminal of a semiconductor circuit formed in the corresponding chip region. The position of the plurality of contact modules according to the movement of the probe supported by each of the contact modules and the position of the external connection terminals of the semiconductor circuit accompanying the dimensional change of the plurality of chip regions on the semiconductor wafer. And each contact module has a shape arranged in at least one dimension, and the means for adjusting the position of the contact module is provided on each of the side surfaces of the contact modules adjacent to each other. Connect the provided groove and the adjacent contact modules that fit into the groove with a predetermined gap. That consists of a member are achieved by depending on the size changes of the chip region semiconductor circuit measuring device, characterized in that by changing the dimensions of the member to be the coupling.
[0010]
[Action]
According to the above means, even when the chip area defined on the semiconductor wafer is reduced over a plurality of stages and the external connection terminal of the semiconductor circuit formed in each chip area is moved, the semiconductor circuit on the wafer is converted into a semiconductor. The probe connected to the circuit measuring device can be easily rearranged at a low cost corresponding to this movement, and the semiconductor circuits in a plurality of chip regions can be measured simultaneously.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a schematic diagram showing a change in the position of an external connection terminal (pad) of a semiconductor circuit accompanying reduction of each chip region on a semiconductor wafer. That is, as the size of the chip region is reduced, the intervals between the pads A, B, C are A ′, B ′, C ′, A ″, B ″ in the order of FIGS. 1 (a), (b), (c). , C ″.
[0012]
FIG. 2 is a side view for explaining the first embodiment of the present invention. As shown in FIG. 2 (a), the contact module 1 has a position corresponding to the pads A, B, C. Needles a, b and c are arranged. Further, in the contact module 1, probes a ′, b ′, c are located at positions corresponding to the pads A ′, B ′, C ′, and positions corresponding to the pads A ″, B ″, C ″. The probes a ", b", c "can be arranged respectively. Specifically, the probes a, b, c, and the like are, for example, pogo pins (contact needles provided with elasticity by a spring) that are detachably fitted in holes provided in the contact module 1 or in notches. . Therefore, the contact module 1 is provided with holes or notches corresponding to the probes a ′, b ′, c and the probes a ″, b ″, c ″.
[0013]
2B and 2C show the probes a ′, b ′, c and the probes a ″, b ″, c ″ arranged in the contact module 1 as described above. Each set of a ′, b ′, c and probes a ″, b ″, c ″ may be the same as the set of probes a, b, c, and these are the pads A ′, B ′, C ′. Alternatively, it may be replaced corresponding to the positions of the pads A ″, B ″, C ″. The number of probes a, b, c is equal to or less than the number of external connection terminals of the semiconductor circuit in each chip area as necessary. Each probe is provided with wiring (not shown) for electrical connection with the measuring device.
[0014]
The arrangement of the probes a, b, c can be any arrangement such as a straight line, a quadrangular quadrilateral, a matrix, etc., corresponding to the arrangement of the external connection terminals of the semiconductor circuits that are in contact with each other. The contact module 1 may be a single plate-like member that covers a plurality of chip regions (generally adjacent regions) on the semiconductor wafer, or is provided in a number corresponding to each of the plurality of chip regions and connected to each other. It may be done.
[0015]
The structure for changing the arrangement by inserting and removing the probes a, b, c like the pogo pin in the above embodiment is simpler than the prober card having the probe like the cantilever, and is re-applied. There are advantages in that the number of man-hours for arrangement is small and the cost can be reduced.
FIG. 3 illustrates an embodiment in which the external connection terminals of the semiconductor circuit move as the chip area on the semiconductor wafer is reduced, but the mutual position of the external connection terminals in each chip area does not change. It is a typical side view to do.
[0016]
That is, the contact module 2 in the present embodiment is provided with the probe 21 arranged corresponding to the external connection terminal of the semiconductor circuit in each chip region. The required number of such contact modules 2 is supported by, for example, a rod-shaped support member 3 so that the mutual positions can be changed. By arranging, for example, a plurality of rod-like support members 3 that support a predetermined number of contact modules 2 in parallel, for example, a predetermined number of contact modules 2 can be arranged in a matrix or the like. Reference numeral 4 denotes a moving mechanism for changing the mutual interval between the contact modules 2, which will be described in detail later. By driving the moving mechanism 4, the mutual interval of the contact modules 2 can be reduced as the chip area is reduced as shown in FIGS. 3 (a) to 3 (b).
[0017]
The probe 21 may be a pogo pin, a cantilever, or any other type that can be inserted into and removed from the contact module 2. Each probe 21 is provided with wiring (not shown) for electrical connection with the measuring device.
FIG. 4 shows some specific examples of the moving mechanism 4 in FIG.
FIG. 4A shows an example of the moving mechanism 4 in which a spiral groove 61 is provided on the surface of a columnar or cylindrical member 6. The spiral groove 61 is formed so that the pitch increases in proportion to the distance from the starting point 60 in the axial direction of the member 6.
[0018]
A plurality of contact modules 2 shown in FIG. 3 are arranged at predetermined equal intervals indicated by arrows in FIG. 4 (a), and protrusions (not shown) provided at the positions of the contact modules 2 are The groove 61 of the member 6 is fitted, or the groove 61 is used as a rack and coupled to a pinion fitted thereto. When the member 6 is rotated around the axis, each contact module 2 moves in the axial direction by a length proportional to the distance from the starting point 60. Therefore, the contact modules 2 after the movement are kept at an equal interval, although the mutual interval changes. That is, it changes from FIG. 3 (a) to FIG. 3 (b) or vice versa.
[0019]
FIG. 4B shows an example of the moving mechanism 4 including a member 7 composed of two arms 71 and 72 rotatably supported at the intersection xo (referred to as a slide bar). For example, a plurality of contact modules 2 shown in FIG. 3 are fixed to each of a plurality of intersections xo at equal intervals, and a lever 73 attached to the arms 71 and 72 of the member 7 at the end of the slide bar is operated. The mutual spacing of the contact modules 2 is changed by extending or contracting the slide bar.
[0020]
FIG. 5 is a plan view showing an embodiment of a mechanism for changing the mutual distance between the contact modules 2 arranged two-dimensionally. That is, the plurality of contact modules 2 are supported by the rails 51 so as to be movable in parallel. Such rails 51 are supported by the frame 5 so as to be parallel to a plurality of rows and change in mutual interval. In this way, the contact modules 2 are arranged in the matrix direction.
[0021]
Of the contact modules 2 in each row, the contact modules 2 arranged in the same column are coupled to a bar-shaped member (bar) 52. The end of each bar 52 is coupled to the X direction adjustment mechanism 53. On the other hand, each rail 51 is coupled to a Y direction adjustment 55 by a connecting member 54.
As the X-direction adjusting mechanism 53 and the Y-direction adjusting mechanism 55, the moving mechanism 4 shown in FIG. 4 (a) or (b) can be used. That is, the end of the bar 52 or the connecting member 54 is coupled to a pinion that fits into the groove 61 of the moving mechanism 4 in FIG. 4 (a) or to the intersection xo of the moving mechanism 4 in FIG. 4 (b). That's fine. By driving the X-direction adjusting mechanism 53 and the Y-direction adjusting mechanism 55, the contact modules 2 arranged two-dimensionally change the mutual interval while maintaining an equal interval relationship.
[0022]
FIG. 6 is an explanatory diagram of an embodiment of the contact module 20 formed separately for each chip region. The contact module 20 separated individually is one-dimensional or two-dimensional depending on the arrangement pitch of the chip regions. Connected in the direction. That is, each contact module 20 has the probes 21 arranged at a predetermined number and pitch, and the protruding connecting portions 24A and 24B are provided on the two adjacent side surfaces, and the other adjacent two side surfaces are provided with Grooves 25A and 25B in which the connecting portions 24A and 24B are fitted are formed. The connecting portions 24A and 24B may be formed by cutting from a base material constituting the contact module 20, or may be formed by appropriately connecting a member different from the contact module 20. The connecting portions 24A and 24B may not have a continuous shape as shown in FIG. Moreover, not a plate shape but a rod shape may be used.
[0023]
By inserting the connecting portions 24A and 24B of one contact module 20 into the grooves 25A and 25B of the adjacent contact module 20, respectively, as shown in FIG. 6 (c), a plurality of contact modules 20 are one-dimensional or two-dimensional. Can be connected in the direction.
When the size of the chip region on the semiconductor wafer is changed, as shown in FIG. 6 (b), the overhanging length of the connecting portions 24A and 24B of the contact module 20 is shortened, as shown in FIG. 6 (d). Thus, the mutual distance between adjacent contact modules 20 can be shortened.
[0024]
FIG. 7 is an explanatory diagram of an embodiment in which the connecting portions 24A and 24B of the contact module 20 in FIG. 6 are separate members, and by measuring only the connecting portions 24A and 24B, the mutual distance of the contact module 20 is increased. To be able to cope with the case. That is, as shown in FIG. 7A, an annular groove 27 is formed on all side surfaces of the contact module 200. Then, as shown in FIG. 7B, for example, plate-like connecting members 28A, 28B, and 28C that fit into the groove 27 are prepared.
[0025]
The connecting member 28A has a shape separated for every two adjacent contact modules 200, the connecting member 28B has a common shape for two adjacent contact modules 200 (or two rows), and the connecting member 28C has an outermost row ( Or the contact module 200 in a row) has a common shape.
By using the connecting member 28A having a different width in the column (or row) direction in the arrangement of the contact module 200, and by using the connecting member 28B having a different width in the row (or column) direction, or like this By using the connecting members 28A and 28B having different widths, the mutual spacing of the contact modules 200 can be changed in accordance with the change in the size of the chip region on the semiconductor wafer.
[0026]
Note that any or all of the connecting members 28A, 28B, and 28C may have at least a portion that fits into the groove 27 of the contact module 200, for example, a bar shape instead of a plate shape.
In the above description, the case where the present invention is applied to the measurement of the semiconductor circuit of the chip size package on the semiconductor wafer has been described. However, the present invention is not limited to the measurement of the semiconductor circuit of the chip size package. This is applicable when simultaneously measuring semiconductor circuits in the chip area.
[0027]
The present invention includes the following aspects.
(Appendix 1) A plurality of contact modules arranged corresponding to each of a plurality of chip regions defined on a semiconductor wafer;
A probe supported by each of the contact modules so as to be in contact with an external connection terminal of a semiconductor circuit formed in the corresponding chip region;
And means for adjusting the position of the multiple of the contact module in accordance with the movement of the position of the external connection terminal of the semiconductor circuit with the dimensional changes of the plurality of chip regions in said semiconductor wafer,
Each of the contact modules has a shape arranged at least one dimension;
The means for adjusting the position of the contact module includes a groove provided on each side surface of the contact module adjacent to each other and a contact module that is fitted in the groove and adjacent to each other with a predetermined gap. And a connecting member, and changing the dimensions of the connecting member in accordance with a change in the size of the chip region .
[0030]
(Additional remark 2) In Additional remark 1, the said member to connect can be inserted / extracted to the said corresponding groove | channel, The semiconductor circuit measuring device characterized by the above-mentioned .
[0033]
【The invention's effect】
According to the present invention, a semiconductor circuit in each of a plurality of chip regions defined on a semiconductor wafer can be measured simultaneously, and even if the position of an external connection terminal of the semiconductor circuit is changed due to a change in the size of the chip region, Corresponding to this, it is possible to easily change the position of the contact terminal on the measuring device side. As a result, it is not necessary to create a new probe card. There is an effect.
[Brief description of the drawings]
FIG. 1 is a schematic diagram showing an embodiment in which the position of a probe is changed in accordance with a change in the position of an external connection terminal of a semiconductor circuit accompanying a reduction in a chip area on a semiconductor wafer. FIG. 3 is a side view for explaining the embodiment. FIG. 3 is a diagram for explaining an embodiment in which the mutual positions of the external connection terminals in the chip region are not changed. FIG. FIG. 5 is an explanatory diagram of an embodiment of a mechanism for changing a mutual interval between two-dimensionally arranged contact modules. FIG. 6 is an explanatory diagram of an embodiment of a contact module integrated with a connecting portion. Explanatory drawing of the embodiment as a separate member [Explanation of symbols]
1, 2, 20, 200 Contact module 3 Support member 4 Moving mechanism 5 Frame 6, 7 Member
21 Probe
24A, 24B connecting part
25A, 25B, 27, 61 groove
28A, 28B, 28C, 54 Connecting member
51 rails
52 bar
53 X direction adjustment mechanism
55 Y direction adjustment mechanism
60 Starting point
71, 72 arms
73 Lever

Claims (2)

A plurality of contact modules arranged corresponding to each of a plurality of chip regions defined on the semiconductor wafer;
A probe supported by each of the contact modules so as to be in contact with an external connection terminal of a semiconductor circuit formed in the corresponding chip region;
And means for adjusting the position of the multiple of the contact module in accordance with the movement of the position of the external connection terminal of the semiconductor circuit with the dimensional changes of the plurality of chip regions in said semiconductor wafer,
Each of the contact modules has a shape arranged at least one dimension;
The means for adjusting the position of the contact module includes a groove provided on each side surface of the contact module adjacent to each other and a contact module that is fitted in the groove and adjacent to each other with a predetermined gap. And a connecting member, and changing the dimensions of the connecting member in accordance with a change in the size of the chip region . 2. The semiconductor circuit measuring device according to claim 1, wherein the connecting member can be inserted into and removed from the corresponding groove.

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