JP4019717B2 - Component built-in multilayer wiring module substrate and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a multilayer wiring circuit board for a semiconductor package, and more particularly to a component built-in multilayer wiring module board formed by embedding parts between wiring layers.
[0002]
[Prior art]
Conventional wiring circuit boards are surface-mounted with components mounted on the surface of the wiring board, and resistance elements and capacitors use bonding members such as solder and conductive adhesive at desired parts of the wiring layer of the wiring board. Surface mounting is performed.
[0003]
In a conventional wiring board, a resistance element, a capacitor, and the like are mounted on the surface of the board without any gap, and therefore, the wiring density of the wiring board is increased and complicated. In such a situation, particularly in the case of a high-density multilayer wiring board, there is a limit only by the surface mounting of the wiring board, and further improvement of the component mounting density is required.
Further, as the wiring density of the multilayer wiring board increases, the inspection of the multilayer wiring board becomes difficult, and the yield also tends to decrease.
[0004]
[Problems to be solved by the invention]
The present invention has been devised in view of the above-mentioned demands, and an object thereof is to provide a component built-in multilayer wiring module substrate in which the component mounting density of the high-density multilayer wiring substrate is improved and a manufacturing method thereof.
[0005]
[Means for Solving the Problems]
In order to solve the above-mentioned problems in the present invention, first, in claim 1, components are built in a substrate of a multilayer wiring board in which a predetermined number of wiring layers and insulating layers are formed on both surfaces of an insulating base material. A component built-in multilayer wiring module substrate, wherein the component is composed of a resistance element, a capacitor, and an inductor, embedded in a through-hole or opening formed in the multilayer wiring substrate , and electrodes at both ends of the component are caulked, and An electrode at both ends of the component is electrically connected to the wiring layer, and a gold film is formed on the electrodes at both ends of the component.
[0007]
Furthermore, according to a second aspect of the present invention, there is provided the method for manufacturing a component built-in multilayer wiring module substrate according to the first aspect, comprising the following steps.
(A) The process of forming a conductor layer on both surfaces of an insulating base material.
(B) The process of forming a through-hole in the predetermined position of the said insulation base material and a conductor layer.
(C) A step of embedding and caulking parts in which a gold film is formed on the electrodes at both ends in the through hole.
(D) A step of patterning the conductor layer to form a wiring layer.
(E) The process of forming an insulating layer on both surfaces of the said insulating base material and the said wiring layer.
(F) A step of forming an opening at a predetermined position of the insulating layer.
(G) forming a thin film conductor layer on the inner wall of the opening on the insulating layer;
(H) A step of embedding in the opening in which the thin-film conductor layer is formed, with one electrode of the component having a gold film formed on the electrodes at both ends facing down.
(I) A step of forming a second conductor layer having a predetermined thickness on the thin film conductor layer and the electrodes at both ends of the component by electroplating, and electrically connecting the other electrode of the component and the conductor layer.
(J) A step of patterning the second conductor layer to form a second wiring layer.
(K) A step of producing a multilayer wiring module substrate with a predetermined number of layers by repeating the steps (e) to (j) as many times as necessary.
[0008]
The component built-in multilayer wiring module substrate according to the present invention reduces the number of mounted components on the surface of the multilayer wiring substrate and improves the mounting density of the components by incorporating the components inside the multilayer wiring substrate. A feature of the module substrate manufacturing method is that the build-up multilayer wiring substrate manufacturing method can be applied as it is.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment of the present invention will be described.
FIG. 1 is a schematic partial sectional view showing an embodiment of a component built-in multilayer wiring module substrate according to the present invention. FIGS. 2 (a) to (f) and FIGS. 3 (g) to (j) The schematic structure partial sectional view which shows an example of the manufacturing method of a component built-in multilayer wiring module board in order of a process is shown, respectively.
As shown in FIG. 1, the component built-in multilayer wiring module substrate 100 of the present invention is formed by embedding components 40 in the insulating base material 11 and the insulating layer 51 between the wiring layers in the multilayer wiring substrate to form a multilayer wiring module substrate. Thus, by arranging the components three-dimensionally, the mounting density of the components is improved as compared with the conventional surface mounting.
[0010]
Components (passive elements) that can be incorporated are resistance elements, capacitors, and inductors. For example, metal electrodes are attached to both ends of a ceramic component, and the electrodes at both ends are devised. When parts are inserted into the through holes of the insulating base material with conductor layers formed on both sides, which will be described later, and the parts are fixed by caulking, the parts are securely fixed, and electrical conduction is ensured. . For example, by using copper as the material of the electrode, it is possible to make the structure easy to be crushed when it is caulked and fixed after component insertion, or it can be easily performed by electrolytic copper plating or the like to obtain electrical continuity with the wiring layer. . In addition, in order to ensure connection reliability, a gold film is formed on the electrode surfaces at both ends of the component, and gold diffuses in contact with copper, so that connection reliability improves over time. Yes.
[0011]
Hereinafter, the manufacturing method of the component built-in multilayer wiring module substrate of the present invention will be described.
First, a double-sided copper-clad laminate in which a copper layer is laminated on both sides of the insulating base material 11 to form a conductor layer 21 is prepared (see FIG. 2A).
Next, a through hole 31 is formed by punching at a predetermined position of the double-sided copper-clad laminate (see FIG. 2B).
[0012]
Next, a component (any one of the resistor element 40R, the capacitor 40C, and the inductor 40L) 40 in which a gold film is formed on the electrodes 41 at both ends having the same outer diameter as the through hole diameter is inserted into the through hole 31. After the insertion, the electrode 41 is caulked, and the electrode 41 is crushed so that the component 40 does not come out of the through hole 31. Further, a thin film conductor layer (not shown) of several μm is formed on the electrode 41 and the conductor layer 21 at both ends of the component 40 by electrolytic copper plating, and the electrode 41 and the conductor layer 21 at both ends of the component 40 are electrically joined. Make sure (see FIG. 2 (c)).
Here, an example of the resistive element 40R, the capacitor 40C, and the inductor 40L of the component 40 is shown in FIGS. 4 (a, b, and c). The resistance element 40R has a ceramic outer tube 42 filled with a resistor 43, and electrodes 41 are formed at both ends (see FIG. 4A). The capacitor 40C has a ceramic outer tube 42 filled with a dielectric 44, and electrodes 41 are formed at both ends (see FIG. 4B). The inductor 40L has a coil 46 wound around a dielectric 45 inside a ceramic outer tube 42, and electrodes 41 are formed on both ends (see FIG. 4C). Further, a gold film (not particularly shown) is formed on the surface of the electrode 41.
[0013]
Next, the conductor layer 21 is patterned to form a first wiring layer 21a and a first wiring layer 21b that are electrically connected to the component 40 (see FIG. 2D).
[0014]
Next, an insulating adhesive film is bonded to both surfaces to form an insulating layer 51 having a predetermined thickness (see FIG. 2E). Here, the thickness of the insulating layer 51 is determined by the height of a component attached to the insulating layer.
Next, an opening 52 having the same diameter as the outer diameter of the component 40 is formed at a predetermined position of the insulating layer 51 by laser processing or the like (see FIG. 2F).
[0015]
Next, a thin film conductor layer 61 having a predetermined thickness is formed on the insulating layer 51 and on the inner wall of the opening 52 by electroless copper plating (see FIG. 3G).
Here, the thin-film conductor layer 61 is used as an electrode for forming a conductor layer by using the thin-film conductor layer 61 as a cathode electrode in order to make an electrical connection with an electrode of the component when the component is attached.
[0016]
Next, a conductive adhesive or the like is applied to one electrode 41 of a component 40 (any one of the resistance element 40R, the capacitor 40C, and the inductor 40L) in which the electrode 41 is formed at both ends in the opening 52 where the thin film conductor layer 61 is formed. Apply, insert with the electrode 41 on the conductive adhesive application surface down, and heat to cure the wiring layer conductive adhesive (see FIG. 3 (h)).
Here, the electrical connection between the one electrode 41 of the component 40 and the first wiring layer 21a and the first wiring layer 21b is reliably performed.
Next, electrolytic copper plating is performed using the thin film conductor layer 61 as a cathode electrode to form a conductor layer 62 on the thin film conductor layer 61 (see FIG. 3I).
Here, the electrical connection between the other electrode 41 of the component 40 and the conductor layer 62 is ensured.
[0017]
Next, the thin film conductor layer 61 and the conductor layer 62 are patterned to form the second wiring layer 62a and the second wiring layer 62b, thereby obtaining the four-layer component built-in multilayer wiring module substrate 100 in which the component 40 is embedded ( (See FIG. 3 (j)).
Further, if necessary, a multilayer wiring module substrate with a desired number of layers can be obtained by repeating the insulating layer formation, opening formation, component attachment, and wiring layer formation steps.
[0018]
【Example】
Hereinafter, the present invention will be described in detail by way of examples.
<Example 1>
First, a conductor layer 21 was formed by laminating a 12 μm thick copper foil on both surfaces of an insulating substrate 11 made of a 50 μm thick polyimide film (see FIG. 2A).
Next, press drilling was performed using a mold having a convex part of 100 μmφ, and a through hole 31 having the same diameter as the outer diameter of the resistance element 40R was formed in the insulating base material 11 and the conductor layer 21 (FIG. 2 ( b)).
Next, a resistance element 40R in which a gold film was formed on the electrodes 41 at both ends shown in FIG. 4A was inserted into the through hole 31, and the electrodes 41 at both ends were caulked (see FIG. 2C).
[0019]
Next, a thin film conductor layer (not shown) having a thickness of 2 μm is formed on the electrode 41 and the conductor layer 21 at both ends of the resistance element 40R by electrolytic copper plating, and the thin film conductor layer and the conductor layer 21 are subjected to patterning treatment, thereby A first wiring layer 21a and a second wiring layer 21b electrically connected to the electrode 41 of the element 40R were formed (see FIG. 2D).
[0020]
Next, a 50 μm-thick polyimide film was bonded to form an insulating layer 51 (see FIG. 2E).
Next, an opening 52 having the same diameter as the outer diameter of the capacitor 40C was formed at a predetermined position of the insulating layer 51 by laser processing (see FIG. 2F).
[0021]
Next, a thin film conductor layer 61 having a thickness of 2 μm was formed on the insulating layer 51 and on the inner wall of the opening 52 by electroless copper plating (see FIG. 3G).
Next, a conductive adhesive or the like is applied to one electrode 41 of the capacitor 40C in which a gold film is formed on the electrode at both ends shown in FIG. 4B in the opening 52 in which the thin film conductor layer 61 is formed. The electrode 41 on the coating surface of the adhesive was inserted with the electrode 41 facing down, and the wiring layer conductive adhesive was cured by heating (see FIG. 3 (h)).
[0022]
Next, electrolytic copper plating was performed using the thin film conductor layer 61 as a cathode electrode to form a conductor layer 62 on the thin film conductor layer 61 (see FIG. 3I).
Next, the thin-film conductor layer 61 and the conductor layer 62 are patterned to form the second wiring layer 62a and the second wiring layer 62b, and the four-layer component built-in multilayer wiring module substrate in which the resistor element 40R and the capacitor 40C are built. 100 was obtained (see FIG. 3 (j)).
[0023]
<Example 2>
First, a conductor layer 21 was formed by laminating a 12 μm thick copper foil on both surfaces of an insulating substrate 11 made of a 50 μm thick polyimide film (see FIG. 2A).
Next, press punching was performed using a mold having a convex portion of 100 μmφ, and a through hole 31 having the same diameter as the outer diameter of the capacitor 40C was formed in the insulating base material 11 and the conductor layer 21 (FIG. 2B). )reference).
Next, a capacitor 40C in which a gold film was formed on the electrodes 41 at both ends shown in FIG. 4B was inserted into the through hole 31, and the electrodes 41 at both ends were caulked (see FIG. 2C).
[0024]
Next, a thin film conductor layer (not specifically shown) having a thickness of 2 μm is formed on the electrode 41 and the conductor layer 21 at both ends of the capacitor 40C by electrolytic copper plating, and the thin film conductor layer and the conductor layer 21 are subjected to patterning processing, thereby forming the capacitor 40C. The first wiring layer 21a and the first wiring layer 21b electrically connected to the electrode 41 were formed (see FIG. 2D).
[0025]
Next, a 50 μm-thick polyimide film was bonded to form an insulating layer 51 (see FIG. 2E).
Next, an opening 52 having the same diameter as the outer diameter of the inductor 40L was formed at a predetermined position of the insulating layer 51 by laser processing (see FIG. 2F).
[0026]
Next, a thin film conductor layer 61 having a thickness of 2 μm was formed on the insulating layer 51 and on the inner wall of the opening 52 by electroless copper plating (see FIG. 3G).
Next, a conductive adhesive or the like is applied to one electrode 41 of the inductor 40L in which a gold film is formed on the electrodes at both ends shown in FIG. 4 (c) in the opening 52 where the thin film conductor layer 61 is formed. The electrode 41 on the coating surface of the adhesive was inserted with the electrode 41 facing down, and the wiring layer conductive adhesive was cured by heating (see FIG. 3 (h)).
[0027]
Next, electrolytic copper plating was performed using the thin film conductor layer 61 as a cathode electrode to form a conductor layer 62 (see FIG. 3I).
Next, the thin film conductor layer 61 and the conductor layer 62 are patterned to form the second wiring layer 62a and the second wiring layer 62b, and the four-layer component built-in multilayer wiring module substrate 100 in which the capacitor 40C and the inductor 40L are built. (See FIG. 3 (j)).
[0028]
【The invention's effect】
By using the component built-in multilayer wiring module substrate of the present invention, it is possible to three-dimensionally arrange resistance elements, capacitors, and inductors that have been mounted on the substrate surface so far, and to improve the component mounting density.
In addition, the layout of the wiring layer can be afforded and the wiring width of the wiring board can be widened, so that the signal attenuation is reduced and the yield of the wiring board can be improved.
Furthermore, by forming a gold plating film on the electrode surfaces at both ends of the component, the electrical continuity between the electrode and the wiring layer can be ensured by utilizing the diffusibility with the wiring layer made of copper.
Further, since the caulking is performed when the component is fixed to the through hole in which the insulating base material and the conductor layer are formed, the component can be securely fixed and electrically connected, so that the manufacturing yield is improved.
[Brief description of the drawings]
FIG. 1 is a schematic partial sectional view showing an embodiment of a component built-in multilayer wiring module substrate according to the present invention.
FIGS. 2A to 2F are schematic structural partial cross-sectional views showing a part of an example of a method for manufacturing a component built-in multilayer wiring module substrate according to the present invention. FIGS.
FIGS. 3G to 3J are schematic structural partial cross-sectional views illustrating a part of an example of a method for manufacturing a component built-in multilayer wiring module substrate according to the present invention. FIGS.
FIGS. 4A to 4C are schematic cross-sectional views showing examples of components (resistive elements, capacitors, and inductors) used in the component built-in multilayer wiring module substrate of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 11 ... Insulating base material 21 ... Conductor layer 21a, 21b ... 1st wiring layer 31 ... Through-hole 40 ... Component 40R ... Resistance element 40C ... Capacitor 40L ... Inductor 41 ... Electrode 42 ... Ceramic Outer tube 43... Resistors 44 and 45... Dielectric 46... Coil 51... Insulating layer 52... Opening 61 ... Thin-film conductor layer 62 ... Conductor layers 62a and 62b. ... Multi-layer wiring module board with built-in components

Claims (2)

A multilayer wiring module board with built-in components in which components are built inside a multilayer wiring board in which a predetermined number of wiring layers and insulating layers are formed on both surfaces of an insulating base material, wherein the components include a resistance element, a capacitor, and an inductor. Embedded in a through hole or opening formed in the multilayer wiring board, electrodes at both ends of the component are caulked, and electrodes at both ends of the component are electrically connected to the wiring layer, A multilayer wiring module substrate with a built-in component, wherein a gold film is formed on electrodes at both ends of the component. The manufacturing method of the component built-in multilayer wiring module substrate according to claim 1, comprising the following steps.
(A) The process of forming a conductor layer on both surfaces of an insulating base material.
(B) The process of forming a through-hole in the predetermined position of the said insulation base material and a conductor layer.
(C) A step of embedding and caulking parts in which a gold film is formed on the electrodes at both ends in the through hole.
(D) A step of patterning the conductor layer to form a wiring layer.
(E) The process of forming an insulating layer on both surfaces of the said insulating base material and the said wiring layer.
(F) A step of forming an opening at a predetermined position of the insulating layer.
(G) forming a thin film conductor layer on the inner wall of the opening on the insulating layer;
(H) A step of embedding in the opening in which the thin-film conductor layer is formed, with one electrode of the component having a gold film formed on the electrodes at both ends facing down.
(I) A step of forming a second conductor layer having a predetermined thickness on the thin film conductor layer and the electrodes at both ends of the component by electroplating, and electrically connecting the other electrode of the component and the conductor layer.
(J) A step of patterning the second conductor layer to form a second wiring layer.
(K) A step of producing a multilayer wiring module substrate with a predetermined number of layers by repeating the steps (e) to (j) as many times as necessary.

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