JP4011235B2 - Building board - Google Patents
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- JP4011235B2 JP4011235B2 JP19200299A JP19200299A JP4011235B2 JP 4011235 B2 JP4011235 B2 JP 4011235B2 JP 19200299 A JP19200299 A JP 19200299A JP 19200299 A JP19200299 A JP 19200299A JP 4011235 B2 JP4011235 B2 JP 4011235B2
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- Prior art keywords
- synthetic resin
- building board
- wood
- waste material
- resin binder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B28/00—Compositions of mortars, concrete or artificial stone, containing inorganic binders or the reaction product of an inorganic and an organic binder, e.g. polycarboxylate cements
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B26/00—Compositions of mortars, concrete or artificial stone, containing only organic binders, e.g. polymer or resin concrete
- C04B26/02—Macromolecular compounds
- C04B26/10—Macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C04B26/12—Condensation polymers of aldehydes or ketones
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/91—Use of waste materials as fillers for mortars or concrete
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Processing Of Solid Wastes (AREA)
Description
【０００１】
【発明の属する技術分野】
本発明は木質補強材によって補強したセメント板の廃材を使用した建築板に関するものである。
【０００２】
【発明の背景】
木片、木質パルプ等の木質補強材をセメント系無機粉体に混合して板状に成形し、養生硬化することによって製造されるセメント板（木質セメント板）は現在例えば建築物の外装材等に多用されている。したがって該木質セメント板を製造する際に発生する端切れ、あるいは建築物の修復や撤去等によって生ずる木質セメント板廃材の再利用が鋭意検討されている。
【０００３】
【従来の技術】
従来このような木質セメント板廃材は粉砕し、合成樹脂結着剤で結着すると共に板状に成形して建築板とすることが提案されている。
【０００４】
【発明が解決しようとする課題】
しかし上記木質セメント板廃材の粉砕物(1) は粒状であり、図１に示すように粉砕物(1) の相互接触が略点的になり、粉砕物(1) 相互間に多くの空隙(2) が形成されるので、合成樹脂結着剤によって結着しにくく、建築板の構造が粗になって高強度の製品が得られない。高強度の建築板を得るには建築板の構造が粗にならないように上記粉砕物(1) の粒径を細かくして、合成樹脂結着剤の添加量を増やす必要があるが、粉砕物(1) の粒径を細かくするには粉砕、篩別の手間がかかり、更に粉砕物(1) から溶出するアルカリの量が多くなって合成樹脂結着剤の硬化が阻害されたり、合成樹脂結着剤が劣化したりするおそれがあり、また合成樹脂結着剤の添加量を増やすと建築板の材料費が高くなる。
【０００５】
【課題を解決するための手段】
本発明は上記従来の課題を解決するための手段として、木質補強材によって補強したセメント板の廃材を切削することによって得られる削片(11)を合成樹脂結着剤によって結着すると共に板状に成形した建築板を提供するものである。
該合成樹脂結着剤は硬化性合樹脂結着剤であることが望ましく、更に該硬化性合成樹脂は粉末状レゾールタイプのフェノール樹脂であることが望ましい。
また該硬化性合成樹脂結着剤は湿気硬化性ウレタンプレポリマーであることが望ましい。
【０００６】
【作用】
図２に示すように木質セメント板の廃材を切削することによって簡単に得られる削片(11)は相互接触が面的になり、該削片(11)相互間には殆んど空隙(2) が形成されない。したがって該削片(11)を小径にしなくても建築板の構造が緻密になって、合成樹脂結着剤による結着効率が向上し、合成樹脂結着剤の添加量を増やさなくても高強度製品を得ることが出来る。
そして上記したように該削片(11)を小径にしなくてもよいから、アルカリ溶出量が少なくなり、合成樹脂結着剤の硬化が阻害されず、かつ合成樹脂結着剤が劣化しにくくなる。
【０００７】
【発明の実施の形態】
本発明を以下に詳細に説明する。
本発明に使用する木質セメント板の廃材は、木質セメント板製造の際、トリミング工程等から発生する端切れ、あるいは建築物の修復や撤去等によって生ずる木質セメント板廃材である。
【０００８】
該木質セメント板は、例えばポルトランドセメント、あるいはポルトランドセメントに高炉スラグを混合した高炉セメント、フライアッシュを混合したフライアッシュセメント、火山灰、シリカフューム、白土等のシリカ物質を混合したシリカセメント、アルミナセメント、高炉スラグ等のセメント系無機粉体と、木粉、木毛、木片、木質繊維、木質パルプ、木質繊維束等の木質補強材とを主体とする原料混合物を使用し、該原料混合物を型板に散布してマットをフォーミングし、該マットを成形養生硬化する乾式あるいは半乾式法、該原料混合物を水に分散してスラリーとし、該スラリーを抄造してマットをフォーミングし、該マットを成形養生硬化する湿式法によって製造される。
【０００９】
上記木質セメント板廃材から削片を製造するには、フレーカー等の切削装置を使用する。望ましい削片の寸法は厚さ１〜３mm、巾２〜１０mm、長さ５〜２０mmである。
【００１０】
上記削片を結着する合成樹脂結着剤としては、例えばポリエチレン、ポリプロピレン、エチレン−プロピレン共重合体、エチレン−酢酸ビニル共重合体、ポリ塩化ビニル、ポリ塩化ビニリデン、ポリスチレン、ポリ酢酸ビニル、フッ素樹脂、熱可塑性アクリル樹脂、熱可塑性ポリエステル、熱可塑性ポリアミド、熱可塑性ウレタン樹脂、アクリロニトリル−ブタジエン共重合体、スチレン−ブタジエン共重合体、アクリロニトリル−ブタジエン−スチレン共重合体等の熱可塑性合成樹脂、ウレタン樹脂、メラミン樹脂、熱硬化型アクリル樹脂、尿素樹脂、フェノール樹脂、エポキシ樹脂、熱硬化型ポリエステル等の硬化性合成樹脂、あるいはウレタン樹脂プレポリマー、エポキシ樹脂プレポリマー、メラミン樹脂プレポリマー、尿素樹脂プレポリマー、フェノール樹脂プレポリマー、ジアリルフタレートプレポリマー、アクリルオリゴマー、多価イソシアナート、メタクリルエステルモノマー、ジアリルフタレートモノマー等のプレポリマー、オリゴマー、モノマー等の合成樹脂前駆体等が含まれる。上記合成樹脂結着剤は二種以上混合使用されてもよい。
【００１１】
上記合成樹脂結着剤として望ましいものは硬化性合成樹脂結着剤である。硬化性合成樹脂結着剤を使用することによって強度の大きな製品を得ることが出来る。上記硬化性合成樹脂結着剤には熱硬化性合成樹脂結着剤、湿気硬化性合成樹脂結着剤、光硬化性合成樹脂結着剤等が含まれる。
【００１２】
望ましい硬化性合成樹脂結着剤としてはアルカリによって硬化阻害をおこしにくいから耐アルカリ性を有する粉末状レゾールタイプのフェノール樹脂、湿気硬化型ウレタン樹脂がある。該湿気硬化型ウレタン樹脂として代表的なものは、例えばトリレンジイソシアナート、パラフェニレンジイソシアナート、２，４−トルエンジイソシアナート、２，６−トルエンジイソシアナート、ヘキサメチレンジイソシアナート、１，４−ナフタレンジイソシアナート、４，４’−ジフェニルジイソシアナート、４，４’−ジフェニルメタンジイソシアナート、３，３’−ジメチル−４，４’−ジフェニルジイソシアナート、３，３’−ジメチル−４，４’−ジフェニルメタンジイソシアナート、３，３’−ジメトキシ−４，４’−ジフェニルジイソシアナート、２−クロロ−１，４−フェニルジイソシアナート、１−クロロ−２，４−フェニレンジイソシアナート、ｍ−フェニレンジイソシアナート、ｐ−フェニレンジイソシアナート、２，２’，５，５’−テトラメチル−４，４’−ビフェニレンジイソシアナート、ｍ−キシリレンジイソシアナート、ω−キシリレンジイソシアナート、ω’−キシリレンジイソシアナート等の多価イソシアナートとポリエチレンアジペート、ポリテトラヒドロフラン、１，４−ブタンジオール、１，４−シスブテンジオール、１，５−ジヒドロキシエトキシナフタリン、１，４−ブチンジオール、ポリエステル、ポリ（オキシプロピレン）ポリオール、ポリ（オキシエチレン−プロピレン）ポリオール、アクリルポリオール、ヒマシ油ダイマー、トール油ダイマー等の多価アルコールからなるプレポリマーであって遊離イソシアナート基を有するものであり、更に望ましいプレポリマーとしては親水基を有し水と混和性のあるものである。
【００１３】
本発明においては、上記原料の他更にガラス繊維、岩綿、セラミック繊維、カーボン繊維，金属繊維等の無機繊維やポリエステル繊維、脂肪族または芳香族ポリアミド繊維、アクリル繊維、ポリエチレン繊維、ポリプロピレン繊維等のポリオレフィン繊維、ポリ塩化ビニリデン繊維、ポリ塩化ビニル繊維、ポリウレタン繊維、ビニロン、レーヨン、キュプラ、アセテート繊維等の有機繊維、パルプ、、再生パルプ、木片等の木質繊維、木綿、竹繊維、麻繊維、ヤシ繊維、羊毛、絹等の天然繊維、あるいは上記有機繊維や天然繊維の再生繊維等を補強材として使用してもよい。
【００１４】
本発明の建築板を製造するには、上記木質セメント板廃材の削片と上記合成樹脂結着剤とを混合し、更に所望なれば他の原料を混合して原料混合物を調製し、該原料混合物を型板上に散布し、通常２〜５ＭＰａの圧力で、通常１００〜２００℃、１０〜３０分間のプレス成形を行なう。
上記原料混合物において、合成樹脂結着剤の添加量は通常５〜２５重量％、望ましくは１０〜２０重量％とする。
【００１５】
プレス成形後得られた成形物は所望なればトリミングして建築板製品とする。この際発生する端切れは切削して削片としたり粉砕して粉砕物とし、本発明の建築板の原料の一部として再利用したり、あるいは木質セメント板セメント板の原料の一部として再利用してもよい。
【００１６】
【発明の効果】
本発明は相互面接触可能な木質セメント板削片を主材として使用するから、合成樹脂結着剤の結着効率が大巾に向上し、かつ該削片は小径にする必要もないのでアルカリ溶出を最小限にとどめて合成樹脂結着剤の硬化を円滑に行ない、かつ該合成樹脂結着剤のアルカリによる劣化も極力抑制することが出来、高強度の建築板を安価に製造することが出来る。
【００１７】
〔実施例１〕
木質セメント板廃材の削片（平均厚さ２mm、平均巾５mm、平均長１０mm）８０重量部、再生パルプ５重量部、粉末状レゾールタイプフェノール樹脂１５重量部を混合して、更に１０重量部の水を添加して該原料混合物を型板上に散布してマットとし、該マットを圧力３ＭＰａ、温度１９０℃で２０分間プレス成形し、厚み９mm、巾２２０mm、長さ２２０mmの建築板試料Ａを製造した。
【００１８】
〔実施例２〕
実施例１において再生パルプを除いた以外は同様にして建築板試料Ｂを製造した。
【００１９】
〔実施例３〕
実施例１のフェノール樹脂に代えてポリプロピレングリコールと４，４′−ジフェニルメタンジイソシアナートとの１：１．２モル比反応物である湿気硬化型ウレタンプレポリマーを使用した以外は同様にして建築板試料Ｃを製造した。
【００２０】
〔実施例４〕
実施例２のフェノール樹脂に代えてポリプロピレングリコールと４，４′−ジフェニルメタンジイソシアナートとの１：１．２モル比反応物である湿気硬化型ウレタンプレポリマーを使用した以外は同様にして建築板試料Ｄを製造した。
【００２１】
〔比較例〕
実施例１〜４の木質セメント板廃材削片に代えて、木質セメント板廃材粉砕物（１００メッシュ通過分６１重量％）を使用して同様に建築板試料Ｅ，Ｆ，Ｇ，Ｈを製造した。
【００２２】
〔物性試験〕
上記８種類の試料Ａ，Ｂ，Ｃ，Ｄ，Ｅ，Ｆ，Ｇ，Ｈについて、比重、曲げ試験、吸水性、木ねじ保持力を測定した。その結果を表１に示す。
【００２３】
【表１】
【図面の簡単な説明】
図１および図２は本発明の一実施例を示すものである。
【図１】従来例の粉砕物の相互接触状態説明図
【図２】本発明の削片の相互接触状態説明図
【符号の説明】
1 粉砕物
2 空隙
11 削片[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a building board using a waste material of a cement board reinforced with a wooden reinforcing material.
[0002]
BACKGROUND OF THE INVENTION
Cement boards (woody cement boards) produced by mixing wood reinforcing materials such as wood chips and wood pulp with cement-based inorganic powders, forming into plates, and curing and curing are now used as exterior materials for buildings, for example. It is used a lot. Accordingly, diligent research has been conducted on the reuse of wood cement board waste material generated by cutting off when the wood cement board is produced, or by restoration or removal of a building.
[0003]
[Prior art]
Conventionally, it has been proposed that such a wood cement board waste material is pulverized and bound with a synthetic resin binder and molded into a plate shape to form a building board.
[0004]
[Problems to be solved by the invention]
However, the pulverized material (1) of the above wood cement board waste is granular, and the mutual contact of the pulverized material (1) becomes substantially dotted as shown in FIG. 2) is formed, it is difficult to bind with the synthetic resin binder, and the structure of the building board becomes rough, and a high strength product cannot be obtained. In order to obtain a high-strength building board, it is necessary to reduce the particle size of the pulverized product (1) and increase the amount of the synthetic resin binder so that the structure of the building board does not become rough. In order to reduce the particle size of (1), it takes time for grinding and sieving, and further, the amount of alkali eluted from the pulverized product (1) is increased to inhibit the curing of the synthetic resin binder, or the synthetic resin. There is a possibility that the binder may deteriorate, and if the amount of the synthetic resin binder added is increased, the material cost of the building board increases.
[0005]
[Means for Solving the Problems]
As a means for solving the above-mentioned conventional problems, the present invention binds a chip (11) obtained by cutting a waste material of a cement board reinforced with a wood reinforcing material and binds it with a synthetic resin binder. It provides building boards molded into
The synthetic resin binder is preferably a curable synthetic resin binder, and the curable synthetic resin is preferably a powdered resol type phenol resin.
The curable synthetic resin binder is preferably a moisture curable urethane prepolymer.
[0006]
[Action]
As shown in FIG. 2, the chips (11) that can be obtained simply by cutting the wood cement board waste material are in contact with each other, and there is almost no space between the pieces (11). ) Is not formed. Therefore, the structure of the building board becomes dense without reducing the diameter of the slab (11), the binding efficiency by the synthetic resin binder is improved, and it is high without increasing the amount of the synthetic resin binder. A strong product can be obtained.
As described above, since it is not necessary to reduce the diameter of the scrap (11), the amount of alkali elution is reduced, the curing of the synthetic resin binder is not inhibited, and the synthetic resin binder is not easily deteriorated. .
[0007]
DETAILED DESCRIPTION OF THE INVENTION
The present invention is described in detail below.
The wood cement board waste material used in the present invention is a wood cement board waste material produced by cutting or the like of a trimming process or the restoration or removal of a building during the production of the wood cement board.
[0008]
The wood cement board is, for example, Portland cement, blast furnace cement in which blast furnace slag is mixed with Portland cement, fly ash cement in which fly ash is mixed, silica cement in which silica substances such as volcanic ash, silica fume, and white clay are mixed, alumina cement, blast furnace A raw material mixture mainly composed of cement-based inorganic powder such as slag and wood reinforcing material such as wood powder, wood wool, wood fragments, wood fiber, wood pulp, wood fiber bundle, etc. is used. Spattering and forming the mat, dry or semi-dry method to form and cure the mat, the raw material mixture is dispersed in water to form a slurry, the slurry is made to form the mat, and the mat is molded and cured Manufactured by a wet method.
[0009]
A cutting device such as a flaker is used to manufacture a piece from the wood cement board waste material. Desirable chip dimensions are 1 to 3 mm thick, 2 to 10 mm wide, and 5 to 20 mm long.
[0010]
Examples of the synthetic resin binder for binding the above-mentioned pieces include polyethylene, polypropylene, ethylene-propylene copolymer, ethylene-vinyl acetate copolymer, polyvinyl chloride, polyvinylidene chloride, polystyrene, polyvinyl acetate, fluorine. Resin, thermoplastic acrylic resin, thermoplastic polyester, thermoplastic polyamide, thermoplastic urethane resin, acrylonitrile-butadiene copolymer, styrene-butadiene copolymer, thermoplastic synthetic resin such as acrylonitrile-butadiene-styrene copolymer, urethane Resin, melamine resin, thermosetting acrylic resin, urea resin, phenol resin, epoxy resin, thermosetting polyester and other curable synthetic resins, or urethane resin prepolymer, epoxy resin prepolymer, melamine resin prepolymer, urea resin pre Rimmer, phenolic resin prepolymer, diallyl phthalate prepolymer, acrylic oligomer, polyisocyanate, methacrylic ester monomers, prepolymers such as diallyl phthalate monomers include oligomers, synthetic resin precursor such as monomers. Two or more of the above synthetic resin binders may be used in combination.
[0011]
What is desirable as the synthetic resin binder is a curable synthetic resin binder. A strong product can be obtained by using a curable synthetic resin binder. The curable synthetic resin binder includes a thermosetting synthetic resin binder, a moisture curable synthetic resin binder, a photocurable synthetic resin binder, and the like.
[0012]
Desirable curable synthetic resin binders include alkali-resistant powdered resol-type phenolic resins and moisture-curable urethane resins since they are difficult to inhibit curing by alkali. Typical examples of the moisture curable urethane resin include tolylene diisocyanate, paraphenylene diisocyanate, 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, hexamethylene diisocyanate, 1 , 4-Naphthalene diisocyanate, 4,4′-diphenyl diisocyanate, 4,4′-diphenylmethane diisocyanate, 3,3′-dimethyl-4,4′-diphenyl diisocyanate, 3,3′- Dimethyl-4,4′-diphenylmethane diisocyanate, 3,3′-dimethoxy-4,4′-diphenyl diisocyanate, 2-chloro-1,4-phenyldiisocyanate, 1-chloro-2,4- Phenylene diisocyanate, m-phenylene diisocyanate, p-phenylene diisocyanate, 2,2 ′, , 5'-tetramethyl-4,4'-biphenylene diisocyanate, m-xylylene diisocyanate, ω-xylylene diisocyanate, ω'-xylylene diisocyanate, polyethylene adipate,
[0013]
In the present invention, in addition to the above raw materials, inorganic fibers such as glass fibers, rock wool, ceramic fibers, carbon fibers, metal fibers, polyester fibers, aliphatic or aromatic polyamide fibers, acrylic fibers, polyethylene fibers, polypropylene fibers, etc. Polyolefin fiber, Polyvinylidene chloride fiber, Polyvinyl chloride fiber, Polyurethane fiber, Vinylon, Rayon, Cupra, Acetate fiber, etc. Organic fiber, Pulp, Recycled pulp, Wood fiber such as wood chip, Cotton, Bamboo fiber, Hemp fiber, Palm Fibers, natural fibers such as wool and silk, or recycled fibers of the above organic fibers and natural fibers may be used as the reinforcing material.
[0014]
In order to produce the building board of the present invention, the above-mentioned waste wood cement board scrap and the above synthetic resin binder are mixed, and if desired, other raw materials are mixed to prepare a raw material mixture. The mixture is sprayed on a template, and press molding is usually performed at a pressure of 2 to 5 MPa and usually at 100 to 200 ° C. for 10 to 30 minutes.
In the raw material mixture, the amount of the synthetic resin binder is usually 5 to 25% by weight, desirably 10 to 20% by weight.
[0015]
If desired, the molded product obtained after press molding is trimmed to obtain a building board product. The cuts generated at this time are cut into slabs or pulverized into pulverized products, which are reused as a part of the raw material for the building board of the present invention, or reused as a part of the raw material for the wood cement board cement board. May be.
[0016]
【The invention's effect】
Since the present invention uses wood cement board scraps that can contact each other as a main material, the binding efficiency of the synthetic resin binder is greatly improved, and the scraps do not need to have a small diameter. It is possible to smoothly cure the synthetic resin binder with minimal elution, and to suppress deterioration of the synthetic resin binder due to alkali as much as possible, and to produce a high-strength building board at low cost. I can do it.
[0017]
[Example 1]
Wood cement board waste scraps (average thickness 2mm, average width 5mm, average length 10mm) 80 parts by weight, recycled pulp 5 parts by weight, powdered resol type phenolic resin 15 parts by weight, and further 10 parts by weight Water is added and the raw material mixture is spread on a template to form a mat. The mat is press-molded at a pressure of 3 MPa and a temperature of 190 ° C. for 20 minutes to obtain a building board sample A having a thickness of 9 mm, a width of 220 mm, and a length of 220 mm. Manufactured.
[0018]
[Example 2]
A building board sample B was produced in the same manner as in Example 1 except that the recycled pulp was removed.
[0019]
Example 3
A building board was prepared in the same manner except that a moisture-curing urethane prepolymer which was a 1: 1.2 molar ratio reaction product of polypropylene glycol and 4,4'-diphenylmethane diisocyanate was used instead of the phenol resin of Example 1. Sample C was manufactured.
[0020]
Example 4
A building board was prepared in the same manner except that a moisture-curing urethane prepolymer which is a 1: 1.2 molar ratio reaction product of polypropylene glycol and 4,4'-diphenylmethane diisocyanate was used instead of the phenol resin of Example 2. Sample D was manufactured.
[0021]
[Comparative Example]
Building board samples E, F, G, and H were produced in the same manner using wood cement board waste material pulverized material (100 mesh passage 61% by weight) instead of the wood cement board waste material chips of Examples 1 to 4. .
[0022]
[Physical property test]
For the eight types of samples A, B, C, D, E, F, G, and H, specific gravity, bending test, water absorption, and wood screw holding force were measured. The results are shown in Table 1.
[0023]
[Table 1]
[Brief description of the drawings]
1 and 2 show an embodiment of the present invention.
FIG. 1 is an explanatory diagram of the mutual contact state of a pulverized product of a conventional example.
1 ground material
2 Air gap
11 Chip
Claims (2)
上記廃材を切削することによって得られる厚さ１〜３ｍｍ、巾２〜１０ｍｍ、長さ５〜２０ｍｍの削片と、粉末状レゾールタイプのフェノール樹脂を５〜２５重量％含み、
上記削片が上記粉末状レゾールタイプのフェノール樹脂によって結着されていると共に板状に成形されていることを特徴とする建築板。 It is a building board using the waste material of the cement board reinforced by the wooden reinforcement ,
Including 5 to 25% by weight of a 1 to 3 mm thick, 2 to 10 mm wide , 5 to 20 mm long scrap obtained by cutting the waste material, and a powdered resol type phenolic resin ,
Building board, characterized in that the cutting piece is formed into Rutotomoni plate is sintered applied by the powdered resole type phenolic resin.
上記廃材を切削することによって得られる厚さ１〜３ｍｍ、巾２〜１０ｍｍ、長さ５〜２０ｍｍの削片と、湿気硬化性ウレタンプレポリマーを５〜２５重量％含み、
上記削片が上記湿気硬化性ウレタンプレポリマーによって結着されていると共に板状に成形されていることを特徴とする建築板。 It is a building board using the waste material of the cement board reinforced by the wooden reinforcement,
Including 5 to 25% by weight of a piece having a thickness of 1 to 3 mm, a width of 2 to 10 mm, and a length of 5 to 20 mm obtained by cutting the waste material, and a moisture-curable urethane prepolymer,
A building board characterized in that the scrap is bound by the moisture-curable urethane prepolymer and is formed into a plate shape .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19200299A JP4011235B2 (en) | 1999-07-06 | 1999-07-06 | Building board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19200299A JP4011235B2 (en) | 1999-07-06 | 1999-07-06 | Building board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001019520A JP2001019520A (en) | 2001-01-23 |
| JP4011235B2 true JP4011235B2 (en) | 2007-11-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19200299A Expired - Fee Related JP4011235B2 (en) | 1999-07-06 | 1999-07-06 | Building board |
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| Country | Link |
|---|---|
| JP (1) | JP4011235B2 (en) |
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1999
- 1999-07-06 JP JP19200299A patent/JP4011235B2/en not_active Expired - Fee Related
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| JP2001019520A (en) | 2001-01-23 |
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