JP4004233B2 - Liquid processing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to a liquid processing apparatus used for performing predetermined liquid processing and drying processing on various substrates such as a semiconductor wafer and an LCD substrate.
[0002]
[Prior art]
  For example, in a semiconductor device manufacturing process, a semiconductor wafer as a substrate (hereinafter referred to as “wafer”) is cleaned with a cleaning solution such as a predetermined chemical solution or pure water, and contamination of particles, organic contaminants, metal impurities, etc. from the wafer. Wafer cleaning device to remove nitrogen and nitrogen (N₂) Wafer drying apparatuses are used that dry a wafer by removing droplets from the wafer with an inert gas such as a gas or IPA vapor having high volatility and hydrophilicity. As these cleaning devices and drying devices, ones that store a plurality of wafers in a wafer cleaning chamber or a wafer drying chamber and process them in a batch manner are known.
[0003]
  For example, in the wafer cleaning apparatus described in US Pat. Nos. 5,847,797 and 5,678,320, the loading provided on the front side of the wafer cleaning chamber (the surface facing the wafer transfer arm when the wafer transfer arm moves). The wafer chuck of the wafer transfer arm enters the wafer cleaning chamber from the front side of the wafer cleaning tank (front side of the rotor) via the outlet, and the wafer held by the wafer chuck is passed to the rotor or held by the rotor. The wafer is received by a wafer chuck.
[0004]
  A wafer cleaning apparatus 200 shown in FIG. 19 is also known. The wafer cleaning apparatus 200 includes a processing chamber 202 that forms a wafer cleaning chamber 201, and a rotor 205 that can hold and rotate the wafer W. Can be advanced and retracted from a wafer loading / unloading port 203 formed on the front side of the processing chamber 202, and the rotor 205 is advanced from the processing chamber 202, and between the rotor 205 and the wafer chucks 209a and 209b of the transfer arm. The wafer W can be delivered. Reference numeral 207 denotes a drive mechanism for moving the rotor 205 forward and backward, rotates it, 208 denotes a rotating shaft, 204 denotes a lid of the processing chamber 202, and 206 denotes a holding member for the rotor 205.
[0005]
[Problems to be solved by the invention]
  However, in the wafer cleaning apparatus disclosed in US Pat. Nos. 5,784,977 and 5,678,320, it is necessary to provide a sufficient space for opening and closing the wafer chuck that has entered the wafer cleaning chamber. The problem is that the room will become larger. In addition, in order to open and close the wafer chuck in a limited space of the wafer cleaning chamber, it is necessary to carefully control the operation of the wafer chuck so as not to collide with the inner wall of the wafer cleaning tank. It becomes complicated and the operation control program must be complicated.
[0006]
  In the wafer cleaning apparatus 200 shown in FIG. 19, it is not necessary to open and close the wafer chuck in a limited space, but the wafer chucks 209a and 209b and the holding member 206 of the rotor 205 are controlled so as not to collide with each other. There is still a problem that the operation program becomes complicated.
[0007]
  The present invention has been made in view of such circumstances, and it is easy to control without increasing the size of the apparatus, and it is possible to efficiently perform liquid processing such as cleaning of an object to be processed. The purpose is to provide.
[0008]
[Means for Solving the Problems]
  As a technique capable of solving the above-mentioned problems, the present applicant previously proposed a substrate processing apparatus (liquid processing apparatus) having a mechanism for moving a processing chamber (processing chamber) in Japanese Patent Application No. 11-326084. is doing. However, as will be described later with reference to FIG. 18, in the substrate processing apparatus disclosed in Japanese Patent Application No. 11-326084, the processing liquid is discharged from the vertical wall 26b on the front surface of the processing chamber. Along with this, new problems such as the time required to separate and replace the atmosphere in the processing chamber arise.
[0014]
  The present invention solves such a new problem in addition to the above problems.A liquid processing apparatus for supplying a predetermined processing liquid to an object to be processed and performing liquid processing,
  A cylindrical processing chamber capable of storing an object to be processed, a chamber moving mechanism for sliding the processing chamber between a processing position positioned in a substantially horizontal direction and a retracted position, and a processing target in the processing chamber A processing liquid supply means for supplying a predetermined processing liquid to the body, a processing liquid discharge port provided at a lower end of the processing chamber, and a process discharged from the processing liquid discharge port in communication with the processing liquid discharge port A drainage guide member for guiding the liquid in a predetermined direction, and a drain pipe provided separately from the processing chamber on the processing position side of the processing chamber,
    One of the drainage guiding member and the drain pipe is inside the otherTo form a fitting part,In the fitting portion, the space between the drainage guiding member and the drain pipe is slidable in the sliding direction of the processing chamber,
  When the processing chamber slides, the fitting portionProvided is a liquid processing apparatus which is always in communication.
[0015]
  According to the first aspect,Drainage routePrevents the treatment liquid from dripping.TheFurther, when the processing chamber is an inner chamber of a dual structure chamber composed of an inner chamber and an outer chamber, there is an advantage that atmosphere separation and control of each chamber are easy.Further, since the processing chamber slides, the object to be processed can be inserted while the processing chamber is retracted, the conveyance control of the object to be processed is not complicated, and damage to the object to be processed is avoided.
[0016]
  In the second aspect of the present invention,A liquid processing apparatus for supplying a predetermined processing liquid to an object to be processed and performing liquid processing,
  A holding member that holds the object to be processed, and a processing chamber that accommodates the object to be processed held by the holding member and performs liquid treatment,
  The processing chamber is inclined so as to incline downward from one end in the horizontal direction to the other end of the cylindrical body in order to collect processing liquid, and a substantially cylindrical body portion having a central axis extending in the horizontal direction. Provided is a liquid processing apparatus comprising: a guide groove provided at the bottom of the body part; and a discharge port provided close to a lower end of the guide groove for discharging the processing liquid. To do.
[0017]
  In the third aspect of the present invention,A liquid processing apparatus for supplying a predetermined processing liquid to an object to be processed and performing liquid processing,
  A truncated conical body portion having a holding member for holding the object to be processed, a first circular end portion having a short diameter, and a second circular end portion having a relatively longer diameter than the first circular end portion. And a processing chamber for storing a liquid to be processed and storing a target object held by the holding member,
  In the processing chamber, the first bus bar of the body part extends in a horizontal direction at the uppermost part of the body part, and the second bus bar of the body part is a first circular shape at the lowermost part of the body part. Arranged so as to be inclined downward from the end toward the second circular end,
  A liquid processing apparatus is provided, wherein a discharge port for discharging a processing liquid from the processing chamber is provided in the vicinity of a lowermost portion of the second circular end portion.
[0018]
  In the second and third aspectsThe processing chamber used is as described above.Of the first viewpointIt can be used as a processing chamber provided in the liquid processing apparatus and facilitates drainage from the processing liquid discharge port. In addition, it is not necessary to form a guide groove or the like to the processing liquid discharge port in the lower part inside the processing chamber, which contributes to a reduction in manufacturing cost of the processing chamber. In addition, since the processing chamber used in the seventh invention has no irregularities such as guide grooves formed inside the processing chamber, even if an air flow is generated in the processing chamber by rotating the object to be processed, Therefore, it is also possible to prevent the processing liquid from colliding with the uneven portion and scattering and reattaching to the object to be processed to form a liquid trace.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The liquid processing apparatus of the present invention can be applied to a cleaning processing apparatus, a drying processing apparatus, and the like using various substrates as objects to be processed. In this embodiment, a semiconductor wafer (hereinafter referred to as “wafer”) is carried in, cleaned, dried, The case where it uses as a washing | cleaning processing apparatus comprised so that carrying out may be batch-processed consistently is demonstrated.
[0020]
  FIG. 1 is a perspective view of a cleaning processing apparatus according to the present embodiment, and FIG. 2 is a plan view thereof. As shown in FIGS. 1 and 2, the cleaning processing apparatus 1 includes an in / out port (container loading / unloading unit) 2 in which a carrier (substrate storage container) C capable of storing a wafer W is loaded and unloaded, A cleaning processing unit 3 that performs cleaning processing on the wafer W, and a stage that is provided between the in / out port 2 and the cleaning processing unit 3 and carries the carrier C into and out of the cleaning processing unit 3. A unit 4, a carrier cleaning unit 5 for cleaning the carrier C, and a carrier stock unit 6 for stocking a plurality of carriers C are provided. Reference numeral 7 is a power supply unit, and 8 is a chemical tank box.
[0021]
  The in / out port 2 is movably provided on a mounting table 10 on which four carriers C can be mounted, and a transport path 11 formed along the arrangement direction of the carriers C. A carrier transport mechanism 12 for transporting to the stage unit 4 and transporting the carrier C of the stage unit 4 to the mounting table 10 is provided. For example, 25 or 26 wafers W can be stored in the carrier C, and the carrier C is arranged so that the main surface of the wafer W is arranged substantially vertically.
[0022]
  The stage unit 4 includes a stage 13 on which the carrier C is placed, and a slide stage 32 is disposed on the stage 13 as shown in FIG. The carrier C transported and placed on the slide stage 32 from the in / out port 2 is carried into the cleaning processing unit 3 by driving the slide stage 32, and the carrier C in the cleaning processing unit 3 is transferred to the slide stage 32. It is carried out to the stage 13 by the stage 32.
[0023]
  In addition, since the carrier C is mounted on the stage 13 by rotating the arm of the carrier transport mechanism 12 from the mounting table 10, the carrier C is mounted in the opposite direction to the mounting table 10. For this reason, the stage 13 is provided with a reversing mechanism (not shown) for returning the direction of the carrier C.
[0024]
  A partition wall 14 is provided between the stage unit 4 and the cleaning processing unit 3, and an opening 14 a for carrying in / out is formed in the partition wall 14. The opening 14a can be opened and closed by a shutter 15. The shutter 15 is closed during processing, and the shutter 15 is opened when the carrier C is loaded and unloaded.
[0025]
  The carrier cleaning unit 5 has a carrier cleaning tank 16, and the carrier C which has been emptied after the wafer W is taken out in the cleaning processing unit 3 is cleaned as will be described later.
[0026]
  The carrier stock unit 6 temporarily waits for the carrier C containing the wafer W before cleaning or the carrier C that is empty after the wafer W before cleaning is taken out, or for storing the wafer W after cleaning. A plurality of carriers C can be stocked in the vertical direction, and a predetermined carrier C among them can be placed on the mounting table 10, A carrier moving mechanism for stocking the carrier C at a predetermined position is incorporated.
[0027]
  Next, the configuration of the cleaning processing unit 3 will be described. Here, as the processing chamber disposed in the cleaning processing unit 3, a dual structure chamber including an outer chamber 26 and an inner chamber 27 that can be accommodated in the outer chamber 26 is exemplified.
[0028]
  3 is a cross-sectional view showing the inside of the cleaning processing unit 3. FIGS. 4 and 5 are cross-sectional views showing the cleaning processing unit 20 of the cleaning processing unit. FIG. 4 shows the inner chamber 27 outside the outer chamber 26. FIG. FIG. 5 shows a state in which the inner chamber 27 is disposed inside the outer chamber 26 (hereinafter referred to as an inner side in such a state). The position of the chamber 27 is referred to as “processing position”). FIG. 3 shows a state in which both the outer chamber 26 and the inner chamber 27 are slid to the retracted position.
[0029]
  As shown in FIG. 3, the cleaning processing unit 3 includes a cleaning processing unit 20, a carrier standby unit 30 that waits for the carrier C immediately below the cleaning processing unit 20, and a carrier C that is standby by the carrier standby unit 30. A wafer moving mechanism 40 is provided to push up and move the plurality of wafers W to the cleaning processing unit 20, and hold the plurality of wafers W of the cleaning processing unit 20 and store them in the carrier C of the carrier standby unit 30. It has been.
[0030]
  In the cleaning processing unit 3, the wafer W is structured to move vertically between the cleaning processing unit 20 and the carrier standby unit 30 with the lower side of the cleaning processing unit 20 as the entrance / exit. There is no limitation on the movement mechanism, and the wafer W may be accommodated in the cleaning processing unit 20 from above the cleaning processing unit 20 or from the lateral direction.
[0031]
  A slide stage 32 on which the carrier C is placed is disposed on the stage 13. For example, the slide stage 32 is configured in three stages, and the upper two stages are slid to the carrier standby unit 30 side, so that the carrier C placed in the upper stage is directly below the rotor 24 in the carrier standby unit 30. It is possible to carry it in and wait.
[0032]
  The wafer moving mechanism 40 includes a wafer holding member 41 that holds the wafer W, a support bar 42 that is vertically arranged to support the wafer holding member 41, and a lift drive unit 43 that moves the wafer holding member 41 up and down via the support bar 42. And have. The wafer holding member 41 is moved up and down by the lift drive unit 43 to move the wafer W before cleaning processing stored in the carrier C in the carrier standby unit 30 into the rotor 24 of the upper cleaning processing unit 20 or the rotor. The wafer W after the cleaning process in 24 is moved to the carrier C in the carrier standby unit 30.
[0033]
  The cleaning processing unit 20 removes a resist mask, a polymer layer as an etching residue, and the like after the etching process of the wafer W, and the support wall 18 provided vertically and the rotating shaft 23a are horizontally disposed on the support wall 18. The motor 23 fixed using the mounting jig 18 a, the rotor 24 attached to the rotating shaft 23 a of the motor 23, the cylindrical support tube 25 surrounding the rotating shaft 23 a of the motor 23, and the support tube 25 The outer chamber 26 is configured to surround the rotor 24, and the inner chamber 27 is disposed inside the outer chamber 26 and performs chemical treatment.
[0034]
  The rotor 24 can hold a plurality of (for example, 26) vertical wafers W arranged in a horizontal direction. The rotor 24 is locked by a motor 23 via a rotating shaft 23a. It is locked by 71a, 71b, 72a, 72b and is rotated together with a plurality of wafers W held by wafer holding members 83a, 83b. 4 and 5, the locking members 71b and 72b are located on the back surface of the locking members 71a and 72a, respectively, and the wafer holding member 83b is located on the back surface of the wafer holding member 83a.
[0035]
  The outer chamber 26 has a substantially frustoconical shape (refers to the shape of the base portion obtained by cutting off the apex side of the substantially conical shape with a plane parallel to the bottom surface), and the processing position (the two-dot chain line in FIG. It is configured to be movable between the retracted position (solid line in FIG. 3), and is positioned at the retracted position as shown in FIG.
[0036]
  Further, as shown in FIG. 4, when the outer chamber 26 is in the processing position and the inner chamber 27 is in the retracted position, the outer chamber 26, the vertical wall 26a on the motor 23 side, and the vertical wall 26b on the front end side. A processing space 51 is formed. A drain (drainage path) including a drain pipe 63 and a drain valve 61 is formed in the lower portion of the processing space 51 so as to communicate with a drainage port 61 a formed in the vertical wall 26 b. Is provided such that an exhaust path composed of an exhaust valve 65 and an exhaust pipe 67 communicates with an exhaust port 65a formed in the vertical wall 26b.
[0037]
  Since the outer diameter of the end surface of the outer chamber 26 is different, the long diameter side is set as the vertical wall 26b side, and the bottom of the trunk portion of the outer chamber 26 is provided with a gradient so that the vertical wall 26b side is downward. The treatment liquid used in the space 51 can be easily discharged through the drain pipe 63.
[0038]
  The vertical wall 26a is attached to the support cylinder 25, and a bearing 28 is provided between the support cylinder 25 and the rotating shaft 23a. Further, the vertical wall 26a and the tip of the support cylinder 25 are sealed by a labyrinth seal 29 to prevent particles generated by the motor 23 from entering the processing space 51. A locking member 25 a that locks the outer chamber 26 and the inner chamber 27 is provided at the end of the support cylinder 25 on the motor 23 side, and the locking member 25 a is attached to the support wall 18.
[0039]
  The inner chamber 27 has a substantially truncated cone shape with a diameter smaller than that of the outer chamber 26, and is configured to be slidable between the processing position shown in FIG. 5 and the retracted position shown in FIGS. When W is loaded and unloaded, it is positioned in the retracted position together with the outer chamber 26. As shown in FIG. 5, when the inner chamber 27 is at the processing position, a processing space 52 is formed by the inner chamber 27 and the vertical walls 26a and 26b.
[0040]
  Next, the configuration of the inner chamber 27 will be described in detail. FIG. 6 is a perspective view of the inner chamber 27, and FIG. 7 is a front view and a cross-sectional view of the inner chamber 27. 6 and 7, the discharge nozzle 56 as the processing liquid supply means shown in FIG. 4 and the like is omitted.
[0041]
  The body 27a of the inner chamber 27 is substantially frustoconical, with the short diameter side being the tip side (vertical wall 26b side (processing position side)) and the long diameter side being the motor 23 side (retraction position side). The side is substantially horizontal and a predetermined gradient is formed at the bottom, and the length direction (the direction of line AA in FIG. 6) is further aligned with the sliding direction. At both end surfaces of the inner chamber 27, a ring member 27b is bonded to the short diameter side, and a ring member 27c is bonded to the long diameter side of the inner chamber 27, respectively. When the inner chamber 27 is disposed at the processing position, The inner peripheral surface of the member 27b and the vertical wall 26b are sealed, and the ring member 27c and the vertical wall 26a are sealed.
[0042]
  The sliding direction of the inner chamber 27 is the horizontal direction in FIG. Further, as shown in FIG. 5, the inner chamber 27 is arranged so that a gradient is also formed on the upper side of the trunk portion 27a as long as a predetermined gradient is formed on the bottom portion of the trunk portion 27a. May be. Further, instead of the trunk portion 27a, a barrel portion 87a formed in a cylindrical shape may be used as shown in the cross-sectional view of FIG. In this case, the bottom of the guide groove 81 may be provided with a gradient that decreases from the ring member 27b side toward the ring member 27c side.
[0043]
  In order to adjust the atmosphere in the processing space 52 and to adjust the atmosphere in the inner chamber 27 at the retracted position, an exhaust port 45a is formed at the upper end of the ring member 27c, and the exhaust port 45a Is provided with an exhaust pipe 44, and an exhaust valve 45 is provided in the middle of the exhaust pipe 44. Further, a processing liquid discharge port 46 is formed at the lower end of the ring member 27 c, and a drainage guiding member 47 is disposed so as to communicate with the processing liquid discharge port 46.
[0044]
  As described above, the ring member 27c is attached to the long diameter side of the trunk portion 27a, and the trunk portion 27a is disposed so that the upper side is substantially horizontal and the bottom portion is formed with a gradient. 27 has a structure in which the processing liquid used in 27 easily flows from the processing liquid discharge port 46 to the drainage guiding member 47.
[0045]
  The drainage guiding member 47 extends downward, and the tip 48 is constituted by a straight pipe 48a so that the major axis direction coincides with the horizontal direction. On the other hand, a drain pipe 49 is disposed as a separate part near the lower portion of the vertical wall 26 a, and an engaging portion 50 is formed at the tip of the drain pipe 49. The drain pipe 49 is disposed at a position that does not obstruct the movement of the outer chamber 26 when the outer chamber 26 is moved to the retracted position.
[0046]
  When the inner chamber 27 is in the retracted position, the pipe 48a and the engaging portion 50 are separated from each other. However, when the inner chamber 27 is slid to the processing position for cleaning the wafer W, the pipe 48a. Is fitted into the engaging portion 50 and sealed. As a result, the drainage guiding member 47 and the drain pipe 49 communicate with each other, and the processing liquid can be drained. On the other hand, when the liquid processing of the wafer W is completed and the inner chamber 27 is returned to the retracted position, the pipe 48a and the engaging portion 50 are separated from each other.
[0047]
  FIG. 9 is a cross-sectional view showing one form of fitting between the pipe 48a and the engaging portion 50. The seal between the pipe 48a and the engaging portion 50 uses, for example, a hollow seal member 84 and a hollow seal member 84. This can be done by supplying a fluid to the hollow part and expanding the hollow part. On the other hand, when the fluid is discharged from the hollow portion of the hollow seal member 84 and the hollow portion is contracted, the sealed state is released, and in this state, the pipe 48a can be inserted and withdrawn. In addition, the engaging part 50 shown in FIG. 9 is provided with an exhaust port 85 so that exhaust can be performed simultaneously with drainage. When exhausting from the exhaust port 85, the baffle plate 86 prevents the drainage (liquid) from entering the exhaust port 85.
[0048]
  As described above, when the drain consisting of the drainage guiding member 47 and the drain pipe 49 that can be contacted and separated is formed, the space of the apparatus can be saved without impairing the drainage performance. That is, for example, when a continuous drain pipe such as a hose is provided in the inner chamber 27, the drain pipe also moves as the inner chamber 27 slides, which causes a problem in mechanical durability. Not only that, the space occupied by the drain tube is also widened, causing problems such as an increase in the size of the apparatus. However, the present invention is characterized in that such a problem does not occur.
[0049]
  Further, when the inner chamber 27 is in the retracted position, no drain is formed below the rotor 24, so that the wafer W can be easily exchanged and moved between the rotor 24 and the carrier standby unit 30. There are also advantages that can be made.
[0050]
  As shown in FIG. 18, the inner chamber 17 is configured such that the major axis side is the vertical wall 26 b side, and the gradient of the bottom of the trunk is opposite to the case of FIG. 4 or 5. , A drainage port is provided at a predetermined position on the vertical wall 26b, which is the lower part of the processing space 87 formed when the inner chamber 17 is at the processing position, and a drain pipe 64 and a drain valve 62 communicating with the drainage port are provided. With the arrangement, even if the drain valve 62 is closed and the inner chamber 17 is moved to the retracted position, the drain valve 62 is present in the processing space 51 formed by the outer chamber 26.
[0051]
  That is, in the case of the structure shown in FIG. 18, the atmosphere of the processing liquid related to the substrate processing in the inner chamber 17 remaining in the drain valve 62 diffuses into the atmosphere of the processing space 51, so that the processing space 87 is transferred to the processing space 51. However, by adopting the drain structure shown in FIGS. 4 to 9, it is possible to avoid such a problem.
[0052]
  In the drain structure provided in the inner chamber 27 described above, an open / close valve is provided in the pipe 48 a at the tip 48 of the drainage guiding member 47, and the pipe 48 a is fitted in the engaging portion 50 of the drain pipe 49. It is preferable that the opening valve is opened when combined, and that the end face of the pipe 48a is closed when separated, so that the treatment liquid from the pipe 48a can be prevented from dripping.
[0053]
  On the other hand, instead of providing such an on-off valve, as shown in the cross-sectional view of FIG. 10, if a flange 57 for receiving the processing liquid dripping from the pipe 48 a is provided below the pipe 48 a of the drainage guiding member 47, Even if the treatment liquid drips from the pipe 48a, it does not adhere to other apparatus members, which is preferable. Since such a ridge 57 moves together with the drainage guiding member 47, the transfer of the wafer W is not hindered. Note that a hook for receiving the dripping treatment liquid may be provided below the engaging portion 50 of the drain pipe 49.
[0054]
  Next, another embodiment of the drain structure used for the inner chamber 27 described above will be described. FIG. 11 shows a structure in which the distal end of the drainage guiding member 47 attached to the inner chamber 27 and the distal end of the drain pipe 49 are always in communication with each other by an elastic bellows pipe 58. The bellows tube 58 is contracted when the inner chamber 27 is at the processing position, and is in an expanded state when moving to the retracted position.
[0055]
  When the drain structure is the structure shown in FIG. 11, it is easy to separate the atmosphere of the processing spaces 51 and 52 respectively formed by the outer chamber 26 and the inner chamber 27 as described with reference to FIG. 18. There is an advantage to become. Further, since no dripping of the processing liquid occurs, it is not necessary to provide an on-off valve or a ridge.
[0056]
  Next, still another embodiment of the drain structure will be described with reference to FIGS. The drainage guiding member 47a attached to the inner chamber 27 is bent a plurality of times and is routed so as not to overlap the inner chamber 27 and the outer chamber 26 when viewed from above as shown in the plan view of FIG. . The drainage guiding member 47 a has a pipe portion 75 which is located obliquely below the inner chamber 27 and extends in parallel with the sliding direction of the inner chamber 27 on the distal end side thereof. A pipe portion 76 extending in parallel with the pipe portion 75 formed on the distal end side is fitted.
[0057]
  An engaging portion 50 similar to that described above with reference to FIG. 9 is formed at the tip of the pipe portion 76, and the overlapping amount of the pipe portions 75 and 76 changes as the inner chamber 27 slides. However, the pipe portion 75 always maintains the engagement with the seal member 84 of the engaging portion 50 provided in the pipe portion 76 of the drain pipe 49. Note that while the pipe portion 75 is moving in accordance with the slide of the inner chamber 27, the hollow seal member 84 is in a seal release state, and the pipe portion 75 is not in contact with the hollow seal member 84.
[0058]
  An exhaust valve 90 is provided at the top of the pipe portion 76, and an exhaust pipe 91 is connected to the exhaust valve 90. A liquid receiver 92 is provided below the ends of the pipe portion 75 and the pipe portion 76, and the liquid receiver 92 should pass through the hollow seal member 84 of the engaging portion 50 and the processing liquid leaks to the outside. However, this treatment liquid is received and adhesion to peripheral components of the apparatus is prevented.
[0059]
  According to the embodiments shown in FIGS. 12 to 14, since the pipe portions 75 and 76 are always fitted, there is basically no problem of liquid leakage. Moreover, since the flexible tube is not used, it is excellent also in durability. Further, the drainage guiding member 47 a and its pipe part 75 and the drain pipe 49 and its pipe part 76 are arranged at positions completely outside the rotor 24 and the movable range of the outer chamber 26 and the inner chamber 27. Therefore, the loading of the wafer W from the standby position of the carrier C to the rotor 24 and the unloading from the rotor 24 to the carrier C in the carrier standby section 30 shown in FIG.
[0060]
  In addition, although the form shown in FIGS. 12-14 has shown the case where the pipe part 75 is provided toward the process position side, as shown in FIG. 15, the pipe part 75, the drain pipe 49, and its pipe part are shown. It is also possible to provide 76 toward the retracted position. In addition, as shown in FIG. 16, an exhaust port is formed at the top so that exhaust can be performed, and a cover 93 that can be drained by forming a drain port at the bottom is attached to the pipe portion 75. It can also be made into a form. The cover 93 also surrounds the drain pipe 49 and the tip of the pipe portion 76 so that the leaked processing liquid can be recovered even when liquid leaks from the tip of the pipe portion 76. It has become.
[0061]
  Next, the form of the processing chamber that facilitates the inflow of the processing liquid to the drains of the various forms described above will be described using the inner chamber 27 as an example. As described above, the inner chamber 27 has a substantially frustoconical shape, the ring member 27c is attached to the longer diameter side of the trunk portion 27a, and the trunk portion 27a is disposed so that a gradient is formed at the bottom. Therefore, the processing liquid used in the inner chamber 27 easily flows from the processing liquid discharge port 46 to the liquid discharge guiding member 47.
[0062]
  As shown in FIG. 8, when the cylindrical body 87a is used for the inner chamber 27 and the guide groove 81 is provided at the bottom of the body 87a, a problem that requires cost for forming the guide groove 81, etc. In addition, when the rotor 24 is rotated, there is a problem that the processing liquid collides with the edge portion of the guide groove 81 and is scattered and reattached to the wafer W. However, such a problem can be avoided by adopting a structure in which the inner chamber 27 using the substantially frustoconical trunk portion 27a has no irregularities inside.
[0063]
  In addition, in the double-structure chamber, when a cylindrical chamber with no gradient formed in the lower part is used as the inner chamber, the long axis direction (length direction) is set so that the bottom of the trunk has a predetermined gradient. It is necessary to tilt it at a certain angle with the horizontal direction. In this case, when the sliding direction of the chamber is inclined, the shape of the outer chamber has to be unnecessarily large, and it is difficult to say that it is a preferable form. However, in the inner chamber 27 described above, the sliding direction is a horizontal direction, and the lower gradient is not greatly inclined while ensuring a sufficient drainage capacity, so that the outer chamber 26 is extremely enlarged. There is also an advantage that it is not necessary.
[0064]
  The gradient provided at the bottom of the body 27a of the inner chamber 27 can be set to an appropriate value in consideration of the viscosity of the processing liquid used, but can be used for various liquids such as pure water. The angle is preferably 3 ° or more, and more preferably 5 ° or more. However, considering that this gradient is too large, the cleaning atmosphere and the drying atmosphere in the chamber will be non-uniform, and the problem that the apparatus will become large is taken into account, the gradient provided on the body 27a is 10 ° or less. It is preferable that
[0065]
  As described above, providing a gradient at the bottom of the body of the chamber can be used for the outer chamber 26 as well. As shown in FIGS. 3 to 5, when the vertical wall 26 b side of the outer chamber 26 is the long diameter side and the motor 23 side is the short diameter side, the liquid discharge port 61 a for discharging the liquid from the processing space 51 is provided in the vertical wall 26 b. Can be provided at a position that is not included in the processing space 52. Similarly, the exhaust port 65 a for the processing space 51 can be provided at a position above the vertical wall 26 b and not included in the processing space 52.
[0066]
  Subsequently, when performing the liquid processing and the drying processing using the various types of chambers described above, the preferable disposition position of the discharge nozzle that is preferably used in the present invention as the processing liquid supply means disposed in the processing space. The processing spaces 51 and 52 shown in FIGS. 3 to 5 will be described as an example.
[0067]
  As shown in FIGS. 4 and 5, in the vicinity of the upper end of the processing space 51, a discharge nozzle 54 having a large number of discharge ports 53 is arranged in the horizontal direction with being attached to the vertical wall 26 b. On the other hand, in the vicinity of the upper end of the processing space 52, a discharge nozzle 56 having a large number of discharge ports 55 is disposed along the horizontal direction in a state of being attached to the inner chamber 27.
[0068]
  Pure water, IPA, N supplied from a supply source (not shown) from the discharge nozzle 54₂Gases and various chemicals can be discharged from the discharge nozzle 56 by various chemicals, pure water, and IPA supplied from a supply source (not shown).
[0069]
  FIG. 17 is a front view showing a state in which the ring members 27b and 27c are omitted and the discharge nozzles 56 (56a to 56c) are arranged in the body portion 27a with respect to the front view of FIG. 7 taking the inner chamber 27 as an example. is there. These discharge nozzles 56 for supplying the processing liquid to the wafer W are preferably disposed in the processing space 52 outside the upper extension range of the wafer W and in a range above the horizontal position. Such an arrangement is the same for the discharge nozzles 54 in the processing space 51.
[0070]
  Here, the arrangement position of the discharge nozzle 56 in the processing space 52 will be described in more detail. The phrase “the discharge nozzle 56 is disposed outside the upper extension range of the wafer W” means that the wafer W extends beyond the processing space 52. This means that the wafer W and the discharge nozzles 56a to 56c do not come into contact with each other. Further, “above the horizontal position” means that it is above a horizontal plane (dotted line SS in FIG. 17) passing through the center of the wafer W held at a predetermined position in the processing space 52. The same applies to the arrangement positions of the discharge nozzles 54 in the processing space 51.
[0071]
  In FIG. 17, the above range is an overlapping portion of the ranges A1 and B1 and an overlapping portion of the ranges A2 and B2 in the trunk portion 27a, but the discharge is performed so that the processing liquid can be uniformly discharged from the discharge ports 55. The nozzle 56 is preferably provided at a slight distance from the wafer W. Accordingly, the actual arrangement position of the discharge nozzle 56 is approximately in a range corresponding to the areas C1 and C2 shown in FIG.
[0072]
  By disposing the discharge nozzles 54 and 56 at such positions in the processing spaces 51 and 52, even if liquid leakage or dripping occurs from the respective discharge ports 53 and 55, they do not adhere to the wafer W. That is, it is avoided that droplets adhere to the wafer W and the partial liquid trace is generated after the various processing liquids are discharged.
[0073]
  Since the wafer W is rotated by the motor 23 in the processing spaces 51 and 52, an air flow is generated in the rotation direction of the wafer W in the processing spaces 51 and 52. In particular, when drying is performed in a state in which the processing liquid is not discharged from the discharge nozzles 54 and 56, when the processing liquid is attached to the discharge nozzles 54 and 56 and the discharge ports 53 and 55, The adhering liquid scatters and a trace of liquid is generated on the wafer W, which may cause a defect.
[0074]
  In order to solve such a problem, for example, as shown in FIG. 17, when the wafer W rotates in the counterclockwise direction indicated by the arrow R, the air flow generated is also counterclockwise. As described above, when the discharge nozzles 56a and 56b are disposed outside the upper outer extension range of the wafer W and above the horizontal position, the liquid dripping from the discharge nozzles 56a and 56b occurs when the wafer W is rotating. Since the processed liquid gets on the airflow and approaches the body 27a, it is difficult for the processing liquid to adhere to the wafer W, thus avoiding the formation of liquid traces on the wafer W. As an example, in FIG. 17, the discharge nozzle 56a is disposed at a position where the angle formed with the dotted line SS is approximately 60 °, and the discharge nozzle 56b is disposed at the position where the angle formed with the dotted line SS is approximately 30 °. Such an angle varies depending on the inner diameter of the body 27a, the outer diameter of the wafer W to be processed, and the shapes of the discharge nozzles 56a and 56b.
[0075]
  On the other hand, for example, for the discharge nozzle 56c to be disposed in the region C2 in FIG. 17, the angle formed by the lower position of the lower half of the region C2, for example, the dotted line SS as shown in FIG. Even if the processing liquid adhering to the discharge nozzle 56c is blown so as to approach the wafer W while riding on the airflow, it is set so as to fall downward without adhering to the wafer W. Is preferred.
[0076]
  The discharge nozzle 56 is preferably provided in the regions C1 and C2 as described above. However, if the discharge nozzle 56 is at a position where the processing liquid flowing from above or falling is not sprayed again, the range D1 • shown in FIG. It can also be disposed in a region slightly below the horizontal position, such as D2, for example, in a range where the angle formed with the dotted line SS is within about 10 °. Even in such a case, it is preferable to take the range D2 narrower than the range D1 in consideration of the generation of airflow due to the rotation of the wafer W.
[0077]
  As mentioned above, although embodiment of this invention has been described, it cannot be overemphasized that this invention is not limited to the said embodiment, A various deformation | transformation is possible. For example, in the above embodiment, the case where the processing is performed by the two processing chambers of the outer chamber 26 and the inner chamber 27 has been described. However, the number of chambers may be three or more, or may be one. Further, any one of the outer chamber 26 and the inner chamber 27 may be used for cleaning and any of them may be used for drying, and can be used for applications in which both cleaning and drying are continuously performed. Furthermore, in the above embodiment, the case where the present invention is applied to the cleaning process has been described. It is also possible to apply to a CVD process or an etching process. Furthermore, although the case where it applied to a semiconductor wafer was shown, it is not restricted to this, It can apply also to processing of other board | substrates, such as a board | substrate for liquid crystal display devices (LCD).
[0079]
【The invention's effect】
  As explained above,According to the present invention, since the drainage path of the processing chamber uses pipe fitting and sliding, the drainage path communicates with the processing chamber while the processing chamber slides. Sagging can be effectively prevented. Further, since the processing chamber slides, the object to be processed can be inserted while the processing chamber is retracted, and damage to the object to be processed is avoided.Further, when used as the inner chamber in the dual structure chamber, there is an advantage that the atmosphere of the outer chamber and the inner chamber can be easily separated. Therefore, running costs can be reduced by shortening the time required to adjust the atmosphere.Can be planned.
[0080]
  Furthermore, the processing chamber has a substantially frustoconical shape and is provided with a gradient at the bottom, which eliminates the need for processing formation of the guide groove for the processing liquid and reduces the manufacturing cost of the apparatus. It is possible to reliably flow into the drain. In addition, since the inner wall of the processing chamber is not uneven, it prevents the processing liquid from colliding with the unevenness and scattering and reattaching to the target object even when the target object is rotated in the processing chamber. Therefore, adhesion of particles or the like to the object to be processed is also prevented. In addition, since the disposition position of the discharge nozzle as the processing liquid supply means is an appropriate position that does not reattach to the substrate even if droplets adhering to the discharge nozzle scatter, It is possible to prevent the occurrence of non-uniformity such as liquid traces on the body and avoid the occurrence of defective products.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a cleaning processing apparatus according to an embodiment of the present invention.
FIG. 2 is a plan view showing a cleaning processing apparatus according to an embodiment of the present invention.
FIG. 3 is a cross-sectional view showing a cleaning processing unit according to an embodiment of the present invention.
4 is a cross-sectional view showing a state in which an inner chamber having a drain structure that can be contacted / separated is taken out of an outer chamber in the cleaning processing unit shown in FIG. 3;
5 is a cross-sectional view showing a state in which an inner chamber having a drain structure that can be contacted and separated in the cleaning processing unit shown in FIG. 3 is arranged inside the outer chamber.
FIG. 6 is a perspective view showing an embodiment of an inner chamber having a drain structure that can be contacted and separated.
7 is a front view and a sectional view of the inner chamber shown in FIG. 6. FIG.
FIG. 8 is a cross-sectional view showing a configuration in which a drain guide groove is provided in a body portion of a cylindrical chamber.
FIG. 9 is a cross-sectional view showing one form of fitting between a pipe portion and a cap portion that form a drain that can be contacted and separated.
FIG. 10 is a sectional view showing a form in which a ridge is provided below the drainage guiding member.
FIG. 11 is a cross-sectional view of a cleaning processing unit having a drain structure in which a drainage guide member and a drain pipe are communicated with each other by a bellows pipe.
FIG. 12 is a cross-sectional view of a cleaning processing unit having a drain structure in which a pipe member is fitted.
13 is a plan view of the cleaning processing unit shown in FIG. 12 as viewed from above.
14 is a cross-sectional view showing a fitting form of a pipe portion in the cleaning processing unit shown in FIG. 12. FIG.
FIG. 15 is a cross-sectional view of another cleaning processing unit having a drain structure fitted with a pipe member.
FIG. 16 is a cross-sectional view of still another cleaning processing unit having a drain structure in which a pipe member is fitted.
FIG. 17 is an explanatory view showing an arrangement position of a discharge nozzle on a body portion of the inner chamber shown in FIG.
18 is a cross-sectional view of a form in which the inclination direction of the bottom of the inner chamber is reversed in the cleaning processing unit shown in FIG.
FIG. 19 is an explanatory view showing a conventional cleaning processing unit.
[Explanation of symbols]
  1: Cleaning processing equipment
  2; In / Out Port
  3; Cleaning unit
  20: Cleaning processing section
  26; outer chamber
  27; inner chamber
  46; Treatment liquid outlet
  47; Drainage induction member
  48; tip
  49; drain pipe
  50; engaging portion
  51, 52; processing space
  54, 56; discharge nozzle
  75/76; Pipe members
  84; seal member
  W …… Semiconductor wafer (substrate)

Claims (12)

A liquid processing apparatus that performs liquid processing by supplying a predetermined processing liquid to an object to be processed,
A processing chamber formed in a cylindrical shape capable of storing an object to be processed;
A chamber moving mechanism for sliding the processing chamber between a processing position located in a substantially horizontal direction and a retracted position;
A processing liquid supply means for supplying a predetermined processing liquid to an object to be processed in the processing chamber;
A processing liquid outlet provided at the lower end of the processing chamber;
A drainage guiding member that communicates with the processing liquid outlet and guides the processing liquid discharged from the processing liquid outlet in a predetermined direction;
A drain pipe provided separately from the processing chamber on the processing position side of the processing chamber;
Comprising
The drainage guiding member and the drain pipe form a fitting portion in which one is fitted inside the other, and the treatment between the drainage guiding member and the drain pipe is performed in the fitting portion. Slidable in the sliding direction of the chamber,
The liquid processing apparatus is characterized in that the fitting portion is always in communication with the length changing according to the slide of the processing chamber . The liquid processing apparatus according to claim 1, characterized in that receiving the liquid subjected to treatment liquid dripping from the fitting portion below the engagement portion is disposed. The liquid processing apparatus according to claim 1 or claim 2, characterized in that the exhaust port is provided on an upper portion of the drain pipe at a distance from the fitting portion. A cover is disposed on the drainage guiding member so as to surround the fitting portion;
The cover liquid processing apparatus as claimed in any one of claims 3, characterized in that it comprises a drainage port formed in the lower and the exhaust port formed in the upper. Liquid treatment according to any one of claims 1 to claim 4, characterized in that the treatment liquid in the bottom of the processing chamber is 3 ° or more gradients provided to flow into the treatment liquid outlet port apparatus. The liquid processing apparatus according to claim 5 , wherein the gradient is 5 ° or more. Above breadth outside and above the range from the horizontal position of the processing liquid supply unit workpiece, any one of claim 6 that claim 1, characterized in that disposed in the process chamber The liquid processing apparatus as described in. A liquid processing apparatus that performs liquid processing by supplying a predetermined processing liquid to an object to be processed,
A holding member for holding the object to be processed;
A processing chamber for accommodating the object to be processed held by the holding member and performing liquid treatment;
Comprising
The processing chamber comprises
A substantially cylindrical body having a central axis extending in the horizontal direction;
A guide groove provided at the bottom of the body so as to incline downward from one end in the horizontal direction to the other end in order to collect the processing liquid;
A discharge port provided close to the lower end of the guide groove to discharge the processing liquid;
A liquid processing apparatus comprising: The liquid processing apparatus according to claim 8 , wherein an inclination angle of a bottom of the guide groove portion is 3 ° or more and 10 ° or less. A liquid processing apparatus that performs liquid processing by supplying a predetermined processing liquid to an object to be processed,
A holding member for holding the object to be processed;
A truncated cone-shaped body having a first circular end having a short diameter and a second circular end having a relatively larger diameter than the first circular end, and held by the holding member A processing chamber for storing a liquid to be processed and processing the liquid;
Comprising
In the processing chamber, the first bus bar of the body part extends in a horizontal direction at the uppermost part of the body part, and the second bus bar of the body part is a first circular shape at the lowermost part of the body part. Arranged to incline downward from the end toward the second circular end,
A liquid processing apparatus, wherein a discharge port for discharging a processing liquid from the processing chamber is provided in the vicinity of a lowermost portion of the second circular end portion. The liquid processing apparatus according to claim 10 , wherein an inclination angle of the second bus bar is 3 ° or more and 10 ° or less. The object to be processed is a disk,
A nozzle for supplying a processing liquid into the processing chamber;
The nozzle is located above a horizontal diameter line passing through the center of the disk in the processing chamber when viewed from the central axis direction of the disk with the disk held by the holding member. It is arrange | positioned in the area | region of the outer side of the perpendicular line which passes along the intersection of this horizontal diameter line and the outer periphery of the said disk, It is any one of Claims 8-11 characterized by the above-mentioned. Liquid processing equipment.

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