JP4003206B2 - Heat treatment apparatus and heat treatment method - Google Patents
Heat treatment apparatus and heat treatment method Download PDFInfo
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Description
【０００１】
【発明の属する技術分野】
本発明は、ガラス基板、半導体基板、プリント基板等の板状被処理物およびその上に形成される絶縁性、導電性あるいはマスク形成用等の膜を加熱、降温する熱処理装置および熱処理方法に関する。
【０００２】
【従来の技術】
従来の熱処理装置として、例えば連続炉のように、複数の熱処理ゾーンを備え、被処理物が、第１熱処理ゾーンから最終熱処理ゾーンを経て搬出されるまでの間に被処理物に対して段階的な温度変化（以下、単に熱処理という）をさせるものがある。
【０００３】
なお、段階的な温度変化とは、予熱、本加熱のような複数段階加熱の他、加熱、冷却の組み合わせも含むものとする。
【０００４】
【発明が解決しようとする課題】
例えば、リフロー処理を行う際、近年環境保全の観点から、鉛を含まないはんだが用いられている。このようなはんだは酸化しやすいため、酸素濃度を低くする必要があり、Ｎ２雰囲気において処理を行うのが一般的である。しかしながら、上記、従来の熱処理装置は、連続炉であるため、被処理物搬入出口から外気が侵入するとともに、Ｎ２ガスが搬入出口から外部に漏れるので酸素濃度を低くするためにはＮ２ガスを炉内に大量に供給する必要があるという問題がある。
【０００５】
また、上記熱処理装置においては、被処理物搬送中の振動が避けられない。このため、例えば、上記熱処理装置によって被処理物である基板に膜を焼成するさい、焼成される膜厚さが均一でなくなる、あるいは、はんだバンプを形成するさいにバンプの形状が歪んだり不揃いになったりすることがあるという問題が生じる。
【０００６】
その他、熱処理装置内に設けられる搬送装置や両端開口からの熱ロスの問題、熱処理装置の大型化という問題などもある。また、搬送装置による発塵も避けられない。さらに、被処理物によっては搬送に適していない形状のものもある。
【０００７】
本発明は、上記問題を解決することを課題とし、不活性ガスの使用量が少なく迅速かつ再現性よく容易に低酸素濃度で熱処理できる熱処理装置を提供することを目的とする。また、被処理物が搬送されることなく、従って被処理物の搬送による上記問題の発生することのない熱処理装置を提供することを目的とする。さらに、熱ロスが小さく小型であり、被処理物の形状によらず熱処理を高い精度で行える熱処理装置を提供することを目的とする。
【０００８】
【課題を解決するための手段】
上記課題を解決するために、本発明の熱処理装置は、熱処理室内で被処理物を熱処理する熱処理装置であって、熱処理室内を真空引きする真空引手段と、熱処理室の被処理物搬入出口を開閉する扉と、板状被処理物が載置されるとともに載置された被処理物を加熱、冷却する被処理物熱処理板と、熱処理板上の被処理物を輻射加熱する輻射加熱装置とを備え、熱処理板の内部に伸縮性を有する膜状仕切部材によって相互に離隔された流路が設けられ、輻射加熱装置と熱処理板内に異なる温度の熱媒体を流すこととで熱処理板上に載置された被処理物に熱処理を施すことを特徴とするものである。
【０００９】
この熱処理装置によれば、熱処理室内に被処理物を搬入した後、扉によって搬入出口を閉じ、熱処理室内を密閉した状態で、真空引を行って処理室内の酸素濃度を低くすることができる。
【００１０】
また、被処理物を搬送することなく、熱処理できるので、熱処理中に被処理物が振動することがない。そして、被処理物を搬送している間に熱処理を行うものではないので、被処理物の搬送スペースが必要でなく装置が小型になり、熱ロスが小さくなる。しかも搬送するのに適さない形状の被処理物をも高い精度で熱処理を行える。また、装置が小型であるので熱処理室を形成するために大がかりな耐圧容器や真空排気系を必要とせず、装置を安価にすることができる。
【００１１】
また、本発明の熱処理方法は、熱処理室内において、伸縮性を有する膜状仕切部材によって相互に離隔された流路が内部に形成された被処理物熱処理板に載置された被処理物に対して熱処理を行う方法であって、熱処理室内を真空引きする工程と、熱処理室内に所定のガスを導入する工程と、一方の流路に流れる第１熱媒体により被処理物を温度変化させる行程と、輻射加熱装置によって被処理物を温度変化させる行程と、さらに、他方の流路へ第２熱媒体を流して被処理物を温度変化させる行程を備えているものである。
【００１２】
この方法においても上記と同様の効果が得られる。
【００１３】
上記熱処理装置は、雰囲気ガスなどを供給するガス供給手段および処理室内のガスを外部に排出するガス排出手段を備えているのが通常である。
【００１４】
そして、ガス供給手段およびガス排出手段により形成される気流によって処理室内部の、例えばフラックス蒸気などの不要物が処理室外部に排出される。
【００１５】
加熱は、熱処理板および輻射加熱装置によって行われ、また、被処理物を熱処理板によって下方から冷却して降温させることができるので、被処理物に熱風および冷風を吹き付ける必要がなく、膜やバンプの形状が歪んだり不揃いになったりすることがない。また、降温時には、被処理物側から上側に向かって膜やはんだが固まるので、ボイド等の欠陥が生成することがない。
【００１６】
熱処理板としては内部が中空であり、この中空部分に１または２以上の板状仕切部材が、仕切部材に対して垂直な方向に移動自在に設けられて熱処理板内に２つ以上の流路が形成されており、一つの流路に熱媒体が流されたときに、板状仕切部材が移動して残りの流路が閉じられるものがある。
【００１７】
また、他の熱処理板として内部が中空であり、この中空部分に１または２以上の膜状仕切部材が設けられ、熱処理板内に２つ以上の流路が形成され、一つの流路に熱媒体が流されたときに、膜状仕切部材が変形して他の流路が閉じられるものなどがある。
【００１８】
【発明の実施の形態】
以下、図面を参照して本発明の実施形態について説明する。
【００１９】
図１に示された第１の実施形態の熱処理装置は、断熱壁によって形成された熱処理室(1)と、熱処理室(1)内に上下に間隔をおいて配され、熱処理室(1)内を複数、例えば、３つの熱処理空間(1a)に気密に分割している隔壁(8)と、隔壁(8)に取り付けられた遮熱板(2)と、各熱処理空間(1a)に１つ設けられた水平状被処理物熱処理板(4)と、各熱処理板(4)の上側に配されたガス供給兼輻射加熱装置(3)と、処理室(1)の前壁に上下に間隔をおいて形成された複数の被処理物搬入出口を開閉する複数の扉(5)と、処理室(1)の後壁を貫通して処理室(1)内の熱処理板(4)の周囲に開口した複数の真空引兼ガス排出管(6)とを備えている。そして、被処理物熱処理板(4)上に被処理物である基板（被処理物）(P)が配されている。なお、図示は省略したが熱処理装置の前方には公知の被処理物搬入出装置が配されており、この搬入出装置によって被処理物(P)が搬入出される。また、各熱処理空間(1a)はそれぞれ独立して熱処理を行えるようになっている。
【００２０】
ガス供給兼輻射加熱装置(3)は、赤外線や遠赤外線を放射する棒状ランプや棒状ヒータなどが複数並べて収められたハウジングと、ハウジングを貫通した冷却媒体流路(3a)とを備えている。流路(3a)はバルブ(B9)(B10)を介して図示しない冷却媒体供給源に接続されている。さらに、ハウジングには図示しないガス供給管が接続されていると共に、ハウジングの下面には内部に収められた棒状ランプなどを避けて、複数のガス供給用開口があけられ、この開口からガスが供給されるようになっている。用いるガスは目的によって異なるが、通常Ｎ２や不活性ガス等が雰囲気ガスとして用いられる。
【００２１】
中空熱処理板(4)内には膜状仕切部材(10)が設けられている。膜状仕切部材(10)は、伸縮性を有し、図２に実線で示したように周端が熱処理板(4)の周壁内面の高さの中央に固定されて熱処理板(4)を上下に２分割している。なお、膜状仕切部材(10)の状態は熱処理板(4)内の第１、第２熱媒体の量により変化する。
【００２２】
熱処理板(4)の最下部に第１熱媒体導入管(11)と第１熱媒体導出管(12)とがそれぞれ接続されている。熱処理板(4)の最上部には第２熱媒体導入管(13)と第２熱媒体導出管(14)とがそれぞれ接続されている。なお、各管(11)(12)(13)(14)にはバルブ(B5)(B6)(B7)(B8)が設けられている。また、熱媒体導入管(11)(13)および熱媒体導出管(12)(14)はそれぞれ第１、第２熱媒体供給源に接続され、後に述べる様に熱処理板(4)内を流れた熱媒体を回収して再利用するようになっている。
【００２３】
図２には、熱処理板(4)内に等量の第１、第２熱媒体が入っている状態が示されているが、膜状仕切部材(10)の状態は熱処理板(4)内の第１、第２熱媒体の量により変化する。なお、図示は省略したが、各熱媒体貯留槽と熱処理板(4)とを結ぶ配管部分は、断熱材により覆われて保温されている。
【００２４】
真空引兼ガス排出管(6)は、熱処理室(1)の外部で分岐し、一方がバルブ(B1)を介して真空引ポンプに、他方がバルブ(B2)を介して排気管に接続されている。
【００２５】
この熱処理装置を例えば、半導体ウェハ上に多数のはんだバンプを形成する工程ではんだリフロー装置として用いる場合について以下に述べるが、この熱処理装置によって他の熱処理を行うことも可能である。また、熱処理板(4)上にボール状のはんだ(B)が載せられた被処理物(P)を載置し、熱処理後に取り出す手順は公知のものであるので、以下、１つの熱処理空間(1a)内の熱処理板(4)上に載置された被処理物(P)にはんだリフローを施す手順について詳細に説明する。なお、独立に運転される他の空間(1a)についても同様の手順で熱処理が行われる。
【００２６】
まず、被処理物(P)が熱処理空間(1a)内の熱処理板(4)に載置された後、扉(5)が閉じられて熱処理空間(1a)が密封される。そして、予め閉じられていたバルブ(B1)(B2)のうち、バルブ(B1)が開かれて真空引ポンプによって熱処理空間(1a)内が真空引きされる。熱処理空間(1a)内が、真空引きされてバルブ(B1)が閉じられた後、熱処理空間(1a)内にＮ２ガスが供給される。
【００２７】
ついでバルブ(B5)(B7)が閉じられ、かつバルブ(B6)(B8)が開かれた状態からバルブ(B5)が開かれ、第１熱媒体導入管(11)から第１熱媒体が熱処理板(4)内に流れ込み、図２に二点鎖線で示したように、膜状仕切部材(10)が上方へと膨らむ。そして、膜状仕切部材(10)は、周壁内面の上半分、上壁内面に沿う形状となり、熱処理板(4)内が第１熱媒体によって満たされる。これによって被処理物(P)を予熱する。この後、バルブ(B5)を閉じ、輻射加熱装置(3)により被処理物(P)を本加熱する。リフロー時には、図２中に二点鎖線で示したようにガス供給兼輻射加熱装置(3)によって上方中央部分から予熱されたＮ２ガスが供給される。このさい、バルブ(B1)は既に閉じられており、バルブ(B2)が開かれて熱処理板(4)の側方周囲の真空引兼ガス排出管(6)からガスが排出される。そして、図２中に実線で示すように、リフロー時に発生したフラックス蒸気は、ガスの気流に乗って熱処理板(4)の側方周囲のガス排出管(6)からガスとともに排出されるので熱処理空間(1a)内は常にクリーンに保たれる。なお、図２中には輻射加熱装置(3)からの輻射熱の流れが破線で示されている。
【００２８】
つぎに、輻射加熱をやめ、同時にバルブ(B7)を開く。そして、第２熱媒体が熱処理板(4)内に流れ込む。このさい、既にバルブ(B5)は閉じられ、熱処理板(4)内の第１熱媒体には圧力がかかっていないので、第２熱媒体が熱処理板(4)内に流れ込むにつれて第１熱媒体が熱処理板(4)の外部へと押しやられ、膜状仕切部材(10)は下方へと膨らむ。そして、膜状仕切部材(10)は、周壁内面の下半分、下壁内面に沿う形状となり、熱処理板(4)内が第２熱媒体によって満たされる。このようにして被処理物(P)が所定温度に降温される。
【００２９】
なお、輻射加熱装置(3)を冷却することにより被処理物(P)の冷却をいっそう早めることができる。さらに、次の処理の初期条件を一定にできるので処理の再現性を高めることができ、均一な処理を高いスループットで行うことができる。また、この熱処理装置は、真空パージ式であるため、被処理物(P)の処理に要するサイクルタイムが短くなる。
【００３０】
第１、第２熱媒体は使用温度によって適宜選択すればよい。加熱時間および降温時間も適宜選択すればよい。降温ははんだが流動しなくなった後であれば冷風によって行ってもよい
また、熱処理板(4)は熱伝導性のよい材料製であることが好ましい。具体的には、アルミニウム製や銅製などがよい。
【００３１】
本発明の熱処理装置は上記実施形態の構成に限定されるものではなく、適宜変更自在である。例えば、各バルブの開閉のタイミングと輻射加熱装置のオン、オフのタイミングとは、必ずしも上記のようには限定されず、目的により逐次最適なタイミングの組み合わせを選択すればよい。また、ガス供給管、ガス排出管の構成や熱処理板の構成も上記に限定されないことはもちろんである。例えば、ガス供給管が輻射加熱装置とは別に設けられていてもよいし、複数系統のガス供給管が設けられていてもよい。また、真空引管はガス排出管と共通としてもよいし、ガス排出管と別に設けてもよい。
【００３２】
さらに、第１と第２の熱媒体の流路を入れ替えてもよい。また輻射加熱装置により加熱した後に、２段階に降温することもできる。従って本発明の装置は、第１熱媒体および第２熱媒体の温度を適宜選択することによって被処理物を段階的に加熱することや加熱および冷却を組み合わせた熱処理を行うことができる。
【００３３】
すなわち、上記の様に２段階加熱の後に降温するだけでなく、例えば３段階に加熱することもできる。特に内部を多分割された熱処理板においては、熱媒体が混ざること無く多段階の熱処理ができる。さらには、熱処理装置は、はんだリフローのみならず、各種基板および基板表面に形成された各種の膜の熱処理にも利用できる。
【００３４】
なお、熱処理板内の流路は２つ以上であればよく、上記実施形態のように流路が２つのものには限定されない。また、実施形態で熱処理空間の数を３としたのは説明の便宜のためであってそれ以外の理由はない。なお、熱処理板によって行われる熱処理は熱媒体の温度によって定められるものであり、加熱、降温のいずれをも行うことができる。また、このように熱処理空間を上下に複数設ければ複数の被処理物を一度に処理できかつ設置面積の少ない熱処理装置を得ることができる。
【図面の簡単な説明】
【図１】本発明の１実施形態における熱処理装置の断面図である。
【図２】同熱処理装置の熱処理板周辺部分の拡大断面図である。
【符号の説明】
(1) 熱処理室
(3) ガス供給兼輻射加熱装置
(4) 熱処理板
(5) 扉
(6) 真空引兼ガス排出管（真空引手段）
(P) 被処理物（基板）[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a heat treatment apparatus and a heat treatment method for heating and lowering a plate-like object to be processed such as a glass substrate, a semiconductor substrate, and a printed circuit board and a film formed thereon for insulation, conductivity, or mask formation.
[0002]
[Prior art]
As a conventional heat treatment apparatus, a plurality of heat treatment zones are provided as in a continuous furnace, for example, in a stepwise manner with respect to the object to be processed until the object is unloaded from the first heat treatment zone through the final heat treatment zone. There are those that cause a significant temperature change (hereinafter simply referred to as heat treatment).
[0003]
The stepwise temperature change includes a combination of heating and cooling in addition to a plurality of steps of heating such as preheating and main heating.
[0004]
[Problems to be solved by the invention]
For example, when performing a reflow process, in recent years, solder containing no lead is used from the viewpoint of environmental protection. Since such solder easily oxidizes, it is necessary to reduce the oxygen concentration, and the treatment is generally performed in an N 2 atmosphere. However, above conventional heat treatment apparatus, since a continuous reactor, along with outside air entering from the object to be processed out port, for N 2 gas is low oxygen concentration so leaks to the outside from the transfer port is N 2 gas There is a problem that it is necessary to supply a large amount of gas into the furnace.
[0005]
Further, in the above heat treatment apparatus, vibration during conveyance of the workpiece is inevitable. For this reason, for example, when the film is baked on the substrate which is the object to be processed by the heat treatment apparatus, the baked film thickness is not uniform, or the bump shape is distorted or uneven when the solder bump is formed. The problem that it may become.
[0006]
In addition, there is a problem of heat loss from the transfer device provided in the heat treatment apparatus and the opening at both ends, and a problem of enlargement of the heat treatment apparatus. Also, dust generation by the transfer device is inevitable. Furthermore, some objects to be processed have shapes that are not suitable for conveyance.
[0007]
An object of the present invention is to provide a heat treatment apparatus that can easily and quickly perform heat treatment at a low oxygen concentration with a small amount of use of an inert gas and good reproducibility. It is another object of the present invention to provide a heat treatment apparatus in which the object to be processed is not transferred, and therefore the above-mentioned problem due to the transfer of the object to be processed does not occur. It is another object of the present invention to provide a heat treatment apparatus that has a small heat loss and is small and that can perform heat treatment with high accuracy regardless of the shape of the workpiece.
[0008]
[Means for Solving the Problems]
In order to solve the above problems, a heat treatment apparatus of the present invention is a heat treatment apparatus for heat treating an object to be processed in a heat treatment chamber, and includes a vacuum drawing means for evacuating the heat treatment chamber, and an object loading / unloading port of the heat treatment chamber. A door that opens and closes; a heat treatment plate on which a plate-like object to be treated is placed and which heats and cools the placed object; and a radiation heating device that radiates and heats the object on the heat treatment plate The heat treatment plate is provided with flow paths separated from each other by a stretchable membrane-like partition member, and a heat medium having different temperatures is allowed to flow in the heat treatment plate on the heat treatment plate. A heat treatment is performed on the workpiece to be placed.
[0009]
According to this heat treatment apparatus, after carrying an object to be processed into the heat treatment chamber, the oxygen concentration in the treatment chamber can be lowered by evacuation with the door closed by the door and the heat treatment chamber sealed.
[0010]
Moreover, since it can heat-process without conveying a to-be-processed object, a to-be-processed object does not vibrate during heat processing. In addition, since heat treatment is not performed while the object to be processed is being conveyed, a space for conveying the object to be processed is not required, the apparatus is downsized, and heat loss is reduced. In addition, a workpiece having a shape that is not suitable for transport can be heat-treated with high accuracy. Further, since the apparatus is small, a large pressure vessel or vacuum exhaust system is not required to form the heat treatment chamber, and the apparatus can be made inexpensive.
[0011]
Further, the heat treatment method of the present invention is applied to an object to be processed placed on an object to be processed heat treatment plate in which flow paths separated from each other by a stretchable membrane partition member are formed in the heat treatment chamber. a method of performing heat treatment Te, a step of evacuating the heat treatment chamber, introducing a predetermined gas into the heat treatment chamber, a step for temperature change treatment object by the first heat medium flowing through the one flow channel The process includes a process of changing the temperature of the object to be processed by the radiant heating device, and a process of changing the temperature of the object to be processed by flowing the second heat medium through the other flow path.
[0012]
In this method, the same effect as described above can be obtained.
[0013]
The heat treatment apparatus usually includes a gas supply means for supplying atmospheric gas and the like and a gas discharge means for discharging the gas in the processing chamber to the outside.
[0014]
Unnecessary substances such as flux vapor inside the processing chamber are discharged outside the processing chamber by the air flow formed by the gas supply unit and the gas discharge unit.
[0015]
Heating is performed by a heat treatment plate and a radiant heating device, and since the object to be processed can be cooled by the heat treatment plate from below to lower the temperature, it is not necessary to blow hot air and cold air on the object to be processed, and a film or bump The shape is not distorted or irregular. Further, when the temperature is lowered, since the film and the solder are hardened from the workpiece side to the upper side, defects such as voids are not generated.
[0016]
The inside of the heat treatment plate is hollow, and one or more plate-like partition members are provided in the hollow portion so as to be movable in a direction perpendicular to the partition member, and two or more flow paths are provided in the heat treatment plate. In some cases, when a heat medium is caused to flow through one flow path, the plate-shaped partition member moves and the remaining flow paths are closed.
[0017]
Further, the other heat treatment plate is hollow inside, and one or two or more membrane partition members are provided in the hollow portion, two or more flow paths are formed in the heat treatment plate, and one flow path is heated. In some cases, when the medium is flowed, the membrane-shaped partition member is deformed and the other flow paths are closed.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0019]
The heat treatment apparatus according to the first embodiment shown in FIG. 1 is provided with a heat treatment chamber (1) formed by heat insulation walls and a heat treatment chamber (1) arranged at intervals in the heat treatment chamber (1). A plurality of, for example, a partition wall (8) that is hermetically divided into three heat treatment spaces (1a), a heat shield (2) attached to the partition wall (8), and one heat treatment space (1a) Two horizontal heat treatment plates (4), a gas supply and radiation heating device (3) disposed above each heat treatment plate (4), and a front wall of the treatment chamber (1) up and down. A plurality of doors (5) for opening and closing a plurality of workpiece loading / unloading ports formed at intervals, and a heat treatment plate (4) in the processing chamber (1) through the rear wall of the processing chamber (1). A plurality of vacuuming and gas discharge pipes (6) opened in the periphery are provided. A substrate (object to be processed) (P) as an object to be processed is arranged on the object to be processed heat treatment plate (4). Although not shown, a known workpiece loading / unloading device is disposed in front of the heat treatment apparatus, and the workpiece (P) is loaded / unloaded by the loading / unloading device. Each heat treatment space (1a) can be independently heat treated.
[0020]
The gas supply and radiant heating device (3) includes a housing in which a plurality of rod-shaped lamps, rod-shaped heaters, and the like that radiate infrared rays and far infrared rays are arranged side by side, and a cooling medium passage (3a) that penetrates the housing. The flow path (3a) is connected to a cooling medium supply source (not shown) via valves (B9) and (B10). In addition, a gas supply pipe (not shown) is connected to the housing, and a plurality of gas supply openings are opened on the lower surface of the housing, avoiding a rod-like lamp housed therein, and gas is supplied from these openings. It has come to be. Although the gas to be used varies depending on the purpose, N 2 , inert gas or the like is usually used as the atmospheric gas.
[0021]
A membrane partition member (10) is provided in the hollow heat treatment plate (4). The membrane-like partition member (10) has elasticity, and as shown by a solid line in FIG. 2, the peripheral end is fixed to the center of the inner surface of the peripheral wall of the heat treatment plate (4), and the heat treatment plate (4) is fixed. Divided into two vertically. The state of the membrane partition member (10) varies depending on the amounts of the first and second heat media in the heat treatment plate (4).
[0022]
A first heat medium introduction pipe (11) and a first heat medium outlet pipe (12) are connected to the lowermost part of the heat treatment plate (4). A second heat medium introduction pipe (13) and a second heat medium outlet pipe (14) are connected to the uppermost part of the heat treatment plate (4). Each pipe (11) (12) (13) (14) is provided with a valve (B5) (B6) (B7) (B8). The heat medium introduction pipes (11) and (13) and the heat medium outlet pipes (12) and (14) are connected to the first and second heat medium supply sources, respectively, and flow through the heat treatment plate (4) as described later. The recovered heat medium is recovered and reused.
[0023]
FIG. 2 shows a state in which equal amounts of the first and second heat media are contained in the heat treatment plate (4), but the state of the membrane partition member (10) is in the heat treatment plate (4). It varies depending on the amount of the first and second heat medium. In addition, although illustration was abbreviate | omitted, the piping part which connects each heat medium storage tank and the heat processing board (4) is covered with the heat insulating material, and is heat-retained.
[0024]
The vacuuming / gas discharge pipe (6) branches outside the heat treatment chamber (1), one is connected to the vacuum pump via the valve (B1) and the other is connected to the exhaust pipe via the valve (B2). ing.
[0025]
For example, a case where this heat treatment apparatus is used as a solder reflow apparatus in a process of forming a large number of solder bumps on a semiconductor wafer will be described below, but other heat treatments can be performed by this heat treatment apparatus. In addition, since the procedure for placing the workpiece (P) on which the ball-shaped solder (B) is placed on the heat treatment plate (4) and taking it out after the heat treatment is a known procedure, hereinafter, one heat treatment space ( A procedure for performing solder reflow on the workpiece (P) placed on the heat treatment plate (4) in 1a) will be described in detail. The heat treatment is performed in the same procedure for the other space (1a) that is operated independently.
[0026]
First, after the workpiece (P) is placed on the heat treatment plate (4) in the heat treatment space (1a), the door (5) is closed and the heat treatment space (1a) is sealed. Of the previously closed valves (B1) and (B2), the valve (B1) is opened, and the heat treatment space (1a) is evacuated by the vacuum pump. After the heat treatment space (1a) is evacuated and the valve (B1) is closed, N 2 gas is supplied into the heat treatment space (1a).
[0027]
Then, the valves (B5) and (B7) are closed and the valves (B6) and (B8) are opened. Then, the valve (B5) is opened, and the first heat medium is heat-treated from the first heat medium introduction pipe (11). As shown by the two-dot chain line in FIG. 2, the membrane partition member (10) swells upward as it flows into the plate (4). The membrane partition member (10) has a shape along the upper half of the inner surface of the peripheral wall and the inner surface of the upper wall, and the heat treatment plate (4) is filled with the first heat medium. As a result, the workpiece (P) is preheated. Thereafter, the valve (B5) is closed, and the object to be processed (P) is heated by the radiant heating device (3). At the time of reflow, N 2 gas preheated from the upper central portion by the gas supply and radiant heating device (3) is supplied as shown by a two-dot chain line in FIG. At this time, the valve (B1) is already closed, the valve (B2) is opened, and the gas is discharged from the vacuuming / gas discharge pipe (6) around the side of the heat treatment plate (4). As shown by the solid line in FIG. 2, the flux vapor generated during the reflow is carried along with the gas flow and discharged from the gas discharge pipe (6) around the side of the heat treatment plate (4) together with the gas. The space (1a) is always kept clean. In FIG. 2, the flow of radiant heat from the radiant heating device (3) is indicated by a broken line.
[0028]
Next, stop radiant heating and open the valve (B7) at the same time. Then, the second heat medium flows into the heat treatment plate (4). At this time, since the valve (B5) is already closed and no pressure is applied to the first heat medium in the heat treatment plate (4), the first heat medium flows as the second heat medium flows into the heat treatment plate (4). Is pushed out of the heat treatment plate (4), and the membrane partition member (10) swells downward. The membrane partition member (10) has a shape along the lower half of the inner surface of the peripheral wall and the inner surface of the lower wall, and the heat treatment plate (4) is filled with the second heat medium. In this way, the workpiece (P) is lowered to a predetermined temperature.
[0029]
Note that the object to be treated (P) can be further cooled by cooling the radiant heating device (3). Furthermore, since the initial conditions for the next process can be made constant, the reproducibility of the process can be improved, and a uniform process can be performed with a high throughput. In addition, since this heat treatment apparatus is of a vacuum purge type, the cycle time required for processing the workpiece (P) is shortened.
[0030]
What is necessary is just to select a 1st, 2nd heat medium suitably according to use temperature. What is necessary is just to select a heating time and temperature fall time suitably. The temperature may be lowered by cold air as long as the solder stops flowing. The heat treatment plate (4) is preferably made of a material having good thermal conductivity. Specifically, aluminum or copper is preferable.
[0031]
The heat processing apparatus of this invention is not limited to the structure of the said embodiment, It can change suitably. For example, the opening / closing timing of each valve and the on / off timing of the radiant heating device are not necessarily limited as described above, and an optimal combination of timings may be selected sequentially according to the purpose. Of course, the configuration of the gas supply pipe and the gas discharge pipe and the configuration of the heat treatment plate are not limited to the above. For example, the gas supply pipe may be provided separately from the radiant heating device, or a plurality of gas supply pipes may be provided. The vacuum drawing tube may be shared with the gas discharge tube, or may be provided separately from the gas discharge tube.
[0032]
Furthermore, the first and second heat medium flow paths may be interchanged. Further, the temperature can be lowered in two stages after being heated by the radiant heating device. Therefore, the apparatus of the present invention can perform a heat treatment in which the object to be processed is heated in stages or a combination of heating and cooling by appropriately selecting the temperatures of the first heat medium and the second heat medium.
[0033]
That is, not only the temperature is lowered after the two-stage heating as described above, but also the three-stage heating can be performed. In particular, in a heat treatment plate having a multi-divided interior, multi-stage heat treatment can be performed without mixing the heat medium. Furthermore, the heat treatment apparatus can be used not only for solder reflow but also for heat treatment of various substrates and various films formed on the substrate surface.
[0034]
In addition, the flow path in a heat processing board should just be two or more, and is not limited to a thing with two flow paths like the said embodiment. Also, to that three the number of the heat treatment space in implementation form is not some other reason be for convenience of explanation. Note that the heat treatment performed by the heat treatment plate is determined by the temperature of the heat medium, and either heating or temperature lowering can be performed. In addition, if a plurality of heat treatment spaces are provided above and below in this manner, a heat treatment apparatus that can process a plurality of objects to be processed at a time and has a small installation area can be obtained.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a heat treatment apparatus according to an embodiment of the present invention.
FIG. 2 is an enlarged cross-sectional view of the periphery of the heat treatment plate of the heat treatment apparatus.
[Explanation of symbols]
(1) Heat treatment room
(3) Gas supply and radiation heating device
(4) Heat treatment plate
(5) Door
(6) Vacuuming and gas exhaust pipe (evacuation means)
(P) Object to be processed (substrate)
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001011872A JP4003206B2 (en) | 2001-01-19 | 2001-01-19 | Heat treatment apparatus and heat treatment method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001011872A JP4003206B2 (en) | 2001-01-19 | 2001-01-19 | Heat treatment apparatus and heat treatment method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002213882A JP2002213882A (en) | 2002-07-31 |
| JP4003206B2 true JP4003206B2 (en) | 2007-11-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2001011872A Expired - Fee Related JP4003206B2 (en) | 2001-01-19 | 2001-01-19 | Heat treatment apparatus and heat treatment method |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007214165A (en) * | 2006-02-07 | 2007-08-23 | Casio Comput Co Ltd | Reflow device and reflow method |
| KR100721762B1 (en) * | 2006-10-02 | 2007-05-25 | 한국고요써모시스템(주) | Lcd glass heat treatment oven of shutter |
| JP2008284557A (en) * | 2007-05-15 | 2008-11-27 | Shinko Seiki Co Ltd | Heating/cooling apparatus |
| JP6388041B2 (en) * | 2017-01-27 | 2018-09-12 | 株式会社九州日昌 | Heating apparatus and heating method |
| DE102019116290A1 (en) * | 2019-06-14 | 2020-12-17 | Werkzeugbau Siegfried Hofmann Gmbh | Device for soldering |
| CN116287627B (en) * | 2022-09-09 | 2023-09-05 | 马鞍山庞博铸业有限公司 | Heat treatment equipment for producing wear-resistant lining plate |
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