JP4003205B2 - Heat treatment equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a heat treatment apparatus and method for heating and cooling a plate-like object to be processed such as a glass substrate, a semiconductor substrate, and a printed board, and an insulating, conductive, or mask forming film formed thereon.
[0002]
[Prior art]
As a conventional heat treatment apparatus, a plurality of heat treatment zones are provided as in a continuous furnace, for example, in a stepwise manner with respect to the object to be processed until the object is unloaded from the first heat treatment zone through the final heat treatment zone. There are those that cause a significant temperature change (hereinafter simply referred to as heat treatment).
[0003]
The stepwise temperature change includes a combination of heating and cooling in addition to a plurality of steps of heating such as preheating and main heating.
[0004]
[Problems to be solved by the invention]
The conventional heat treatment apparatus has a problem that flux vapor is generated and adheres to the heat treatment apparatus, for example, as in a solder reflow process. Furthermore, vibrations during transfer of the workpiece are inevitable. For this reason, for example, when the film is baked on the substrate which is the object to be processed by the heat treatment apparatus, the baked film thickness is not uniform, or the bump shape is distorted or uneven when the solder bump is formed. The problem arises.
[0005]
In addition, there is a problem of heat loss from the transfer device provided in the heat treatment apparatus and the opening at both ends, and a problem of enlargement of the heat treatment apparatus. Also, dust generation by the transfer device is inevitable. Furthermore, some objects to be processed have shapes that are not suitable for conveyance.
[0006]
An object of the present invention is to solve the above-described problems, and an object of the present invention is to provide a heat treatment apparatus in which unnecessary substances such as flux do not adhere inside during heat treatment. It is another object of the present invention to provide a heat treatment apparatus in which the object to be processed is not transferred, and therefore the above-mentioned problem due to the transfer of the object to be processed does not occur. It is another object of the present invention to provide a heat treatment apparatus that has a small heat loss and is small and that can perform heat treatment with high accuracy regardless of the shape of the workpiece.
[0007]
[Means for Solving the Problems]
In order to solve the above problems, the heat treatment apparatus of the present invention comprises:
A heat treatment apparatus for heat-treating an object to be processed in a heat treatment chamber, wherein a plate-like object to be processed is placed and a heat-treating object heat-treating plate for heating and cooling the placed object to be processed, and a substrate on the heat-treating plate It consists of a radiant heating device that radiates and heats the processed material, a gas supply means that supplies gas into the heat treatment chamber, and a gas discharge means that discharges the gas inside the heat treatment chamber to the outside. And an unnecessary material discharging means that discharges the airflow generated by the means to the outside of the heat treatment chamber, and the heat treatment plate is provided with a flow path separated from each other by a stretchable film-shaped partition member inside the heat treatment plate. The heat treatment is performed on the object to be processed placed on the heat treatment plate by flowing heat media having different temperatures through one flow path and the other flow path of the apparatus and the heat treatment plate.
Furthermore, another heat treatment apparatus of the present invention according to the present invention is
A heat treatment apparatus for heat-treating an object to be processed in a heat treatment chamber, wherein a plate-like object to be processed is placed and a heat-treating object heat-treating plate for heating and cooling the placed object to be processed, and a substrate on the heat-treating plate It consists of a radiant heating device that radiates and heats the processed material, a gas supply means that supplies gas into the heat treatment chamber, and a gas discharge means that discharges the gas inside the heat treatment chamber to the outside. And an unnecessary material discharging means that discharges the air generated by the means to the outside of the heat treatment chamber, the heat treatment plate is provided with a flow path separated from each other by a horizontal plate-shaped partition member that can move up and down, and radiation A heat medium having different temperatures is allowed to flow through one flow path and the other flow path of the heating device and the heat treatment plate to heat-treat the object to be processed placed on the heat treatment plate .
[0008]
According to this heat treatment apparatus, for example, flux vapor generated during solder reflow is discharged to the outside together with the internal gas, so that the flux does not adhere to the inside of the heat treatment chamber.
[0009]
Moreover, since it can heat-process without conveying a to-be-processed object, a to-be-processed object does not vibrate during heat processing. In addition, since heat treatment is not performed while the object to be processed is being conveyed, a space for conveying the object to be processed is not required, the apparatus is downsized, and heat loss is reduced. In addition, a workpiece having a shape that is not suitable for transport can be heat-treated with high accuracy.
[0010]
Heating is performed by a heat treatment plate and a radiant heating device, and since the object to be processed can be cooled by the heat treatment plate from below to lower the temperature, it is not necessary to blow hot air and cold air on the object to be processed, and a film or bump The shape will not be distorted or irregular. Further, when the temperature is lowered, since the film and the solder are hardened from the workpiece side to the upper side, defects such as voids are not generated.
[0011]
The inside of the heat treatment plate is hollow, and a plate-like partition member that divides the hollow portion into two is provided so as to be movable in a direction perpendicular to the partition member, so that two flow paths are formed in the heat treatment plate. When the heat medium is flowed in one flow path, the plate-shaped partition member moves and the other flow path is closed, and when the heat medium is flowed in the other flow path, the plate-shaped partition Some members move to close one channel.
[0012]
Also, when the inside is hollow and two flow paths are formed in the heat treatment plate by the film-shaped partitioning member that partitions the hollow portion into two, when the heat medium is flowed into one flow path, the film-shaped partition In some cases, when the member is deformed and the other flow path is closed and a heat medium is passed through the other flow path, the membrane partition member is deformed and the one flow path is closed.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0014]
The heat treatment apparatus according to the first embodiment shown in FIG. 1 is provided with a heat treatment chamber (1) formed by heat insulation walls and a heat treatment chamber (1) arranged at intervals in the heat treatment chamber (1). A plurality of, for example, a heat insulating partition wall (2) that is divided into three spaces (1a), a horizontal object heat treatment plate (4) provided in each space (1a), and each heat treatment A radiation heating device (3) disposed on the upper side of the plate (4), and a plurality of doors for opening and closing a plurality of workpiece loading / unloading ports formed at intervals in the vertical direction on the front wall of the processing chamber (1) ( 5), a plurality of gas supply pipes (6) connected to the upper part of each space (1a) in the processing chamber (1) through the rear wall of the processing chamber (1), and the processing chamber (1) A plurality of gas discharge pipes (7) connected to be positioned above the gas supply pipe (6) are provided above the spaces (1a) in the processing chamber (1) through the front wall. Yes.
[0015]
The gas supply pipe (6) is connected to a gas source (not shown). The gas used varies depending on the purpose, but N ₂ or air is usually used. On the other hand, the gas discharge pipe (7) is connected to an exhaust pipe (not shown). The gas supply pipe (6) and the gas discharge pipe (7) both have a rectangular shape with a long cross section on the left and right, and supply gas uniformly into the space (1a) of the processing chamber (1). It is designed to discharge gas. A substrate (object to be processed) (P) as an object to be processed is arranged on the object to be processed heat treatment plate (4).
[0016]
Although not shown, a known workpiece loading / unloading device is disposed in front of the heat treatment apparatus, and the workpiece (P) is loaded / unloaded by the loading / unloading device.
[0017]
FIG. 2 shows an enlarged sectional view of the peripheral portion of the heat treatment plate (4). In this hollow heat treatment plate (4), a horizontal plate-like partition member (12) is arranged so as to be movable in a direction perpendicular thereto, i.e., in the vertical direction, and the heat treatment plate (4) by this horizontal plate-like partition member (12). The interior is divided up and down.
[0018]
A first heat medium introduction pipe (16) and a first heat medium outlet pipe (15) are connected to the lowermost part of the heat treatment plate (4). A second heat medium introduction pipe (13) and a second heat medium outlet pipe (14) are connected to the uppermost part of the heat treatment plate (4). Each pipe (13) (14) (15) (16) is provided with a valve (B5) (B6) (B7) (B8). The heat medium introduction pipes (13), (16) and the heat medium outlet pipes (14), (15) are connected to the first and second heat medium supply sources, respectively, and flow through the heat treatment plate (4) as described later. The recovered heat medium is recovered and reused.
[0019]
FIG. 2 shows a state in which equal amounts of the first and second heat media are contained in the heat treatment plate (4). The horizontal plate-like partition member (12) is positioned at the heat treatment plate (4). It changes with the quantity of the 1st, 2nd heat carrier of the inside. In addition, although illustration was abbreviate | omitted, the piping part which connects each heat medium storage tank and the heat processing board (4) is covered with the heat insulating material, and is heat-retained.
[0020]
Although the detailed illustration of the radiant heating device (3) is omitted, the radiant heating device (3) includes a main body such as a lamp or a heater that radiates infrared rays or far infrared rays, and a cooling medium flow path (3a passing through the housing of the main body). ). The flow path (3a) is connected to a cooling medium supply source (not shown) via valves (B9) and (B10).
[0021]
The case where this heat treatment apparatus is used as, for example, a solder reflow apparatus will be described below, but other heat treatments can be performed by this heat treatment apparatus.
[0022]
Since the procedure for placing the workpiece (P) on which the ball-shaped solder (B) is placed on the heat treatment plate (4) and taking it out after the heat treatment is a known procedure, hereinafter, on the heat treatment plate (4) A procedure for performing solder reflow on the workpiece (P) placed will be described.
[0023]
In this heat treatment plate (4), the valves (B5) and (B8) are closed, and the valves (B8) are opened from the state in which the valves (B6) and (B7) are opened, and the predetermined heat is supplied from the first heat medium introduction pipe (16). The first heat medium having a temperature flows into the heat treatment plate (4). Then, the first heat medium flows out from the first heat medium outlet pipe (15) to the outside of the heat treatment plate (4). At this time, since the horizontal plate-like partition member (12) is movable up and down, it is pushed up by the pressure of the first heat medium flowing into the heat treatment plate (4), and the heat treatment plate (4) has the first inside. Filled with heat medium. In this way, the object to be processed (P) on the heat treatment plate (4) is brought to a predetermined temperature and preheated.
[0024]
Thereafter, the valve (B8) is closed, and radiant heating is performed from the upper surface side of the substrate (P) by the radiant heating device (3), and the temperature is further changed to perform main heating. During the main heating, gas is supplied from the gas supply pipe (6) as shown by a two-dot chain line in FIG. 2, and the internal gas is discharged from the gas discharge pipe (7). And the flux vapor | steam generate | occur | produced at the time of reflow rises as shown by the continuous line in FIG. 2, and is discharged | emitted on the gas flow shown by the dashed-two dotted line. In FIG. 2, the flow of radiant heat from the radiant heating device (3) is indicated by a broken line.
[0025]
And after the to-be-processed object (P) on a heat processing board (4) is made predetermined temperature, a radiation heating is stopped and a valve | bulb (B5) is opened simultaneously. Then, the second heat medium having a predetermined temperature (different from the temperature of the first heat medium) flows into the heat treatment plate (4). At this time, since the valve (B8) is already closed and no pressure is applied to the first heat medium in the heat treatment plate (4), as the second heat medium flows into the heat treatment plate (4), the horizontal plate partition The member (12) moves downward, and the first heat medium in the heat treatment plate (4) is pushed out of the heat treatment plate (4). The horizontal plate-like partition member (12) is located at the lowest position in the heat treatment plate (4), and the heat treatment plate (4) is filled with the second heat medium. In this way, the workpiece (P) is lowered to a predetermined temperature.
[0026]
Note that the object to be treated (P) can be further cooled by cooling the radiant heating device (3). Furthermore, since the initial conditions for the next process can be made constant, the reproducibility of the process can be improved, and a uniform process can be performed with a high throughput.
[0027]
What is necessary is just to select a 1st, 2nd heat medium suitably according to use temperature. What is necessary is just to select a heating time and temperature fall time suitably.
[0028]
The heat-treated plate (4) preferably has good thermal conductivity. Specifically, aluminum or copper is preferable.
[0029]
Next, a heat treatment apparatus according to still another embodiment of the present invention will be described with reference to FIG. In addition, the same code | symbol is attached | subjected to the part which has the structure similar to the heat processing apparatus of the said embodiment, and description is abbreviate | omitted.
[0030]
In the heat treatment plate (20), a film-like partition member (21) is provided instead of the horizontal plate-like partition member (12). The membrane-like partition member (21) has elasticity, and as shown by a solid line in FIG. 3 , the peripheral end is fixed at the center of the height of the inner surface of the peripheral wall of the heat treatment plate (20). It is divided vertically. The state of the membrane partition member (21) varies depending on the amounts of the first and second heat media in the heat treatment plate (20).
[0031]
In this heat treatment apparatus, gas is supplied from the upper center as shown by a two-dot chain line in FIG. 3, and gas is discharged from a gas discharge pipe (22) opened around the side of the heat treatment plate. ing. In order to supply the gas from above, for example, the radiation heating device (3) may have a plurality of rod heaters arranged, and an opening of a gas supply pipe (not shown) may be positioned between the rod heaters.
[0032]
The case where this heat treatment apparatus is used as, for example, a solder reflow apparatus will be described below, but other heat treatments can be performed by this heat treatment apparatus as in the case of the above embodiment.
[0033]
In this heat treatment plate (20), when the valves (B5) and (B8) are closed and the valves (B6) and (B7) are opened, the valve (B8) is opened, and the first heat medium introduction pipe (16) opens the first. as the heat medium is shown in FIG. 3 flows into the thermal processing plate (20) by a two-dot chain line, the film-like partition member (21) is inflated upward. The membrane partition member (21) has a shape along the upper half of the inner surface of the peripheral wall and the inner surface of the upper wall, and the heat treatment plate (20) is filled with the first heat medium. Thereafter, the valve (B8) is closed, and the substrate (P) is radiantly heated by the radiant heating device (3). At the time of reflow, gas is supplied from the upper center as shown by a two-dot chain line in FIG. 3, and gas is discharged from the annular gas discharge pipe (22) around the side of the heat treatment plate (20). And the flux vapor | steam which generate | occur | produced at the time of reflow shown by the continuous line in FIG. 3 rides on the gas flow, and is discharged | emitted with gas from the gas discharge pipe (22) around the side of a heat processing board (20). In FIG. 3, the flow of radiant heat from the radiant heating device (3) is indicated by a broken line.
[0034]
Next, stop radiant heating and open the valve (B5) at the same time. Then, the second heat medium flows into the heat treatment plate (20). At this time, since the valve (B8) has already been closed and no pressure is applied to the first heat medium in the heat treatment plate (20), the first heat medium flows as the second heat medium flows into the heat treatment plate (20). Is pushed out of the heat treatment plate (20), and the membrane-like partition member (21) swells downward. The membrane partition member (21) has a shape along the lower half of the inner surface of the peripheral wall and the inner surface of the lower wall, and the heat treatment plate (20) is filled with the second heat medium. Note that it is preferable to cool the radiant heating device (3) as in the case of the above embodiment.
[0035]
Still another embodiment of the heat treatment apparatus will be described with reference to FIG. In this heat treatment apparatus, another film member (23) is arranged in addition to the film member (21) in the heat treatment plate (20), and the inside of the heat treatment plate (20) is divided into three. Then, a third heat medium introduction pipe (24) to which a valve (B11) is attached and a third heat medium outlet pipe (25) to which a valve (B12) is attached are provided at the center in the height direction of the heat treatment plate (20). Is provided.
[0036]
In this case, the other two heat mediums are pushed out of the heat treatment plate (20) by flowing one heat medium as described above.
[0037]
Similarly, if the inside of the heat treatment plate is divided into multiple parts, the heat medium flowing through the heat treatment plate can be switched without causing the heat media to mix with each other, so that multi-step heat treatment can be performed, the heat efficiency of the heat treatment apparatus is improved, and the heat medium It becomes easy to use repeatedly.
[0038]
The heating apparatus of the present invention is not limited to the configuration of the above embodiment, and can be changed as appropriate. For example, the opening / closing timing of each valve and the on / off timing of the radiant heating device are not necessarily limited as described above, and an optimal combination of timings may be selected sequentially according to the purpose. Of course, the combination of the arrangement of the gas supply pipe and the gas discharge pipe and the heat treatment plate is not limited to the above.
[0039]
Furthermore, the first and second heat medium flow paths may be interchanged. Further, the temperature can be lowered in two stages after being heated by the radiant heating device. Therefore, the apparatus of the present invention can perform a heat treatment in which the object to be processed is heated in stages or a combination of heating and cooling by appropriately selecting the temperatures of the first heat medium and the second heat medium. That is, not only the temperature is lowered after the two-stage heating as described above, but also the three-stage heating can be performed. In particular, in a heat treatment plate having a multi-divided interior, multi-stage heat treatment can be performed without mixing the heat medium. Furthermore, the radiation heating device can be used not only for solder reflow but also for heat treatment of various substrates and various films formed on the substrate surface.
[0040]
Note that the number of the flow paths in the heat treatment plate may be two or more, and the number of flow paths is not limited to two or three as in the above embodiment. Also, to that three the number of heat treatment chambers in implementation form is not some other reason be for convenience of explanation. Note that the heat treatment performed by the heat treatment plate is determined by the temperature of the heat medium, and either heating or temperature lowering can be performed.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a heat treatment apparatus according to an embodiment of the present invention.
FIG. 2 is an enlarged cross-sectional view of the periphery of the heat treatment plate of the heat treatment apparatus.
FIG. 3 is an enlarged cross-sectional view of a peripheral portion of a heat treatment plate of a heat treatment apparatus according to another embodiment.
FIG. 4 is an enlarged cross-sectional view of a peripheral portion of a heat treatment plate of a heat treatment apparatus according to another embodiment.
[Explanation of symbols]
(1) Heat treatment room
(3) Radiation heating device
(4) Heat treatment plate
(6) Gas supply pipe
(7) Gas exhaust pipe
(20) Heat treatment plate
(22) Gas exhaust pipe
(P) Object to be processed (substrate)

Claims (2)

A heat treatment apparatus for heat-treating an object to be processed in a heat treatment chamber, wherein a plate-like object to be processed is placed and a heat-treating object heat-treating plate for heating and cooling the placed object to be processed, and a substrate on the heat-treating plate It consists of a radiant heating device that radiates and heats the processed material, a gas supply means that supplies gas into the heat treatment chamber, and a gas discharge means that discharges the gas inside the heat treatment chamber to the outside. And an unnecessary material discharging means that discharges the airflow generated by the means to the outside of the heat treatment chamber, and the heat treatment plate is provided with a flow path separated from each other by a stretchable film-shaped partition member inside the heat treatment plate. A heat treatment apparatus, wherein a heat medium having different temperatures is passed through one flow path and the other flow path of the apparatus and the heat treatment plate to heat treat an object to be processed placed on the heat treatment plate. A heat treatment apparatus for heat-treating an object to be processed in a heat treatment chamber, wherein a plate-like object to be processed is placed and a heat-treating object heat-treating plate for heating and cooling the placed object to be processed, and a substrate on the heat-treating plate It consists of a radiant heating device that radiates and heats the processed material, a gas supply means that supplies gas into the heat treatment chamber, and a gas discharge means that discharges the gas inside the heat treatment chamber to the outside. And an unnecessary material discharging means that discharges the air generated by the means to the outside of the heat treatment chamber, the heat treatment plate is provided with a flow path separated from each other by a horizontal plate-shaped partition member that can move up and down, and radiation A heat treatment apparatus, wherein heat treatment is performed on an object to be processed placed on a heat treatment plate by flowing heat media having different temperatures through one flow path and the other flow path of the heating device and the heat treatment plate .

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