JP3998371B2 - Strip-like thin plate separation device and supply device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a device for separating stacked strip-like thin plates and a device for feeding, and more particularly, to a device for automatically separating and feeding accurately one sheet at a time.
[0002]
[Prior art]
Many devices for taking out a thin plate one by one from a pile in which a large number of thin plates are laminated in the thickness direction have been provided, but a widely adopted method is vacuum suction. This is a device in which a vacuum pad connected to a vacuum device is brought into contact with a first thin plate on the surface of a mountain to be sucked and moved. This is adopted not only for separation / feeding devices used in sheet metal processing in heavy industry and the like, but also for separating and supplying thin plates such as lead frames used in the electronics industry.
[0003]
However, in recent years, problems have arisen when this adsorption method is adopted for a lead frame. In other words, the demand for thin lead frames has increased due to the increase in pin count, compatibility with CSP (Chip Size Package), and the miniaturization and thinning of packages. As a result, the surface is wavy and the flatness tends to decrease. It is because it is increasing. In particular, lead frames with warping and undulation tend to cause many separation errors, and fine adjustment is necessary each time. Even with lead frames of the same model number, fine adjustment may be required if the manufacturer and manufacturing lot are different.
[0004]
By the way, a chuck mechanism can be considered as a solution to such a problem. In this case, a lead frame is sandwiched between pickups that open and close like a ridge, and the pickup efficiency is not affected by the surface state of the lead frame.
[0005]
[Problems to be solved by the invention]
However, in the above-described chuck mechanism, since the separation claw comes into mechanical contact, the contact surface is worn away, and eventually proper lead frame separation cannot be performed. For this reason, maintenance management of the separation claw is important, and a large amount of maintenance is required.
[0006]
Also, depending on the surface condition of the lead frames, the lead frames may be relatively tightly attached. At this time, even if one piece is picked up from a mountain, two or more lead frames are picked up simultaneously. There was a thing that I did.
[0007]
Furthermore, when the first sheet is closely attached to the second sheet and the second sheet is closely adhered to the third sheet, the second sheet is not separated from the mountain, and the first and second sheets are deformed. In some cases, the product was separated halfway, which lowered the yield.
[0008]
When a separation error is made in this way, the apparatus stops and the operator must take action, which reduces the operating rate. Even if the device does not stop, multiple lead frames in close contact with each other are supplied to the transport section of the next process. For example, the upper and lower molds do not collide with each other in the later molding process, resin leakage, etc. There is a risk of generating secondary traps.
[0009]
The present invention solves the above-mentioned problems, maintains a high operating rate without being influenced by the surface state of the strip-shaped thin plate such as a lead frame, and does not have to deform the strip-shaped thin plate even if there is a separation error. It is an object of the present invention to provide a strip-like thin plate separating apparatus and supplying apparatus that can reduce the man-hours, suppress the consumption of the separation claws, greatly reduce the maintenance time, and do not cause defects to flow into the subsequent processes.
[0010]
[Means for Solving the Problems]
In order to achieve the above object, the strip thin plate separating apparatus according to the present invention uses a separation claw to separate one strip thin plate at the lowest layer of a mountain from a stack of a plurality of strip thin plates stacked in the thickness direction. In the strip-shaped thin plate separating apparatus that sandwiches, moves the separation claw, and separates the one strip-shaped thin plate from the mountain, when the one strip-shaped thin plate is separated from the mountain by the separation claw, It has a separation pin protrudingly inserted between the one sheet-like thin plate and the mountain. With this configuration, separation between the strip-shaped thin plate and the mountain is promoted.
[0011]
Furthermore, it has a platform that is in contact with a part of the mountain and can be supported from below, and moves up and down, the separation claw and the separation pin are arranged under the mountain, and the platform is the separation A structure in which a claw sandwiches and moves the one strip-shaped thin plate, the separation pin is inserted between the one strip-shaped thin plate and the mountain, and the mountain descends after being supported from below by the separation pin. It is good. With this configuration, the amount of movement of the separation claw applied to separate the strip-shaped thin plate is minimized.
[0012]
In addition, the separation claw and the separation pin are arranged in parallel in the longitudinal direction of the strip-shaped thin plate, and the platform rests on a part of the strip-shaped thin plate between the two separation claws and the separation pin. It is suitable as a structure to contact. With this configuration, the separation force is distributed to multiple points to prevent deformation of the strip-shaped thin plate local area, and stability is ensured by the multi-point support, and the load applied to one separation claw is reduced to reduce wear. To reduce.
[0013]
In the separation apparatus having the above-described separation pin, the separation pin may be projected by being pulled by a power source that linearly moves, and the power source and the separation pin may be coupled by a magnetic force. With this configuration, even if the separation pin is overloaded, the strip-shaped thin plate is not loaded with a load greater than the coupling force due to magnetic force.
[0014]
Further, in these separation devices, a diamond plasma CVD film may be applied to a surface of the separation claw facing the strip-shaped thin plate so as to be in contact with the strip-shaped thin plate. With this configuration, the separation claw is provided with wear resistance and surface roughness capable of obtaining moderate friction.
[0015]
The strip-shaped thin plate supply device according to the present invention includes a guide rail on which the strip-shaped thin plate separated by any of the separators described above is placed, and the strip-shaped thin plate end along the guide rail. A frame pusher that moves while being pushed, and a gap with a thickness of one or more and less than two of the strip-shaped thin plate from the surface position of the guide rail is formed, and the strip-shaped thin plate can pass through the gap during movement And a stopper provided. Even if two or more lead frames are separated from each other by this configuration, they are not conveyed to the next process as they are.
[0016]
At this time, the frame pusher is preferably moved by being pulled by a linearly moving power source, and the power source and the frame pusher are coupled by magnetic force. Even if the frame pusher is overloaded by this configuration, the strip-shaped thin plate is not subjected to a load exceeding the coupling force due to the magnetic force.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings. In addition, the same code | symbol was attached | subjected to the same or equivalent thing over several drawing, and the duplication of description was avoided.
[0018]
FIG. 1 is a perspective view showing a state in which the lead frame separation device and the supply device of the present invention are combined, and shows an initial state before the device is operated. Although not shown in the drawing, the lead frame 1 is first laminated in the thickness direction in the frame guide 15 to form a mountain, and these are supported from below by the separation pin 3.
[0019]
First, the lead frame separating apparatus in this figure will be described. The separation device is roughly divided into a separation claw movement mechanism, a platform movement mechanism, and a separation pin movement mechanism.
[0020]
The separation claw moving mechanism includes four separation claws 2, four movement blocks 2 b connected to each via a compression spring 2 a, and an actuator (not shown) that freely moves the movement block 2 b in the horizontal and vertical directions. These grip the lead frame 1 with the separation claws 2 facing each other across the lead frame, and move downward simultaneously at the gripped state to move the lead frame 1 down. This actuator (not shown) can be easily configured by a combination of a cylinder laid for horizontal movement and a cylinder standing for vertical movement in which a cylinder shaft is connected.
[0021]
The platform moving mechanism is composed of a platform 4 and an actuator (not shown) such as a cylinder and a solenoid connected to the platform 4 and can contact a part of the back surface of the lead frame 1 to support the mountain of the lead frame 1 from below. Thus, the lead frame 1 can be placed and moved up and down.
[0022]
The separation pin moving mechanism includes two separation pins 3, a block 29 with one end secured, two shafts 21 with one end secured to the back surface of the mounting surface of the separation pin 3 of the block 29, and the shafts 21. The other end of the iron plate 14a is fixed, the slide bush 22 is movably fitted along the shaft 21 between the block 29 and the iron plate 14a, the mounting table 30 to which this is fixed, and the air that is fixed to the back surface thereof. It consists of a cylinder 13a and a magnet 12a fixed to the tip of the cylinder shaft.
[0023]
Normally, the magnet 12a and the iron plate 14a are connected by magnetic force, and the system of the shaft 21, the block 29, and the separation claw 3 fixed and connected to the iron plate 14a simultaneously moves by the operation of the air cylinder 13a. Although not shown, the mounting table 30 is fixed to a non-moving part of the apparatus and does not move even if other mechanical parts are operated.
[0024]
Next, the lead frame supply device will be described. This is because the guide rail 28 arranged below the mountain of the lead frame 1 so that the lead frame 1 can be placed, the frame pusher 5 arranged on the front side (the opposite side to the conveying side), and one end below the guide rail 28 are fixed. An L-shaped iron plate 14b, an air cylinder 13b to which the tip of the cylinder shaft is coupled by magnetic force via a magnet 12b, a moving piece 17a to which the lower surface of the iron plate 14b is fixed, and a rail 17b fitted thereto The two-frame insertion preventing stopper 16 disposed on the conveying side of the guide rail 28 and the air cylinder 13c disposed further outside thereof.
[0025]
The air cylinder 13b is fixed to a non-illustrated non-moving portion of the device, and the cylinder shaft is extended in an initial state, and the cylinder shaft is pulled in by supplying compressed air. When the cylinder shaft is pulled, the iron plate 14b magnetically coupled to the magnet 12b is pulled, and the moving piece 17a moves along the rail 17b. At the same time, the frame pusher 5 moves.
[0026]
The upper end of the frame pusher 5 protrudes above the lead frame mounting surface of the guide rail 28 (the surface recessed in an L-shaped section in the figure), and the lead frame 1 is mounted on the guide rail 28. In this case, the frame pusher 5 comes into contact with the lead frame 1 during movement and pushes out the lead frame 1 in the moving direction.
[0027]
The extruded lead frame 1 passes through the two-frame insertion preventing stopper 16 and is sent to the subsequent apparatus. The two-frame prevention stopper 16 is configured by bringing two plate-like objects close to each other, and the lead frame 1 is passed through the gap between the two plate-like objects. The gap is set to be as thin as one or more lead frames 1 and less than two.
[0028]
The air cylinder 13c projects the cylinder shaft in conjunction with the lead frame 1 being sent out, works as a stopper for the lead frame 1, and improves the positioning accuracy of the lead frame 1 for smooth delivery to the subsequent device. I am trying.
[0029]
The apparatus described above separates the lead frames one by one from below the piles of the lead frames stacked in the thickness direction by a series of operations shown in FIGS. 2A to 2J, and this is shown in FIG. It is conveyed to the subsequent process by a series of operations shown in (l). All the operations of the mechanical parts shown in these figures are the next operation to be performed based on the information sent from these sensors, such as a photoelectric sensor, proximity sensor, and area sensor that senses the presence or absence of a lead frame. The microcomputer is automatically controlled by a CPU such as a microcomputer or a sequencer that determines the above and a driving device such as a motor or an actuator that is instructed by these to operate unattended. The flowchart is shown in FIG. 2 (a), (d), (g), (j) to (l) are front views of the apparatus, and FIGS. 2 (b), (c), (e), (f), (h), (I) has shown the device side.
[0030]
Here, the operation shown in FIG. 3 will be described with reference to FIG. First, in the initial state of FIG. 2A, the lead frame 1 is pulled out by a lead frame transport device (not shown), and the lead frame 1a (lead frame separated before transport) disappears from the upper part of the first separation start sensor 6. Then, the STEP1 operation in FIG. 3 is started. As shown in FIG. 2B, the separation claw 2 is closed as shown in FIG. 2C from the state where the separation claw 2 is opened, and one of the lowermost layers of the lead frame 1 is clamped. Next, as shown in FIG. 2 (d), the frame mounting base 4 rises to about several mm above the separation pin 3, and the end of the lowermost lead frame 1 b is separated from the upper lead frame 1. At this time, the separation pin 3 located under the lead frames 1 and 1b as shown in FIG. 2E is pulled out rearward as shown in FIG. 2F in the next operation. This ends STEP1.
[0031]
In FIG. 2 (d), when the lead frame 1a is further pulled out by the above-described unillustrated transporting device and the lead frame 1a disappears from the upper part of the second separation start sensor 7, the separation claw as shown in FIG. 2 goes down. Next, as shown in FIG. 2 (h), the separation pin 3 located at the rear is inserted between the lead frames 1 and 1b. At this time, it is confirmed by the separation pin overload sensor 10 whether or not the separation pin 3 is normally inserted. When it is confirmed by the sensor 10 that the block 29 is directly below, the separation claw 2 is opened as shown in FIG. 2 (i), and the lead frame 1b is released. Finally, as shown in FIG. 2 (j), the frame platform 4 on which the lead frame 1b is placed is lowered, and the separation claw 2 is raised. This ends STEP2.
[0032]
Whether the lead frame 1b is normally separated in this state is confirmed by the second separation start sensor 7 and the separation state monitoring sensors 9, 9. After confirming that there is a lead frame directly above the sensor 7 and that there is no lead frame between the sensors 9 and 9, the transport device which is further separated on the third separation start sensor 8 and separated earlier When the lead frame 1a in the middle of being pulled out by (not shown) disappears, the frame pusher 5 pushes and supplies the lead frame 1 to the subsequent frame transfer device (not shown) as shown in FIG. 2 (k). To do. At this time, it is confirmed by the frame pusher overload sensor 11 whether the frame pusher 5 is operating normally. After confirming that the frame pusher 5 is in the vicinity of the sensor 11, as shown in FIG. 2 (l), the process returns to the original and the STEP3 and the separation operation cycle are completed.
[0033]
Next, a relief mechanism when the frame pusher 5 is overloaded will be described. FIG. 4 is a diagram showing the operation of the lead frame supply apparatus of the present invention. FIG. 4A shows a standby state. From this state, when the lead frame on the third separation start sensor 8 disappears as described above, the air cylinder 13b pulls the cylinder shaft and the frame pusher 5 pushes out the lead frame 1 as shown in FIG. At the same time, the cylinder shaft of the interlocked air cylinder 13c projects to position the lead frame 1b. If the frame pusher overload sensor 11 detects the iron plate 14 in this state, it is determined that there was no overload detection and that the operation was normal.
[0034]
FIG. 4C shows a case where two or more lead frames 1b separated from the mountain overlap. Although the cylinder shaft of the air cylinder 13b is pulled in, the magnet 12 and the iron plate 14b are separated at the moment when the lead frame 1 hits the two-frame insertion preventing stopper 16. At this time, since the frame pusher overload sensor 11 cannot detect the iron plate 14b, a separation error error is generated. If the load applied to the lead frame at this time is sufficiently reduced by adjusting the magnetic force or the like, the lead frame 1 will not be deformed or damaged at all. For example, an iron lead frame having a thickness of about 0.15 mm and a width of about 22 mm is about 40 g.
[0035]
Next, a relief mechanism when the separation pin is overloaded will be described. This is also the same principle as the above-described escape mechanism when the frame pusher is overloaded. FIG. 5 is a diagram illustrating the operation of the separation pin. FIG. 5A shows a standby state, and then, in the operation stage of FIG. 2H described above, the cylinder shaft of the air cylinder 13a is drawn as shown in FIG. 5B, and a separation pin is interposed between the lead frames 1 and 1b. 3 is inserted. At this time, the iron plate 14a is confirmed by the separation pin overload sensor 10 as described above. However, when the lead frame 1 is not separated, the separation pin 3 may come into contact with the lead frame 1b. At this time, as shown in FIG. 5C, since the magnet 12 and the iron plate 14 are separated from each other, the separation pin overload sensor 10 works to detect a separation error, and the operation in the subroutine STEP2 of the operation flow diagram of FIG. The automatic separation and the separation operation are performed again, and the frame separation apparatus automatically performs the treatment without the worker. If the load applied to the lead frame by the separation pin 3 at the time of the trouble shown in FIG. 5C is sufficiently reduced, the lead frame 1 is not deformed or damaged at all. For example, an iron lead frame having a thickness of about 0.15 mm and a length of about 200 mm is about 100 g.
[0036]
Further, lead frame status monitoring will be described. FIG. 6 is a diagram showing a state of frame state monitoring. In the state of FIG. 2 (k) described above, only one sheet is normally separated, but in FIG. 6 (a), the center of the lead frame 1 is in close contact with the upper lead frame 1. In FIG. 6B, the left side of the lead frame 1 is normally separated, but the right side is not separated. In FIG. 6C, the right side is normally separated in the reverse of FIG. 6B, but the left side is not separated. If such a problem occurs after STEP 2 is completed in the main routine of FIG. 3, the separation state monitoring sensors 9 and 9 catch this, and move to the RETRY operation of the subroutine of FIG. Automatically recovers and performs separation again.
[0037]
The above is the main part of the embodiment of the present invention. A configuration that brings about a good result will be described here.
[0038]
FIG. 7A shows a state in which the lead frame 1 is clamped by the separation claw 2, and FIG. 7B is an enlarged view thereof. The weight / adjustment gauge 19 is placed on the lead frame 1 so that the deflection of the lead frame 1 is corrected to be minimized.
[0039]
Further, as shown in FIG. 7B, even if the position of the lead frame 1 is slightly moved up and down, if the diamond film 18 is applied in a range exceeding the position, the position adjustment at the time of clamping can be simplified and the lead frame can be simplified. The influence on the swell of 1 can be eliminated, and the adjustment of the maintenance can be simplified. Note that this diamond film can form a rough surface capable of obtaining an appropriate friction by plasma CVD, and can dramatically improve the wear resistance.
[0040]
FIG. 8 is a side view of the separation device, showing the periphery of the separation pin 3. As shown in the figure, when the lead frame 1 rides on the separation pin 3, if a pair of pin holding portions 20 are provided below, this supports the separation pin 3 and stabilizes the position of the separation pin 3. The load on the shaft 21 and the slide bush 22 can be reduced, and the load resistance against the weight of the lead frame 1 can be increased. Thereby, the height of the frame guide 15 can be extended, and the supply amount of the lead frame 1 can be increased.
[0041]
Further, if the pillars at the four corners of the frame guide 15 are movable, it is possible to correspond to lead frames of various sizes. At this time, if the gauges 19 shown in FIGS. 7 and 8 are prepared in a variety of sizes and weights according to the type of the lead frame 1, it is possible to immediately respond to the type change.
[0042]
As mentioned above, although the embodiment taking the lead frame as an example has been described, it goes without saying that the present invention can be applied to the separation and supply of strip-shaped thin plates other than the lead frame.
[0043]
【The invention's effect】
As described above, according to the present invention, the separation error is greatly reduced, and even if it occurs, deformation of the lead frame and failure of discarding do not occur. Since no separation failure is supplied to the subsequent process, no secondary trouble occurs.
[0044]
In general, it is possible to provide an apparatus that can easily separate and supply strip-like thin plates that are difficult to handle and reduce manufacturing costs.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an embodiment of the present invention.
FIG. 2 is a diagram showing the mechanism operation of the present invention.
FIG. 3 is a flowchart of the separation operation of the present invention.
FIG. 4 shows the operation of the frame pusher mechanism of the present invention.
FIG. 5 shows the operation of the separation pin mechanism of the present invention.
FIG. 6 is a diagram showing a state of frame state monitoring according to the present invention.
FIG. 7 is a view showing a state when the separation claw of the present invention is in a clamped state.
FIG. 8 is a schematic view of a separation pin portion of the present invention.
[Explanation of symbols]
1: lead frame, 2: separation claw, 3: separation pin, 4: frame platform, 5: frame pusher, 6, 7, 8: separation start sensor, 9: separation state monitoring sensor, 10: separation pin overload Sensor: 11: Frame pusher overload sensor, 12: Magnet, 13: Air cylinder, 14: Iron plate, 15: Frame guide, 16: Double frame insertion prevention stopper, 17a: Moving piece, 17b: Rail, 18: Diamond Plasma CVD film, 19: weight / adjustment gauge, 20: pin holding part, 21: shaft, 22: slide bush, 28: guide rail, 29: block, 30: mounting table

Claims (5)

One strip-like thin plate in the lowest layer of the pile is sandwiched by a separation claw from a pile in which a plurality of strip-like thin plates are stacked in the thickness direction, the separation claw is moved, and the one piece of strip-like thin plate is In the strip-shaped thin plate separating apparatus that separates from the pile,
Wherein when said one of the strip-shaped sheet by the separation claw is separated from the mountain, have a protruding the inserted separating pin between said one strip sheet and the mountains,
The separation pin is pulled by a linearly moving power source and protrudes, and the power source and the separation pin are coupled by magnetic force.
The crest is provided so as to be in contact with a part of the mountain and can be supported from below, and has a platform that moves up and down, the separation claw and the separation pin are disposed under the mountain, and the platform has the separation claw The one strip-shaped thin plate is sandwiched and moved, the separation pin is inserted between the one strip-shaped thin plate and the mountain, and the mountain is lowered after being supported from below by the separation pin. A strip thin plate separator. The separation claw and the separation pin are arranged in parallel two by two in the longitudinal direction of the strip-shaped thin plate, and the platform is in contact with a part of the strip-shaped thin plate between the two separation claws and the separation pin. The strip-shaped thin plate separating apparatus according to claim 1 . Strip sheet separating apparatus according to claim 1 or 2, characterized in that deposited the separation claw the strip sheet can come into contact with said short books like thin plate to a surface facing the diamond plasma CVD film. A guide rail for mounting the strip-shaped thin plates separated by a strip-shaped thin plate separator according to claims 1 to 3, the frame pusher moves while pushing the strip thin end along the guide rail A gap having a thickness of not less than one and less than two of the strip-like thin plates from the surface of the guide rail, and a stopper provided in the gap so that the strip-like thin plate can pass while moving. A strip-shaped thin plate supply device characterized by comprising: 5. The strip-shaped thin plate feeding device according to claim 4 , wherein the frame pusher is pulled and moved by a linearly moving power source, and the power source and the frame pusher are coupled by magnetic force.

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