JP3990234B2 - Saw wire manufacturing equipment - Google Patents

Saw wire manufacturing equipment Download PDF

Info

Publication number
JP3990234B2
JP3990234B2 JP2002245921A JP2002245921A JP3990234B2 JP 3990234 B2 JP3990234 B2 JP 3990234B2 JP 2002245921 A JP2002245921 A JP 2002245921A JP 2002245921 A JP2002245921 A JP 2002245921A JP 3990234 B2 JP3990234 B2 JP 3990234B2
Authority
JP
Japan
Prior art keywords
wire
saw wire
power supply
wire manufacturing
manufacturing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002245921A
Other languages
Japanese (ja)
Other versions
JP2004082253A (en
Inventor
寛之 大上
孝二 宇野
Original Assignee
金井 宏彰
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 金井 宏彰 filed Critical 金井 宏彰
Priority to JP2002245921A priority Critical patent/JP3990234B2/en
Publication of JP2004082253A publication Critical patent/JP2004082253A/en
Application granted granted Critical
Publication of JP3990234B2 publication Critical patent/JP3990234B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Description

【0001】
【産業上の利用分野】
この発明は、半導体用ウエハーの母材であるシリコン結晶や人工水晶、超硬合金、セラミック等の高価な素材を切断するのに用いられるソーワイヤの製造装置に関するものであり、その生産性を改良して生産コストを低減することができるものである。
【0002】
【従来の技術】
近年、細い金属線の表面にダイヤモンドなどの微細な砥粒を固着した固定砥粒式ソーワイヤが使用されはじめている。この従来の固定砥粒式ソーワイヤには、例えば金属線を伸線加工して細径化し、これにレジンボンド(熱硬化性樹脂)を積層して、上記レジンボンド層によって、その表面に密にダイヤモンド砥粒やCBN砥粒、硬質微細繊維などの硬質微片(以下これを砥粒という)を固着したもの、或いは、複合メッキによってメッキ層に砥粒を埋設して固着したものがある。前者の固定砥粒式ソーワイヤの製造方法は砥粒を混入させたレジンボンドの中に鋼線を通過させることでその表面に砥粒を混入したレジンボンドを付着させ、これを冷却硬化させる方法であり、後者の固定砥粒式ソーワイヤの製造方法はメッキ液(Niメッキ液等)に砥粒を浮遊させておいてメッキ(電気メッキ)処理時にメッキ層に砥粒が付着する(析出する)ようにする方法である。
【0003】
後者の場合は、砥粒の金属線表面への固着力は十分で、したがって、長時間にわたって切削性能が保持されるが、メッキ液に浮遊させた砥粒を十分な固着力で固着・保持させるために必要な厚さにメッキ層を形成しなければならず、また、メッキ層による砥粒の固着力を一定にするには、メッキ層の厚さが可及的に均一であることが必要である。
ワイヤへの複合メッキは、図1に示すような装置で行うものであり、砥粒を混入させたメッキ液中でワイヤを走行させて、ワイヤに給電ローラで給電してメッキするとともにメッキ層に砥粒を付着させるものである。
給電ローラには耐蝕性が求められるのでステンレス製が一般的である。給電ローラとワイヤとの直接接触によってワイヤへの給電がなされるのであるが、給電ローラの表面には非導電性の砥粒が付着しているので、ワイヤの金属表面と給電ローラの金属表面とが常時安定的に接触するわけではなく、したがって、このワイヤと給電ローラ間の電気抵抗が常に変動する。また、下流側の給電ローラには、砥粒が混入したメッキ層が形成されたワイヤが接触するのであるから、上記の傾向が特に著しい。
【0004】
他方、電気メッキには直流電流が用いられ、この直流電流は交流電源からの電流を整流器にて整流し、これを電流値一定で制御することで、メッキ層の形成速度(形成されるメッキ層の厚さ)を一定に制御する。ところが、直流電源は定電流で制御されているにも関わらず、上記のとおり、ワイヤと給電ローラ間の電気抵抗が常に変動するので、電圧変動が激しく、電圧は所定限度を越えると、電流値が安定しなくなり、その結果、メッキ層の厚さ(析出層の厚さ)が一定せず、そのためにソーワイヤの品質不良を生じる。これを防ぐには、上記の電気抵抗の変動を可及的に抑制して、電圧上昇が所定限度を越えることを確実に防止することが必要である。
【0005】
【発明が解決しようとする課題】
そこで、この発明は、給電ローラに砥粒が付着し、またワイヤに砥粒が付着していても、給電ローラとワイヤ間の所要の導通性を確保して、上記電圧変動を可及的に抑制して、上記の電圧上昇が所定限度を越えることがないように、給電ローラを工夫することをその課題とするものである。
【0006】
【課題を解決するための手段】
上記課題解決のために講じた手段は、複合メッキによるソ−ワイヤ製造装置において、その給電ロ−ラの外周面を表面に無数の微細繊維が突出している導電性の繊維ウエブで被覆したことである。
【0007】
【作用】
導電性の繊維ウエブ(不織布)の表面に無数の微細繊維が突出している。したがって、上記繊維ウエブにワイヤが巻きかけられると、繊維ウエブに砥粒が付着していても、上記の突出した微細繊維(突起)がワイヤのメッキ層表面に必ず接し、給電ローラとワイヤ間の所要の導通性が、上記突起によって常に確保される。また、ワイヤに砥粒が付着している場合も同様である。
【0008】
【実施態様1】
実施態様1は、解決手段における繊維ウエブがステンレス繊維製または銅繊維製あるいは化学繊維に導電性金属繊維を含有、又は編み込んであることである。但し、上記繊維ウエブは耐蝕性であり、さらに耐摩耗性に優れた材質が好ましい。
【実施態様2】
実施態様2は、解決手段における繊維ウエブが線径5〜20μmの金属繊維製であることである。
【実施態様3】
実施態様3は、上記給電ローラがステンレス製、銅製、アルミニュウム製、セラミック製又はプラスチック製、その他耐蝕性に優れた材質であることである。
【実施態様4】
実施態様4は、上記給電ローラが外周に環状溝を有し、当該環状溝を上記金属繊維ウエブで被覆したものであることである。
【0009】
【実施例】
この実施例の給電ローラ10は耐蝕性に優れたステンレス製の直径80mm、幅20mmのものであり、その外周に断面円弧状の環状溝(溝幅10mm、深さ5mm)が形成されている。
上記環状溝にステンレス繊維(繊維太さが12μm、ただし5〜20μmで可)の厚さ5mmのウエブ11を巻き付けて、接着剤(導電性テープ)で接着している。
上記構造の給電ローラに、ワイヤを巻きかけて、走行させる。
線径0.2mmのピアノ線を粒径30〜40μmのダイヤモンド砥粒を浮遊させたNiメッキ液内を走行させる。このときの給電電流1Aである。
ワイヤの走行に伴って電圧は2.5〜4.0Vの範囲で変動するが、この間の電流値は1Aに保持され、メッキ、砥粒の付着はほぼ均一で、その品質低下は全く見られない。これに対して、外周面を導電性の繊維ウエブ11で被覆していない従来例では、同様の条件下で、電圧が3.0〜15.0Vの範囲で変動し、メッキ、砥粒の付着は不均一であり、著しい品質低下が見られた。
【0010】
給電ローラ本体については外周面が導電性を有するので、必ずしも導電性を有する必要はなく、セラミック、プラスチックなどの他の耐蝕性に優れたものを使用することができる。給電ローラ本体が非導電性である場合は、小径の電源ローラを給電ローラ外周に当接させて、当該電源ローラと上記繊維ウエブによる被覆層とを導通させればよい。
また、導電性ウエブの繊維については、銅繊維など、耐蝕性に優れていて、導電性の高いものであればよい。
また、給電ローラの外周の環状溝は断面U形、V形でもよく、また必ずしも環状溝を有するものである必要もない。環状溝を有しない場合は、ワイヤに対するガイドローラを給電ローラの上流側に隣接して設け、このガイドローラでワイヤを案内させて給電ローラから外れないようにすればよい。
なおまた、上記のように給電ローラの外周に環状溝を形成することにより、該溝に巻き付けて付着した上記繊維ウエブが上記ローラの回転中に外れる恐れが少ない。
【0011】
【発明の効果】
以上のとおり、この発明によって、ソーワイヤ製造装置における複合メッキのための給電を安定させることができ、したがって、メッキ層、砥粒付着を均一にすることができるので、給電不安定に起因するソーワイヤの品質低下を確実に防止することができる。
【図面の簡単な説明】
【図1】複合メッキによるソーワイヤ製造装置の全体図である。
【図2】実施例の給電ローラの側面図である。
【図3】従来技術におけるワイヤと給電ローラ間の接触状態を模式的に示す正面図である。
【図4】実施例におけるワイヤと給電ローラ間の接触状態を模式的に示す正面図である。
【符号の説明】
10:給電ローラ
11:導電性の繊維ウエブ
[0001]
[Industrial application fields]
The present invention relates to a saw wire manufacturing apparatus used for cutting expensive materials such as silicon crystals, artificial crystals, cemented carbides, ceramics and the like, which are base materials for semiconductor wafers. Thus, the production cost can be reduced.
[0002]
[Prior art]
In recent years, fixed-abrasive saw wires in which fine abrasive grains such as diamond are fixed to the surface of a thin metal wire have begun to be used. In this conventional fixed-abrasive saw wire, for example, a metal wire is drawn to reduce the diameter, and a resin bond (thermosetting resin) is laminated thereon, and the resin bond layer densely adheres to the surface. There are those in which hard fine pieces (hereinafter referred to as abrasive grains) such as diamond abrasive grains, CBN abrasive grains and hard fine fibers are fixed, or those in which abrasive grains are embedded and fixed in a plating layer by composite plating. The former method of manufacturing a fixed abrasive saw wire is a method in which a steel wire is passed through a resin bond mixed with abrasive grains to attach the resin bond mixed with abrasive grains to the surface, and this is cooled and hardened. There is a method for producing the latter fixed abrasive type saw wire, in which the abrasive particles are suspended in a plating solution (Ni plating solution, etc.) and the abrasive particles adhere (deposit) to the plating layer during plating (electroplating). It is a method to make.
[0003]
In the latter case, the adhesive force of the abrasive grains to the metal wire surface is sufficient, and thus the cutting performance is maintained for a long time, but the abrasive particles suspended in the plating solution are fixed and held with sufficient adhesive force. Therefore, the plating layer must be formed to the required thickness, and the thickness of the plating layer must be as uniform as possible in order to make the adhesive strength of the abrasive grains constant. It is.
The composite plating on the wire is performed with an apparatus as shown in FIG. 1. The wire is run in a plating solution mixed with abrasive grains, and the wire is plated by feeding with a power feeding roller. Abrasive grains are attached.
Since the feed roller is required to have corrosion resistance, stainless steel is generally used. Power is supplied to the wire by direct contact between the power supply roller and the wire, but since non-conductive abrasive particles are attached to the surface of the power supply roller, the metal surface of the wire and the metal surface of the power supply roller Are not always in stable contact, and therefore, the electrical resistance between the wire and the feed roller always fluctuates. Further, the above-mentioned tendency is particularly remarkable because the wire on which the plated layer mixed with the abrasive grains is in contact with the power feeding roller on the downstream side.
[0004]
On the other hand, a direct current is used for electroplating, and this direct current rectifies the current from an alternating current power source with a rectifier, and controls this at a constant current value, so that the formation speed of the plating layer (the formed plating layer) (Thickness) is controlled to be constant. However, although the DC power supply is controlled by a constant current, as described above, the electrical resistance between the wire and the feeding roller constantly fluctuates, so the voltage fluctuates severely, and if the voltage exceeds a predetermined limit, the current value As a result, the thickness of the plating layer (the thickness of the deposited layer) is not constant, which causes a poor quality of the saw wire. In order to prevent this, it is necessary to prevent the voltage rise from exceeding a predetermined limit by suppressing the fluctuation of the electric resistance as much as possible.
[0005]
[Problems to be solved by the invention]
In view of this, the present invention ensures the necessary electrical conductivity between the power supply roller and the wire even when the abrasive particles are attached to the power supply roller and the abrasive particles are attached to the wire. The problem is to devise the power supply roller so that the voltage rise does not exceed a predetermined limit.
[0006]
[Means for Solving the Problems]
The means taken in order to solve the above problems is that, in a saw wire manufacturing apparatus using composite plating , the outer peripheral surface of the power supply roller is covered with a conductive fiber web on which countless fine fibers protrude. is there.
[0007]
[Action]
Innumerable fine fibers protrude from the surface of the conductive fiber web (nonwoven fabric). Therefore, when a wire is wound around the fiber web, the protruding fine fibers (protrusions) always come into contact with the surface of the plated layer of the wire even if abrasive grains are attached to the fiber web, and between the feeding roller and the wire. The required continuity is always ensured by the protrusions. The same applies to the case where abrasive grains are attached to the wire.
[0008]
Embodiment 1
Embodiment 1 is that the fiber web in the solution means is made of stainless steel, copper fiber or chemical fiber containing or braided conductive metal fiber. However, the fiber web is preferably a material that is corrosion resistant and has excellent wear resistance.
Embodiment 2
Embodiment 2 is that the fiber web in the solution means is made of metal fibers having a wire diameter of 5 to 20 μm.
Embodiment 3
Embodiment 3 is that the power supply roller is made of stainless steel, copper, aluminum, ceramic or plastic, or other material having excellent corrosion resistance.
Embodiment 4
In the fourth embodiment, the power feeding roller has an annular groove on the outer periphery, and the annular groove is covered with the metal fiber web.
[0009]
【Example】
The power supply roller 10 of this embodiment is made of stainless steel having an excellent corrosion resistance and has a diameter of 80 mm and a width of 20 mm, and an annular groove (groove width of 10 mm, depth of 5 mm) having an arcuate cross section is formed on the outer periphery thereof.
A web 11 having a thickness of 5 mm made of stainless fiber (fiber thickness is 12 μm, but can be 5 to 20 μm) is wound around the annular groove and bonded with an adhesive (conductive tape).
A wire is wound around the power supply roller having the above-described structure to run.
A piano wire having a wire diameter of 0.2 mm is run in a Ni plating solution in which diamond abrasive grains having a particle size of 30 to 40 μm are suspended. This is the feed current 1A at this time.
As the wire travels, the voltage fluctuates in the range of 2.5 to 4.0 V, but the current value during this period is maintained at 1 A, the adhesion of the plating and abrasive grains is almost uniform, and there is no deterioration in the quality. Absent. On the other hand, in the conventional example in which the outer peripheral surface is not covered with the conductive fiber web 11, the voltage fluctuates in the range of 3.0 to 15.0 V under the same conditions, and the adhesion of plating and abrasive grains Was non-uniform and significant quality degradation was observed.
[0010]
Since the outer peripheral surface of the power supply roller body has conductivity, it is not always necessary to have conductivity, and other excellent corrosion resistance materials such as ceramic and plastic can be used. When the power supply roller main body is non-conductive, a small-diameter power supply roller may be brought into contact with the outer periphery of the power supply roller so that the power supply roller and the coating layer made of the fiber web are made conductive.
Moreover, about the fiber of an electroconductive web, it is excellent in corrosion resistance, such as a copper fiber, What is necessary is just high conductivity.
The annular groove on the outer periphery of the power supply roller may be U-shaped or V-shaped in cross section, and does not necessarily have to have an annular groove. When there is no annular groove, a guide roller for the wire may be provided adjacent to the upstream side of the power supply roller, and the guide roller may guide the wire so that it does not come off the power supply roller.
In addition, by forming the annular groove on the outer periphery of the power supply roller as described above, the fiber web wound around and attached to the groove is less likely to come off during the rotation of the roller.
[0011]
【The invention's effect】
As described above, according to the present invention, it is possible to stabilize the power supply for composite plating in the saw wire manufacturing apparatus, and therefore, it is possible to make the plating layer and the abrasive grain adhesion uniform. Quality degradation can be reliably prevented.
[Brief description of the drawings]
FIG. 1 is an overall view of an apparatus for manufacturing a saw wire by composite plating.
FIG. 2 is a side view of the power supply roller according to the embodiment.
FIG. 3 is a front view schematically showing a contact state between a wire and a power feeding roller in a conventional technique.
FIG. 4 is a front view schematically showing a contact state between a wire and a feeding roller in the embodiment.
[Explanation of symbols]
10: Feed roller 11: Conductive fiber web

Claims (5)

複合メッキによるソ−ワイヤ製造装置において、その給電ロ−ラの外周面を表面に無数の微細繊維が突出している導電性の繊維ウエブで被覆したソ−ワイヤ製造装置。In a saw wire manufacturing apparatus using composite plating, a saw wire manufacturing apparatus in which an outer peripheral surface of a power supply roller is covered with a conductive fiber web on which countless fine fibers protrude . 上記繊維ウエブがステンレス繊維製または銅繊維製である請求項1記載のソ−ワイヤ製造装置。2. The saw wire manufacturing apparatus according to claim 1, wherein the fiber web is made of stainless fiber or copper fiber. 上記繊維ウエブが線径5〜20μmの金属繊維製である請求項1又は請求項2記載のソ−ワイヤ製造装置。3. The saw wire manufacturing apparatus according to claim 1, wherein the fiber web is made of a metal fiber having a wire diameter of 5 to 20 [mu] m. 上記給電ロ−ラがステンレス製、銅製、セラミック製又はプラスチック製である請求項1乃至請求項3記載のソ−ワイヤ製造装置。4. The saw wire manufacturing apparatus according to claim 1, wherein the power supply roller is made of stainless steel, copper, ceramic or plastic. 上記給電ロ−ラが外周に環状溝を有し、当該環状溝を上記金属繊維ウエブで被覆したものである請求項1乃至請求項4記載のソ−ワイヤ製造装置。5. The saw wire manufacturing apparatus according to claim 1, wherein the feed roller has an annular groove on the outer periphery, and the annular groove is covered with the metal fiber web.
JP2002245921A 2002-08-26 2002-08-26 Saw wire manufacturing equipment Expired - Fee Related JP3990234B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002245921A JP3990234B2 (en) 2002-08-26 2002-08-26 Saw wire manufacturing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002245921A JP3990234B2 (en) 2002-08-26 2002-08-26 Saw wire manufacturing equipment

Publications (2)

Publication Number Publication Date
JP2004082253A JP2004082253A (en) 2004-03-18
JP3990234B2 true JP3990234B2 (en) 2007-10-10

Family

ID=32053957

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002245921A Expired - Fee Related JP3990234B2 (en) 2002-08-26 2002-08-26 Saw wire manufacturing equipment

Country Status (1)

Country Link
JP (1) JP3990234B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100768256B1 (en) * 2006-03-14 2007-10-18 (주)한국프로테크 Flexible flat cable plating electrode
CN103189158B (en) 2010-10-29 2016-05-18 贝卡尔特公司 There is the sawline of electroplating the abrasive grain in substrate lines
JP2012241242A (en) * 2011-05-20 2012-12-10 Nippon Parkerizing Co Ltd Plating apparatus

Also Published As

Publication number Publication date
JP2004082253A (en) 2004-03-18

Similar Documents

Publication Publication Date Title
KR200331228Y1 (en) Conductive polishing article for electrochemical mechanical polishing
JP4139810B2 (en) Electrodeposition wire tool
TWI503213B (en) Method and jig assembly for manufacturing outer blade cutting wheel
KR20140002710A (en) Abrasive article and method of forming
JP5078949B2 (en) Fixed abrasive wire and method of manufacturing fixed abrasive wire
JP2009066689A (en) Fixed abrasive grain wire saw
EP2497602A1 (en) Super-abrasive grain fixed type wire saw, and method of manufacturing super-abrasive grain fixed type wire saw
JP6352176B2 (en) Fixed abrasive wire saw, manufacturing method thereof, and work cutting method using the same
JP2014530770A (en) Abrasive article and forming method
CN110076705B (en) Bare powder sanding diamond wire electroplating process
JP2007152486A (en) Manufacturing method of saw wire
JP2007044870A (en) Method of detecting disconnection of wire saw, method of inspection quality, and method of manufacturing cut product
JP2000246654A (en) Resin bond wire saw using metal coated super abrasive grain
CN108136567B (en) Diamond abrasive grain for wire tool and wire tool
JPH11216657A (en) Wire saw, and its use
JP2004050301A (en) Wire saw and its manufacturing method
JP3990234B2 (en) Saw wire manufacturing equipment
JPH09155631A (en) Diamond wire saw and its manufacture
JP5066508B2 (en) Fixed abrasive wire saw
JP2000052226A (en) Wire saw and its manufacture
JP2003340729A (en) Wire saw and method for manufacturing the same
JP5705813B2 (en) Diamond abrasive manufacturing method, wire tool manufacturing method, and wire tool
CN202079512U (en) Fretsaw structure with fixed abrasive particles
KR20110048659A (en) Wire saw and method for the manufacture of wire saw
CN104647618A (en) Heterogeneous fixed abrasive wire saw for multi-line cutting

Legal Events

Date Code Title Description
A625 Written request for application examination (by other person)

Free format text: JAPANESE INTERMEDIATE CODE: A625

Effective date: 20050623

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20060720

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20070409

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070417

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070608

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20070703

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20070719

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100727

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110727

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120727

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120727

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130727

Year of fee payment: 6

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees