JP3986327B2 - Method for manufacturing light emitting device - Google Patents

Method for manufacturing light emitting device Download PDF

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Publication number
JP3986327B2
JP3986327B2 JP2002056669A JP2002056669A JP3986327B2 JP 3986327 B2 JP3986327 B2 JP 3986327B2 JP 2002056669 A JP2002056669 A JP 2002056669A JP 2002056669 A JP2002056669 A JP 2002056669A JP 3986327 B2 JP3986327 B2 JP 3986327B2
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Prior art keywords
light
resin
light emitting
led
emitting device
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JP2003258312A (en
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孝一 深澤
康介 土屋
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Citizen Electronics Co Ltd
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Citizen Electronics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Description

【０００１】
【発明の属する分野】
本発明は発光素子本来の発光色をパステル調のやわらかな中間色の発光に変換する発光装置の製造方法に関する。
【０００２】
【従来の技術】
従来、パステル調のやわらかな中間色の発光を行う発光装置として、発光素子からの１次発光を蛍光物質に照射することによって色調の異なる２次発光を行わせ、この１次発光と２次発光を合成することにより白色光とし、この白色光を着色剤でフイルターすることで所望の中間色を有するパステル調の発光を得ることが行われている。
【０００３】
例えば、公知の特開平１１−８７７８４号公報には青色発光ダイオード（以下ＬＥＤと略記）にＹＡＧ系蛍光物質を含有した透明被覆部材を装着することにより白色発光装置とし、この白色発光装置の上に着色剤を含有する被覆材を設けて所望の中間色を有するパステル調の発光を得ることが開示されている。
【０００４】
又、本出願人は特願２０００−２９８５７９号において、青色ＬＥＤを被覆する透明樹脂中に蛍光粒子と色素粒子を含有させることにより、所望の中間色を有するパステル調の発光を得る発光装置を提案している。
【０００５】
【発明が解決しようとする課題】
上記蛍光粒子と色素粒子とによるパステル調の発光装置は、従来より行われていた赤色ＬＥＤ、緑色ＬＥＤ、青色ＬＥＤによる多色混合方式に比べて、単一の発光素子により多様な中間色を有するパステル調の発光を得ることが出来るという利点を有するが、反面以下の問題を有する。
【０００６】
この蛍光粒子と色素粒子とを用いて中間色をつくる方法は、所望の中間色を実現するためには、青色ＬＥＤの発光波長、蛍光粒子の量、色素粒子の量等の各要素を最適に調整する必要があるが、前記従来の青色ＬＥＤを被覆する透明樹脂中に蛍光粒子と色素粒子を含有させる方法では、青色ＬＥＤの発光が前記透明樹脂中において蛍光粒子に当たらずに直接色素粒子を通過する、いわゆる発光の無効分が多くなり、十分な発光効率を得る事が困難であった。
【０００７】
又、特開平１１−８７７８４号公報に開示された青色ＬＥＤに蛍光物質を含有した透明被覆部材と、着色剤を含有した被覆材とを装着する方法は、考え方としては発光効率を高める可能性が有るが、量産性のある具体的な製造方法は何ら示されていない。
本発明は上記問題に鑑みなされたものであり、蛍光粒子と色素粒子とを用いてパステル調の中間色をつくる発光装置において、発光効率が高く、量産性に優れた発光装置の製造方法を提供することを目的としている。
【０００８】
【課題を解決するための手段】
上記目的を達成するため、本発明は電極が形成された基体上に発光素子を搭載し、この発光素子の上面を樹脂材で封止してなる発光装置において、前記発光素子の電極に対応する位置に貫通孔を有するごとく、前記発光素子を蛍光粒子を含有した第１樹脂で封止する第１封止工程と、前記第１樹脂の貫通孔を通して発光素子の電極と前記基体上の電極とを接続する接続工程と、前記第１樹脂の上を色素粒子を含有した第２樹脂で封止する第２封止工程とを有することを特徴とする。
【０００９】
また、第１封止工程は、前記第１樹脂の前記発光素子の電極に対応する位置に貫通孔を有するごとく、樹脂成形すると良い。
【００１０】
さらに、前記第１封止工程と第２封止工程との間に、前記第１樹脂の貫通孔を通して発光素子の電極と前記基体上の電極とを接続する接続工程を設けると良い。
【００１１】
【発明の実施の形態】
以下図面により本発明の実施の形態を説明する。図１は本発明の実施の形態を示す発光装置の断面図であり、１は発光装置、２は基体である回路基板で、電極３が形成されている。４は発光素子であるＬＥＤであり、前記回路基板２に搭載されるとともにワイヤー５によって前記電極３に接続されている。
【００１２】
６は蛍光粒子を含有した第１樹脂、７は色素粒子を含有した第２樹脂であり、前記ＬＥＤ４は第１樹脂６及び第２樹脂７によって２重に封止されている。
【００１３】
次に前記発光装置１の製造方法を説明する。前記回路基板２にＬＥＤ４を搭載し、該ＬＥＤ４の電極４ａと前記回路基板２の電極３とをヤイヤー５によって接続する。次にこのＬＥＤ４を実装した回路基板２を第１成形金型に入れ、蛍光粒子を含有した第１樹脂６により封止する第１封止工程を行う。
【００１４】
前記第１封止工程による第１樹脂６が硬化した後に、回路基板２を第２成形金型に入れ、色素粒子を含有した第２樹脂７で封止する第２封止工程を行って前記発光装置１が完成する。
【００１５】
本実施の形態においては、前記ＬＥＤ４として青色ＬＥＤを用いるとともに、前記第１樹脂６として、エポキシ樹脂またはシリコン樹脂中にイットリウム・アルミニウム・ガーネット（ＹＡＧ）系の蛍光粒子を含有させた樹脂材を用い、さらに第２樹脂７はエポキシ樹脂またはシリコン樹脂中に所望のパステル・カラーに合せた色素を含有させた樹脂材を用いた。
【００１６】
次に上記発光装置１の発光動作を説明する。前記ＬＥＤ４に電流を流すと、ＬＥＤ４は青色発光を行い、この青色発光が第１樹脂６に分散された蛍光粒子に当たって励起することで、蛍光粒子より波長変換された広波長の黄色光が発光される。そしてこの黄色光とＬＥＤ４からの青色光とが合成されることによって第１樹脂６の表面より白色光が発光される。
【００１７】
さらに、この白色光が色素粒子を含有した第２樹脂７を通過する時に、この色素粒子の吸収によって、所望の中間色光が発光される。そしてこの中間色光は前記第２樹脂７に含有させる色素を選択することで任意のパステル・カラーを作ることができる。
【００１８】
尚、この製造過程において、第１封止工程が終了後に前記ＬＥＤ４に電流を供給して発光させ、この時の前記第１樹脂６の表面より発光される白色光を測定し、その色調及び光量に合せて前記第２樹脂７に含有させる色素の状態を調整してやれば、前記ＬＥＤ４及び第１樹脂６に含有された蛍光粒子のバラツキをカバーして前記発光装置１としての製品バラツキを小さくすることができる。
【００１９】
図２は本発明の他の実施の形態を示す発光装置の断面図である。図２における発光装置１０において、図１の発光装置１と異なるところは、前記第１樹脂６の成形時に、前記ＬＥＤ４の電極４ａに対応する位置に貫通孔６ａが設けられており、前記ワイヤー５による回路基板２の電極３とＬＥＤ４の電極４ａとの接続が、この貫通孔６ａを通して行われていることである。
【００２０】
次に前記発光装置１０の製造方法を説明する。図３は第１成形工程であるチップ化工程によって作成された発光チップ２０を示し、図３Ａは斜視図、図３Ｂは断面図である。発光チップ２０を作成するチップ化工程は、前記ＬＥＤ４を第１成形金型内に入れて前記蛍光粒子を含有した第１樹脂６で封止するが、このとき前記ＬＥＤ４の電極４ａに対応する位置には金型によって貫通孔６ａが同時成形されている。
【００２１】
図４は前記発光装置１０のチップ化工程以後の製造工程を示す製造工程図であり、Ａは前記回路基板２に前記発光チップ２０を搭載する実装工程、Ｂは実装されたＬＥＤ４と回路基板２の電極を接続する接続工程、Ｃは前記ＬＥＤ４を実装した回路基板２を第２成形金型に入れ、色素粒子を含有した第２樹脂７で封止する第２封止工程である。
【００２２】
以下、製造工程を説明すると、図４Ａの実装工程においては、第１成形工程であるチップ化工程によって作成された発光チップ２０を回路基板２の所定の位置に搭載固定する。次に図４Ｂの接続工程において前記ＬＥＤ４の電極４ａと前記回路基板２の電極３とを、前記第１樹脂６に形成された貫通孔６ａを通してワイヤー５により接続する。さらに図４Ｃの第２封止工程において前記ＬＥＤ４を実装した回路基板２を第２成形金型に入れ、色素粒子を含有した第２樹脂７で封止することにより、発光装置１０が完成する。
【００２３】
この実施の形態においては、ＬＥＤ４を予め第１樹脂６によりモールドして発光チップ２０に加工し、この発光チップ２０を従来のＬＥＤ素子と同様に回路基板２に実装することができるため、ＬＥＤ素子単体をハンドリングして実装していたのに比べて、ＬＥＤ素子の破損や劣化を少なくすることが可能となり、また、ＬＥＤ素子の周囲に蛍光体層を均一に形成することで、前記蛍光粒子の量を一定にする事ができるので色のバラツキを少なくする事が可能となり、ＬＥＤ素子の青色発光を効率よく白色発光に変換することが可能となる。
【００２４】
そして、この発光装置１０の発光動作は前記発光装置１と同様であり、また、この製造工程においても接続工程Ｂの終了後に前記ＬＥＤ４に電流を供給して発光させ、この時の前記第１樹脂６の表面より発光される白色光を測定し、その色調及び光量に合せて前記第２樹脂７に含有させる色素の状態を調整してやれば、前記ＬＥＤ４及び第１樹脂６に含有された蛍光粒子のバラツキをカバーして前記発光装置１０としての製品バラツキを小さくすることができる。
【００２５】
【発明の効果】
上記のごとく、本発明においては蛍光粒子と色素粒子とを用いてパステル調の中間色をつくる発光装置において、ＬＥＤの封止を蛍光粒子を含有した第１樹脂による封止と、色素粒子を含有した第２樹脂による封止との２工程にしているため、発光効率が高く、量産性に優れた発光装置の製造方法を提供するができる。特にＬＥＤ素子を予め第１樹脂によりモールドして発光チップ２０に加工する方法は製品の歩留まりを改善する効果が大きい。
【図面の簡単な説明】
【図１】 本発明の実施の形態を示す発光装置の断面図。
【図２】本発明の他の実施の形態を示す発光装置の断面図。
【図３】本発明の発光チップ２０を示し、図３Ａは斜視図、図３Ｂは断面図である。
【図４】本発明の発光装置の製造工程図であり、図４Ａは実装工程、図４Ｂは接続工程、図４Ｃは封止工程である。
【符号の説明】
１、１０ 発光装置
２ 回路基板
４ ＬＥＤ
６ 第１樹脂
６ａ 貫通孔
７ 第２樹脂
２０ 発光チップ[0001]
[Field of the Invention]
The present invention relates to a method for manufacturing a light-emitting device that converts light emitted from a light-emitting element into light emission having a soft pastel color.
[0002]
[Prior art]
Conventionally, as a light emitting device that emits light in a soft pastel color, secondary light emission having a different color tone is performed by irradiating a fluorescent material with primary light emission from a light emitting element, and this primary light emission and secondary light emission are performed. A pastel-like light emission having a desired intermediate color is obtained by synthesizing white light and filtering the white light with a colorant.
[0003]
For example, in the known Japanese Patent Application Laid-Open No. 11-87784, a blue light emitting diode (hereinafter abbreviated as LED) is mounted with a transparent covering member containing a YAG-based fluorescent material to form a white light emitting device. It is disclosed that a coating material containing a colorant is provided to obtain pastel light emission having a desired intermediate color.
[0004]
In addition, in Japanese Patent Application No. 2000-298579, the present applicant has proposed a light emitting device that obtains pastel light emission having a desired intermediate color by including fluorescent particles and pigment particles in a transparent resin covering a blue LED. ing.
[0005]
[Problems to be solved by the invention]
The pastel light emitting device using the fluorescent particles and the pigment particles is a pastel having various intermediate colors with a single light emitting element as compared with the conventional multi-color mixing method using red LED, green LED, and blue LED. Although it has an advantage that it is possible to obtain a luminescent light, it has the following problems.
[0006]
In this method of creating an intermediate color using fluorescent particles and pigment particles, each element such as the emission wavelength of the blue LED, the amount of fluorescent particles, and the amount of pigment particles is optimally adjusted in order to realize a desired intermediate color. Although it is necessary, in the conventional method of containing fluorescent particles and pigment particles in the transparent resin covering the blue LED, the light emission of the blue LED passes directly through the pigment particles without hitting the fluorescent particles in the transparent resin. In other words, the amount of ineffective light emission increases, and it is difficult to obtain sufficient light emission efficiency.
[0007]
In addition, the method of mounting a transparent coating member containing a fluorescent substance and a coating material containing a colorant on a blue LED disclosed in Japanese Patent Application Laid-Open No. 11-87784 may increase the luminous efficiency as a concept. However, there is no specific production method with mass productivity.
The present invention has been made in view of the above problems, and provides a method for manufacturing a light-emitting device having high luminous efficiency and excellent mass productivity in a light-emitting device that uses a fluorescent particle and a pigment particle to produce a pastel-tone intermediate color. The purpose is that.
[0008]
[Means for Solving the Problems]
To achieve the above object, the present invention is equipped with a light emitting element on a substrate on which electrodes are formed, the light-emitting device obtained by encapsulating in a resin material to an upper surface of the light emitting element, corresponding to the electrode of the light emitting element A first sealing step of sealing the light emitting element with a first resin containing fluorescent particles so as to have a through hole at a position; an electrode of the light emitting element and an electrode on the substrate through the through hole of the first resin; And a second sealing step of sealing the first resin with a second resin containing pigment particles.
[0009]
In the first sealing step, it is preferable to perform resin molding so that the first resin has a through hole at a position corresponding to the electrode of the light emitting element.
[0010]
Furthermore, it is preferable to provide a connection step for connecting the electrode of the light emitting element and the electrode on the substrate through the through hole of the first resin between the first sealing step and the second sealing step.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view of a light-emitting device showing an embodiment of the present invention. 1 is a light-emitting device, 2 is a circuit board as a base, and an electrode 3 is formed thereon. Reference numeral 4 denotes an LED which is a light emitting element, which is mounted on the circuit board 2 and connected to the electrode 3 by a wire 5.
[0012]
Reference numeral 6 denotes a first resin containing fluorescent particles, 7 denotes a second resin containing pigment particles, and the LED 4 is double-sealed by the first resin 6 and the second resin 7.
[0013]
Next, a method for manufacturing the light emitting device 1 will be described. An LED 4 is mounted on the circuit board 2, and the electrode 4 a of the LED 4 and the electrode 3 of the circuit board 2 are connected by a Year 5. Next, the circuit board 2 on which the LED 4 is mounted is placed in a first molding die, and a first sealing process is performed in which the circuit board 2 is sealed with a first resin 6 containing fluorescent particles.
[0014]
After the first resin 6 is cured by the first sealing step, the circuit board 2 is put in a second molding die, and the second sealing step of sealing with the second resin 7 containing pigment particles is performed, The light emitting device 1 is completed.
[0015]
In the present embodiment, a blue LED is used as the LED 4, and a resin material containing yttrium, aluminum, garnet (YAG) -based fluorescent particles in an epoxy resin or silicon resin is used as the first resin 6. Further, as the second resin 7, a resin material in which a dye matched with a desired pastel color is contained in an epoxy resin or a silicon resin is used.
[0016]
Next, the light emitting operation of the light emitting device 1 will be described. When an electric current is passed through the LED 4, the LED 4 emits blue light, and the blue light emitted strikes the fluorescent particles dispersed in the first resin 6, thereby exciting yellow light with a wide wavelength converted from the fluorescent particles. The Then, white light is emitted from the surface of the first resin 6 by combining the yellow light and the blue light from the LED 4.
[0017]
Further, when the white light passes through the second resin 7 containing the pigment particles, desired intermediate color light is emitted by the absorption of the pigment particles. The intermediate color light can produce an arbitrary pastel color by selecting a pigment to be contained in the second resin 7.
[0018]
In this manufacturing process, after the first sealing step is completed, current is supplied to the LED 4 to emit light, white light emitted from the surface of the first resin 6 at this time is measured, and the color tone and light amount are measured. If the state of the pigment contained in the second resin 7 is adjusted according to the above, the variation of the fluorescent particles contained in the LED 4 and the first resin 6 is covered to reduce the product variation as the light emitting device 1. Can do.
[0019]
FIG. 2 is a cross-sectional view of a light-emitting device showing another embodiment of the present invention. 2 differs from the light emitting device 1 of FIG. 1 in that when the first resin 6 is molded, a through hole 6a is provided at a position corresponding to the electrode 4a of the LED 4, and the wire 5 That is, the connection between the electrode 3 of the circuit board 2 and the electrode 4a of the LED 4 is made through the through hole 6a.
[0020]
Next, a method for manufacturing the light emitting device 10 will be described. FIG. 3 shows the light emitting chip 20 produced by the chip forming process as the first molding process, FIG. 3A is a perspective view, and FIG. 3B is a cross-sectional view. In the chip forming step for creating the light emitting chip 20, the LED 4 is put in a first molding die and sealed with the first resin 6 containing the fluorescent particles. At this time, the position corresponding to the electrode 4 a of the LED 4 The through-hole 6a is simultaneously formed by a mold.
[0021]
FIG. 4 is a manufacturing process diagram showing manufacturing steps after the chip forming process of the light emitting device 10, A is a mounting process for mounting the light emitting chip 20 on the circuit board 2, and B is a mounted LED 4 and circuit board 2. C is a second sealing step in which the circuit board 2 on which the LED 4 is mounted is placed in a second molding die and sealed with a second resin 7 containing pigment particles.
[0022]
Hereinafter, the manufacturing process will be described. In the mounting process of FIG. 4A, the light emitting chip 20 created by the chip forming process as the first molding process is mounted and fixed at a predetermined position on the circuit board 2. 4B, the electrode 4a of the LED 4 and the electrode 3 of the circuit board 2 are connected by the wire 5 through the through hole 6a formed in the first resin 6. Furthermore, in the second sealing step of FIG. 4C, the circuit board 2 on which the LED 4 is mounted is placed in a second molding die and sealed with a second resin 7 containing pigment particles, whereby the light emitting device 10 is completed.
[0023]
In this embodiment, the LED 4 can be molded in advance with the first resin 6 and processed into the light-emitting chip 20, and the light-emitting chip 20 can be mounted on the circuit board 2 in the same manner as the conventional LED element. Compared to mounting and handling a single unit, it is possible to reduce the damage and deterioration of the LED element, and by uniformly forming a phosphor layer around the LED element, Since the amount can be made constant, it is possible to reduce color variation, and it is possible to efficiently convert blue light emission of the LED element into white light emission.
[0024]
The light-emitting operation of the light-emitting device 10 is the same as that of the light-emitting device 1. Also in this manufacturing process, after the connection process B is completed, the LED 4 is supplied with current to emit light, and the first resin at this time If the white light emitted from the surface of 6 is measured and the state of the pigment contained in the second resin 7 is adjusted in accordance with the color tone and the amount of light, the fluorescent particles contained in the LED 4 and the first resin 6 The variation in the product as the light emitting device 10 can be reduced by covering the variation.
[0025]
【The invention's effect】
As described above, in the present invention, in a light-emitting device that creates a pastel intermediate color using fluorescent particles and pigment particles, the LED is sealed with a first resin containing fluorescent particles and pigment particles are contained. Since the two steps of sealing with the second resin are employed, it is possible to provide a method for manufacturing a light emitting device with high light emission efficiency and excellent mass productivity. In particular, the method of processing the LED element by pre-molding it with the first resin into the light emitting chip 20 has a great effect of improving the yield of the product.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a light emitting device according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view of a light-emitting device showing another embodiment of the present invention.
3 shows a light-emitting chip 20 of the present invention, FIG. 3A is a perspective view, and FIG. 3B is a cross-sectional view.
4A and 4B are manufacturing process diagrams of the light-emitting device of the present invention, in which FIG. 4A is a mounting process, FIG. 4B is a connection process, and FIG. 4C is a sealing process.
[Explanation of symbols]
1, 10 Light emitting device 2 Circuit board 4 LED
6 1st resin 6a Through-hole 7 2nd resin 20 Light emitting chip

Claims (2)

電極が形成された基体上に発光素子を搭載し、この発光素子の上面を樹脂材で封止してなる発光装置において、前記発光素子の電極に対応する位置に貫通孔を有するごとく、前記発光素子を蛍光粒子を含有した第１樹脂で封止する第１封止工程と、前記第１樹脂の貫通孔を通して発光素子の電極と前記基体上の電極とを接続する接続工程と、前記第１樹脂の上を色素粒子を含有した第２樹脂で封止する第２封止工程とを有することを特徴とする発光装置の製造方法。In a light-emitting device in which a light-emitting element is mounted on a substrate on which an electrode is formed and the upper surface of the light-emitting element is sealed with a resin material, the light-emitting element has a through-hole at a position corresponding to the electrode of the light-emitting element. A first sealing step of sealing the element with a first resin containing fluorescent particles, a connecting step of connecting the electrode of the light emitting element and the electrode on the substrate through the through hole of the first resin, and the first And a second sealing step of sealing the resin with a second resin containing pigment particles. 発光素子を蛍光粒子を含有した第１樹脂にて電極部を露出させてモールドすることにより、発光チップを作成するチップ化工程と、前記発光チップを電極が形成された基体上に搭載し、前記発光素子の電極と基体上の電極とを接続する接続工程と、前記接続された発光チップ上を色素粒子を含有した第２樹脂で封止する封止工程とを有することを特徴とする発光装置の製造方法。  The light emitting element is molded by exposing the electrode portion with a first resin containing fluorescent particles, thereby forming a light emitting chip, and mounting the light emitting chip on a substrate on which an electrode is formed, A light emitting device comprising: a connecting step of connecting an electrode of a light emitting element and an electrode on a substrate; and a sealing step of sealing the connected light emitting chip with a second resin containing pigment particles. Manufacturing method.
JP2002056669A 2002-03-01 2002-03-01 Method for manufacturing light emitting device Expired - Fee Related JP3986327B2 (en)

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JP4503950B2 (en) * 2003-07-11 2010-07-14 スタンレー電気株式会社 Method for manufacturing phosphor-integrated LED lamp
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US7372198B2 (en) * 2004-09-23 2008-05-13 Cree, Inc. Semiconductor light emitting devices including patternable films comprising transparent silicone and phosphor
KR101047683B1 (en) * 2005-05-17 2011-07-08 엘지이노텍 주식회사 Light emitting device packaging method that does not require wire bonding
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