JP3984710B2 - 露光方法及び露光装置 - Google Patents

露光方法及び露光装置 Download PDF

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Publication number
JP3984710B2
JP3984710B2 JP20133498A JP20133498A JP3984710B2 JP 3984710 B2 JP3984710 B2 JP 3984710B2 JP 20133498 A JP20133498 A JP 20133498A JP 20133498 A JP20133498 A JP 20133498A JP 3984710 B2 JP3984710 B2 JP 3984710B2
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JP
Japan
Prior art keywords
exposure
pattern
position detection
detection mark
exposed
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Expired - Fee Related
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JP20133498A
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English (en)
Japanese (ja)
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JP2000021754A5 (https=
JP2000021754A (ja
Inventor
隆宏 松本
栄一 村上
謙治 斉藤
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Canon Inc
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Canon Inc
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Application filed by Canon Inc filed Critical Canon Inc
Priority to JP20133498A priority Critical patent/JP3984710B2/ja
Publication of JP2000021754A publication Critical patent/JP2000021754A/ja
Publication of JP2000021754A5 publication Critical patent/JP2000021754A5/ja
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  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP20133498A 1998-06-30 1998-06-30 露光方法及び露光装置 Expired - Fee Related JP3984710B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20133498A JP3984710B2 (ja) 1998-06-30 1998-06-30 露光方法及び露光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20133498A JP3984710B2 (ja) 1998-06-30 1998-06-30 露光方法及び露光装置

Publications (3)

Publication Number Publication Date
JP2000021754A JP2000021754A (ja) 2000-01-21
JP2000021754A5 JP2000021754A5 (https=) 2005-04-14
JP3984710B2 true JP3984710B2 (ja) 2007-10-03

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ID=16439305

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20133498A Expired - Fee Related JP3984710B2 (ja) 1998-06-30 1998-06-30 露光方法及び露光装置

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JP (1) JP3984710B2 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW541605B (en) 2000-07-07 2003-07-11 Hitachi Ltd Fabrication method of semiconductor integrated circuit device
US7687209B2 (en) * 2006-03-21 2010-03-30 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method with double exposure overlay control
NL2003762A (en) 2008-11-18 2010-05-20 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
US9087982B2 (en) 2013-11-18 2015-07-21 Tdk Corporation Manufacturing method for pattern multilayer body and mask set
EP3237973B1 (en) * 2014-12-22 2019-08-21 Eulitha A.G. Method for printing colour images
CN121165410B (zh) * 2025-11-19 2026-02-03 深圳市埃芯半导体科技有限公司 层间对准误差的测量方法、装置及电子设备

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JP2000021754A (ja) 2000-01-21

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