JP3980231B2 - Carrier tape and manufacturing apparatus thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a carrier tape for storing and transporting electronic components and a manufacturing apparatus thereof.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a carrier tape for storing and transporting electronic components is known in which a recess is formed in a plastic substrate and the electronic component is stored in the recess.
[0003]
Another carrier tape is known in which a through hole is formed in a cardboard base material, and lids are attached to both surfaces of the base material in a state where electronic parts are accommodated in the through hole.
[0004]
[Problems to be solved by the invention]
As described above, a carrier tape made from a cardboard substrate is known. In this case, the lid material is attached to both surfaces of the base material, but it is complicated to attach the lid material to both surfaces of the base material.
[0005]
Also, a carrier tape has been developed in which a concave portion is provided in a cardboard base material, an electronic component is accommodated in the concave portion, and a lid member is attached only to the opening side of the concave portion. In such a carrier tape, it is considered that the electronic component discharge pin is pushed up to break the bottom surface of the recess and take out the electronic component.
[0006]
The present invention has been made in consideration of such points, and the lid member can be attached to only one side of the base material, and the bottom surface of the concave portion of the lid material can be easily made thin by the electronic component discharge pin. It is an object of the present invention to provide a carrier tape and a manufacturing apparatus therefor.
[0007]
[Means for Solving the Problems]
The present invention comprises a base material made of cardboard, and this base material has a concave part for storing electronic parts formed by holding the base material on a cradle and pressing the base material from above with a punch. The base material made of cardboard remains in the thickness before pressing, and a depression is formed by pressing the base material from below with a protruding die on the back surface of the concave portion of the base material, and the back surface of the base material is a depression formed on the back surface of the concave portion. The carrier tape is formed in a flat shape except for.
The present invention relates to a cradle for receiving a base made of cardboard, a stripper disposed above the cradle, abutting the base and having a through hole formed therein, and provided on the stripper so as to be movable in the vertical direction. And a punch plate for holding a punch for forming a recess for storing an electronic component in the base material through the through hole of the base plate, and a protrusion die for forming a recess in the back surface of the concave portion of the base material the protrusion die protrudes upward from the upper surface of the pedestal, the rear surface of the substrate, in the manufacturing apparatus of the carrier tape, characterized in that it is formed in a flat shape except for recess formed in the recess back surface is there.
[0008]
According to the present invention, a concave portion is formed in the base material by pressing the base material made of cardboard between the cradle and the stripper and then allowing the punch held by the punch plate to enter the base material through the through hole of the stripper. At the same time, a depression can be formed on the bottom surface of the recess by the protruding die on the cradle side.
[0009]
Since the bottom surface of the concave portion of the substrate becomes thin due to the depression, the electronic component can be taken out by breaking the bottom surface of the concave portion by pushing up the discharging pin from below.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings. 1 to 3 are views showing an embodiment of the present invention.
[0011]
First, the entire carrier tape body will be described with reference to FIGS. As shown in FIG. 3, the carrier tape body 20 includes a carrier tape 10 according to the present invention in which a concave portion 24 is formed of a base material 10 a made of cardboard, an electronic component 25 accommodated in the concave portion 24, and an opening of the concave portion 24. And a cover 21 for covering.
[0012]
Of these, the carrier tape 10 is made of, for example, a cardboard substrate 10a having a thickness of 0.6 mm. Further, in the recess 24 of the carrier tape 10, a fine electronic component 25, for example, a surface mount component is accommodated, and this electronic component 25 is placed on the bottom surface 26 of the recess 24. A recess 26 a is formed on the back surface of the recess 24. By providing the recess 26 a on the back surface of the recess 24, the bottom surface 26 of the recess 24 can be made thin. For this reason, after peeling off the cover material 21 from the carrier tape 10, the electronic component 25 can be easily taken out by breaking the bottom surface 26 of the recess 24 by pushing up the electronic component discharge pin 30 from below.
[0013]
Moreover, as shown in FIG. 2, the recess 26a on the back surface of the recess 24 formed in the base material 10a is divergent toward the back surface side (downward). That is, the side edge 27 of the recess 26a is inclined in a divergent shape toward the back side. The recess 26a is formed by the protruding die 19 provided on the cradle 11 as will be described later. However, by providing the inclined side edge 27 on the recess 26a, the engagement between the protruding die 19 and the recess 26a is facilitated. The carrier tape 10 can be smoothly moved on the cradle 11 by unwinding.
[0014]
In FIG. 2, when the width _{L 1} of the recess 24 is about 0.7 mm, the thickness _{L 2} of the bottom surface 26 of the recess 24 becomes 1 / 100~2 / 100mm. When the recess 26a is not provided on the back surface of the recess 24, the thickness of the bottom surface 26 of the recess 24 is about 5/100 mm. Therefore, by providing the recess 26a, the thickness L2 of the bottom surface 26a of the recess 24 is reduced to 1/100 to ₂ / It can be 100 mm. For this reason, after peeling the cover material 21 from the carrier tape 10, the electronic component 25 can be easily taken out by breaking the bottom surface of the recess 24 by pushing up the electronic component discharge pin 30 from below.
[0015]
Further, the lid 21 covers the opening of the recess 24 in which the electronic component 25 is accommodated. As the lid 21, for example, a plastic or paper is used, and the carrier tape 10 is subjected to thermocompression bonding. It is stuck by the method.
[0016]
The carrier tape 10 is provided with a transport feed hole 27a in a portion other than the recess 24 (FIG. 3).
[0017]
Next, a carrier tape manufacturing apparatus will be described with reference to FIG.
[0018]
As shown in FIG. 1, the carrier tape manufacturing apparatus has a mechanism for forming a recess 24 in the base material 10 a. That is, the carrier tape manufacturing apparatus includes a receiving base 11 that receives a base 10a made of cardboard, a stripper 12 that is provided to face the receiving base 11 and contacts the base 10a, and has a through hole 14. And a punch 13 which is inserted into the hole 14 and forms a recess 24 in the base material 10a.
[0019]
The punch 13 is held by a punch plate 15, and the stripper 12 is supported by the lower end of the presser rod 16. A flange 28 mounted in the space 27 of the punch plate 15 is fixed to the upper end of the presser rod 16, and the flange 28 is elastically pressed downward by a spring 17 provided in the space 27. ing.
[0020]
In addition, the receiving base 11 is provided with a protruding die 19 for forming a recess 26a on the back surface of the recess 24 so as to be movable in the vertical direction.
[0021]
Next, the manufacturing method of a carrier tape is demonstrated. First, the cardboard substrate 10a is placed on the cradle 11, and the stripper 12 is disposed above the substrate 10a.
[0022]
Thereafter, the drive ram 18 is lowered, and the punch plate 15 and the presser rod 16 are lowered accordingly, and the base material 10a is pressed and held between the stripper 12 and the cradle 11.
[0023]
Next, the drive ram 18 is further lowered, and the punch 13 held by the punch plate 15 enters the substrate 10a from the inside. At this time, the recess 24 is formed in the base material 10a.
[0024]
During this time, the stripper 12 elastically holds the substrate 10 a by the spring 17. Further, since the protruding die 19 rises from the cradle 11 side and protrudes upward in advance, the protruding die 19 simultaneously forms a recess 26 a on the back surface of the recess 24.
[0025]
Thereafter, the punch plate 15 is raised by the drive ram 18 and the punch 13 is pulled out from the substrate 10a. Thereafter, by raising the stripper 12, it is possible to obtain the carrier tape 10 in which the recess 24 and the recess 26a are formed in the base material 10a.
[0026]
Next, the carrier tape 10 is transferred to the right side of FIG. At this time, since the depression 26 a is provided with the inclined side edge 27, the engagement between the protruding die 19 and the depression 26 a can be easily released, and the carrier tape 10 can be smoothly transferred on the cradle 11. .
[0027]
In addition, after forming the recessed part 24 and the hollow 26a in the base material 10a, the protruding die 19 may be lowered with respect to the cradle 11 and the protruding die 19 may be retracted downward.
[0028]
According to the present embodiment, the recesses 24 and the depressions 26a can be easily formed in the base material 10a by the punch 13 and the protruding die 19. Since the bottom surface 26 of the recess 24 of the substrate 10a is thinned by the recess 26a, the electronic component 25 can be easily taken out by damaging the bottom surface 26 by pushing up the electronic component discharge pin 30 from below.
[0029]
【The invention's effect】
As described above, according to the present invention, the concave portion and the depression can be easily formed in the base material by the punch and the protruding die while pressing the cardboard base material between the cradle and the stripper. Since the bottom surface of the concave portion of the substrate becomes thin due to the depression, the electronic component can be easily taken out by breaking the bottom surface of the concave portion by pushing up the discharge pin from below. For this reason, the taking-out operation of the electronic component can be performed reliably.
[Brief description of the drawings]
FIG. 1 shows a carrier tape manufacturing apparatus according to the present invention.
FIG. 2 is a side sectional view showing a carrier tape body.
FIG. 3 is a plan view showing a carrier tape.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Carrier tape 10a Base material 11 Receptacle 12 Stripper 13 Punch 14 Through-hole 15 Punch plate 16 Pressing rod 17 Spring 18 Drive ram 19 Protrusion die 20 Carrier tape body 24 Recess 25 Electronic component 26 Bottom 26a Depression

Claims (6)

It consists of a cardboard base material,
This base material has a concave portion for storing an electronic component that is formed by holding the base material on a cradle and pressing the base material with a punch from above, and between the concave portions, the base material made of cardboard has a thickness before pressing. Now,
A carrier characterized in that a recess is formed by pressing the substrate from below with a protruding die on the recess back surface of the substrate, and the back surface of the substrate is formed flat except for the recess formed on the recess back surface. tape. The carrier tape according to claim 1 , wherein the recess of the base material is divergent toward the back side of the base material. The carrier tape according to claim 1 , wherein the thickness of the bottom surface of the concave portion of the substrate is 1/100 to 2/100 mm. A cradle for receiving a cardboard substrate;
A stripper disposed above the cradle, contacting the substrate and having a through-hole formed therein;
A punch plate which is provided on the stripper so as to be movable in the vertical direction, and holds a punch for penetrating the through hole of the stripper and forming a recess for storing an electronic component in the base material;
The cradle is provided with a protrusion die for forming the recess in the recess back surface of the substrate, the projection die protrudes upward from the upper surface of the pedestal, the rear surface of the substrate, recess formed in the recess back surface An apparatus for producing a carrier tape, characterized in that it is formed in a flat shape except for . 5. The carrier tape manufacturing apparatus according to claim 4, wherein the punch plate and the stripper are connected by a presser rod that elastically presses the stripper from the punch plate side. 5. The carrier tape manufacturing apparatus according to claim 4, wherein the protruding die is provided so as to be movable in the vertical direction with respect to the cradle.

Images