JPH10329096A - Punched hole forming device and method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To form a punched hole with high accuracy without generating flash at a cardboard base material. SOLUTION: A cardboard base material 15 is clamped between an upper mold 11 and a lower mold 12. While the base material 15 is being compressed between a punch 13 and a receiving part 17, the punch 13 passes through the base material 15. When the punch 13 passes through the base material 15, the base material 15 is clamped between the upper mold 11 and the lower mold 12 and compressed between the punch 13 and the receiving part 17, therefore, the paper fiber of the base material 15 is broken by the punch 13. It is thus possible to provide a highly accurate punched hole 19 without generation of flash.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a punch hole forming apparatus and a punch hole forming method capable of accurately forming punch holes in a cardboard substrate.

[0002]

2. Description of the Related Art Conventionally, plastic carrier tapes have been used to transport electronic parts and the like. In recent years, instead of a plastic carrier tape, a carrier tape has been produced by forming punched holes in a cardboard base material and attaching lids to both sides of the base material.

FIGS. 6A and 6B show a conventional punch hole forming apparatus for forming punch holes in a cardboard base material. As shown in FIGS. 6A and 6B, the punch hole forming apparatus 10 includes an upper die 11 and a lower die 12, and a punch 13 is provided on the upper die 11 so as to be able to advance and retreat. The lower die 12 is provided with an opening 14 into which the punch 13 enters.

In FIG. 6A, first, a cardboard base material 15 is placed on a lower mold 12. Next, the punch 13 is
Penetrates into the opening 14 and the punch 13 forms a punch hole in the base material 15 in this manner.

[0005]

SUMMARY OF THE INVENTION As described above, the punch 1
When 3 penetrates the base material 15, a punch hole is formed in the base material 15, and a chip 16 is generated. In this case, since the cardboard base material 15 is configured by overlapping a large number of paper fibers, when the punch 13 penetrates the base material 15, a part of the paper fibers is drawn into the punch hole together with the punch 13,
In some cases, burrs made of paper fibers may occur in the punch holes. When burrs are generated in the punch holes of the base material, it hinders the storage of precision electronic components in the punch holes. Therefore, it is necessary to remove the burrs, but it is not easy to remove the burrs in the punch holes.

The present invention has been made in view of the above points, and an object of the present invention is to provide a punch hole forming apparatus and a punch hole forming method capable of forming punch holes with high accuracy without generating burrs. And

[0007]

SUMMARY OF THE INVENTION The present invention is directed to one type,
A mold for holding a cardboard base material between one of the molds; and a mold for forming a punch hole in the base material is provided on one of the mold and the other mold so as to be able to advance and retreat. A punch hole forming apparatus characterized in that a receiving portion for compressing a base material between the punch and a retracting portion corresponding to the approach of the punch is provided so as to be able to move forward and backward, and the punch hole forming apparatus described above. In the punch hole forming method, a step of sandwiching a cardboard base material between one mold and the other mold, and protruding the punch toward the base material side to compress the base material between the punch and the receiving portion A punch hole forming method, comprising: a step of forming a punch hole by penetrating a punch through a base material while compressing the base material between a punch and a receiving portion.

According to the present invention, a cardboard substrate is sandwiched between one mold and the other mold. Thereafter, the punch penetrates the base material while compressing the base material between the punch and the receiving portion. In this case, the punch penetrates the base material while holding the base material between one mold and the other mold and compressing the base material between the punch and the receiving portion. At this time, punch holes can be formed in the substrate while breaking the paper fibers around the punch.

[0009]

Embodiments of the present invention will be described below with reference to the drawings.

FIGS. 1 to 5 are views showing a punch hole forming apparatus and a punch hole forming method according to the present invention.

First, the carrier tape will be briefly described with reference to FIG. As shown in FIG. 5, the carrier tape 20 is made of a cardboard base material 15 in which punch holes 19 are formed, and a base material 15.
And lid materials 21 and 22 attached to both sides of the cover.

The electronic component 23 is accommodated in the punched hole 19 of the base material 15, and the punched hole 19 is
It is covered by 1,22.

In FIG. 5, the thickness of the cardboard lid member 15 is 0.3 to 1.2 mm. In addition, the lid material 21,
22 are made of plastic and paper, respectively, and each has a thickness of 0.05 to 0.08 mm.

Next, a punch hole forming apparatus will be described with reference to FIGS. The punch hole forming apparatus 10 includes an upper mold 11
And a lower mold 12 for holding a cardboard base material 15 between the upper mold 11 and the upper mold 11. A punch 13 is provided on the upper die 11 so as to be able to move up and down in the vertical direction, and a receiving portion 17 is provided on the lower die 12 corresponding to the punch 13. Receiving part 1
Reference numeral 7 is provided on the lower mold 12 and is urged upward by a spring (not shown). When the punch 13 moves down, the base material 7 is compressed with the punch 13 and retreated into the lower mold 12. It has become.

Next, the operation of the embodiment having the above-described configuration will be described. As shown in the figure, first, the lower mold 1
The cardboard substrate 15 is placed on the base material 2. Next, the upper mold 11 descends with respect to the lower mold 12, and the base material 15 is firmly held between the upper mold 11 and the lower mold 12 (see FIG. 2).

Thereafter, the punch 13 in the upper die 11 descends and compresses the base material 15 with the receiving portion 17. During this time, the base material 15 is sandwiched between the upper mold 11 and the lower mold 12,
When compressing the base material 15 between the punch 13 and the receiving portion 17,
The paper fibers constituting the base material 15 around the punch 13 are sequentially broken. When the punch 13 further descends, the receiving part 17 also descends, and the punch 13 completely penetrates the substrate 15 to form a punch hole 19 in the substrate 15. Simultaneously, compressed dust 16 is produced (see FIG. 3). When the punch 13 penetrates the base material 15 as described above, first, the base material 15 is compressed between the punch 13 and the receiving portion 17 so that the punch 13
The surrounding paper fibers are broken, and the punch 13 is completely
5, the paper fibers around the punch 13 can be similarly broken. When the punch 13 penetrates the base material 15 in this manner, the paper fiber is punched by the punch 13 into the punch hole 19.
Since it can be broken without being pulled into the inside, no burrs of paper fibers occur in the punch holes 19.

Next, as shown in FIG. 4, when the punch 13 is pulled into the upper mold 11, the receiving portion 17 which has been urged upward in the lower mold 12 moves upward, and the scrap 16 is moved to the lower mold. Return to surface 12. The base material 15 then slides on the lower mold 12, and the chips 16 remaining in the punch holes 19 of the base material 15 are thereafter dropped from the punch holes 19 and removed.

In this way, it is possible to form the punch holes 19 in the base material 15 with high accuracy without causing the burrs of the paper fibers.

[0019]

As described above, according to the present invention, the base is sandwiched between the one mold and the other mold, and the base is compressed while compressing the base between the punch and the receiving portion. Since the punch penetrates the material, when the punch penetrates the base material, the punch holes can be formed in the base material while breaking the paper fibers around the punch. For this reason, a punch hole can be accurately formed without generating burrs made of paper fibers.

[Brief description of the drawings]

FIG. 1 is a side sectional view showing a punch hole forming apparatus according to the present invention.

FIG. 2 is a side sectional view showing a punch hole forming apparatus according to the present invention.

FIG. 3 is a side sectional view showing a punch hole forming apparatus according to the present invention.

FIG. 4 is a side sectional view showing a punch hole forming apparatus according to the present invention.

FIG. 5 is a side sectional view showing a carrier tape.

FIG. 6 is a side sectional view showing a conventional punch hole forming apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Punch hole forming apparatus 11 Upper die 12 Lower die 13 Punch 15 Substrate 16 Dust 17 Reception part 19 Punch hole

Claims (2)

[Claims] 1. A mold comprising: a first mold; and a second mold for holding a cardboard base material between the first mold and a punch hole in the base material in one of the molds and the other mold. A punch hole forming apparatus characterized in that a punch to be formed is provided so as to be able to move forward and backward, and a receiving portion which compresses a base material between the punch and the receiving part which retreats in response to the approach of the punch is provided to the other side. 2. A punch hole forming method using a punch hole forming apparatus according to claim 1, wherein a cardboard base material is sandwiched between one mold and the other mold; Protruding and compressing the base material between the punch and the receiving part; forming the punch hole by penetrating the punch through the base material while compressing the base material between the punch and the receiving part; A punch hole forming method characterized by comprising: