JP3963328B2 - 多層セラミック基板及びその製造方法 - Google Patents

多層セラミック基板及びその製造方法 Download PDF

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Publication number
JP3963328B2
JP3963328B2 JP2005359591A JP2005359591A JP3963328B2 JP 3963328 B2 JP3963328 B2 JP 3963328B2 JP 2005359591 A JP2005359591 A JP 2005359591A JP 2005359591 A JP2005359591 A JP 2005359591A JP 3963328 B2 JP3963328 B2 JP 3963328B2
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JP
Japan
Prior art keywords
green sheet
cavity
shrinkage
multilayer ceramic
ceramic substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005359591A
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English (en)
Japanese (ja)
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JP2007043050A5 (https=
JP2007043050A (ja
Inventor
晴雄 西野
謙二 遠藤
潔 畑中
昌治 平川
秀昭 藤岡
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TDK Corp
Original Assignee
TDK Corp
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Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP2005359591A priority Critical patent/JP3963328B2/ja
Priority to TW095113715A priority patent/TW200644757A/zh
Priority to KR1020060034914A priority patent/KR100849455B1/ko
Priority to US11/405,462 priority patent/US7578058B2/en
Priority to DE602006011671T priority patent/DE602006011671D1/de
Priority to EP06252137A priority patent/EP1720203B1/en
Publication of JP2007043050A publication Critical patent/JP2007043050A/ja
Publication of JP2007043050A5 publication Critical patent/JP2007043050A5/ja
Application granted granted Critical
Publication of JP3963328B2 publication Critical patent/JP3963328B2/ja
Priority to US12/149,193 priority patent/US7733663B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

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  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2005359591A 2005-04-19 2005-12-13 多層セラミック基板及びその製造方法 Expired - Fee Related JP3963328B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2005359591A JP3963328B2 (ja) 2005-04-19 2005-12-13 多層セラミック基板及びその製造方法
KR1020060034914A KR100849455B1 (ko) 2005-04-19 2006-04-18 다층 세라믹 기판 및 그 제조 방법
US11/405,462 US7578058B2 (en) 2005-04-19 2006-04-18 Production method of a multilayer ceramic substrate
TW095113715A TW200644757A (en) 2005-04-19 2006-04-18 Multilayer ceramic substrate and production method thereof
DE602006011671T DE602006011671D1 (de) 2005-04-19 2006-04-19 Verfahren zur Herstellung eines mehrschichtigen Keramiksubstrats
EP06252137A EP1720203B1 (en) 2005-04-19 2006-04-19 Production method of a multilayer ceramic substrate
US12/149,193 US7733663B2 (en) 2005-04-19 2008-04-29 Multilayer ceramic substrate

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005121666 2005-04-19
JP2005192496 2005-06-30
JP2005359591A JP3963328B2 (ja) 2005-04-19 2005-12-13 多層セラミック基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2007043050A JP2007043050A (ja) 2007-02-15
JP2007043050A5 JP2007043050A5 (https=) 2007-03-29
JP3963328B2 true JP3963328B2 (ja) 2007-08-22

Family

ID=37800716

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005359591A Expired - Fee Related JP3963328B2 (ja) 2005-04-19 2005-12-13 多層セラミック基板及びその製造方法

Country Status (1)

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JP (1) JP3963328B2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5019106B2 (ja) * 2007-03-27 2012-09-05 Ｔｄｋ株式会社 多層セラミックス基板の製造方法
JP5333308B2 (ja) * 2009-05-11 2013-11-06 株式会社デンソー セラミック積層体の製造方法
KR20110014415A (ko) * 2009-08-05 2011-02-11 삼성전기주식회사 세라믹 기판의 제조 방법
JP6068164B2 (ja) * 2013-01-28 2017-01-25 京セラ株式会社 セラミック積層体の製造方法
JP6076431B2 (ja) * 2014-09-25 2017-02-08 株式会社イースタン 半導体パッケージ基板の製造方法
CN113573484B (zh) * 2021-09-23 2022-03-25 西安宏星电子浆料科技股份有限公司 一种ltcc基板小批量快速制作方法
CN114599151A (zh) * 2022-02-28 2022-06-07 诚亿电子（嘉兴）有限公司 一种内埋元器件的陶瓷基pcb板结构及其制备工艺

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Publication number Publication date
JP2007043050A (ja) 2007-02-15

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