JP3958451B2 - IC card with antenna coil - Google Patents

IC card with antenna coil Download PDF

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Publication number
JP3958451B2
JP3958451B2 JP32017898A JP32017898A JP3958451B2 JP 3958451 B2 JP3958451 B2 JP 3958451B2 JP 32017898 A JP32017898 A JP 32017898A JP 32017898 A JP32017898 A JP 32017898A JP 3958451 B2 JP3958451 B2 JP 3958451B2
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Japan
Prior art keywords
antenna coil
card
lead wire
gold
module
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Expired - Fee Related
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JP32017898A
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Japanese (ja)
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JPH11219417A (en
Inventor
誠一 西野
謙一郎 小林
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Tokin Corp
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NEC Tokin Corp
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Priority to JP32017898A priority Critical patent/JP3958451B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48475—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball
    • H01L2224/48476—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area
    • H01L2224/48477—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding)
    • H01L2224/48484—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) being a plurality of pre-balls disposed side-to-side
    • H01L2224/48485—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) being a plurality of pre-balls disposed side-to-side the connecting portion being a wedge bond, i.e. wedge on pre-ball
    • H01L2224/48486—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding) being a plurality of pre-balls disposed side-to-side the connecting portion being a wedge bond, i.e. wedge on pre-ball on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48475—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball
    • H01L2224/48496—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball not being interposed between the wire connector and the bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps

Description

【０００１】
【発明の属する技術分野】
本発明はアンテナコイル付ＩＣカードに関し、特に非接触型ＩＣカードに関するものである。
【０００２】
【従来の技術】
従来、上記した非接触型ＩＣカードは、アンテナコイルを銅箔よりエッチングされたプリントコイルで形成するという案が提案されていたが材料単価が高く、コストアップの要因となっていた。その為、材料単価の安い銅線でアンテナコイルを形成する方法が提案されている。
【０００３】
以下、図３を参照して従来の非接触型ＩＣカードにおけるアンテナコイルとＩＣモジュールとの接続方法について述べる。銅線のアンテナコイルとＩＣモジュールの端子を接続する方法としてはＩＣモジュール端子上に金バンプを形成し銅線と接続する方法が良く知られている。図３（ａ）に示すように、ＩＣモジュール（図示せず）上の接続用端子３５の表面には金バンプ３６が形成される。金バンプ３６の上部は最初テール（突起）が形成されているが、そのテールを潰してレベリングして平面部３９を形成する。アンテナコイルのリード線３４とＩＣモジュールの接続用端子３５の接続は図３（ｂ）に示すように平面部３９の上に銅線をはわせて半田４０により固定する。
【０００４】
【発明が解決しようとする課題】
しかしながら、上記した構造の非接触型ＩＣカードでは、銅線とバンプの位置決めが難しく位置ズレによる銅線のはみ出しが生じると共に、バンプ１つでは接続強度が足りないという問題が生じる。
【０００５】
又、半田付けの為の材料費や熱変形対策の為の費用が掛かるという問題も生じていた。
【０００６】
本発明の目的は、上記問題点を解消し、ＩＣモジュール端子上の金バンプのテールとアンテナコイルのリード線をはめ合いにより位置決めし、機械的なカシメ接続をする事でより安価な構造とし、かつ接続強度の強化を図ることである。
【０００７】
又、本発明の他の目的は、上記問題点を解消し、ＩＣモジュール端子上に金バンプを２つ形成する事により金バンプのテール間でリード線のガイドを行い、該テール部でリード線を仮止めし、かつ、銅線を覆い囲うように半田付けする事で接続強度の強化を図ることである。
【０００８】
【課題を解決するための手段】
本発明によれば、ＩＣカード基板上に、アンテナコイルと、接続用端子を有するＩＣモジュールを設けてなるアンテナコイル付ＩＣカードにおいて、前記アンテナコイルのリード線の両端が貫通孔が形成された平角形状となっており、前記接続用端子上には突起を有する金バンプが形成され、前記リード線の一方及び他方の先端部の貫通孔をそれぞれ前記一方及び他方の金バンプの突起に挿通し、その後前記金バンプの突起の上部から圧力を加えてカシメを行うことにより、前記アンテナコイルと前記ＩＣモジュールが接続されることを特徴とするアンテナコイル付ＩＣカードが得られる。
【０００９】
又、本発明によれば、ＩＣカード基板上に、アンテナコイルと、接続用端子を有するＩＣモジュールを設けてなるアンテナコイル付ＩＣカードにおいて、前記アンテナコイルのリード線の両端がＶ字の切り欠きが形成された平角形状となっており、前記接続用端子上には突起を有する金バンプが形成され、前記リード線の一方及び他方のＶ字の切り欠きをそれぞれ前記一方及び他方の金バンプの突起に嵌着し、その後前記金バンプの突起の上部から圧力を加えてカシメを行うことにより、前記アンテナコイルと前記ＩＣモジュールが接続されることを特徴とするアンテナコイル付ＩＣカードが得られる。
【００１０】
又、本発明によれば、ＩＣカード基板上に、アンテナコイルと、接続用端子を有するＩＣモジュールを設けてなるアンテナコイル付ＩＣカードにおいて、前記接続用端子上には突起を有する２つの金バンプが互いに近接して形成され、前記アンテナコイルのリード線の一方及び他方の先端部をそれぞれ前記一方及び他方の金バンプの突起間に嵌め合わせて位置決めし、その後半田により前記金バンプとリード線の端部を固定することにより、前記アンテナコイルと前記ＩＣモジュールが接続されることを特徴とするアンテナコイル付ＩＣカードが得られる。
【００１１】
さらに、本発明によれば、前記金バンプの突起間に嵌め合わせて位置決めした後、前記突起の頭を機械的に曲げて前記リード線を仮止めすることを特徴とするアンテナコイル付ＩＣカードが得られる。
【００１２】
さらに、本発明によれば、前記半田の材料としてＰｂフリーを使用することを特徴とするアンテナコイル付ＩＣカードが得られる。
【００１３】
又、本発明によれば、ＩＣカード基板上に、アンテナコイルと、接続用端子を有するＩＣモジュールを設けてなるアンテナコイル付ＩＣカードにおいて、前記アンテナコイルのリード線の両端が平角形状となっており、前記接続用端子上には金バンプが形成され、前記リード線の一方及び他方の平角形状の先端部をそれぞれ前記一方及び他方の金バンプに位置決めし、その後半田により前記金バンプとリード線の先端部を固定することにより、前記アンテナコイルと前記ＩＣモジュールが接続されることを特徴とするアンテナコイル付ＩＣカードが得られる。
【００１４】
さらに、本発明によれば、前記金バンプに合金線を使用することを特徴とするアンテナコイル付ＩＣカードが得られる。
【００１５】
さらに、本発明によれば、前記合金に０．５〜１．５重量パーセントのパラジウムを含む金又は０．５〜１．５重量パーセントの白金を含む金を使用することを特徴とするアンテナコイル付ＩＣカードが得られる。
【００１６】
【発明の実施の形態】
以下、本発明の一実施の形態について図１を参照して説明する。図１（ａ）に示すように非接触型ＩＣカード１の内部にはアンテナコイル２とＩＣモジュール３が内蔵されている。アンテナコイル２のリード線４はＩＣモジュール３の接続用端子５に接続されて通信用の回路を形成する。ここで接続用端子５の上部には図１（ｂ）に示すように金バンプ６が２つ近接して形成されており、金バンプ６には突起状のテール７が形成されている。図１（ｃ）に示すように、近接された突起状のテール７間にリード線４が置かれ、半田８により固定されている。ここでリード線４は２つの金バンプのテール７の間に沿って這わすことができ、位置決めが容易にできる。
【００１７】
上記した構成によれば、リード線４をテール７で囲うように半田８により固定しているので、接続力はより強固なものとなる。又、金バンプと銅線の位置決めが容易になり、接続強度が向上する。又、金バンプのレベリングの工程が不要となり工数の削減ができる。その結果、安価で信頼性の高いＩＣモジュールとアンテナコイルの接続法が可能となった。一方、従来例では金バンプ６をレベリングしてできた平面部９の上部にリード線４を這わして半田８により固定しており、バンプ径に比してリード線の径は大きく位置決めが困難であったが本実施の形態に係る非接触型ＩＣカードではその問題を解消している。尚、半田の材料としてはＰｂフリーを使用するのが好ましいが、これに限定されるものではない。
【００１８】
本実施の形態では、金バンプのレベリングの工程が不要となり工数の削減ができ、半田等の材料が不要でかつ常温で接続可能となり、合金線を使用する事により金バンプのテール寸法が安定して得られる。その結果、安価で信頼性の高いＩＣモジュールとアンテナコイルの接続法が可能となる。
【００１９】
尚、金バンプには合金線を使用し、その合金の組成として０．５〜１．５重量パーセントのパラジウムを含む金又は０．５〜１．５重量パーセントの白金を含む金を使用するのが好ましいが、これに限定するものではない。
【００２０】
次に、本発明の他の実施の形態について図２を参照して説明する。図２（ａ）に示すように非接触型ＩＣカード１１の内部にはアンテナコイル１２とＩＣモジュール１３が内蔵されている。アンテナコイル１２のリード線１４はＩＣモジュール１３の接続用端子１５に接続されて通信用の回路を形成する。ここで図２（ｂ）に示すように接続用端子１５の上部には金バンプ１６が形成されており、金バンプ１６には突起状のテール１７が形成される。一方、リード線１４はコイニングにより端部を潰して平角状にしたものであり、丸穴（貫通孔）１８が空けられている。ここで図２（ｄ）に示すようにリード線１４は金バンプ１６のテール１７に丸穴１８をはめ込み位置決めする。その後、テール１７をカシメにより潰してリード線１４と金バンプ１６を接合する。
【００２１】
次に、丸穴（貫通孔）１８が空けられた平角状以外の実施の形態について述べる。この例は、先端部形状が図２（ｃ）に示すようにＶ字状の切り欠き１９を有する平角状である場合の例である。金バンプ１６のテール１７にＶ字状の切り欠き１９をあてがい位置決めし、その後、テール１７をカシメにより潰してリード線１４と金バンプ１６を接合する。したがって図２（ｃ）に示すようにＶ字状の切り欠き１９を有する平角状の場合についても上記同様に簡単に位置決めでき、接続強度がより強固な接続が可能となると共に、機械的カシメにより半田付け時の半田高さよりも低くできるのでカード全体の高さを低くすることができ、カードの薄型化に有利となる。
【００２２】
又、リード線の先端部が、図２（ｂ）に示すような平角形状の先端部に貫通孔を空けたものではなく、貫通孔なしの単なる平角形状であって、金バンプも突起状のテールをもたない単なる平板状の金バンプのみの場合であっても、先端部が平角形状ゆえ、その平角形状の先端部を平板状の金バンプに位置決めするのは容易であり、上記した実施形態と同様に、接続強度がより強固な接続が可能となる。ただし、この場合には図２（ｂ），（ｃ）の場合と異なり、リード線と金バンプとの接合は半田で行われる。
【００２３】
【発明の効果】
本発明によれば、リード線とバンプの位置決めが容易となると共に、接続強度がより強固な接続が可能となった。
【００２４】
又、本発明によれば、金バンプのレベリングの工程が不要となり工数の削減ができる。
【００２５】
又、本発明によれば、リード線の先端を平角状にした構成をとっているケースでは、半田時の熱によるシート材の熱変形等の影響が無くなり信頼性が向上し半田に必要な熱源や半田材等が不要となり安価にできる事となった。
【００２６】
又、本発明によれば、２つのバンプの間にリード線を載せた構成をとっているケースでは、１つのレベリングした平面部を有したバンプの上にリード線を載せた場合に比べて全体の高さを低くすることができ、カードの薄型化に有利となる。又、リード線の先端を平角状にした構成をとっているものであっても機械的カシメにより半田付け時の半田高さよりも低くできるので全体の高さを低くすることができ共にカードの薄型化に有利となる。
【図面の簡単な説明】
【図１】（ａ）は本発明の一実施の形態に係るアンテナコイル付ＩＣカードの全体構成図であり、（ｂ）は（ａ）に示されるリード線の先端部と金バンプの構造を示した図であり、（ｃ）はリード線の先端部を金バンプへ固定した状態を示した図である。
【図２】（ａ）は本発明の他の実施の形態に係るアンテナコイル付ＩＣカードの全体構成図であり、（ｂ）は（ａ）に示されるリード線の先端部と金バンプの構造を示した図であり、（ｃ）は（ｂ）の変形例を示した図であり、（ｄ）はリード線の先端部の金バンプへの固定方法を示した図である。
【図３】従来の非接触型ＩＣカードにおけるアンテナコイルとＩＣモジュールとの接続方法を説明するための図である。
【符号の説明】
１，１１ 非接触型ＩＣカード
２，１２ アンテナコイル
３，１３ ＩＣモジュール
４，１４，２４，３４ リード線
５，１５，３５ 接続用端子
６，１６，３６ 金バンプ
７，１７ テール
８，４０ 半田
１８ 丸穴
１９ 切り欠き
３９ 平面部[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an IC card with an antenna coil, and more particularly to a non-contact type IC card.
[0002]
[Prior art]
Conventionally, the above-described non-contact type IC card has been proposed in which the antenna coil is formed of a printed coil etched from a copper foil. However, the material unit price is high, which causes a cost increase. Therefore, a method of forming an antenna coil with a copper wire having a low material unit price has been proposed.
[0003]
Hereinafter, a method for connecting an antenna coil and an IC module in a conventional non-contact type IC card will be described with reference to FIG. As a method of connecting the antenna coil of the copper wire and the terminal of the IC module, a method of forming a gold bump on the IC module terminal and connecting to the copper wire is well known. As shown in FIG. 3A, gold bumps 36 are formed on the surface of the connection terminal 35 on the IC module (not shown). A tail (protrusion) is initially formed on the upper portion of the gold bump 36, and the flat portion 39 is formed by crushing and leveling the tail. As shown in FIG. 3B, the lead wire 34 of the antenna coil and the connection terminal 35 of the IC module are fixed by the solder 40 with a copper wire placed on the flat portion 39.
[0004]
[Problems to be solved by the invention]
However, in the non-contact type IC card having the above-described structure, it is difficult to position the copper wire and the bump, and the copper wire protrudes due to misalignment, and the connection strength is insufficient with one bump.
[0005]
In addition, there has been a problem that material costs for soldering and costs for measures against thermal deformation are required.
[0006]
The object of the present invention is to solve the above-mentioned problems, to position the tail of the gold bump on the IC module terminal and the lead wire of the antenna coil by fitting, and to make a more inexpensive structure by mechanically caulking, In addition, the connection strength should be strengthened.
[0007]
Another object of the present invention is to eliminate the above-mentioned problems, and to guide the lead wire between the tails of the gold bumps by forming two gold bumps on the IC module terminal. It is intended to strengthen the connection strength by temporarily fixing the wire and soldering so as to cover the copper wire.
[0008]
[Means for Solving the Problems]
According to the present invention, in an IC card with an antenna coil in which an antenna coil and an IC module having a connection terminal are provided on an IC card substrate, a rectangular plate in which through holes are formed at both ends of the lead wire of the antenna coil. A gold bump having a protrusion is formed on the connection terminal, and a through hole at one and the other end of the lead wire is inserted into the protrusion of the one and the other gold bump, respectively. Thereafter, the antenna coil and the IC module are connected by caulking by applying pressure from the upper part of the protrusion of the gold bump to obtain an IC card with an antenna coil.
[0009]
According to the present invention, in an IC card with an antenna coil, in which an IC coil having an antenna coil and a connection terminal is provided on an IC card substrate, both ends of the lead wire of the antenna coil are notched in a V shape. A gold bump having a protrusion is formed on the connection terminal, and one and the other V-shaped notches of the lead wire are respectively formed on the connection terminal. An IC card with an antenna coil, wherein the antenna coil and the IC module are connected to each other, is obtained by fitting to the protrusion and then caulking by applying pressure from above the protrusion of the gold bump.
[0010]
According to the present invention, in the IC card with an antenna coil in which an IC module having an antenna coil and a connection terminal is provided on the IC card substrate, two gold bumps having protrusions on the connection terminal. Are formed close to each other, and one and the other end of the lead wire of the antenna coil are fitted and positioned between the protrusions of the one and the other gold bumps, respectively, and then the solder bumps and the lead wires are soldered. By fixing the end portion, the antenna coil and the IC module are connected to obtain an IC card with an antenna coil.
[0011]
Further, according to the present invention, there is provided an IC card with an antenna coil, wherein the lead wire is temporarily fixed by mechanically bending the head of the protrusion after being fitted and positioned between the protrusions of the gold bump. can get.
[0012]
Furthermore, according to the present invention, there is obtained an IC card with an antenna coil, wherein Pb-free is used as the solder material.
[0013]
Further, according to the present invention, in an IC card with an antenna coil, in which an antenna coil and an IC module having a connection terminal are provided on an IC card substrate, both ends of the lead wire of the antenna coil have a rectangular shape. A gold bump is formed on the connection terminal, and one and the other rectangular tip of the lead wire are respectively positioned on the one and the other gold bump, and the gold bump and the lead wire are then soldered. By fixing the tip of the antenna coil, the antenna coil and the IC module are connected to obtain an IC card with an antenna coil.
[0014]
Furthermore, according to the present invention, there is obtained an IC card with an antenna coil, wherein an alloy wire is used for the gold bump.
[0015]
Further, according to the present invention, the alloy coil is characterized in that the alloy includes gold containing 0.5 to 1.5 weight percent palladium or gold containing 0.5 to 1.5 weight percent platinum. An attached IC card is obtained.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to FIG. As shown in FIG. 1A, an antenna coil 2 and an IC module 3 are built in the non-contact type IC card 1. The lead wire 4 of the antenna coil 2 is connected to the connection terminal 5 of the IC module 3 to form a communication circuit. Here, as shown in FIG. 1B, two gold bumps 6 are formed close to each other on the connection terminal 5, and a protruding tail 7 is formed on the gold bump 6. As shown in FIG. 1 (c), the lead wire 4 is placed between the protruding tails 7 that are close to each other, and is fixed by solder 8. Here, the lead wire 4 can be wound along the tails 7 of the two gold bumps to facilitate positioning.
[0017]
According to the above configuration, since the lead wire 4 is fixed by the solder 8 so as to be surrounded by the tail 7, the connection force becomes stronger. Further, the gold bump and the copper wire can be easily positioned, and the connection strength is improved. Further, the step of leveling the gold bump is not required, and the number of man-hours can be reduced. As a result, an inexpensive and highly reliable IC module and antenna coil connection method has become possible. On the other hand, in the conventional example, the lead wire 4 is wound around the upper portion of the flat portion 9 formed by leveling the gold bump 6 and fixed by the solder 8, and the lead wire diameter is large compared to the bump diameter, and positioning is difficult. However, the non-contact type IC card according to the present embodiment solves this problem. In addition, although it is preferable to use Pb free as a material of solder, it is not limited to this.
[0018]
In this embodiment, the gold bump leveling process is not required, and the number of man-hours can be reduced. Solder or other materials are not required and connection is possible at room temperature. The use of alloy wires stabilizes the tail dimensions of the gold bumps. Obtained. As a result, an inexpensive and highly reliable connection method between the IC module and the antenna coil becomes possible.
[0019]
In addition, an alloy wire is used for the gold bump, and gold containing 0.5 to 1.5 weight percent palladium or gold containing 0.5 to 1.5 weight percent platinum is used as the composition of the alloy. However, it is not limited to this.
[0020]
Next, another embodiment of the present invention will be described with reference to FIG. As shown in FIG. 2A, an antenna coil 12 and an IC module 13 are built in the non-contact type IC card 11. The lead wire 14 of the antenna coil 12 is connected to the connection terminal 15 of the IC module 13 to form a communication circuit. Here, as shown in FIG. 2B, a gold bump 16 is formed on the connection terminal 15, and a protruding tail 17 is formed on the gold bump 16. On the other hand, the lead wire 14 is formed by flattening the end portion by coining, and a round hole (through hole) 18 is opened. Here, as shown in FIG. 2D, the lead wire 14 is positioned by fitting a round hole 18 into the tail 17 of the gold bump 16. Thereafter, the tail 17 is crushed by caulking to join the lead wire 14 and the gold bump 16.
[0021]
Next, embodiments other than the rectangular shape in which a round hole (through hole) 18 is formed will be described. In this example, the shape of the tip is a rectangular shape having a V-shaped cutout 19 as shown in FIG. The V-shaped notch 19 is positioned on the tail 17 of the gold bump 16 and then the tail 17 is crushed by caulking to join the lead wire 14 and the gold bump 16. Therefore, as shown in FIG. 2 (c), the rectangular shape having the V-shaped notch 19 can be easily positioned in the same manner as described above, and the connection strength can be made stronger, and mechanical caulking can be used. Since it can be made lower than the solder height at the time of soldering, the height of the entire card can be lowered, which is advantageous for making the card thinner.
[0022]
The lead wire tip is not a flat tip as shown in FIG. 2 (b) but a through hole, and is simply a flat shape without a through hole. Even if it is only a flat gold bump without a tail, it is easy to position the flat tip on the flat gold bump because the tip is a flat shape. Similar to the configuration, connection with stronger connection strength is possible. However, in this case, unlike the case of FIGS. 2B and 2C, the joining of the lead wire and the gold bump is performed by solder.
[0023]
【The invention's effect】
According to the present invention, positioning of the lead wire and the bump becomes easy, and connection with stronger connection strength can be achieved.
[0024]
Further, according to the present invention, the step of leveling the gold bump is not required, and the number of man-hours can be reduced.
[0025]
Further, according to the present invention, in the case where the lead wire has a flat end, there is no influence of thermal deformation of the sheet material due to heat during soldering, and the reliability is improved and the heat source necessary for soldering This eliminates the need for solder and soldering materials and makes it cheaper.
[0026]
Further, according to the present invention, in the case where the lead wire is placed between the two bumps, the entire lead wire is placed as compared with the case where the lead wire is placed on the bump having one leveled flat portion. The height of the card can be reduced, which is advantageous for making the card thinner. Also, even if the lead wire has a flat end, it can be made lower than the solder height at the time of soldering by mechanical caulking, so that the overall height can be lowered and the card is thin. It is advantageous for the conversion.
[Brief description of the drawings]
FIG. 1 (a) is an overall configuration diagram of an IC card with an antenna coil according to an embodiment of the present invention, and FIG. 1 (b) shows the structure of a lead wire tip and a gold bump shown in FIG. It is the figure shown, (c) is the figure which showed the state which fixed the front-end | tip part of the lead wire to the gold bump.
2A is an overall configuration diagram of an IC card with an antenna coil according to another embodiment of the present invention, and FIG. 2B is a structure of a tip end portion of a lead wire and a gold bump shown in FIG. (C) is a figure which showed the modification of (b), (d) is the figure which showed the fixing method to the gold bump of the front-end | tip part of a lead wire.
FIG. 3 is a diagram for explaining a method of connecting an antenna coil and an IC module in a conventional non-contact type IC card.
[Explanation of symbols]
1,11 Non-contact type IC card 2,12 Antenna coil 3,13 IC module 4,14,24,34 Lead wire 5,15,35 Connection terminal 6,16,36 Gold bump 7,17 Tail 8,40 Solder 18 Round hole 19 Notch 39 Flat part

Claims (8)

ＩＣカード基板上に、アンテナコイルと、接続用端子を有するＩＣモジュールを設けてなるアンテナコイル付ＩＣカードにおいて、前記アンテナコイルのリード線の両端が貫通孔が形成された平角形状となっており、前記接続用端子上には突起を有する金バンプが形成され、前記リード線の一方及び他方の先端部の貫通孔をそれぞれ前記一方及び他方の金バンプの突起に挿通し、その後前記金バンプの突起の上部から圧力を加えてカシメを行うことにより、前記アンテナコイルと前記ＩＣモジュールが接続されることを特徴とするアンテナコイル付ＩＣカード。On the IC card substrate, in the IC card with an antenna coil, in which an IC module having an antenna coil and a connection terminal is provided, both ends of the lead wire of the antenna coil have a rectangular shape in which through holes are formed, Gold bumps having protrusions are formed on the connection terminals, and through-holes at one and other tip portions of the lead wires are respectively inserted into the protrusions of the one and other gold bumps, and then the protrusions of the gold bumps An IC card with an antenna coil, wherein the antenna coil and the IC module are connected by caulking by applying pressure from the top of the IC coil. ＩＣカード基板上に、アンテナコイルと、接続用端子を有するＩＣモジュールを設けてなるアンテナコイル付ＩＣカードにおいて、前記アンテナコイルのリード線の両端がＶ字の切り欠きが形成された平角形状となっており、前記接続用端子上には突起を有する金バンプが形成され、前記リード線の一方及び他方のＶ字の切り欠きをそれぞれ前記一方及び他方の金バンプの突起に嵌着し、その後前記金バンプの突起の上部から圧力を加えてカシメを行うことにより、前記アンテナコイルと前記ＩＣモジュールが接続されることを特徴とするアンテナコイル付ＩＣカード。In an IC card with an antenna coil, in which an antenna coil and an IC module having a connection terminal are provided on an IC card substrate, both ends of the lead wire of the antenna coil have a rectangular shape in which V-shaped notches are formed. Gold bumps having protrusions are formed on the connection terminals, and one and the other V-shaped notches of the lead wires are fitted into the protrusions of the one and other gold bumps, respectively. An IC card with an antenna coil, wherein the antenna coil and the IC module are connected by caulking by applying pressure from the upper part of the protrusion of the gold bump. ＩＣカード基板上に、アンテナコイルと、接続用端子を有するＩＣモジュールを設けてなるアンテナコイル付ＩＣカードにおいて、前記接続用端子上には突起を有する２つの金バンプが互いに近接して形成され、前記アンテナコイルのリード線の一方及び他方の先端部をそれぞれ前記一方及び他方の金バンプの突起間に嵌め合わせて位置決めし、その後半田により前記金バンプとリード線の端部を固定することにより、前記アンテナコイルと前記ＩＣモジュールが接続されることを特徴とするアンテナコイル付ＩＣカード。On the IC card substrate, in the IC card with an antenna coil in which an antenna coil and an IC module having a connection terminal are provided, two gold bumps having protrusions are formed close to each other on the connection terminal, By fitting and positioning one and the other end of the lead wire of the antenna coil between the protrusions of the one and the other gold bumps respectively, and then fixing the gold bump and the end of the lead wire by soldering, An IC card with an antenna coil, wherein the antenna coil and the IC module are connected. 前記金バンプの突起間に嵌め合わせて位置決めした後、前記突起の頭を機械的に曲げて前記リード線を仮止めすることを特徴とする請求項３記載のアンテナコイル付ＩＣカード。4. The IC card with an antenna coil according to claim 3, wherein after positioning by fitting between the protrusions of the gold bump, the head of the protrusion is mechanically bent to temporarily fix the lead wire. 前記半田の材料としてＰｂフリーを使用することを特徴とする請求項３又は４記載のアンテナコイル付ＩＣカード。5. The IC card with an antenna coil according to claim 3, wherein Pb-free is used as the solder material. ＩＣカード基板上に、アンテナコイルと、接続用端子を有するＩＣモジュールを設けてなるアンテナコイル付ＩＣカードにおいて、前記アンテナコイルのリード線の両端が平角形状となっており、前記接続用端子上には金バンプが形成され、前記リード線の一方及び他方の平角形状の先端部をそれぞれ前記一方及び他方の金バンプに位置決めし、その後半田により前記金バンプとリード線の先端部を固定することにより、前記アンテナコイルと前記ＩＣモジュールが接続されることを特徴とするアンテナコイル付ＩＣカード。In an IC card with an antenna coil, in which an antenna coil and an IC module having a connection terminal are provided on an IC card substrate, both ends of the lead wire of the antenna coil have a rectangular shape, and Is formed with gold bumps, positioning one and the other flat end of the lead wire to the one and the other gold bump, respectively, and then fixing the gold bump and the tip of the lead wire by soldering An IC card with an antenna coil, wherein the antenna coil and the IC module are connected. 前記金バンプに合金線を使用することを特徴とする請求項１乃至６のいずれか一つに記載のアンテナコイル付ＩＣカード。The IC card with an antenna coil according to any one of claims 1 to 6, wherein an alloy wire is used for the gold bump. 前記合金に０．５〜１．５重量パーセントのパラジウムを含む金又は０．５〜１．５重量パーセントの白金を含む金を使用することを特徴とする請求項７記載のアンテナコイル付ＩＣカード。8. The IC card with an antenna coil according to claim 7, wherein gold containing 0.5 to 1.5 weight percent palladium or gold containing 0.5 to 1.5 weight percent platinum is used for the alloy. .
JP32017898A 1997-11-12 1998-11-11 IC card with antenna coil Expired - Fee Related JP3958451B2 (en)

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JP32017898A JP3958451B2 (en) 1997-11-12 1998-11-11 IC card with antenna coil

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