JP3955028B2 - Waveguide / conductive structure - Google Patents

Description

  The present invention relates to a waveguide structure such as a radio wave waveguide and a cavity resonator, a conductive structure such as an electric conductive circuit, or a structure (component) in which a waveguide function and a conductive function are mixed (hereinafter collectively referred to as “component”). (Referred to as “waveguide / conductive structure”).

Conventionally, radio wave waveguides have been manufactured by complicated bending of metal pipes, but since precise processing is difficult, in recent conventional examples, a grooved waveguide is drilled in a metal plate. A waveguide is formed by placing a lid on this metal plate and fastening with a bolt. In other conventional examples, a groove-shaped waveguide is injection molded on a thermoplastic synthetic resin plate, and the lid is placed on this resin plate. To form a waveguide by fastening with bolts
Has been proposed. However, a waveguide groove is formed by drilling a waveguide groove in this metal plate, placing a lid on the metal plate and fastening with a bolt, and joining the metal plate to the lid and the lid. The surface needs to be polished precisely, and if there is a gap, there is a problem that radio waves leak and the characteristics are not good. Furthermore, if the bolt torque at the time of fastening is not uniform, there will still be a problem of leakage of radio waves, and fine adjustment is required. In the conventional example in which a groove-shaped waveguide is injection-molded on a thermoplastic synthetic resin plate, a lid is placed on the resin plate, and a waveguide is formed by fastening with a bolt, the bolt torque at the time of fastening is not uniform, Since the problem of leakage of radio waves still occurs, fine adjustment is necessary. Furthermore, since the groove-shaped waveguide and waveguide are complicated and multiple meandering shapes, the tube portion forming this waveguide is In most cases, the mold core does not come off, so in many cases it has not been put to practical use. Mitsubishi Electric Corporation's Technical Document “Resin Waveguide Components” Paper titled “Metal-plated Resin Injection Molded Waveguide Filter” at the Institute of Electronics, Information and Communication Engineers in July 2002

  Therefore, the problem to be solved by the present invention is that even if the mold core has a complicated shape that does not come off in the synthetic resin integral molding, it can be easily molded, and the structure is downsized. In addition, it is possible to easily and precisely form a waveguide / conductive structure that can be completely seamless and that has no leakage of radio waves and has high performance.

A first feature of the waveguide structure according to the present invention includes a first substrate (1) and a second substrate (2), both of which are made of a thermoplastic synthetic resin. A groove-shaped waveguide is formed on at least one of the substrates (2), and a waveguide (21) (22) made seamless by welding the other substrate is formed. The inner peripheral surface of the wave tube is plated (210) (220).
The second feature of the waveguide structure is that a plurality of the waveguides (21) and (22) are provided, and a dummy waveguide (23) is provided between the waveguides.
The third feature of the waveguide structure is that one of the two substrates (1) has a color tone with good light transmission, and the other (2) has a color tone with good light absorption. The two substrates are welded by irradiating laser beam (a) from the substrate side.
The fourth feature of this waveguide structure is that the plating (210) (220) (230) is a double layer.

A fifth feature of the conductive structure according to the present invention includes a first substrate (3) and a second substrate (4), and both the substrates are made of a thermoplastic synthetic resin. The substrate (3) has through holes (31) and (32), and at least one of the two substrates (4) has a groove-shaped conductive path, and the other (3) substrate. Conductive tubes (41), (42), and (43) are formed by welding, and the through holes communicate with the conductive tubes, and the through holes and the inner peripheral surface of the conductive tubes are formed. Is plated (310) (320) (410) (420) (430), and the plating of the through hole and the conductive tube is in electrical conduction.
A sixth feature of the conductive structure is that predetermined circuit patterns (310) and (320) that are electrically connected to the through holes (31) and (32) are formed on the first base.
A seventh feature of the conductive structure is that a predetermined circuit pattern is formed on the outer peripheral surface of the second base.
The eighth feature of the conductive structure is that one of the substrates (3) has a color tone with good light transmission, and the other substrate (4) has a color tone with good light absorption, and this light transmission property is good. The two substrates are welded by laser light (a) from the substrate side.

A ninth feature of the waveguide conductive structure according to the present invention includes a first substrate (3) and a second substrate (5). Both the substrates are made of a thermoplastic synthetic resin. The first substrate (3) has through holes (31) and (32), and at least one of the two substrates (5) has a groove-like conductive path, and the other (3) Conductive tubes (51) and (52) that are made seamless by welding the bases of the above are formed, the through holes communicate with the conductive tubes, and at least one of the two bases (5) A groove-shaped waveguide is formed, and a waveguide (53) is formed by bonding the other substrate, and the waveguide is plated (530), and the through hole ( (31) (32) and the inner peripheral surface of the conductive tube (51) (52) are plated (310) (320) (510) (520), respectively, the plating of the through hole (310) ( 320) and the above conductive tube The plating (510) (520) is in place which is electrically conductive.
The tenth feature of the waveguide conductive structure is that one of the substrates (3) has a color tone with good light transmission and the other (5) has a color tone with good light absorption. The two substrates are welded by irradiating a laser beam from a good substrate side.

  The waveguide / conductive structure according to the present invention having the above-described configuration can be molded in a complicated shape, is lighter and smaller, and does not require fine adjustment such as screwing as in the conventional example. It is effective, and there is no leakage of radio waves between the seamless waveguides, and the performance is improved.

  Hereinafter, embodiments of a waveguide structure that guides radio waves, a conductive structure that conducts current, and a structure in which both radio waves and conductivity are mixed will be described with reference to the drawings.

  A first embodiment of the present invention will be described with reference to FIGS. 1 to 8. This embodiment relates to a waveguide structure, and the structure thereof is the same as that of the plate-like first substrate 1 shown in FIGS. As shown in FIG. 3 and FIG. 4, the first substrate 1 has the same planar shape as the first substrate 1 but is composed of two members, the second substrate 2 which is thicker than the first substrate 1, and both the substrates have a quality compatible with each other. A thermoplastic synthetic resin, preferably a synthetic resin of the same material, such as a wholly aromatic polyester liquid crystal polymer, is formed by injection molding of this material. One of the first substrates 1 has a color tone with good light transmission, preferably a transparent material, and the other second substrate has a color tone with good light absorption, for example, black. As this liquid crystal polymer, for example, “Vectra” (trade name of Polyplastics Co., Ltd.) “plating grade C810” is available.

  In the second base 2, a plurality of, in the drawing, groove-shaped waveguides constituting two waveguides 21 and 22 are integrally formed, and a dummy waveguide is interposed between the two waveguides. A groove-shaped waveguide for forming the structure 23 is integrally formed. As shown in FIGS. 5 and 6, the second base 2 is joined to the first base 1 and welded to make the waveguide 21 seamless. To 23. Of course, the waveguides 21 and 22 and the dummy waveguide 23 may be formed on the first base 1, or the waveguides 21 and 22 and the dummy waveguide 23 may be formed on both bases, respectively. In any case, at least one of the substrates 1 and 2 is formed with a groove-shaped waveguide for forming a waveguide, and the other substrate is integrated to be integrated and completely seamless. Any waveguide can be used as long as the waveguide is formed.

  Next, the process of joining the first base 1 and the second base 2 together and further welding and integrating them will be described. As shown in FIGS. 5 and 6, the first base 1 and the second base 2 Are joined. Therefore, although not shown, the first substrate 1 is pressed by a heat-resistant transparent glass pressing jig. The laser beam a is irradiated from above the holding jig. The laser beam at this time has a wavelength of 940 nm and an output of 60 W, and the irradiation speed may be about 1 to 2 mm / sec. The laser beam a penetrates the holding jig and the first base 1 and is absorbed by the joining end face of the second base 2. At this time, since the color tone of the second substrate 2 is black with good light absorption, the laser light a is efficiently absorbed. The energy of the laser beam a is converted into heat, the bonding surfaces of the first and second substrates 1 and 2 are welded, and the first substrate 1 and the second substrate 2 are clamped as they are, This heat is transmitted from the second base 2 to the first base 1 of the transmissive member, and the joint surfaces of both bases are welded and integrated. This is the primary molded product.

  Therefore, as shown in FIGS. 7 and 8, plating 210, 220, and 230 are applied to the inner peripheral surfaces of the waveguides 21, 22, and 23. In this plating process, first, welding shown in FIGS. 5 and 6 is performed. It is necessary to roughen the outer peripheral surfaces of the first base 1 and the second base 2 (primary molded product) and the inner peripheral surfaces of the waveguides 21, 22 and 23. As a roughening, that is, etching method, an alkaline aqueous solution in which caustic soda or caustic potash is dissolved at a predetermined concentration, for example, 45 wt%, is heated to a predetermined temperature, for example, 50 to 90 ° C. The substrate 2 is immersed for a predetermined time, for example, 30 minutes. By this etching, the outer peripheral surfaces of the first base 1 and the second base 2 and the inner peripheral surfaces of the waveguides 21, 22 and 23 are roughened.

  Although not shown in the figure, the opposing surfaces of the normal upper and lower molds conform to a shape having a predetermined gap on the outer periphery of the primary molded product made up of the integrated first base 1 and second base 2. A cavity having a shape to be formed is formed, a primary molded product is placed in the cavity, the mold is closed, and in this state, an oxyalkylene group-containing polyvinyl alcohol resin is injected into the cavity to remove the primary molded product. The outer peripheral surface which is a plating surface is covered. This is a secondary molded product. As an oxyalkylene group-containing polyvinyl alcohol resin which is this coating agent, for example, “Ecomati AX” (trade name of Nippon Synthetic Chemical Industry Co., Ltd.) is available. As the injection molding conditions, this "Ekomatei AX" has a cylinder temperature of 220 ° C, a mold temperature of 80 ° C, an injection pressure of 900 kg / cm2, and a cooling time of 30 seconds.

  Next, since the roughened plating surface is exposed, a catalyst such as palladium or gold is applied to the rough surface. This catalyst method is a known method. For example, the first substrate 1 and the second substrate 2 that are welded to a mixed catalyst solution of tin and palladium are immersed in the catalyst, and then activated with an acid such as hydrochloric acid or sulfuric acid, To deposit palladium. The mixed catalyst solution is immersed at 15 to 23 ° C. for 5 minutes. In this way, the plated surface is in a state where a catalyst is applied.

After that, when the secondary molded product composed of the first substrate 1 and the second substrate 2 which are welded and integrated is placed in hot water at 80 ° C. for 10 minutes, the ecomatic AX of the coating agent is eluted in the hot water. Removed. Since “Vectra” plating grade C810 has a heat distortion temperature of 200 ° C. or higher, it does not give any change. Therefore, plating is performed on the surface to which the catalyst is attached, and chemical copper plating, chemical nickel plating, or the like is used for this plating. As described above, the plated surfaces 210, 220, and 230 are formed on the inner peripheral surfaces of the waveguides 21, 22, and 23, and finally, heat treatment may be performed to remove moisture inside.
The first substrate 1 and the second substrate 2 may be subjected to the etching process first, and then both substrates are welded with laser light to cover the non-plated surface, and then the above-described plating step may be performed. .

  In the above examples, chemical copper plating or chemical nickel plating is applied. However, by making this plating a double layer of copper plating and nickel / iron plating, this copper plating depends on conductivity. Electric field noise is shielded, and nickel / iron plating shields magnetic field noise by its high permeability.

  Further, the dummy waveguide 23 is not always necessary, and only the waveguides 21 and 22 may be used. However, depending on conditions such as the strength of radio waves, radio waves leak from the waveguide 21 and are adjacent to each other. Since there is a danger of radio waves entering the tube 22 and causing interference, in order to reliably prevent radio waves from entering one waveguide to another, there is a gap between the two waveguides. It is desirable to interpose a dummy waveguide 23.

  Next, a second embodiment of the present invention will be described with reference to FIGS. 9 to 17. This embodiment relates to a conductive structure, and the structure is a plate-like first base body shown in FIGS. 3 and the same planar shape as shown in FIGS. 11 and 12, and a thicker plate-like second base body 4. The two base bodies are compatible with each other or compatible with each other. The same thermoplastic synthetic resin, for example, the above-mentioned “Vectra” plating grade C810 of wholly aromatic polyester liquid crystal polymer is used as a material, and the first base of one of the two bases has a light-transmitting color tone, preferably It is a transparent material, and the other second substrate is black having a color tone with good light absorption.

The first substrate 3 has a plurality of through holes 31 and 32 in the drawing, and the second substrate 4 has a plurality of groove-shaped conductive paths constituting two conductive tubes 41 and 42 in the drawing. A conductive path constituting a dummy conductive tube 43 is formed between the conductive paths. As shown in FIGS. 13 and 14, the second base is joined to the first base 1. Thus, the conductive tubes 41 to 43 are configured. Then, the two through holes 31 and 32 of the first base 3 are communicated with the groove-like conductive paths constituting the two conductive tubes 41 and 42 of the second base 4 as shown in FIG.
Of course, the conductive paths 41 and 42 and the dummy conductive paths 43 may be formed on the first base 3, or the conductive paths 41 and 42 and the dummy conductive paths 43 may be formed on both bases. In any case, it suffices that at least one of the substrates 3 and 4 is provided with a groove-like conductive path and a conductive tube is formed by welding the other substrate.

  Next, the process of bonding the first substrate 3 and the second substrate 4 and welding the both substrates will be described. As shown in FIGS. 13 and 14, the first substrate 3 and the second substrate 4 are bonded. . Therefore, as in the above-described embodiment, the first base 1 is pressed with a pressing jig, and the laser beam a is irradiated from above the pressing jig. The wavelength, output, and irradiation speed of the laser light at this time may be the same as those in the first embodiment. This laser beam penetrates the holding jig and the first base 3 and is absorbed by the joining end face of the second base 4. At this time, since the color tone of the second substrate 4 is good in light absorption, for example, black, the laser light a is efficiently absorbed. The energy of the laser beam a is converted into heat, and the joining surfaces of both the substrates 3 and 4 are welded. If the first base 3 and the second base 4 are clamped in this state, the heat is transferred from the second base to the first base of the transmission member, and the bases are welded and integrated. This is the primary molded product.

  Therefore, as shown in FIGS. 15 to 17, the inner peripheral surfaces of the conductive tubes 41, 42 and 43 are plated. This plating step is performed first with the welded first base 3 and the first base 3 shown in FIGS. It is necessary to roughen the outer peripheral surface of the two substrates 4 and the inner peripheral surfaces of the conductive tubes 41, 42, 43. As this roughening, that is, an etching treatment method, an alkaline aqueous solution in which caustic soda or caustic potash is dissolved in 45 wt%, for example, is heated to, for example, 50 to 90 ° C., and the first substrate 3 and the second substrate 4 are subjected to, for example, 30 minutes. Immerse. By this etching, the outer peripheral surfaces of the first base 3 and the second base 4 and the inner peripheral surfaces of the conductive tubes 41, 42, 43 are roughened. In addition, a cavity having a shape matching a shape having a predetermined gap is formed on the outer circumferences of the integrated bases 3 and 4 on the opposing surfaces of the upper and lower molds, and the cavity is integrated in the cavity. The primary molded product is inserted, the mold is closed, and an oxyalkylene group-containing polyvinyl alcohol resin is injected into the cavity to cover the non-plated surface. This is a secondary molded product. As this oxyalkylene group-containing polyvinyl alcohol resin, the above-mentioned “Ecomati AX” is used, and the cylinder temperature, mold temperature, injection pressure, and cooling time of the injection molding conditions are the same as those in the first embodiment.

  Since the roughened plating surface is exposed, a catalyst such as palladium or gold is added to the rough surface. In this catalyst method, for example, the first substrate 3 and the second substrate 4 that are welded are immersed in a mixed catalyst solution of tin and palladium, and then activated with an acid such as hydrochloric acid or sulfuric acid to deposit palladium on the surface. . The temperature and immersion time of the mixed catalyst solution are the same as those in the first embodiment.

  After that, when a secondary molded product composed of the first base 3 and the second base 4 having the bonded surfaces welded to each other is placed in 80 ° C. hot water for 10 minutes, the coating ecomatic AX is dissolved in the hot water. To do. Since “Vectra” plating grade C810 has a heat distortion temperature of 200 ° C. or higher, it does not give any change. In this way, the through holes 31 and 32, the conductive tubes 41, 42, and 43, and the circuit patterns 44 and 45, which are plated surfaces, are in a state where a catalyst is applied.

  Therefore, plating is performed on the surface to which the catalyst is attached, and chemical copper plating, chemical nickel plating, or the like is used for this plating. In this way, the through holes 31 and 32 have plated surfaces 310 and 320 and circuit patterns 310 and 320 electrically connected to the plated surfaces (the same reference numerals are given to the plated holes 310 and 320 because they are the same as the plated surfaces 310 and 320). The plated surfaces 410, 420, and 430 are formed on the inner peripheral surfaces of the conductive tubes 41, 42, and 43. Further, two circuit patterns 44 and 45 are formed on the second base body 4, and finally heat treatment is performed. Water may be removed.

According to this embodiment, a plurality of conductive paths, that is, a multi-layer circuit is formed. Specifically, the first is centered on the through hole 31 and then the path between the circuit pattern 310 and the conductive tube 41. The second is centered around the through-hole 32, and then the path between the circuit pattern 320 and the conductive tube 42, the third is the path of the conductive tube 43, the fourth is the path of the circuit pattern 44, and the fifth is the many of the circuit patterns 45. A path is formed.
Note that the first base 3 and the second base 4 may be subjected to an etching treatment first, and then both bases are welded with a laser beam to cover the non-plated surface, and a subsequent plating step may be performed.

  The above is an example of chemical copper plating or chemical nickel plating, but this plating may be a double layer of copper plating and nickel / iron plating.

  The dummy conductive tube 43 is not always necessary, and only the conductive tubes 41 and 42 may be used.

  A third embodiment of the present invention will be described with reference to FIGS. This shows a waveguide conductive structure in which a waveguide structure and a conductive structure are mixed, and this drawing itself is the same as FIGS. 15 to 17 of the second embodiment.

  In this embodiment, the first substrate 3 shown in FIG. 18 and the second substrate 5 shown in FIG. 20 are composed of two members, both of which are formed by injection molding using a thermoplastic synthetic resin as a material. The specific example is the same as in the first and second embodiments. One first substrate 3 of both substrates has a color tone with good light transmittance, and the other second substrate 5 has a color tone with good light absorption, and laser light is irradiated from the side of the substrate 3 with good light transmittance. As a result, the joint surfaces of both bases 3 and 5 are welded and integrated.

  First, the conductive structure will be described. The first base 3 has the same shape as that shown in FIGS. 9 and 10, and a plurality of through holes 31, 32 are formed in the base. Further, in the example of FIG. 19, groove-like conductive paths constituting the conductive tubes 51 and 52 are formed in the second base 5 in the example of FIG. 19, and the other first base 3 is connected to the second base 3. Conductive tubes 51 and 52 are formed by bonding and welding to the second substrate. The through holes 31 and 32 communicate with the conductive tubes 51 and 52. The inner peripheral surfaces of the conductive tubes 51 and 52 are also plated with 510 and 520, respectively, and the plating applied to the inner peripheral surfaces of the through holes 31 and 32 extends to the surface of the first base 3 and the circuit pattern 310. 320, and is electrically connected to the plating of the conductive tube. Further, circuit patterns 54 and 55 are formed on the surface of the second substrate 5.

  Next, the waveguide structure will be described. At least one of the substrates 3 and 5, in the example of FIG. 19, the second substrate 5 is provided with a groove-shaped waveguide constituting the waveguide 53. A seamless waveguide 53 is formed by welding the other substrate, in this example, the first substrate 3 to the second substrate. The inner peripheral surface of the waveguide 53 is plated 530.

  In addition, as plating 530 to be applied to the waveguide 53, the copper plating shields electric field noise due to conductivity by making the plating a double layer of copper plating and nickel / iron plating. Magnetic field noise can be shielded by the high permeability.

  Therefore, according to the third embodiment, as the conductive path, the circuit pattern 310 and the conductive tube 51 are routed around one through hole 31, the circuit pattern 320 and the conductive tube 52 are routed around the other through hole 32, There are circuit patterns 54 and 55, and there is a path by the waveguide 53 as a waveguide path.

  Examples of use of the invention include a waveguide filter installed at the entrance of a TV receiving parabolic antenna, a radar radiation waveguide that emits radio waves for preventing rear-end collisions of automobiles, and a high-frequency resonator for amplifying radio waves in a tunnel It can be used as a multilayer circuit board.

Front view of the first substrate of Example 1 Sectional view taken along line 2-2 of FIG. Front view of the second substrate of Example 1 Sectional view taken along line 4-4 of FIG. The front view of the state which joined the 1st base of Example 1 and the 2nd base Sectional view taken along line 6-6 in FIG. 5 of the first embodiment. The front view of the state which plated in the state which joined the 1st base | substrate and 2nd base | substrate of Example 1 Sectional view taken along line 8-8 in FIG. Front view of first substrate of Example 2 Sectional view taken along line 10-10 in FIG. 9 of the second embodiment. Front view of the second substrate of Example 2 Sectional view taken along line 12-12 in FIG. 11 of the second embodiment. The front view of the state which joined the 1st base of Example 2 and the 2nd base. 14 is a cross-sectional view taken along line 14-14 of FIG. The front view of the state which plated in the state which joined the 1st base | substrate and 2nd base | substrate of Example 2 15 is a cross-sectional view taken along line 16-16 in FIG. The rear view of the state which plated in the state which joined the 1st base | substrate and 2nd base | substrate of Example 2 The front view of the state which plated in the state which joined the 1st base | substrate and 2nd base | substrate of Example 3 18 is a cross-sectional view taken along line 19-19 in FIG. The rear view of the state which plated in the state which joined the 1st base | substrate and 2nd base | substrate of Example 3

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 1st base | substrate 2 2nd base | substrate 21 Waveguide 22 Waveguide 210 Plating 220 Plating 23 Dummy waveguide 230 Plating 3 1st base | substrate 31 Through-hole 310 Plating (circuit pattern)
32 Through hole 320 Plating (circuit pattern)
4 Second substrate 41 Conductive tube 410 Plating 42 Conductive tube 420 Plating 43 Conductive tube 430 Plating 5 Second substrate 51 Conducting tube 510 Plating 52 Conducting tube 520 Plating 53 Waveguide 530 Plating

Claims (3)

It consists of a first substrate (1) and a second substrate (2),
Both the substrates are made of a thermoplastic synthetic resin,
At least one of the two substrates (2) is formed with a groove-shaped waveguide, and a waveguide (21) (22) made seamless by welding the other substrate is formed,
There are a plurality of the waveguides (21) and (22), and a dummy waveguide (23) is provided between the waveguides.
A waveguide structure characterized in that plating (210) (220) (230) is applied to the inner peripheral surfaces of the waveguide and the dummy waveguide. 2. The waveguide structure according to claim 1, wherein the plating (210) (220) (230) is a double layer of copper plating and nickel / iron plating . It consists of a first substrate (3) and a second substrate (5),
Both the substrates are made of a thermoplastic synthetic resin,
Through holes (31), (32) are formed in the first base (3),
At least one of the two substrates (5) is formed with a groove-like conductive path, and the other (3) substrate is welded to form a seamless conductive tube (51) (52). Yes,
The through hole communicates with the conductive tube,
At least one of the two substrates (5) has a groove-shaped waveguide, and a waveguide (53) is formed by bonding the other substrate,
The waveguide is plated (530),
Plating (310) (320) (510) (520) is applied to the inner peripheral surfaces of the through holes (31) (32) and the conductive tubes (51) (52), respectively.
The waveguide conductive structure, wherein the through-hole plating (310) (320) and the conductive tube plating (510) (520) are electrically connected .

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