JP2003298319A - Electromagnetic wave transmission circuit element and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To eliminate the fear of leaving a gap between mating faces of a plurality of element components assembled to form a microwave transmission circuit element. <P>SOLUTION: A cross guide coupler 32 is composed of an upper and lower members 34, 36 and a coupling plate 38. A gold plating layer P on a mating side 34A of the upper member 34 and a gold plating layer P on an upper mating side of the coupling plate 38 are mated and pressed to compression-weld both gold plating layers. A gold plating layer P on a mating side 36A of the lower member 36 and a gold plating layer P on a lower mating side of the coupling plate 38 are mated and pressed to compression-weld both gold plating layers, thus forming the cross guide coupler 32. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electromagnetic wave transmission circuit element and its manufacturing method.

[0002]

2. Description of the Related Art As an electromagnetic wave transmission circuit element, and particularly as a microwave transmission circuit element, a microwave coupler,
Examples of the microwave filter, the microwave attenuator, the microwave resonator, the microwave terminator, the microwave waveguide, the microwave antenna, etc. are one of the microwave couplers as shown in FIG. 6, for example. The cross guide coupler 12 is composed of three element constituent members including an upper member 14, a lower member 16, and a coupling plate 18. The upper member 14 is provided with a groove portion 1402 forming a part of a wall surface defining the first microwave transmission space 22 and a mating surface 14A. Further, the lower member 16 is provided with a groove portion 1602 forming a part of a wall surface defining the second microwave transmission space 24 and a mating surface 16A. Of the upper surface of the coupling plate 18, a portion corresponding to the groove portion 1402 of the upper member 14 forms a part of a wall surface that defines the first microwave transmission space 22, and the other portions are aligned with the upper member 14. It becomes a face. In addition, the coupling plate 18 includes the lower member 1 on the lower surface thereof.
A portion of the groove 6 that corresponds to the groove 1602 forms a part of a wall surface that defines the second microwave transmission space 24, and the other portion serves as a mating surface for the lower member 16. The coupling plate 18 is further provided with a plurality of coupling holes (not shown) at a central portion where the first microwave transmission space 22 and the second microwave transmission space 24 intersect. Then, the upper member 14, the coupling plate 18, and the lower member 16 are overlapped with each other and fixed with screws 20 to complete the cross guide coupler 12, and thereby the first microwave transmission space 22 and the second microwave transmission. The space 24 is defined as a tubular space. The first microwave transmission space 22 and the second microwave transmission space 24 function as a rectangular waveguide,
The microwaves sent into one of the microwave transmission spaces travel in the microwave transmission space and are coupled to the other microwave transmission space through the coupling holes of the coupling plate 18.

[0003]

However, in such a conventional cross guide coupler 12 as described above, an assembly portion between the mating surface of the upper member 14 and the mating surface of the coupling plate 18 and a mating surface of the lower member 16 are formed. In the assembly portion between the coupling plate 18 and the mating surface, a gap of a micron unit remained, and the microwave often leaked from the microwave transmission space to the outside through the gap. The present invention has been devised in view of the above circumstances, and an object of the present invention is to assemble a plurality of element constituent members having a part of a wall surface defining an electromagnetic wave transmission space and a mating surface with each other. In the electromagnetic wave transmission circuit element to be configured, in the assembly portion between the mating surfaces of the plurality of element component members, the possibility of leaving a gap is wiped out, whereby electromagnetic waves are transmitted from the electromagnetic wave transmission space through such a gap. It is to completely prevent leakage to the outside.

[0004]

In order to achieve the above object, an electromagnetic wave transmission circuit element according to the present invention comprises a plurality of element constituent members having a part of a wall surface defining an electromagnetic wave transmission space and a mating surface. A gold-plated layer is formed on at least the mating surfaces of the plurality of element constituent members, and the plurality of element constituent members are formed by combining the gold-plated layers on the mating surfaces and press-bonding the gold-plated layers. It is characterized by being joined to each other. Further, the electromagnetic wave transmission circuit element according to the present invention includes a plurality of element constituent members in which a part of a wall surface defining an electromagnetic wave transmission space and a mating surface are formed, and the entire surface of the plurality of element constituent members. A gold plating layer is formed on the plurality of element constituent members, and the gold plating layers on their mating surfaces are combined,
The gold-plated layers are bonded to each other by being pressure-bonded. Further, the method for manufacturing an electromagnetic wave transmission circuit element according to the present invention is to manufacture a plurality of element constituent members in which a part of a wall surface defining an electromagnetic wave transmission space and a mating surface are formed, A gold plating layer is formed on at least the mating surfaces, the gold plating layers on the mating surfaces of the plurality of element component members are combined, and the plurality of element component members are bonded to each other by pressure bonding the gold plating layers. Characterize. Further, the method for manufacturing an electromagnetic wave transmission circuit element according to the present invention is to manufacture a plurality of element constituent members in which a part of a wall surface defining an electromagnetic wave transmission space and a mating surface are formed, and each of the plurality of element constituent members. A gold-plated layer is formed on all surfaces, the gold-plated layers on the mating surfaces of the plurality of element-constituting members are combined, and the plurality of element-constituting members are bonded to each other by pressure bonding the gold-plating layers. Characterize.

According to the present invention, since the assembly portion between the mating surfaces of the plurality of element constituent members is joined by pressure bonding of the gold plating layer, no gap remains in the assembly portion, and therefore electromagnetic wave transmission is performed. It is possible to completely prevent electromagnetic waves from leaking out of the space.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION An electromagnetic wave transmission circuit element of the present invention will be described below with reference to the drawings together with a method for manufacturing the same. FIG. 1 is a perspective view of the cross guide coupler, and FIG. 2 is an exploded perspective view of the cross guide coupler. The cross guide coupler 32, which is one of the electromagnetic wave transmission circuit elements and is a microwave coupler, is composed of three element constituent members, an upper member 34, a lower member 36, and a coupling plate 38. Upper member 3
Reference numeral 4 denotes a flat metal block, and the upper member 34 is provided with a groove portion 3402 that forms a part of a wall surface that defines the first microwave transmission space 42 and a flat mating surface 34A. The upper member 34 has a gold plating layer P formed on the entire surface thereof. The lower member 36 is the upper member 3
This lower member 3 is made of a flat metal block like 4
6, a groove portion 3602 forming a part of a wall surface that defines the second microwave transmission space 44 and a flat mating surface 36A are formed. The lower member 36 also has a gold plating on the entire surface. A layer P is formed. The coupling plate 38 is made of a metal plate and is formed in a rectangular shape having the same contour as the upper member 32 and the lower member 36. Of the flat upper surface of the coupling plate 38, the portion corresponding to the groove portion 3402 of the upper member 34 is the first portion.
Forming part of a wall surface that defines the microwave transmission space 42,
The other portion serves as a mating surface for the upper member 34. Further, in the coupling plate 38, a portion of the lower surface corresponding to the groove portion 3602 of the lower member 36 is provided in the second microwave transmission space 4
A part of the wall surface defining 4 is formed, and the other part is a mating surface for the lower member 36. The coupling plate 38 further includes a first microwave transmission space 42 and a second microwave transmission space 4
Two coupling holes 3804 are formed in the central portion where 4 and 4 intersect. The gold plate P is formed on the entire surface of the connecting plate 38.

Upper member 34, lower member 36, and connecting plate 38
When the above is manufactured as described above, these three element constituting members 34, 36 and 38 are superposed in the positional relationship shown in FIG. 2 and mounted on, for example, a heating press equipped with heating means. Then, these element component members 34, 36, 38
Are heated and pressed to bond the three component elements 34, 36, 38 to each other. As a result, the gold plating layer P of the mating surface 34A of the upper member 34 and the gold plating layer P of the mating surface of the upper surface of the coupling plate 38 are pressed together, and the lower member 3
In a state where the gold plating layer P of the mating surface 36A of 6 and the gold plating layer P of the mating surface of the lower surface of the coupling plate 38 are combined, the gold plating layers are pressure-bonded. As a result, the cross guide coupler 32 is completed. Moreover, by this, the upper member 34
Groove portion 3402 and the groove portion 34 of the upper surface of the coupling plate 38.
And a portion corresponding to 02, the first microwave transmission space 42
Is defined as a tubular space, and the groove portion 3602 of the lower member 36 and the groove portion 3602 of the lower surface of the coupling plate 38 are formed.
The second microwave transmission space 44 is defined as a tubular space by the portion corresponding to. First microwave transmission space 4
The extending directions of the second microwave transmission space 44 and the second microwave transmission space 44 are orthogonal to each other, and each of them functions as a rectangular waveguide, and the microwaves sent into one microwave transmission space are While advancing in the microwave transmission space, it is coupled to the other microwave transmission space through the two coupling holes 3802 of the coupling plate 38. When the gold-plated layer is pressure-bonded to join the element component members 34, 36, 38,
The heating temperature may be set to a temperature suitable for crimping, and if necessary, this crimping may be performed in an atmosphere of an inert gas, or may be performed while giving vibration. is there.

As described above, in the cross guide coupler 32 of this embodiment, the three element constituting members 34 and 3 are provided.
6, 38 are joined to each other by pressure-bonding the gold-plated layer P formed on the mating surfaces of the element constituent members. Therefore, these element constituent members 34, 36,
There is no possibility that a gap will remain between the mating surfaces of the 38, so that microwaves are completely prevented from leaking outside from the microwave transmission space through such a gap.

Next, another embodiment will be described.
3 is a perspective view of the microwave filter, FIG. 4 is a sectional view taken along the line AA of FIG. 3, and FIG. 5 is a sectional view taken along the line BB of FIG. Microwave filter 5 which is one of microwave transmission circuit elements
The reference numeral 2 is composed of three element constituent members including an upper member 54, a lower member 56, and a partition plate 58. The upper member 54 is made of a flat metal block, and the upper member 54 is provided with a groove portion 5402 forming a part of a wall surface defining the microwave transmission space 62 and a flat mating surface 54A. The gold plating layer P is formed on the entire surface of the upper member 54. The lower member 56 is made of a flat metal block similarly to the upper member 54. The lower member 56 has a groove portion 5602 forming a part of a wall surface defining the microwave transmission space 62 and a flat mating surface 56A. The lower member 56 is also formed with the gold plating layer P on the entire surface thereof. The partition plate 58 is made of a flat thin plate-like substrate having copper foil adhered on both sides, and is housed between the mounting recess 5404 of the upper member 52 and the mounting recess 5604 of the lower member 56. is there. The copper foils on both sides are formed in a predetermined pattern, and the copper foils are left on both side edges of the partition plate 58. Furthermore, a gold plating layer P is formed on the entire surface of the copper foil.

The upper member 54, the lower member 56, and the partition plate 5
8 is manufactured as described above, these three element constituting members 54, 56 and 58 are superposed in the positional relationship shown in FIGS. 4 and 5 and mounted on, for example, a heating press equipped with heating means. To do. To establish the positional relationship shown in the figure, the upper member 5
4 mounting recess 5404 and lower member 56 mounting recess 560
4, a partition plate 58 is interposed between the partition plates 58, and the gold plating layers P on both mating surfaces 58A of the partition plate 58 are respectively placed on the mounting recesses 54.
To match the gold plating layer P on the bottom surface of 04, 5604,
The gold plating layer P on the mating surface 54A of the upper member 54 and the lower member 5
The mating surface 56A of No. 6 and the gold plating layer P are matched. Then, by operating the heating press machine or the like to heat and pressurize the three element constituting members 54, 56, 58, the element constituting members 54, 56, 58 are joined to each other. Thereby, the mating surface 54 of the upper member 54
In a state where the gold plating layer P of A and the gold plating layer P of the mating surface 56A of the lower member 56 are combined, the gold plating layers are pressure-bonded. This completes the microwave filter 52. Further, by this, the microwave transmission space 6 is formed by the groove portion 5402 of the upper member 54 and the groove portion 5602 of the lower member 56.
2 is defined as a tubular space. The microwave transmission number winding 62 functions as a rectangular waveguide, and a partition plate 58 is provided for the microwave transmitted therein.
By the function of the copper foil patterns on both sides of the, the degree of attenuation according to the wavelength is given. Note that the crimping process for manufacturing the microwave filter 52 may be performed by various methods, like the crimping process for manufacturing the cross guide coupler 32 described above.

As described above, in the microwave filter 52 of the present embodiment, the upper member 54 and the lower member 56 have the gold plating layer P formed on their mating surfaces 54A and 56A.
Are joined together by crimping. Therefore, there is no possibility of leaving a gap between the mating surface 54A of the upper member 54 and the mating surface 56A of the lower member 56. Therefore, the microwave is transmitted from the microwave transmission space to the outside through such a gap. Waves are completely prevented from leaking out.

In the above embodiment, the case where the gold plating layer is formed on the entire surface of the plurality of element constituting members constituting the microwave transmission circuit element has been described, but the gold plating layer should be formed only on the mating surface. You may Further, in the present specification, as the embodiments, the case where the electromagnetic wave transmission circuit element is the microwave coupler and the case where the electromagnetic wave transmission circuit element is the microwave filter have been described, but the present invention is, for example, a microwave attenuator, It is also widely applicable to other microwave transmission circuit elements and electromagnetic wave transmission circuit elements such as a wave resonator, a microwave terminator, a microwave waveguide, and a microwave antenna.

[0013]

As is apparent from the above description, according to the present invention, an electromagnetic wave is formed by assembling a plurality of element constituent members having a part of a wall surface defining an electromagnetic wave transmission space and a mating surface. In the transmission circuit element, it is possible to eliminate the risk of leaving a gap in the assembly portion between the mating surfaces of the plurality of element constituent members, whereby electromagnetic waves are transmitted from the electromagnetic wave transmission space through such a gap. It can be completely prevented from leaking to the outside. The present invention is particularly likely to leak even from a minute gap of a micron unit, when used in an electromagnetic wave transmission circuit element for transmitting microwaves in the submillimeter wave region or millimeter wave region,
It has a particularly excellent effect, but it is effective not only for microwaves in those regions but also for microwaves of any wavelength, and for wavelengths longer than those in the microwave region. Even in the application of transmitting electromagnetic waves, good results can be obtained.

[Brief description of drawings]

FIG. 1 is a perspective view of a cross guide coupler according to the present invention.

FIG. 2 is an exploded perspective view of the cross guide coupler of FIG.

FIG. 3 is a perspective view of a microwave filter according to the present invention.

FIG. 4 is a sectional view taken along line AA of FIG.

5 is a sectional view taken along line BB of FIG.

FIG. 6 is a perspective view of a conventional cross guide coupler.

[Explanation of symbols]

32 Cross guide coupler 34 Upper member 36 Lower member 38 Bonding plate 52 Microwave filter 54 Upper member 56 Lower member 58 Partition board P Gold plating layer

Claims (5)

[Claims] 1. A plurality of element constituent members having a mating surface and a part of a wall surface defining an electromagnetic wave transmission space are formed, and a gold plating layer is formed on at least the mating surface of the plurality of element constituent members. The electromagnetic wave transmission circuit element is characterized in that the plurality of element constituent members are joined to each other by combining the gold-plated layers on their mating surfaces and press-bonding the gold-plated layers. 2. A plurality of element constituting members formed with a mating surface and a part of a wall surface defining an electromagnetic wave transmission space, wherein a gold plating layer is formed on all surfaces of the plurality of element constituting members. The electromagnetic wave transmission circuit element is characterized in that the plurality of element constituent members are joined to each other by combining the gold-plated layers on their mating surfaces and press-bonding the gold-plated layers. 3. The electromagnetic wave transmission circuit element includes a microwave coupler, a microwave filter, a microwave attenuator, a microwave resonator, a microwave terminator, a microwave waveguide,
The electromagnetic wave transmission circuit element according to claim 1 or 2, which is one of microwave antennas. 4. A plurality of element-constituting members in which a part of a wall surface defining an electromagnetic wave transmission space and a mating surface are formed, and a gold plating layer is formed on at least the mating surface of the plurality of element-constituting members, A method for manufacturing an electromagnetic wave transmission circuit element, characterized in that the gold-plated layers on the mating surfaces of the plurality of element-constituting members are aligned and the gold-plated layers are bonded by pressure to bond the plurality of element-constituting members to each other. Method. 5. A plurality of element-constituting members in which a part of a wall surface defining an electromagnetic wave transmission space and a mating surface are formed, and a gold plating layer is formed on all surfaces of each of the plurality of element-constituting members. A method for manufacturing an electromagnetic wave transmission circuit element, characterized in that the gold-plated layers on the mating surfaces of the plurality of element-constituting members are aligned and the gold-plated layers are bonded by pressure to bond the plurality of element-constituting members to each other. Method.