JP2005151439A - Waveguide, line convertor, and high-frequency module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a high-frequency module with a simple arrangement and with a low loss which is arranged by making a waveguide an input/output portion and by using a plane transmission line for a function circuit portion. <P>SOLUTION: A high-frequency module where a channel 10 of an upper conductor board 1 and a channel 20 of a lower conductor board 2 are opposed through a dielectric board 3 is composed of a waveguide where the upper and lower conductor boards 1 and 2 are conducted by upside and underside electrodes 30a, 30b and a through hole, a line converter where one end 50a of a strip conductor 50 of a dielectric board 3 is inserted into the waveguide, a circuit formed on the dielectric board 3 where the strip conductor 50 is formed, and a function circuit composed of parts formed or mounted. In the function circuit portion and the line converter, the upside and the underside electrodes 30a and 30b of the dielectric substrate 3 where the strip conductor 50 is formed are conducted by the through hole, so that a suspended line is formed by the strip conductor 50 and the upper and lower conductor boards 1 and 2. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a waveguide that transmits a high-frequency signal, a line converter that performs signal conversion between the waveguide and a planar transmission line such as a microstrip line, and a high-frequency module that includes these and a functional circuit. It is.

  Conventionally, transmission lines for transmitting millimeter waves and transmission lines for functional circuits used for millimeter waves include a plurality of types of transmission lines such as waveguides, fin lines, microstrip lines, coplanar lines, suspended lines, and NRDs. Yes, they are used properly according to their structure and characteristics. For example, waveguides are often used for signal transmission because they are excellent in transmission efficiency and shielding from the outside. On the other hand, structural components such as amplifying elements and circuit elements are installed. Is difficult. On the other hand, planar transmission lines such as microstrip lines and coplanar lines are usually formed on a dielectric substrate, and although they are inferior to waveguides in terms of transmission efficiency and shielding from the outside, amplifying elements and circuit elements are formed. It is easy to mount and it is easy to configure a functional circuit.

  For this reason, a high-frequency module is often used in which a functional circuit portion is formed on a dielectric substrate on which a planar transmission line is formed, and a signal is input to and output from this functional circuit as a waveguide. In a high-frequency module using such a planar transmission line and a waveguide, a line conversion unit that performs line conversion between these transmission lines must be provided. The line conversion unit of such a high-frequency module inserts a line conductor of a planar transmission line into a predetermined position in the waveguide, thereby coupling the signal transmitted through the waveguide and the line conductor, A transmission signal is transmitted to a planar transmission line (for example, refer to Patent Document 1, Patent Document 2, and Patent Document 3).

  As a high-frequency module including such a waveguide and a planar transmission line, a structure as shown in FIG.

The conventional high-frequency module has a circuit board installed on the bottom surface inside the housing, and an internal conductor that penetrates the bottom of the housing 1 from the inner bottom surface to the bottom surface, with the direction perpendicular to the inner bottom surface (bottom surface) as the axial direction. A wave tube, an external waveguide installed on the bottom surface of the housing and connected to the internal waveguide, and a part of the line conductor connected to the circuit board are installed at the end of the internal waveguide in the housing. And a waveguide / planar line conversion substrate. Then, the waveguide / planar line conversion substrate is placed at a position away from one end of the internal waveguide by a predetermined distance (1/4 of the in-tube wavelength of the transmission signal). The signal is coupled to the line conductor of the waveguide / planar line conversion board and transmitted to the line conductor of the circuit board.
JP-A-6-112708 JP 2000-151222 A JP 2000-244411 A

  However, in the conventional high-frequency module, as described above, the waveguide must be fixed to the casing in which the planar circuit is installed. Solder, adhesive, or the like is used for such fixing, but the position where the waveguide is fixed to the housing needs to be highly accurate, but it is difficult to fix the waveguide with high accuracy by the above method. Moreover, since such a connection (joining) process is required, a manufacturing process increases and it becomes a factor of a cost rise. Also, no matter how accurate the connection is, the bonding strength may deteriorate due to changes over time, and the positional relationship between the housing and the waveguide may shift, and transmission characteristics may deteriorate due to such a positional shift. There is. Here, in order to solve such a problem, it is sufficient to improve the bonding reliability of the adhesive. However, the adhesive having excellent bonding reliability is expensive, and as a result, the cost of the high-frequency module increases. .

  As another waveguide / planar line exchanger structure, a dielectric plate in which a hole is formed in a waveguide wall, a line conductor is inserted into the waveguide from the hole, and the line conductor is formed. In some cases, the waveguide and the waveguide are joined. However, even in such a waveguide / planar line exchanger, since the waveguide and the dielectric plate must be joined at an accurate position, the above-described problem occurs.

  An object of the present invention is to provide a waveguide, a line converter, and a high-frequency module including these for easily realizing a low-frequency high-frequency module having a simple structure using a waveguide as an input / output unit. There is.

According to the present invention, in a waveguide in which a groove portion of an upper and lower conductor plate having grooves formed at positions facing each other is used as a transmission path for a predetermined transmission signal, a dielectric plate is at least sandwiched between portions other than the groove portion of the upper and lower conductor plates. The conductor plate is provided on both surfaces of the dielectric plate, and a plurality of conductor paths conducting the conductor layers on both surfaces are provided on the dielectric plate at intervals shorter than at least half the wavelength of the transmission signal. It is characterized by being formed.
Further, the waveguide according to the present invention is characterized in that the dielectric plate is also formed in a portion sandwiched between grooves formed to face each other in the vertical direction.

  In this configuration, by inserting the dielectric plates between the upper and lower conductor plates of the waveguide, a waveguide / planar line converter as described later can be easily formed in the waveguide. That is, by forming the circuit electrode on the dielectric plate, a structure in which the line conductor of the planar circuit is inserted into the waveguide can be easily obtained. Here, the electrodes formed on the upper and lower surfaces of the dielectric plate are electrically connected by a conductor path such as a through hole at an interval shorter than ½ the wavelength of the signal transmitted through the waveguide. A signal transmitted through the waveguide is blocked by the through hole and does not leak into the dielectric plate.

  According to another aspect of the present invention, there is provided a line converter comprising: the waveguide; and a planar transmission line having a planar electrode having a predetermined width formed at a position other than the transmission line portion of the waveguide on the dielectric plate as a line conductor. And one end of the line conductor is inserted in a direction substantially perpendicular to the H-plane of the waveguide with respect to the waveguide.

  In this configuration, a dielectric plate, on which a planar circuit of a predetermined shape is formed in advance, is placed between the upper and lower waveguides having the opposite groove as the transmission path, and is arranged in the transmission path of this waveguide. The signal transmitted through the waveguide is coupled to the planar transmission line, and the signal is transmitted to the planar transmission line formed on the dielectric substrate, and the signal transmitted through the planar transmission line is coupled to the waveguide. Then, the signal converted into the waveguide mode is transmitted to the waveguide.

  The high-frequency module according to the present invention includes the waveguide, the line converter, and a predetermined functional circuit formed on a dielectric plate, and a signal inputted to and outputted from the functional circuit is guided to the waveguide. Transmission is performed by a line converter and a planar transmission line.

  In this configuration, the functional circuit on the dielectric substrate is electrically connected to the waveguide via the planar transmission line on the dielectric substrate and the line converter, so that the functional circuit has a predetermined effect on the transmission signal. As a result, a high-frequency module having the waveguide as an input unit, an output unit, or an input / output unit is formed.

  According to this invention, the dielectric plate is sandwiched by forming conductor paths such as through holes for conducting the electrodes formed on the upper and lower surfaces of the dielectric plate at intervals of less than half of the wavelength of the transmission signal. A signal transmitted through a waveguide composed of the formed upper and lower conductor plates does not leak into the dielectric plate. Furthermore, since the dielectric plate is disposed in the waveguide in advance, the waveguide-planar transmission line converter can be easily formed by forming a line conductor on the dielectric plate.

  In addition, according to the present invention, a functional circuit is provided on the dielectric substrate together with the line converter, so that a predetermined function is applied to a high-frequency signal and a low-loss high-frequency module using a waveguide as an input / output unit Can be realized with a small and simple structure.

A waveguide according to a first embodiment of the present invention will be described with reference to FIGS.
FIG. 1A is an exploded perspective view showing a structure of a waveguide according to the present embodiment, and FIG. 1B is a cross section of the waveguide shown in FIG. 1A taken along a plane perpendicular to the transmission direction of a transmission signal. FIG.
As shown in FIG. 1, the waveguide of this embodiment includes an upper conductor plate 1 and a lower conductor plate 2, and a dielectric plate 3 installed between these conductor plates 1 and 2.
A groove 10 having a square cross section extending in a predetermined direction is formed in the upper conductor plate 1, and the surface on which the groove 10 is formed is in contact with the upper surface side of the dielectric plate 3.
Similarly to the upper conductor plate 1, a groove 20 having a square cross section is formed on the lower conductor plate 2, and the surface on which the groove 20 is formed is in contact with the lower surface side of the dielectric plate 3. Here, the upper conductor plate 1 and the lower conductor plate 2 are arranged so that the respective grooves 10 and 20 face each other with the dielectric plate 3 interposed therebetween.

  The upper electrode 30a is formed only on the surface on the upper conductor plate 1 side of the dielectric plate 3 only on the portion in contact with the upper conductor plate 1, and only on the portion in contact with the lower conductor plate 2 on the surface on the lower conductor plate 2 side. A bottom electrode 30b is formed. A plurality of through-holes 300 are formed along the grooves 10 and 20 in the portion sandwiched between the upper surface electrode 30a and the lower surface electrode 30b of the dielectric plate 3 so as to conduct the upper surface electrode 30a and the lower surface electrode 30b. With such a configuration, the upper conductor plate 1 and the lower conductor plate 2 are electrically connected by the upper surface electrode 30a, the lower surface electrode 30b, and the through hole 300 formed on the dielectric plate 3, so that the grooves 10, 20 and A waveguide having a rectangular cross-sectional area between the dielectric plates 3 sandwiched between them as a signal transmission path can be configured.

  Here, the plurality of through holes 300 are formed at intervals of a length less than ½ of the wavelength of a signal (hereinafter simply referred to as “transmission signal”) transmitted through the waveguide. Thereby, since the transmission signal is blocked by the plurality of through holes 300 formed along the grooves 10 and 20, the transmission signal hardly transmits through the dielectric plate 3 other than the transmission path portion. That is, the waveguide mode is cut off. As a result, the transmission signal is transmitted only through the transmission path including the grooves 10 and 20 and the dielectric 3 therebetween.

  In this embodiment, the dielectric plate 3 is disposed also in the portion sandwiched between the grooves 10 and 20, but a structure without the dielectric plate 3 in the portion sandwiched between the grooves 10 and 20 as shown in FIG. 2 is used. May be.

FIG. 2A is an exploded perspective view showing another structure of the waveguide according to the present embodiment, and FIG. 2B is a plane perpendicular to the transmission direction of the transmission signal of the waveguide shown in FIG. It is sectional drawing cut | disconnected by.
The waveguide shown in FIG. 2 is obtained by arranging the dielectric plate 3 of the waveguide shown in FIG. 1 only in a portion sandwiched between the upper conductor plate 1 and the lower conductor plate 2.
By setting it as such a structure, the waveguide provided with the transmission path of the cross-sectional square shape which consists only of the grooves 10 and 20 can be formed.

As shown in FIGS. 3 (a) and 3 (b), dielectric members 4a and 4b having a predetermined dielectric constant are arranged in the groove portions 10 and 20 of the waveguide shown in FIGS. 1 and 2, respectively. Alternatively, a dielectric-loaded waveguide may be formed.
3A is an exploded perspective view of a waveguide in which dielectric members 4a and 4b are arranged in the grooves 10 and 20 of the waveguide shown in FIG. 1, and FIG. 3B is a perspective view of FIG. FIG. 3 is an exploded perspective view of a waveguide in which dielectric plates 4a and 4b are disposed in the illustrated grooves 10 and 20, respectively. In the case of the structure shown in FIG. 3B, the dielectric member may be integrally formed without being separated into 4a and 4b.

Next, a high-frequency module according to the second embodiment will be described with reference to FIG.
FIG. 4 is an exploded perspective view showing the structure of the high-frequency module according to this embodiment.
As shown in FIG. 4, the high-frequency module of this embodiment includes an upper conductor plate 1 and a lower conductor plate 2, and a dielectric plate 3 installed between these conductor plates 1 and 2.

  A groove 10 having a rectangular cross section extending in a predetermined direction is formed in the upper conductor plate 1, and a groove 11 having a variety of branches is formed so as to connect to the groove 10. The shape of the groove 11 corresponds to the shape of a circuit formed by strip conductors formed on the upper surface of the dielectric plate 3 to be described later and the circuit elements mounted on this circuit. The upper conductor plate 1 is disposed such that the surface on which the grooves 10 and 11 are formed is in contact with the dielectric plate 3. Here, since the groove 11 has the above structure, even if the upper conductor plate 1 is brought into contact with the upper surface of the dielectric plate 3, the strip conductors and circuit elements on the upper surface of the dielectric plate 3 do not contact the upper conductor plate 1.

  A groove 20 having a rectangular cross section extending in a predetermined direction is also formed in the lower conductor plate 2, and a groove 21 having various branched shapes is formed so as to be connected to the groove 20. The shape of the groove 21 corresponds to the shape of the electrode non-forming portion provided on the lower surface of the dielectric plate 3 to be described later. The lower conductor plate 2 is disposed with the surface on which the grooves 20 and 21 are formed in contact with the lower surface side of the dielectric plate 3.

  Further, the upper conductor plate 1 and the lower conductor plate 2 are formed so that the grooves 10 and 20 formed in the respective conductors are symmetrically located via the dielectric plate 3, and the grooves 11 and 21 are also interposed via the dielectric plate 3. Are in contact with the upper and lower surfaces of the dielectric plate 3 so as to be symmetrical.

  On the surface of the dielectric plate 3 on the upper conductor plate 1 side (upper surface in FIG. 4), an upper surface electrode 30a is formed at a portion in contact with the upper conductor plate 1 and is grounded. Further, on the surface of the dielectric plate 3 on the upper conductor plate 1 side, a predetermined position of a portion corresponding to the groove 10 of the upper conductor plate 1 is set as one end 50a so as to be separated from the upper surface electrode 30a and in a direction in which the groove 10 extends. A strip conductor 50 having a predetermined length is formed extending in a direction perpendicular to and parallel to this plane, that is, in a direction substantially perpendicular to the H plane of the waveguide composed of the upper conductor plate 1 and the lower conductor plate 2. The strip conductor 50 corresponds to the “flat electrode” of the present invention.

  The strip conductor 50 is provided with separation points 52 and 54 separated by a predetermined gap at a position where the amplification element 101 is mounted at a predetermined distance from one end 50a and a position where the amplification element 102 is mounted. Further, between the one end 50a of the strip conductor 50 and the separation point 52, an alignment stub 51 and a drive power supply strip conductor 50c are formed in order from the one end 50a side. Further, between the separation point 52 and the separation point 54 of the strip conductor 50, a bias supply strip conductor 50d, a matching stub 53, and a capacitor 58 are formed in order from the separation point 52 side. Here, the capacitor 58 separates the strip conductor 50 in the width direction over a predetermined length, removes the conductor on the side of the separation point 52 of one conductor of the separated strip conductor 50, and removes the other conductor. It is formed by removing the conductor at the end of the separation point 54 side. A bias supply strip conductor 50e is formed between the separation point 54 of the strip conductor 50 and the other end 50b. Here, the drive power supply strip conductor 50c, the bias supply strip conductor 50d, and the bias supply strip conductor 50e are each formed in an axial direction perpendicular to the extending direction of the strip conductor 50, and each has a stub. 55, 56, 57 are formed.

  On the other hand, an upper surface electrode 30b is formed on the surface of the dielectric plate 3 on the lower conductor plate 2 side (the lower surface in FIG. 4) at a portion in contact with the lower conductor plate 2, and is grounded. Here, no electrode is formed at a position facing the strip conductor formed on the surface on the upper conductor plate 1 side on the surface on the lower conductor plate 2 side of the dielectric plate 3. That is, an electrode non-formation part is provided.

  Further, as shown in the first embodiment, a plurality of through holes (not shown) are formed in the portion of the dielectric plate 3 where the upper surface electrode 30a and the lower surface electrode 30b are formed. The upper surface electrode 30a and the lower surface electrode 30b are electrically connected through the hole, and the upper conductor plate 1 and the lower conductor plate 2 are electrically connected.

  Here, the plurality of through holes are formed at intervals of less than half the wavelength of the transmission signal, as in the first embodiment. Further, the width of the groove (electrode non-formed portion) formed in the upper surface electrode 30a and the lower surface electrode 30b of the dielectric plate 3 to form the strip conductor 50 is compared with the length of ½ of the wavelength of the transmission signal. Make it extremely small.

  By adopting such a configuration, in the region where the dielectric plate 3 is sandwiched between the upper surface electrode 30a and the lower surface electrode 30b, the signal of the transmission mode of the waveguide is not transmitted by the through holes formed at the intervals, Further, by reducing the width of the groove as described above, the transmission mode signal of the waveguide is not transmitted (not leaked) to the groove portion where the strip conductor 50 is formed. That is, only a region composed of a portion having the groove 10 of the upper conductor plate 1, a portion having the groove 20 of the lower conductor plate 2, and the dielectric plate 3 sandwiched therebetween functions as a waveguide having a rectangular cross section. .

  Since the upper conductor plate 1 and the lower conductor plate 2 are grounded, the strip conductors and stubs including the upper conductor plate 1, the lower conductor plate 2, and the strip conductor 50 formed on the upper surface are provided. The dielectric plate 3 is a functional circuit using a suspended line. Here, this suspended line corresponds to the “planar transmission line” of the present invention.

Next, an example of the operation of this high frequency module will be described. In the following description, the signals transmitted by the strip conductors are actually transmitted by the suspended lines including the upper and lower conductor plates. Description will be made using symbols of strip conductors used.
When a predetermined bias voltage signal is input from the outside via the bias supplying strip conductor 50e, a signal having a resonance frequency of the dielectric resonator 103 is reflected and oscillated between the dielectric resonator 103 and the amplifying element 102. . At this time, the upper conductor plate 1 and the lower conductor plate 2 disposed above and below the dielectric resonator 103 function as a cavity of the dielectric resonator 103. At this time, since the stub 57 is formed at a predetermined position of the bias supply strip conductor 50e, the oscillation signal transmitted between the dielectric resonator 103 and the amplifying element 102 is attenuated by the stub 57, and the bias supply side Is not transmitted to the external circuit. As described above, a band reflection type oscillation circuit is formed by the dielectric resonator 103, the active element 102, and the strip conductor connecting them.

  Next, the oscillation signal output from the active element 102 is input to the active element 101 via the capacitor 58. A stub 53 is formed between the output side of the active element 102 and the input side of the active element 101. The stub 53 is formed so that the impedance of the output side of the active element 102 and the input side of the active element 101 are matched, and the stub 53 is matched between the two elements. It is transmitted to the active element 101 with low loss. Further, a stub 56 is formed on the bias supply strip conductor 50d for applying a bias to the active element 101. The stub 56 is formed so as to attenuate the oscillation signal, and the oscillation signal is not transmitted to the external circuit on the bias supply side by the stub 56.

  The active element 101 amplifies the oscillation signal input in accordance with the bias voltage signal input from the bias supply strip conductor 50d and the drive voltage signal input from the drive power supply strip conductor 50c to amplify one of the strip conductors 50. Output to the end 50a side. Here, a stub 51 is formed between the output side of the active element 101 and one end 50a of the strip conductor 50. This stub 51 is connected to the output side of the active element 101 and one end of a strip conductor 50 described later. The line conversion unit that converts the signal mode by 50a and the waveguide and transmits the signal mode is impedance-matched. As a result, the amplified oscillation signal output from the active element 101 is transmitted to the one end 50a of the strip conductor 50 with low loss. Further, a stub 55 is formed on the driving power supply strip conductor 50c, and this stub 55 is formed so as to attenuate the output signal from the active element 101. As a result, the amplified oscillation signal output from the active element 101 is not transmitted to the external circuit on the drive power supply side. In this way, an oscillation signal amplification circuit including the active element 101 is formed.

  The oscillation signal output from the active element 101 is transmitted through the strip conductor 50 and transmitted to one end 50a. As described above, the strip conductor 50 is inserted into the inside of the waveguide made of the upper conductor plate 1, the lower conductor plate 2, and the dielectric 3, and the tip 50 a of the transmission line (having the grooves 10 and 20 ( In the waveguide). Thus, a magnetic field parallel to the H-plane of the waveguide is generated by the oscillation signal that has reached one end 50a, and an electric field perpendicular to the magnetic field is generated, so that the oscillation signal is converted into a waveguide mode signal. This signal is transmitted through the waveguide and output to the outside. At this time, the strip conductor 50, the upper and lower conductors are arranged by setting the arrangement position of the one end 50a of the strip conductor 50 to ¼ of the wavelength of the transmission signal from the end of the waveguide (side wall portion on the right back side in FIG. 4). The suspended line made up of the plates 1 and 2 and the waveguide made up of the upper and lower conductor plates 1 and 2 and the dielectric plate 3 are matched, and the signal is converted and transmitted with low loss. The portion composed of the waveguide and one end 50a of the strip conductor 50 corresponds to the “line converter” of the present invention.

  With such a configuration, a functional circuit using a strip conductor, a line transmission section between a planar transmission line and a waveguide using the strip conductor, and a dielectric in which the waveguide is sandwiched between the upper and lower conductor plates Since it is formed of a plate, a high-frequency module having a simple structure can be formed.

  Moreover, since the axial direction of the waveguide is not perpendicular to the plane on which the strip conductor of the planar transmission line is formed and is parallel to this plane, these two transmission lines can be formed in one plane, The structure of the high-frequency module is small and simple. In addition, a high-frequency module including a line converter can be formed without using a method of separately forming a waveguide and connecting to a housing in which a planar transmission line is formed. That is, the manufacturing process can be suppressed by eliminating the waveguide connecting process, and the adhesive used for the connection is unnecessary, and the component cost is suppressed. In addition, since the waveguide is integrally formed, there is no deterioration in characteristics due to changes over time unlike when an adhesive is used.

  Further, by forming the output circuit of the oscillation signal with a waveguide, the electrical length becomes shorter than when the output circuit is formed with a planar transmission line, and transmission loss can be reduced.

  In the above-described embodiment, the high-frequency module is configured by using a single dielectric plate, but may be formed by using different dielectric plates for each part of the high-frequency module. For example, the line converter portion, the amplifier circuit portion, and the oscillation circuit portion may be formed of different dielectric plates. At this time, the thickness of each dielectric plate is the same. With such a configuration, it is possible to easily select and set a circuit configuration for obtaining required characteristics. In addition, an optimum matching circuit can be combined by easily changing the matching circuit with the waveguide portion. Even if the waveguide portion and the matching circuit portion are separately formed as described above, the waveguide portion and the matching circuit portion are separated from each other because the waveguide is divided into two conductors at the center of the H plane. Even if it is very slightly separated, the transmission signal hardly leaks from this separated portion.

  In the above-described embodiment, the suspended line-waveguide-connected high-frequency module is configured. However, as shown in FIG. 5, the groove 21 of the lower conductor plate 2 is not formed, and the lower conductor plate 2 of the dielectric plate 3 is formed. By forming the lower surface electrode 30b on the entire surface on the side, a high frequency module of microstrip line-waveguide connection can be configured. FIG. 5 is an exploded perspective view in which the line conversion portion of the high-frequency module is enlarged.

  In the above-described embodiment, the dielectric plate 30 is formed on the entire portion (transmission path) sandwiched between the grooves 10 and 20 of the upper and lower conductor plates 1 and 2, but the waveguide structure shown in FIG. Alternatively, the dielectric plate 3 may be formed only in the portion where the strip conductor 50 is formed. In this case, even if the dielectric loss of the dielectric plate 3 increases, it is less susceptible to the deterioration of the dielectric loss than the structure in which the dielectric plate 3 is formed on the entire transmission line as shown in FIG. Can do. Thereby, a low-cost dielectric plate having a relatively large dielectric loss can be used, and a high-frequency module can be formed at low cost. In addition, since the work of partially removing such a dielectric plate can be performed by an easy method such as cutting with a router or cutting with a mold, an increase in manufacturing cost can be suppressed and manufacturing cost can be suppressed. The high frequency module can be formed at a low cost.

  In the above-described embodiment, the inside of the waveguide is an air layer, but the structure shown in FIG. 3 may be used, and a dielectric member may be installed in the waveguide to use a dielectric loaded waveguide structure.

1 is an exploded perspective view showing a structure of a waveguide according to a first embodiment and a sectional view thereof. FIG. 3 is an exploded perspective view showing another structure of the waveguide according to the first embodiment and a sectional view thereof. FIG. 3 is an exploded perspective view showing another structure of the waveguide according to the first embodiment. The disassembled perspective view which shows the structure of the high frequency module which concerns on 2nd Embodiment. The partially exploded perspective view which shows the other structure of the high frequency module which concerns on 2nd Embodiment

Explanation of symbols

1-upper conductor plate 10, 11-groove formed in upper conductor plate 1-lower conductor plate 20, 21-groove formed in lower conductor plate 2 3-dielectric plate 30 a-upper surface electrode of dielectric plate 3 30b—Lower surface electrode 300 of the dielectric plate 3—Through holes 4a, 4b—Dielectric member 50—Strip conductors 50a, 50b—Strip conductor ends 51, 53, 55, 56.57—Alignment stubs 52, 54— Separation point 50c of the strip conductor 50-drive power supply strip conductors 50d, 50e-bias supply strip conductors 101, 102-amplifying element 103-dielectric resonator

Claims (4)

In the waveguide having the groove portion of the upper and lower conductor plates in which grooves are formed at positions facing each other as a transmission path for a predetermined transmission signal,
A dielectric plate is disposed at least between the upper and lower conductor plates other than the groove,
Electrodes are provided on both surfaces of the dielectric plate, and a plurality of conductor paths that conduct the electrodes on both surfaces are formed on the dielectric plate at intervals shorter than at least half the wavelength of the transmission signal. A waveguide characterized by the following.   The waveguide according to claim 1, wherein the dielectric plate is also formed in a portion sandwiched between the groove portions of the upper and lower conductor plates. A waveguide according to claim 1 or claim 2,
A plane transmission line having a plate conductor of a predetermined width formed at a position other than the waveguide portion on the dielectric plate as a line conductor;
A line converter characterized in that one end of the line conductor is inserted in a direction substantially perpendicular to the H-plane of the waveguide with respect to the waveguide. A waveguide according to claim 1 or claim 2, a line converter according to claim 3,
A functional circuit having a predetermined function formed on the dielectric plate,
A high-frequency module, wherein a signal inputted to and outputted from the functional circuit is transmitted through the waveguide, the line converter, and the planar transmission line.

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