JP3944849B2 - Connecting member - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention is for example the electrodes connected, such as to suitable for, on the connection member using a conductive particle child capable of controlling deformation degree.
[0002]
[Prior art]
The circuit element and the circuit board, and the circuit boards are bonded to each other with a connecting member in which conductive particles are dispersed in an adhesive component such as an epoxy resin, and the circuit elements, the circuit board, and the circuit boards are electrically connected only in the pressing direction. There is an anisotropic conductive connecting member.
In this connection member, as the conductive particles dispersed in the adhesive component, there are known conductive particles in which a high molecular polymer is used as a core (polymer core) and the surface thereof is covered with a thin metal layer. . Since these particles have a small specific gravity, they are difficult to settle when the adhesive component is liquid. In addition, using such a connection member, for example, when connecting a microelectrode of an electronic component, the polymer core is deformed by the temperature and pressure at the time of connection, and the contact area between the conductive particles and the electrode is increased. There are features such as being able to. In this case, in order to prevent the conductive particles from being deformed excessively, it has also been proposed to mix hard spacer particles.
[0003]
[Problems to be solved by the invention]
Conductive particles made by coating the surface of the polymer core with a thin metal layer will cause large deformation of the polymer core when the temperature and pressure at the time of connection increase, and the thin metal layer will peel from the polymer core. In some cases, the metal pieces are separated by being broken or partially broken, and the discrete metal pieces come into contact with the connection electrodes to impair the insulation between the adjacent electrodes. For this reason, it is necessary to strictly control the connection conditions, and the inspection process after the connection is indispensable in consideration of variation in conditions.
[0004]
In addition, when mixing hard spacer particles, it is necessary to uniformly disperse these mixed particles, but it is difficult to uniformly disperse in a minute portion due to a difference in specific gravity and a difference in surface charge. In particular, this type of adhesive has recently been applied to the connection of fine electrodes and circuits, such as the connection of integrated circuits such as IC and LSI, and display elements such as liquid crystal, EL, and plasma with electronic circuits. Therefore, there is a strong demand for stable connection reliability over a wide range of connection conditions and for eliminating the need for post-connection inspection processes in mass production. It has become.
[0005]
[Means for Solving the Problems]
In the present invention, a soft layer 2 made of a crosslinked polymer having a thickness of ½ or less of the particle size of nickel nuclei is formed on the surface of nickel nuclei 1, and a conductive layer 3 containing nickel is placed on the outside of the adhesive layer. Is a connecting member containing 0.1 to 15% by volume .
[0006]
The present invention will be described below with reference to the drawings.
FIG. 1A is a schematic sectional view showing an embodiment of the present invention.
The material of the nickel core 1 is nickel and its alloy. A soft layer is formed on the surface of the nickel core. Here, the meaning of the soft layer means the relative hardness relationship between the nickel core and the soft layer 2 under the connection conditions in the use environment of the conductive particles, for example, in the case of connecting electrodes and circuits. To do. A general hardness index such as elastic modulus and hardness at a constant temperature, or a difference in thermal transformation point such as melting point, glass transition temperature, and softening point can be used as a guide.
[0007]
The average particle diameter of the nickel core 1 is 0.1 to 20 μm, preferably 0.3 to 10 μm, more preferably 0.5 to 6 μm. From the viewpoint of improving the properties. The particle diameter of the nickel core 1 is preferably uniform. The particle shape of the nickel core 1 is preferably substantially spherical, but may be any shape such as a large number of irregularities on the surface as shown in FIG.
[0008]
The soft layer 2 is preferably a polymer such as polystyrene, nylon, or various rubbers, and since these are cross-linked products, the solvent resistance is improved, so when the adhesive component contains a solvent, there is no elution, It is more preferable because it has little influence on characteristics.
Moreover, when the soft layer 2 is made of a polymer, it is easy to obtain deformability, and adhesion to the conductive layer and the nucleus is good. Therefore, when a connection member is used, a connection with low resistance and excellent reliability can be obtained. Moreover, a combination can be appropriately set according to the heat resistance and hardness of the connection electrode and the substrate.
[0009]
The thickness of the soft layer 2 is preferably about 0.1 to 10 μm. If the thickness is less than 0.1 μm, a sufficient amount of deformation cannot be obtained and the reliability is insufficient. If the thickness exceeds 10 μm, the amount of deformation becomes excessive and the coating of the thin metal layer is easily peeled off. For these reasons, 0.3 to 5 μm is preferable and 0.5 to 3 μm is more preferable.
[0010]
Further, if the thickness of the soft layer 2 is not more than the particle diameter of the nickel core 1, more preferably not more than ½, the deformation amount of the conductive particles can be easily controlled, which is preferable as a circuit connection material. The soft layer 2 may be present in the form of particles as shown in FIG. 1 (c), and may be configured as a single layer or multiple layers. In the case of a structure of multiple layers or more, functions such as strength retention, solvent resistance, adhesion, flexibility, heat resistance, and plating solution resistance can be shared, which is preferable. The soft layer 2 can be formed by an arbitrary method such as a spray method, a high-speed stirring method, or a spray dryer.
[0011]
The conductive layer 3 is made of various conductive metals, alloys, oxides, and the like. Materials that are preferably used in consideration of conductivity and corrosion resistance are Ni, Cu, Al, Sn, Zn, Au, Pd, Ag, Co, Pb, etc., which are single layer or multiple layers or more. It can also be configured.
[0012]
The conductive layer 3 may be formed by a general method such as a vapor deposition method, a sputtering method, an ion plating method, a thermal spraying method, or a plating method, but the electroless plating method should provide a coating layer having a uniform thickness. To preferred.
[0013]
As shown in FIG. 1D, a resin layer 4 that can be melted under connection conditions may be formed on the surface of the conductive layer 3 as necessary. In this case, when it is used for connection of the fine electrode described above, the resin layer melts and can be connected at the contact surface with the electrode under heating and pressure, but the resin layer is not sufficiently heated in the adjacent electrode direction. Since it is difficult to melt, there is little decrease in insulation, and higher-density mounting becomes possible.
[0014]
An auxiliary layer such as a coupling agent for improving adhesion can be formed between the above-described layers as necessary.
[0015]
In order to use the conductive particles of the present invention for connecting fine electrodes, it is possible to make the particle size smaller than the minimum width of the distance between adjacent wiring patterns to prevent a short circuit between adjacent wiring patterns and to reduce the thickness of the wiring. It is necessary to cope with.
[0016]
The adhesive component in this case may be a thermoplastic material, but is preferably applied because a curable material using energy such as heat, light, and electron beam is excellent in heat resistance and moisture resistance. The form may be any of liquid, paste, film, etc., and can be used by taking advantage of each feature. For example, when it is in the form of a film, it is easy to obtain a certain thickness, and an application operation is not necessary. In the case of a liquid or paste, it can be formed only in a necessary portion of a small area.
[0017]
The ratio of the electroconductive particle which occupies in a connection member can be arbitrarily set by a use. In the case of a connecting member for a fine electrode that requires electrical conductivity only in the thickness direction, it is 0.1 to 15% by volume, preferably 0.2 to 10% by volume, more preferably 0.5 to 6% by volume. When the blending amount is small, the number of conductive particles on the electrode to be connected is reduced, so that the reliability is lowered. When the blending amount is excessive, the insulating property of the adjacent electrode is lowered and the connection of the fine electrode becomes difficult.
[0018]
In the case of a coating material that requires conductivity also in the surface direction, 10 to 35% by volume is used.
[0019]
The electrode connection structure of the connection member using the electroconductive particle which becomes this invention is shown in FIG.
Between the electrodes 13 and 13 provided on the substrates 12 and 12, the conductive particles 11 are connected by the connection member 14 while being controlled by the particle diameter of the nucleus by heat and pressure at the time of connection. At this time, since the soft layer 2 on the nickel core 1 has deformability, the conductive layer 3 does not peel off. In the lateral direction of the electrode, insulation can be maintained by controlling the amount of conductive particles added and the particle size.
[0020]
In the conductive particles according to the present invention, the conductive layer 3 is formed on the soft layer 2, and the soft layer 2 follows deformation at the time of connection. And since the maximum deformation amount is controlled by the particle size of the core 1, excessive deformation does not occur. For this reason, the conductive layer 3 does not peel off during the connection work.
[0021]
Since the core 1 is harder than the soft layer at the time of heating and pressing at the time of electrode connection, there is little or no deformation. Therefore, since the distance between the electrodes after the connection by heating and pressing can be controlled to the particle size of the hard core, a stable connection can be obtained even if there is little consideration of the connection conditions. As is well known, the control of the distance between the electrodes greatly affects the improvement of connection reliability.
[0022]
【Example】
Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited thereto.
Example 1
An average particle of polystyrene / divinylbenzene = 100 / 0.5 (glass transition point 115 ° C.) as a coating layer on the surface of conductive Ni particles (melting point 1455 ° C.) obtained by a carbonyl method having an average particle size of 3 μm as a nucleus Particles having a diameter of 1 μm were coated with a spray dryer using alcohol as a dispersant, heated to 125 ° C. and fixed.
[0023]
The particles were dispersed in water, and after palladium chloride activation treatment, Ni plating was performed at 90 ° C. using an electroless Ni plating solution, and substitution plating was then performed at 70 ° C. using an Au plating solution. At this time, the thickness of Ni / Au was 0.2 / 0.02 μm. Thus, the electroconductive particle of the structure of FIG.1 (b) was obtained.
[0024]
2% by volume of the conductive particles were added to an adhesive component having a high molecular weight epoxy as a main component, and applied on a polytetrafluoroethylene film having a thickness of 50 μm to a thickness of 20 μm to obtain a connecting member. The sodium ion and the chlorine ion of the extracted water after extracting the obtained connection member for 10 hours with 100 degreeC pure water were 10 ppm or less, respectively.
[0025]
A Cu circuit electrode having a thin solder layer of Sn / Pb = 10/90 on a circuit having a thickness of 18 μm on a polyimide substrate having a thickness of 15 μm was formed on a polyimide substrate having a thickness of 15 μm and a glass having a thickness of 1.1 mm. The connecting member was placed with a width of 1.5 mm between a thin layer electrode of indium oxide (ITO, surface resistance 20Ω / □), and both electrodes were aligned and then connected.
[0026]
In addition, it is an electrode of a parallel circuit with a circuit pitch of 100 μm and an electrode width of 50 μm, and one test piece has 300 electrode connection portions. The temperature of the connection part was widely varied as 150 ° C., 170 ° C., 190 ° C., and the pressure was widely changed to 0.5 MPa, 2 MPa, and 10 MPa. Thus, under a wide range of connection conditions, the distance between the electrodes was controlled to 3 μm, which is the average particle diameter of the nuclei, and good connection reliability was exhibited. By using nickel nuclei as metal particles having a high melting point, even if the surface of the electrode is an oxide material such as solder, a good connection was obtained in the form of biting into the oxide layer.
[0027]
Comparative Example 1
Using conductive particles in which a Ni / Au layer (thickness: 0.2 / 0.02 μm) was directly formed on the surface of a cured epoxy particle having an average particle diameter of 5 μm, a connecting member was obtained in the same manner as in Example 1 below. Evaluation was made in the same manner (however, a Cu circuit electrode having a Sn thin layer was formed on a circuit formed on a polyimide substrate having a thickness of 75 μm.)
Due to variations in connection conditions, the distance between the electrodes varies from 4 to 15 μm and the variation range of the connection resistance is large. For practical use, it is necessary to strictly control the connection conditions within a very narrow temperature and pressure range.
[0028]
【The invention's effect】
As described above in detail, according to the present invention, stable connection reliability can be obtained under a wide range of connection conditions, and conductive particles and connection members that are easier to use can be obtained.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of conductive particles according to an embodiment of the present invention.
FIG. 2 is a sectional view of an electrode connection structure according to an embodiment of the present invention.
[Explanation of symbols]
1 Nickel Core 2 Soft Layer 3 Conductive Layer 4 Resin Layer 11 Conductive Particles 12 Substrate 13 Electrode 14 Connecting Member

Claims (1)

1/2 or less of the soft layer comprising a crosslinked product of a polymer thickness formed, the adhesive component of the conductive particles obtained by forming a conductive layer comprising nickel on the outside of the particle size of nickel nuclei on the surface of the nickel nuclei A connecting member containing 0.1 to 15% by volume.

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