JP3927629B2 - 基板処理工程モニター装置、及びこれを用いたデバイス製造方法 - Google Patents

基板処理工程モニター装置、及びこれを用いたデバイス製造方法 Download PDF

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Publication number
JP3927629B2
JP3927629B2 JP26438396A JP26438396A JP3927629B2 JP 3927629 B2 JP3927629 B2 JP 3927629B2 JP 26438396 A JP26438396 A JP 26438396A JP 26438396 A JP26438396 A JP 26438396A JP 3927629 B2 JP3927629 B2 JP 3927629B2
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Japan
Prior art keywords
pattern
substrate processing
processing process
substrate
wafer
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Expired - Fee Related
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JP26438396A
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English (en)
Japanese (ja)
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JPH10112425A (ja
JPH10112425A5 (https=
Inventor
誠二 竹内
広 前原
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Canon Inc
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Canon Inc
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Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP26438396A priority Critical patent/JP3927629B2/ja
Priority to US08/886,887 priority patent/US6594012B2/en
Priority to TW086109399A priority patent/TW368682B/zh
Priority to EP97304889A priority patent/EP0816926A3/en
Priority to KR1019970031226A priority patent/KR100277110B1/ko
Publication of JPH10112425A publication Critical patent/JPH10112425A/ja
Publication of JPH10112425A5 publication Critical patent/JPH10112425A5/ja
Application granted granted Critical
Publication of JP3927629B2 publication Critical patent/JP3927629B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP26438396A 1996-07-05 1996-10-04 基板処理工程モニター装置、及びこれを用いたデバイス製造方法 Expired - Fee Related JP3927629B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP26438396A JP3927629B2 (ja) 1996-10-04 1996-10-04 基板処理工程モニター装置、及びこれを用いたデバイス製造方法
US08/886,887 US6594012B2 (en) 1996-07-05 1997-07-02 Exposure apparatus
TW086109399A TW368682B (en) 1996-07-05 1997-07-03 Exposure apparatus
EP97304889A EP0816926A3 (en) 1996-07-05 1997-07-04 Exposure apparatus
KR1019970031226A KR100277110B1 (ko) 1996-07-05 1997-07-05 노광장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26438396A JP3927629B2 (ja) 1996-10-04 1996-10-04 基板処理工程モニター装置、及びこれを用いたデバイス製造方法

Publications (3)

Publication Number Publication Date
JPH10112425A JPH10112425A (ja) 1998-04-28
JPH10112425A5 JPH10112425A5 (https=) 2007-03-01
JP3927629B2 true JP3927629B2 (ja) 2007-06-13

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Application Number Title Priority Date Filing Date
JP26438396A Expired - Fee Related JP3927629B2 (ja) 1996-07-05 1996-10-04 基板処理工程モニター装置、及びこれを用いたデバイス製造方法

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JP (1) JP3927629B2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001210580A (ja) 2000-01-28 2001-08-03 Mitsubishi Electric Corp 半導体装置およびその製造方法ならびに半導体製造システム
JP4802481B2 (ja) 2004-11-09 2011-10-26 株式会社ニコン 表面検査装置および表面検査方法および露光システム
US7763404B2 (en) * 2006-09-26 2010-07-27 Tokyo Electron Limited Methods and apparatus for changing the optical properties of resists
JP5375020B2 (ja) * 2008-10-14 2013-12-25 株式会社ニコン 接合評価方法、接合評価装置、基板貼り合わせ装置、接合評価ゲージおよび積層型半導体装置

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Publication number Publication date
JPH10112425A (ja) 1998-04-28

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