JP3916366B2 - チップ熱圧着ツール及びそれを備えたチップ実装装置 - Google Patents

チップ熱圧着ツール及びそれを備えたチップ実装装置 Download PDF

Info

Publication number
JP3916366B2
JP3916366B2 JP2000074710A JP2000074710A JP3916366B2 JP 3916366 B2 JP3916366 B2 JP 3916366B2 JP 2000074710 A JP2000074710 A JP 2000074710A JP 2000074710 A JP2000074710 A JP 2000074710A JP 3916366 B2 JP3916366 B2 JP 3916366B2
Authority
JP
Japan
Prior art keywords
ceramic
indenter
chip
holder
thermocompression bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000074710A
Other languages
English (en)
Japanese (ja)
Other versions
JP2000332061A (ja
JP2000332061A5 (enExample
Inventor
朗 山内
義之 新井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Engineering Co Ltd
Original Assignee
Toray Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Engineering Co Ltd filed Critical Toray Engineering Co Ltd
Priority to JP2000074710A priority Critical patent/JP3916366B2/ja
Publication of JP2000332061A publication Critical patent/JP2000332061A/ja
Publication of JP2000332061A5 publication Critical patent/JP2000332061A5/ja
Application granted granted Critical
Publication of JP3916366B2 publication Critical patent/JP3916366B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP2000074710A 1999-03-16 2000-03-16 チップ熱圧着ツール及びそれを備えたチップ実装装置 Expired - Fee Related JP3916366B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000074710A JP3916366B2 (ja) 1999-03-16 2000-03-16 チップ熱圧着ツール及びそれを備えたチップ実装装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP11-70229 1999-03-16
JP7022999 1999-03-16
JP2000074710A JP3916366B2 (ja) 1999-03-16 2000-03-16 チップ熱圧着ツール及びそれを備えたチップ実装装置

Publications (3)

Publication Number Publication Date
JP2000332061A JP2000332061A (ja) 2000-11-30
JP2000332061A5 JP2000332061A5 (enExample) 2005-07-07
JP3916366B2 true JP3916366B2 (ja) 2007-05-16

Family

ID=26411400

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000074710A Expired - Fee Related JP3916366B2 (ja) 1999-03-16 2000-03-16 チップ熱圧着ツール及びそれを備えたチップ実装装置

Country Status (1)

Country Link
JP (1) JP3916366B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002041385A1 (en) * 1999-03-16 2002-05-23 Toray Engineering Co., Ltd. Tool for thermo-compression-bonding chips, and chip packaging device having the same
US6821381B1 (en) 1999-03-16 2004-11-23 Toray Engineering Co., Ltd. Tool for thermo-compression-bonding chips, and chip packaging device having the same
AT414079B (de) * 2002-12-20 2006-08-15 Datacon Semiconductor Equip Einrichtung zum positionieren
AT412603B (de) * 2003-03-12 2005-04-25 Datacon Semiconductor Equip Einrichtung zum verbinden von elektronischen schaltungen
KR100993079B1 (ko) 2005-10-12 2010-11-08 가부시키가이샤 무라타 세이사쿠쇼 접합장치
JP6106320B2 (ja) * 2016-06-24 2017-03-29 東レエンジニアリング株式会社 実装装置
CN115394689B (zh) * 2022-09-05 2023-09-01 江苏富乐华功率半导体研究院有限公司 一种功率半导体器件热压烧结装置

Also Published As

Publication number Publication date
JP2000332061A (ja) 2000-11-30

Similar Documents

Publication Publication Date Title
CN101288152B (zh) 接合装置
JP4749072B2 (ja) ウェハ保持体
US20060021705A1 (en) Substrate mounting apparatus and control method of substrate temperature
TWI681478B (zh) 安裝裝置及安裝方法
CN111344855B (zh) 卡盘板、具有所述卡盘板的卡盘结构物及具有卡盘结构物的焊接装置
US6821381B1 (en) Tool for thermo-compression-bonding chips, and chip packaging device having the same
JP7164959B2 (ja) 保持装置、および、保持装置の製造方法
JP2000332061A (ja) チップ熱圧着ツール及びそれを備えたチップ実装装置
CN111212489A (zh) 加热器组件
JP7352317B2 (ja) ボンディング装置及びボンディングヘッド調整方法
CN109935538A (zh) 部件接合装置、部件接合方法及安装结构体
JP5552826B2 (ja) 基板貼り合せ装置、積層半導体装置製造方法及び積層半導体装置
KR101764055B1 (ko) 전자 부품 본딩 헤드
CN110648943B (zh) 用于对准接合工具的模块和具有该模块的裸芯接合装置
JP3872568B2 (ja) チップ熱圧着ツール
JP3898630B2 (ja) 押圧加熱装置
WO2002041385A1 (en) Tool for thermo-compression-bonding chips, and chip packaging device having the same
KR102658985B1 (ko) 본딩 헤드 및 이를 포함하는 다이 본딩 장치
JP7778349B2 (ja) 電子部品接合装置
JP7516147B2 (ja) 保持装置
JP7296174B2 (ja) 基板保持具、並びに、ボンディングシステム及びボンディング方法
JP7561164B2 (ja) 保持装置
KR101614252B1 (ko) 기판 예열 유닛 및 이를 포함하는 다이 본딩 장치
KR20260064321A (ko) 본딩 장치
KR101578605B1 (ko) 기판 예열 유닛 및 이를 포함하는 다이 본딩 장치

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040402

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20041028

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20041028

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20041122

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20041208

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20041214

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050209

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20050303

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20050404

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050428

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20050512

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20050603

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20061208

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20061226

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20070206

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100216

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110216

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120216

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120216

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130216

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140216

Year of fee payment: 7

LAPS Cancellation because of no payment of annual fees