JP3916019B2 - Film deposition apparatus and method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a film forming apparatus and a method thereof, and more particularly, to a film forming apparatus and a method thereof used for manufacturing an electronic component.
[0002]
[Prior art]
In the manufacture of electronic components, a technique is known in which a metal film or the like is formed on a base material such as alumina using a vapor deposition apparatus or a sputtering apparatus (hereinafter may be referred to as “film deposition”). When a metal film is formed on one or both sides of a substrate that is a plate-like base material, the substrate may be broken to a predetermined size after the metal film is formed.
[0003]
Depending on the electronic component having a cylindrical shape or a rectangular shape, there are cases where it is desired to form a metal film on all the surfaces of a base material, for example, a rectangular parallelepiped component such as a rectangular chip component. In this case, the base material is divided into a predetermined size in advance, and then a metal film is formed on the entire surface of the base material (hereinafter referred to as “coated film body” or “substrate”) divided by a vapor deposition apparatus or a sputtering apparatus. However, it is not possible to form a uniform metal film on the entire surface only by disposing the adherend in the vapor deposition apparatus or the sputtering apparatus.
[0004]
In view of this, as shown in FIG. 1, the adherend film body 3 is housed in a cylindrical container 2 having a mesh disposed in an inclined state in the vacuum chamber 1, and the container 2 is rotated by a rotating shaft 5. By rotating the container 2, the adherend film body 3 accommodated therein is stirred. According to this method, it is expected that a uniform metal film is formed on the entire surface of the adherend film 3. Note that reference numeral 4 in FIG. 1 indicates a crucible for melting and depositing a metal material.
[0005]
[Problems to be solved by the invention]
The film deposition apparatus as shown in FIG. 1 has the following drawbacks.
(1) Since the film is deposited on the adherend body 3 through the mesh of the container 2, the deposition rate indicating the growth rate of the metal film is low, and the film deposition rate fluctuates due to clogging of the mesh, so that the film Reproducibility of thickness is poor.
(2) In order to control the thickness of the metal film or to form an alloy film or the like, sputtering may be performed instead of vapor deposition, but when a target is disposed instead of the crucible 4 shown in FIG. Abnormal discharge is likely to occur due to so-called dust falling from the rotating mesh 2 and a metal film having a thickness as expected cannot be obtained.
(3) The shape of the vacuum chamber 1 shown in FIG. 1 has a lot of wasted space, takes time to exhaust, and cannot increase productivity.
[0006]
The present invention is intended to solve the above-described problems, and an object of the present invention is to provide a film forming apparatus and method for obtaining a stable film forming rate.
[0007]
Another object of the present invention is to provide a film forming apparatus and a method for preventing the abnormal discharge in the case of sputtering and easily controlling the film thickness.
[0008]
It is another object of the present invention to provide a film forming apparatus and method for reducing the size of the vacuum chamber.
[0009]
[Means for Solving the Problems]
The present invention has the following configuration as one means for achieving the above object.
[0010]
The film deposition apparatus according to the present invention is a film deposition apparatus for forming a film on the entire surface of a substrate, and is disposed below the inside of the vacuum chamber and the supply source of the film material disposed above the inside of the vacuum chamber . And a reed having a mesh of a predetermined size which is a mounting means for the substrate, and a rotating shaft for giving a predetermined rotational motion to the mounting means , and the vacuum chamber is disposed at a predetermined angle. It is characterized by being.
[0011]
Preferably, the placing means has an opening at a position facing the supply source of the film material.
[0012]
Preferably, the mesh of the colander, the substrate is not passing through, and wherein to Rukoto to a size suitable for stirring Hook the corners of the substrate.
[0013]
In the film deposition method according to the present invention, a substrate is placed on a placement portion disposed below a vacuum chamber that is inclined at a predetermined angle, and a rotating shaft connected to the placement portion is provided. A film deposition method for forming a film on the entire surface of the substrate by applying a predetermined rotational motion to the mounting unit and using a film material supply source disposed above the vacuum chamber. The placing portion is a ridge having a mesh of a predetermined size .
[0014]
Preferably, the placement unit is provided with a motion that rotates and stops or repeats rotating and reversing.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a film deposition apparatus according to an embodiment of the present invention will be described in detail with reference to the drawings.
[0016]
[Construction]
FIG. 2 is a cross-sectional view schematically showing a vacuum chamber in the film deposition apparatus according to one embodiment of the present invention.
[0017]
In FIG. 2, the vacuum chamber 11 is disposed at a predetermined angle with respect to the vertical line. Above the vacuum chamber 11, a sputtering target 14 inclined substantially the same as the vacuum chamber 11 is disposed, and below the pan-like container 12 for placing the adherend film body 13 is disposed. . A rotating shaft 15 drawn out from the container 12 extends outside the vacuum chamber 11, and the tip of the rotating shaft is connected to a motor (not shown). Therefore, by controlling the rotation of the motor, it is possible to give the container 12 a desired rotation operation.
[0018]
The surface of the target 14 and the bottom surface of the container 12 are arranged so as to be substantially parallel. Although not shown in the figure, in order to minimize the volume, the vacuum chamber 11 is preferably formed in a cylindrical shape, and the rotation shaft 15 is preferably disposed at the center of the bottom surface of the vacuum chamber 11.
[0019]
[Process]
In the film forming apparatus having such a configuration, for example, a procedure for forming a metal film or the like on the film body 13 to be formed into a rectangular chip part will be briefly described with reference to FIG.
[0020]
First, the adherend film body 13 is charged into the container 12 (P1: charging process). Thereafter, the inside of the vacuum chamber 11 is exhausted (P2: exhaust process). In this heating and exhausting process, the container 12 does not have to be rotated, but in order to promote degassing from the adherend film 13, it is preferable to rotate the container 12 also in the exhausting process. Note that the number of the adherend bodies 13 put into the container 12 at a time is about several tens to several thousand.
[0021]
When the inside of the vacuum chamber 11 reaches a predetermined degree of vacuum, an inert gas such as argon is introduced to a predetermined pressure as required (P2: gas introduction process), and sputtering is started by supplying power to the target 14 (P3: film deposition process). The sputtering method may be either DC sputtering or RF sputtering. In the film deposition process, the rotation of the motor 12 is controlled to give the container 12 a rotational motion, which will be described later, and the film body 13 is stirred so that the metal film or the like is uniformly deposited.
[0022]
After the time determined by the required film thickness and film deposition rate has elapsed since the start of the film deposition process, the sputtering and the rotational movement of the container 12 are stopped, the vacuum chamber 11 is returned to normal pressure, a metal film, etc. The film-deposited body 13 on which is deposited is removed from the container 12 (P4: extraction step). Note that the film body 13 to which a metal film or the like is deposited is sent to the next process and subjected to a predetermined processing to form, for example, a square chip part.
[0023]
[Details of container 12]
Next, the structure of the container 12 will be described in detail.
[0024]
The container 12 is usually manufactured using stainless steel as a material. However, there are cases in which a desired agitation cannot be applied to the loaded adherend 13 with a structure in which the stainless steel is simply shaved. That is, sufficient friction between the inner side surface and inner bottom surface of the container 12 and the adherend film body 13 cannot be obtained, and the adherend film body 13 slides on the inner side surface and inner bottom surface of the container 12 even when the container 12 is rotated. It is because it may not be stirred only. When sputtering is performed in this state, not only the adherent film bodies 13 are adhered to each other by the metal to be adhered, but also the adherent film body 13 may adhere to the container 12.
[0025]
In order to prevent the above problem, the present embodiment employs the container 12 having the structure shown in FIG. FIG. 4 is a side view in which a part of the container 12 is broken. Inside the container 12, a bowl 16 (or a bowl-shaped net bowl) made of, for example, stainless steel is attached. The deposited film body 13 is put into the substrate. The mesh of 笊 16 is determined according to the size of the adherend film 13, but the appropriate size is sufficient for the adherent film body 13 not to pass through the mesh and to catch the corner of the adherend film body 13 for stirring. To. If the mesh is too small, not only is it difficult to catch the corners of the film to be deposited 13, but metal may be deposited on the mesh by sputtering and the mesh may be blocked.
[0026]
The heel 16 may be attached to the container 12 by welding, but in order to improve the efficiency of the charging process and the unloading process, for example, a plurality of hooks 17 are attached to the edge of the heel 16 and the hook 17 is attached to the container 12 by this hook 17. Link. In order to follow the rotation of the container 12, the hook 16 is inserted and locked to the holder 18 provided on the edge of the container 12, for example, as shown in FIG.
[0027]
By using the scissors 16, by preparing a plurality of types of scissors with large and small meshes, it is possible to adapt to the deposition film bodies 13 of various sizes. There is an advantage that you can work in 笊 16. However, sufficient agitation can be obtained without necessarily using the scissors 16. For example, protrusions such as a lowering metal may be formed on the inner side surface and the inner bottom surface of the container 12, and the adherend film body 13 may be hooked by the protrusions. A hole may be provided. In any case, any work that can provide sufficient agitation to the adherend film 13 does not violate the gist of the present invention.
[0028]
Furthermore, when using the bowl 16, the container 12 does not necessarily have a pan shape. For example, the heel 16 may be supported on a support 19 as shown in FIG.
[0029]
[Rotational motion given to container 12]
As described above, in the film-forming process, the container 12 is subjected to a rotational motion for the purpose of preventing adhesion between the film-coated bodies 13 and adhesion between the heel 16 and the film-coated film 13 and forming a uniform metal film. give. This is because when the container 12 having a predetermined inclination is rotated, the adherend film body 13 carried to the position higher side in the cage 16 falls to the position lower side in the cage 16. Is expected to be stirred at. However, when the heel 16 is used, the adherend film 13 caught on the mesh may not easily fall.
[0030]
Therefore, instead of simply rotating the container 12 in one direction at a constant speed, for example, if the container 12 is rotated 90 degrees clockwise, it is temporarily stopped or rotated 45 degrees counterclockwise. By giving the reversal motion, the detached film body 13 caught by the mesh is easily detached, and the stirring is promoted. In particular, when a reverse movement is applied, the inversion of the adherend film body 13 is promoted, and there is an effect that a uniform metal film or the like adheres to the entire surface of the adherend film body 13. Note that the rotation angle and the reverse rotation angle are appropriately set according to the size of the container 12, the size of the adherend film body 13, the number of charged films, and the like.
[0031]
As described above, in the present embodiment, since the adherend film body 13 is dropped to the position lower side of the ridge 16, the metal to the adherend film body 13 is disposed on the position lower side of the ridge 16. A film or the like is deposited. Therefore, as shown in an example in FIG. 7, it is sufficient that the size of the target 14 is at least half that of the vacuum chamber 11. If the target 14 is reduced in size, the purchase cost of the target can be reduced, and the target is not consumed wastefully, so that the utilization efficiency thereof can be improved.
[0032]
Further, the flange 16 can be formed in a shape as shown in FIG. That is, a stainless steel cylinder 20 is welded with a stainless steel mesh, and the outer diameter of the cylinder 20 or the inner diameter of the pot-shaped portion of the container 20 is adjusted, and when the cage 16 is placed on the container 12, 16 is locked to the container 12.
[0033]
As described above, according to the present embodiment, it is possible to improve the drawbacks of the film deposition apparatus as shown in FIG. 1 as described below.
(1) Since the film is not deposited on the adherend body 13 through the net, the film deposition rate is stabilized.
(2) Since the target 14 is disposed above the container 12 and the basket 16, no dust falls from the rotated container 12 and the basket 16 toward the target 14. Therefore, abnormal discharge due to dust falling from the container 12 and the basket 16 toward the target 14 does not occur, and the control of the thickness of the metal film deposited on the deposited film body 13 is facilitated.
(3) The shape of the vacuum chamber 11 shown in FIG. 2 makes it easy to cut down a useless space, shortens the exhaust time, and improves productivity.
[0034]
Furthermore, according to the present embodiment, by repeatedly rotating and reversing the container 12 and the basket 16, the adherend film body 13 can be sufficiently agitated to achieve uniform film formation.
[0035]
【The invention's effect】
As described above, according to the present invention, it is possible to provide a film forming apparatus and a method for obtaining a stable film forming rate.
[0036]
In addition, it is possible to provide a film forming apparatus and method that can easily control the film thickness while preventing abnormal discharge when sputtering is performed.
[Brief description of the drawings]
FIG. 1 is a diagram showing an outline of a vacuum chamber of a deposition apparatus;
FIG. 2 is a cross-sectional view schematically showing a vacuum chamber in the film deposition apparatus according to the embodiment of the present invention;
FIG. 3 is a diagram showing an example of a procedure for forming a metal film or the like on a substrate by the apparatus shown in FIG.
4 is a side view in which a part of the container shown in FIG. 2 is broken,
FIG. 5 is a view for explaining an example of connection between the container and the basket shown in FIG.
FIG. 6 is a view showing an example of a bag support that can be used instead of a container;
FIG. 7 is a diagram for explaining downsizing of a target;
FIG. 8 is a view showing a second example of a basket for inserting a base.
[Explanation of symbols]
11 Vacuum chamber
12 containers
13 Substrate (substrate)
14 Target
15 Rotation axis
16 笊

Claims (8)

A film forming apparatus for forming a film on the entire surface of a substrate,
A source of membrane material disposed above in the vacuum chamber;
Wherein disposed beneath the vacuum chamber, a colander having a predetermined size of the mesh is a mounting means of said substrate,
A rotating shaft for giving a predetermined rotational motion to the placing means,
2. The film deposition apparatus according to claim 1, wherein the vacuum chamber is disposed at a predetermined angle.   2. The film deposition apparatus according to claim 1, wherein the placement unit has an opening at a position facing the supply source of the film material. Mesh of the colander, the substrate is not passing through, film deposition apparatus according to claim 1 or claim 2, a to Rukoto characterized in sizes suitable for stirring Hook the corners of the substrate.   4. The film forming apparatus according to claim 1, wherein the placing unit is detachable from the vacuum chamber in a state where the base is placed.   5. The film deposition apparatus according to claim 1, wherein the film material supply source is a sputtering target, and the film is formed on the entire surface of the substrate by sputtering. A base is placed on a placement portion disposed below a vacuum chamber that is inclined at a predetermined angle, and a predetermined shaft is placed on the placement portion via a rotating shaft connected to the placement portion. A film forming method for forming a film on the entire surface of the substrate by using a supply source of a film material disposed on the upper side of the vacuum chamber by applying a rotational motion ,
The film forming method, wherein the placing portion is a ridge having a mesh of a predetermined size .   7. The film forming method according to claim 6, wherein the placement unit is provided with a motion that repeatedly rotates and stops, or rotates and reverses.   8. The film forming method according to claim 6, wherein the substrate is put in and out of the vacuum chamber in a state of being placed on the placing portion.

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