JP3915765B2 - Joining method - Google Patents

Joining method Download PDF

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JP3915765B2
JP3915765B2 JP2003345410A JP2003345410A JP3915765B2 JP 3915765 B2 JP3915765 B2 JP 3915765B2 JP 2003345410 A JP2003345410 A JP 2003345410A JP 2003345410 A JP2003345410 A JP 2003345410A JP 3915765 B2 JP3915765 B2 JP 3915765B2
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substrate
lead
electrode
solder
flexible substrate
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JP2005116596A (en
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忠彦 境
誠一 吉永
秀喜 永福
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

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  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)

Description

本発明は、基板の端部に設けられた細長形状の電極に柔軟性基板の端部に設けられた細長形状のリードを接合する接合方法に関するものである。   The present invention relates to a bonding method for bonding an elongated lead provided at an end of a flexible substrate to an elongated electrode provided at an end of a substrate.

携帯電話などの小型の電子機器には、ＣＣＤカメラなど個々の機能モジュールを主基板に接続するための部品としてフレキシブル基板が多用されるようになっている。このフレキシブル基板を接続する方法として、従来より樹脂接着剤中に導電粒子を配合した異方性導電樹脂を用いる方法が用いられている。この方法は、フレキシブル基板を主基板に樹脂接着剤により接着して固定するとともに、フレキシブル基板に設けられた接続用端子を導電粒子を介してマザーボードの電極に導通させるものである（例えば特許文献１参照）。
特開平９−９２６８３号公報 In a small electronic device such as a mobile phone, a flexible substrate is frequently used as a component for connecting individual functional modules such as a CCD camera to a main substrate. As a method for connecting the flexible substrate, a method using an anisotropic conductive resin in which conductive particles are blended in a resin adhesive has been conventionally used. In this method, a flexible substrate is bonded and fixed to a main substrate with a resin adhesive, and a connection terminal provided on the flexible substrate is electrically connected to an electrode of a mother board through conductive particles (for example, Patent Document 1). reference).
JP-A-9-92683

しかしながら、上述の異方性導電樹脂を用いた接合方法には、使用する材料のコストおよび製造過程における品質管理負荷に起因して製造コストが高いという難点がある。すなわち異方性導電樹脂は配合される導電粒子の粒径や配合比などの組成を厳密に管理する必要があることから材料コストが高く、更に導電粒子によって電気的導通を確保するためには、接合過程においてフレキシブル基板のリードと主基板の電極との平行度を高精度に保つ必要があることから、設備費用の高い高精度圧着装置の使用を余儀なくされていた。   However, the bonding method using the anisotropic conductive resin described above has a drawback that the manufacturing cost is high due to the cost of the material used and the quality control load in the manufacturing process. That is, the anisotropic conductive resin has a high material cost because it is necessary to strictly control the composition such as the particle size and blending ratio of the conductive particles to be blended, and in order to ensure electrical conduction by the conductive particles, In the joining process, it is necessary to keep the parallelism between the lead of the flexible substrate and the electrode of the main substrate with high accuracy, and thus a high-precision crimping device with high equipment cost has been used.

そこで本発明は、基板の電極に柔軟性基板の端部に設けられたリードを低コスト・高信頼性で接合することができる接合方法を提供することを目的とする。   Therefore, an object of the present invention is to provide a bonding method capable of bonding a lead provided at an end portion of a flexible substrate to an electrode of a substrate with low cost and high reliability.

本発明の接合方法は、基板の端部に設けられた細長形状の電極に柔軟性基板の端部に設けられた細長形状のリードを接合する接合方法であって、前記電極またはリードに半田を供給する工程と、前記基板または前記柔軟性基板上の前記電極とリードの接合部に対応する位置に結合用材料を供給する工程と、前記基板に柔軟性基板を搭載して前記電極に対して前記リードを当接させることにより前記結合用材料を流動させて前記接合部から前記基板と柔軟性基板との間の基板間隙間部を通じて流出させる工程と、前記電極に対してリードを押圧するとともに前記接合部を前記半田の融点未満の温度で加熱することにより電極とリードの当接面を前記半田が溶融することなく金属間接合する工程と、前記流出した結合用材料を熱硬化させて前記接合部を補強する樹脂補強部を形成する工程とを含む。 The joining method of the present invention is a joining method of joining an elongated lead provided at an end of a flexible substrate to an elongated electrode provided at an end of the substrate, and soldering the electrode or the lead. A step of supplying, a step of supplying a bonding material to a position corresponding to a joint between the electrode and the lead on the substrate or the flexible substrate, and mounting the flexible substrate on the substrate to the electrode. A step of causing the bonding material to flow by abutting the lead and flowing out of the bonding portion through an inter-substrate gap between the substrate and the flexible substrate; and pressing the lead against the electrode Heating the joint at a temperature lower than the melting point of the solder to bond the contact surfaces of the electrode and the lead between the metals without melting the solder; Contact And forming a resin reinforcing portion for reinforcing the parts.

本発明によれば、基板に柔軟性基板を搭載して電極に対してリードを当接させることにより結合用材料を流動させて基板と柔軟性基板との間の基板間隙間部を通じて接合部から流出させ、電極に対してリードを押圧するとともに接合部を加熱して電極とリードの当接面を金属間接合し、更に流出した結合用材料を熱硬化させて接合部を補強する樹脂補強部を形成することにより、基板の電極に柔軟性基板の端部に設けられたリードを低コスト・高信頼性で接合することができる。   According to the present invention, the flexible substrate is mounted on the substrate and the lead is brought into contact with the electrode to cause the bonding material to flow, and from the joint portion through the inter-substrate gap between the substrate and the flexible substrate. Resin reinforcement part that flows out, presses the lead against the electrode, heats the joint part to bond the contact surface between the electrode and the lead between metals, and further hardens the leaked bonding material to reinforce the joint part By forming the leads, the leads provided at the end portions of the flexible substrate can be bonded to the electrodes of the substrate with low cost and high reliability.

次に本発明の実施の形態を図面を参照して説明する。図１は本発明の一実施の形態の接合方法が適用される基板の構成図、図２は本発明の一実施の形態の接合方法が適用される
柔軟性基板の構成図、図３，図４は本発明の一実施の形態の接合方法の工程説明図、図５は本発明の一実施の形態の接合方法が適用される柔軟性基板の構成図である。 Next, embodiments of the present invention will be described with reference to the drawings. 1 is a configuration diagram of a substrate to which a bonding method according to an embodiment of the present invention is applied. FIG. 2 is a configuration diagram of a flexible substrate to which a bonding method according to an embodiment of the present invention is applied. 4 is a process explanatory diagram of a bonding method according to an embodiment of the present invention, and FIG. 5 is a configuration diagram of a flexible substrate to which the bonding method according to an embodiment of the present invention is applied.

まず図１を参照して、基板１について説明する。基板１は携帯電話などの小型電子機器のマザーボードであり、図１に示すように、基板１の上面の端部には、細長形状の電極２が複数並列して設けられている。電極２は銅などの導電性金属の表面に金層２ａをメッキにより形成した構成となっている。   First, the substrate 1 will be described with reference to FIG. The substrate 1 is a mother board of a small electronic device such as a mobile phone. As shown in FIG. 1, a plurality of elongated electrodes 2 are provided in parallel on the end portion of the upper surface of the substrate 1. The electrode 2 has a structure in which a gold layer 2a is formed by plating on the surface of a conductive metal such as copper.

次に、図２を参照してフレキシブル基板３について説明する。フレキシブル基板３は、カメラモジュールなどの機能モジュールを基板１に接続するために用いられる薄型で屈曲自在の柔軟性基板である。図２に示すように、フレキシブル基板３の一方側の面には、細長形状のリード４が基板１における電極２の配列ピッチに対応して設けられている。   Next, the flexible substrate 3 will be described with reference to FIG. The flexible substrate 3 is a thin and bendable flexible substrate used for connecting a functional module such as a camera module to the substrate 1. As shown in FIG. 2, elongated leads 4 are provided on one surface of the flexible substrate 3 corresponding to the arrangement pitch of the electrodes 2 on the substrate 1.

リード４はフレキシブル基板３の端部に設定された基板１との接続範囲を除いて、フレキシブル基板３に形成されたレジスト膜５によって覆われている。またリード４がフレキシブル基板３の端部において露呈した露呈部には、半田被膜部であるプリコート半田６が形成されており、リード４には予め接合用の半田が供給された形態となっている。なおプリコート半田６に用いられる半田材質としては、一般に錫など低融点の金属と他種金属との合金が用いられるが、合金ではなく単一種類の金属（例えば錫）を半田として用いてもよい。   The leads 4 are covered with a resist film 5 formed on the flexible substrate 3 except for the connection range with the substrate 1 set at the end of the flexible substrate 3. A precoat solder 6 that is a solder coating portion is formed on the exposed portion where the lead 4 is exposed at the end portion of the flexible substrate 3, and the lead 4 is supplied with solder for bonding in advance. . The solder material used for the precoat solder 6 is generally an alloy of a metal having a low melting point such as tin and another kind of metal, but a single kind of metal (for example, tin) may be used as the solder instead of the alloy. .

次に、基板１の電極２にフレキシブル基板３のリード４を接合する接合方法について、図３，図４を参照して説明する。なお本実施の形態では、前述のようにリード４にはプリコート半田６によって予め半田が供給されている。まず図３（ａ）に示すように、基板１の上面の電極２とリード４の接合部に対応する位置に、結合用材料である樹脂接着材８をディスペンサ７によって供給する。これにより、図４（ａ）に示すように、当該位置の電極２は樹脂接着材８によって覆われる。樹脂接着材８は、有機酸などの活性成分を含んでおり、半田などの金属表面に生成した酸化膜を除去する作用を有している。   Next, a bonding method for bonding the lead 4 of the flexible substrate 3 to the electrode 2 of the substrate 1 will be described with reference to FIGS. In the present embodiment, the lead 4 is pre-supplied with the precoat solder 6 as described above. First, as shown in FIG. 3A, a resin adhesive 8 as a bonding material is supplied by a dispenser 7 to a position corresponding to the joint between the electrode 2 and the lead 4 on the upper surface of the substrate 1. Thereby, as shown in FIG. 4A, the electrode 2 at the position is covered with the resin adhesive 8. The resin adhesive 8 includes an active component such as an organic acid, and has an action of removing an oxide film generated on a metal surface such as solder.

次に基板１にはフレキシブル基板３が搭載される。すなわち、図３（ｂ）、図４（ｂ）に示すように、フレキシブル基板３を搭載ツール９によって保持して基板１に対して下降させ、電極２に対してリード４を当接させる。この搭載過程において、電極２の接合部近傍に供給された樹脂接着材８はフレキシブル基板３によって押し広げられて流動し、基板１とフレキシブル基板３との間に形成される基板間隙間部１０、すなわち電極２、リード４が存在しない部分に形成されるトンネル状の隙間部分を通じて、電極２、リード４の配列方向に沿って接合部から流出する。流出した樹脂接着材８は、図４（ｃ）に示すように、フレキシブル基板３の左端のコーナ部と基板１の右端のコーナ部にてフィレット状に停溜する。   Next, the flexible substrate 3 is mounted on the substrate 1. That is, as shown in FIGS. 3B and 4B, the flexible substrate 3 is held by the mounting tool 9 and lowered with respect to the substrate 1, and the lead 4 is brought into contact with the electrode 2. In this mounting process, the resin adhesive 8 supplied in the vicinity of the joint portion of the electrode 2 is spread and flows by the flexible substrate 3, and the inter-substrate gap portion 10 formed between the substrate 1 and the flexible substrate 3, That is, it flows out from the joint portion along the arrangement direction of the electrode 2 and the lead 4 through a tunnel-shaped gap portion formed in a portion where the electrode 2 and the lead 4 do not exist. As shown in FIG. 4C, the resin adhesive 8 that has flowed out is retained in a fillet shape at the left corner portion of the flexible substrate 3 and the right corner portion of the substrate 1.

次いで図３（ｃ）に示すように、搭載ツール９によってリード４を電極２に対して押圧するとともに、この押圧過程において搭載ツール９に備えられた加熱機構によって電極２とリード４との接合部を加熱する。すなわちリード４に形成されたプリコート半田６は、加熱により軟化しながら電極２表面の金膜２ａに押しつけられる。そしてプリコート半田６の表面の酸化膜が押圧時の外力によって部分的に破壊されることによって金膜２ａとプリコート半田６とが金属間接合し、金膜２ａとプリコート半田６の接合界面には、固相拡散により金と半田の合金層が形成される。   Next, as shown in FIG. 3C, the lead 4 is pressed against the electrode 2 by the mounting tool 9, and the joining portion of the electrode 2 and the lead 4 is heated by a heating mechanism provided in the mounting tool 9 in this pressing process. Heat. That is, the precoat solder 6 formed on the lead 4 is pressed against the gold film 2a on the surface of the electrode 2 while being softened by heating. Then, the oxide film on the surface of the precoat solder 6 is partially broken by an external force at the time of pressing, whereby the gold film 2a and the precoat solder 6 are bonded to each other, and the bonding interface between the gold film 2a and the precoat solder 6 is An alloy layer of gold and solder is formed by solid phase diffusion.

この押圧・加熱においては、加熱温度は半田の融点未満の温度となるよう１５０℃程度とし、約１秒間押圧状態を保持する。これにより、リード４はプリコート半田６が溶融することなく電極２に接合され、電極間寸法が微細なファインピッチ電極に対して接合方法
を適用した場合においても、溶融半田が電極間で流動してブリッジを形成することによる短絡などの不具合を避けることができる。 In this pressing and heating, the heating temperature is about 150 ° C. so that the temperature is lower than the melting point of the solder, and the pressed state is maintained for about 1 second. As a result, the lead 4 is bonded to the electrode 2 without melting the precoat solder 6, and even when the bonding method is applied to a fine pitch electrode having a fine interelectrode dimension, the molten solder flows between the electrodes. Problems such as a short circuit due to the formation of a bridge can be avoided.

また上述の接合過程において、フレキシブル基板３や基板１の反り変形などによって電極２とリード４との平行度が保たれていないような場合にあっても、押圧過程において熱によって軟化したプリコート半田６が押圧荷重によって押し潰されることにより、すべてのリード４が電極２に接続される。したがって。フレキシブル基板３を基板１に実装するための搭載作業には高精度の圧着装置を必要とせず、設備コストを低減することができる。   Further, in the above-described joining process, even when the parallelism between the electrode 2 and the lead 4 is not maintained due to warp deformation of the flexible substrate 3 or the substrate 1, the precoat solder 6 softened by heat in the pressing process. Are crushed by the pressing load, whereby all the leads 4 are connected to the electrode 2. Therefore. The mounting operation for mounting the flexible substrate 3 on the substrate 1 does not require a high-precision crimping device, and the equipment cost can be reduced.

さらに、樹脂接着材８として活性剤成分を含有したものを用いていることから、金属間接合に際してプリコート半田６の表面の酸化膜が活性成分によって除去され、より良好な金属間接合が行われる。そして前述の加熱により、接合部に供給された樹脂接着材８や、接合部から流出しフレキシブル基板３の左端のコーナ部と基板１の右端のコーナ部にてフィレット状に停溜した樹脂接着材８が熱硬化する。これにより、電極２とリード４との接合部を基板１とフレキシブル基板３との間で補強するとともに、接合部を周囲から補強する樹脂補強部が形成される。したがってリード４を金属間接合によって電極２に良好に導通させるとともに、フレキシブル基板３を基板１に強固に固着させることができる。   Further, since the resin adhesive 8 containing an activator component is used, the oxide film on the surface of the precoat solder 6 is removed by the active component during the inter-metal bonding, and a better inter-metal bonding is performed. The resin adhesive 8 supplied to the joint by the heating described above, or the resin adhesive flowing out of the joint and retained in a fillet shape at the left corner of the flexible substrate 3 and the right corner of the substrate 1. 8 is thermally cured. Thereby, while joining the junction part of the electrode 2 and the lead | read | reed 4 between the board | substrate 1 and the flexible substrate 3, the resin reinforcement part which reinforces a junction part from the periphery is formed. Therefore, the lead 4 can be electrically connected to the electrode 2 by intermetallic bonding, and the flexible substrate 3 can be firmly fixed to the substrate 1.

なお上記実施の形態においては、リード４に予めプリコート半田６を形成することにより接合部に半田を供給する例を示しているが、これ以外の半田供給方法、例えば、電極２またはリード４のいずれかに印刷などの方法を用いて半田を供給する方法を用いてもよい。また、上記実施の形態では、樹脂接着材８を電極２に塗布して供給する例を示しているが、リード４に樹脂接着材８を供給してもよい。 In the above embodiment, an example is shown in which the precoat solder 6 is formed in advance on the lead 4 to supply solder to the joint portion. However, other solder supply methods such as the electrode 2 or the lead 4 are used. A method of supplying solder using a method such as crab printing may be used. In the above embodiment, the resin adhesive 8 is applied to the electrode 2 and supplied. However, the resin adhesive 8 may be supplied to the lead 4.

さらに、フレキシブル基板に設けられるリードの形状として、図５に示すように電極２との接続位置にリード幅を外側に膨らませた幅膨出部４ａを設けた形状としてもよい。このような幅膨出部４ａを備えたリード４にプリコート半田６を形成すると、幅膨出部４ａにおいてはプリコート厚みはリード４の他の部分よりも高くなり（符号６ａにて示す隆起したプリコート半田６参照）、幅膨出部４ａは半田高さを隆起させる半田隆起部として機能する。これにより接合時の半田押し潰し代を増大させることとなり、リード４を電極２に対してさらに高い信頼性で接合することができる。 Furthermore, the shape of the lead provided on the flexible substrate may be a shape in which a width bulging portion 4a in which the lead width is expanded outward is provided at the connection position with the electrode 2 as shown in FIG. When the precoat solder 6 is formed on the lead 4 having such a width bulge portion 4a, the precoat thickness at the width bulge portion 4a is higher than the other portions of the lead 4 (the raised precoat indicated by reference numeral 6a). Referring to the solder 6) , the width bulging portion 4 a functions as a solder raised portion that raises the solder height. As a result, the solder crushing margin at the time of bonding is increased, and the lead 4 can be bonded to the electrode 2 with higher reliability.

すなわち上述の接合方法は、基板１の端部に設けられた細長形状の電極２にフレキシブル基板３の端部に設けられた細長形状のリード４を接合する接合方法であって、電極２またはリード４に半田を供給する工程と、基板２またはフレキシブル基板３上の電極２とリード４の接合部に対応する位置に樹脂接着材８を供給する工程と、基板１にフレキシブル基板３を搭載して電極２に対してリード４を当接させることにより基板１上の樹脂接着材８を流動させて基板２とフレキシブル基板３との間の基板間隙間部１０を通じて接合部から流出させる工程と、搭載ツール９によって接合部を半田の融点未満の温度で加熱するとともに電極２に対してリード４を押圧することにより電極２とリード４の当接面を半田が溶融することなく金属間接合する工程と、流出した樹脂接着材８を熱硬化させて接合部を
周囲から補強する樹脂補強部を形成する工程とを含む形態となっている。 That is, the above-described joining method is a joining method in which the elongated lead 4 provided at the end of the flexible substrate 3 is joined to the elongated electrode 2 provided at the end of the substrate 1. A step of supplying solder to 4, a step of supplying resin adhesive 8 to a position corresponding to the joint between the electrode 2 and the lead 4 on the substrate 2 or flexible substrate 3, and mounting the flexible substrate 3 on the substrate 1. A process of causing the resin adhesive 8 on the substrate 1 to flow by bringing the lead 4 into contact with the electrode 2 and flowing out of the joint through the inter-substrate gap 10 between the substrate 2 and the flexible substrate 3; to the metal junction without a contact surface of the electrode 2 and the lead 4 solder by pressing the lead 4 to the electrodes 2 with heating the bonding portion with solder temperature below the melting point by the tool 9 is melted A step, and the resin adhesive 8 which flows out a form and a step of forming a resin reinforcing portion for reinforcing the periphery of the joint is thermally cured.

このような接合方法を採用することにより、材料コストが高く、且つ接合過程においてフレキシブル基板３のリード４と基板１の電極２との平行度を高精度に保つ必要がある異方性導電樹脂を用いることなく、基板１の電極２にフレキシブル基板３の端部に設けられたリード４を、低コスト・高信頼性で接合することができる。   By adopting such a joining method, an anisotropic conductive resin which has a high material cost and needs to maintain the parallelism between the lead 4 of the flexible substrate 3 and the electrode 2 of the substrate 1 with high accuracy in the joining process. Without use, the lead 4 provided at the end of the flexible substrate 3 can be bonded to the electrode 2 of the substrate 1 with low cost and high reliability.

本発明の接合方法は、高コストの異方性導電樹脂を用いることなく低コスト・高信頼性
の接合を実現できるという利点を有し、小型の携帯用電子機器などにおいて基板の端部に設けられた細長形状の電極に柔軟性基板の端部に設けられた細長形状のリードを接合する分野に利用可能である。 The bonding method of the present invention has an advantage that low-cost and high-reliability bonding can be realized without using a high-cost anisotropic conductive resin, and is provided at the end of a substrate in a small portable electronic device or the like. The present invention can be used in the field of joining an elongated lead provided at the end of a flexible substrate to the elongated electrode.

本発明の一実施の形態の接合方法が適用される基板の構成図The block diagram of the board | substrate with which the joining method of one embodiment of this invention is applied 本発明の一実施の形態の接合方法が適用される柔軟性基板の構成図1 is a configuration diagram of a flexible substrate to which a bonding method according to an embodiment of the present invention is applied. 本発明の一実施の形態の接合方法の工程説明図Process explanatory drawing of the joining method of one embodiment of the present invention 本発明の一実施の形態の接合方法の工程説明図Process explanatory drawing of the joining method of one embodiment of the present invention 本発明の一実施の形態の接合方法が適用される柔軟性基板の構成図1 is a configuration diagram of a flexible substrate to which a bonding method according to an embodiment of the present invention is applied.

符号の説明Explanation of symbols

１ 基板
２ 電極
３ フレキシブル基板
４ リード
６ 半田プリコート
８ 樹脂接着材 1 substrate 2 electrode 3 flexible substrate 4 lead 6 solder precoat 8 resin adhesive

Claims (4)

基板の端部に設けられた細長形状の電極に柔軟性基板の端部に設けられた細長形状のリードを接合する接合方法であって、前記電極またはリードに半田を供給する工程と、前記基板または前記柔軟性基板上の前記電極とリードの接合部に対応する位置に結合用材料を供給する工程と、前記基板に柔軟性基板を搭載して前記電極に対して前記リードを当接させることにより前記結合用材料を流動させて前記接合部から前記基板と柔軟性基板との間の基板間隙間部を通じて流出させる工程と、前記電極に対してリードを押圧するとともに前記接合部を前記半田の融点未満の温度で加熱することにより電極とリードの当接面を前記半田が溶融することなく金属間接合する工程と、前記流出した結合用材料を熱硬化させて前記接合部を補強する樹脂補強部を形成する工程とを含むことを特徴とする接合方法。 A method of joining an elongated lead provided at an end of a flexible substrate to an elongated electrode provided at an end of a substrate, the step of supplying solder to the electrode or the lead, and the substrate Or supplying a bonding material to a position corresponding to a joint between the electrode and the lead on the flexible substrate, and mounting the flexible substrate on the substrate and bringing the lead into contact with the electrode Causing the bonding material to flow and flowing out from the joint through the inter-substrate gap between the substrate and the flexible substrate, pressing a lead against the electrode, and connecting the joint to the solder resin accessory for reinforcing the step of intermetallic bonding without the abutment surface of the electrode and the lead solder by heating at a temperature lower than the melting point melts, the joint of the coupling materials the outflow by thermally curing Joining method which comprises a step of forming a section. 基板の端部に設けられた細長形状の電極に柔軟性基板の端部に設けられ表面に半田被膜部を有する細長形状のリードを接合する接合方法であって、前記基板上の前記電極とリードの接合部に対応する位置に結合用材料を供給する工程と、前記基板に柔軟性基板を搭載して前記電極に対して前記リードを当接させることにより前記結合用材料を流動させて前記接合部から前記基板と柔軟性基板との間の基板間隙間部を通じて流出させる工程と、前記電極に対してリードを押圧するとともに前記接合部を前記半田の融点未満の温度で加熱することにより電極とリードの当接面を前記半田が溶融することなく金属間接合する工程と、前記流出した結合用材料を熱硬化させて前記接合部を補強する樹脂補強部を形成する工程とを含むことを特徴とする接合方法。 A bonding method for bonding an elongated lead provided at an end of a flexible substrate to a elongated electrode provided at an end of a substrate and having a solder coating on a surface thereof, the electrode and the lead on the substrate Supplying a bonding material to a position corresponding to the bonding portion of the substrate, and mounting the flexible substrate on the substrate and bringing the lead into contact with the electrode to cause the bonding material to flow and the bonding A step of flowing out from a portion through a gap between the substrate and the flexible substrate, pressing a lead against the electrode and heating the joint at a temperature lower than the melting point of the solder, A step of joining the abutting surfaces of the leads between the metals without melting the solder, and a step of thermosetting the outflowing bonding material to form a resin reinforcing portion for reinforcing the joining portion. Be If the method. 前記結合用材料が、酸化膜除去能力を有する活性成分を含んでいることを特徴とする請求項１または請求項２記載の接合方法。 The bonding method according to claim 1 , wherein the bonding material includes an active component having an oxide film removing ability . 前記リードが半田を隆起させる半田隆起部を有することを特徴とする請求項１または請求項２記載の接合方法。 The joining method according to claim 1, wherein the lead has a solder raised portion for raising the solder .
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