JP5013111B2 - Flexible wiring board connection structure of liquid crystal display element - Google Patents

Flexible wiring board connection structure of liquid crystal display element Download PDF

Info

Publication number
JP5013111B2
JP5013111B2 JP2008114949A JP2008114949A JP5013111B2 JP 5013111 B2 JP5013111 B2 JP 5013111B2 JP 2008114949 A JP2008114949 A JP 2008114949A JP 2008114949 A JP2008114949 A JP 2008114949A JP 5013111 B2 JP5013111 B2 JP 5013111B2
Authority
JP
Japan
Prior art keywords
wiring board
display element
liquid crystal
crystal display
flexible wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2008114949A
Other languages
Japanese (ja)
Other versions
JP2009267086A (en
Inventor
和雄 平野
典昭 丸山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Seiki Co Ltd
Original Assignee
Nippon Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Seiki Co Ltd filed Critical Nippon Seiki Co Ltd
Priority to JP2008114949A priority Critical patent/JP5013111B2/en
Publication of JP2009267086A publication Critical patent/JP2009267086A/en
Application granted granted Critical
Publication of JP5013111B2 publication Critical patent/JP5013111B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Combinations Of Printed Boards (AREA)
  • Liquid Crystal (AREA)
  • Structure Of Printed Boards (AREA)

Description

本発明は、液晶表示素子の可撓性配線基板接続構造に関し、特に、液晶表示素子と可撓性配線基板との間に補強材を設けた液晶表示素子の可撓性配線基板接続構造に関する。   The present invention relates to a flexible wiring board connection structure for a liquid crystal display element, and more particularly to a flexible wiring board connection structure for a liquid crystal display element in which a reinforcing material is provided between the liquid crystal display element and the flexible wiring board.

従来の液晶表示素子に接続される可撓性配線基板は、ポリイミド樹脂等の絶縁性素材からなる基材上に、銅等の導電性素材により所定パターンの導電路が形成され、この導電路は、一部を除き絶縁性素材からなるカバーフィルムにより被覆され、露出された導電路には、ニッケル、金等の導電性補強材のメッキが施され電極端子部が形成されるような構成とされていた。
特開２０００−１６５００９号公報（図１参照） In a flexible wiring board connected to a conventional liquid crystal display element, a conductive path having a predetermined pattern is formed of a conductive material such as copper on a base material made of an insulating material such as polyimide resin. The conductive path is covered with a cover film made of an insulating material except for a portion, and the exposed conductive path is plated with a conductive reinforcing material such as nickel or gold to form an electrode terminal portion. It was.
Japanese Patent Laid-Open No. 2000-165009 (see FIG. 1)

従来、可撓性配線基板は、カバーフィルムにより被覆されていない電極端子部にのみ導電性補強材のメッキが施されていたため、この電極端子部を液晶表示素子の電極端子部に接続し、小型化等のために可撓性配線基板を折り曲げて使用した場合、可撓性配線基板の電極端子部における導電性補強材の先端が当接しているカバーフィルムの端縁近傍において、可撓性配線基板の導電路に断線が生じることがあった。   Conventionally, a flexible wiring board has been plated with a conductive reinforcing material only on an electrode terminal portion that is not covered with a cover film. Therefore, the electrode terminal portion is connected to the electrode terminal portion of a liquid crystal display element, and is compact. When the flexible wiring board is bent for use, for example, in the vicinity of the edge of the cover film where the tip of the conductive reinforcing material is in contact with the electrode terminal portion of the flexible wiring board, Disconnection may occur in the conductive path of the substrate.

このため、折り曲げる箇所に接着剤などからなる補強材を塗布し硬化させて補強することにより、導電路の断線を防止するようにしていた。   For this reason, a reinforcing material made of an adhesive or the like is applied to a portion to be bent and cured to reinforce, thereby preventing disconnection of the conductive path.

しかし、補強材を供給する量が適切でなく不足する場合は、導電路の断線が発生し、また、供給量が過剰の場合は、コストの増大を招くこととなる。   However, when the supply amount of the reinforcing material is not appropriate and insufficient, the conductive path is disconnected, and when the supply amount is excessive, the cost is increased.

本発明はこのような問題点に鑑みてなされたもので、補強材の適切な供給量を供給することが可能な液晶表示素子の可撓性配線基板接続構造を提供するものである。   The present invention has been made in view of such problems, and provides a flexible wiring board connection structure of a liquid crystal display element capable of supplying an appropriate supply amount of a reinforcing material.

本発明は、前記問題点を解決するために、液晶表示素子と、導電路を備えた可撓性配線基板と、を備え、前記液晶表示素子の電極端子部と前記可撓性配線基板の電極端子部とを電気的に接続するとともに、前記液晶表示素子と前記可撓性配線基板との間に補強材を設けた液晶表示素子の可撓性配線基板接続構造において、前記可撓性配線基板に前記補強材の供給量を規定する目印を形成したものである。   In order to solve the above problems, the present invention includes a liquid crystal display element and a flexible wiring board provided with a conductive path, and an electrode terminal portion of the liquid crystal display element and an electrode of the flexible wiring board. In the flexible wiring board connection structure of a liquid crystal display element, in which a terminal portion is electrically connected and a reinforcing material is provided between the liquid crystal display element and the flexible wiring board, the flexible wiring board And a mark for defining the supply amount of the reinforcing material.

また、本発明は、前記目印を前記導電路と同一材料としたものである。   In the present invention, the mark is made of the same material as the conductive path.

また、本発明は、前記目印をシルク印刷パターンとしたものである。   In the present invention, the mark is a silk print pattern.

また、本発明は、前記目印は帯状をしており、前記補強材の端部が前記帯状の目印の幅の中に位置するものである。   In the present invention, the mark has a band shape, and an end portion of the reinforcing material is positioned within a width of the band-shaped mark.

本発明によれば、所期の目的を達成でき、補強材の適切な供給量を供給することが可能な液晶表示素子の可撓性配線基板接続構造を提供することができる。   ADVANTAGE OF THE INVENTION According to this invention, the flexible wiring board connection structure of the liquid crystal display element which can achieve the intended objective and can supply the appropriate supply amount of a reinforcing material can be provided.

以下、本発明を適用した第１実施形態を添付図面に基づいて説明する。   Hereinafter, a first embodiment to which the present invention is applied will be described with reference to the accompanying drawings.

本発明は、液晶表示素子１と可撓性配線基板２との接続構造である。   The present invention is a connection structure between the liquid crystal display element 1 and the flexible wiring board 2.

液晶表示素子１は、２枚のガラス基板３、４間に液晶を封入したものである。なお、５は、液晶表示素子１を駆動するＩＣであり、ガラス基板４上に実装されている。また、６は、液晶表示素子１の図示しない電極端子部やＩＣ５を保護する樹脂からなる保護材である。   The liquid crystal display element 1 is one in which liquid crystal is sealed between two glass substrates 3 and 4. Reference numeral 5 denotes an IC for driving the liquid crystal display element 1 and is mounted on the glass substrate 4. Reference numeral 6 denotes a protective material made of a resin for protecting the electrode terminal portions (not shown) of the liquid crystal display element 1 and the IC 5.

可撓性配線基板２は、ポリイミド樹脂等の絶縁性素材からなる基材７上に、銅等の導電性素材により所定パターンの導電路８が複数形成されたものである。この導電路８は、一部を除き絶縁性素材からなるカバーフィルム９により被覆され、露出された導電路８には、ニッケル、金等の導電性補強材のメッキが施され電極端子部１０が形成されている。   The flexible wiring board 2 is obtained by forming a plurality of conductive paths 8 having a predetermined pattern on a base material 7 made of an insulating material such as polyimide resin, using a conductive material such as copper. The conductive path 8 is covered with a cover film 9 made of an insulating material except for a part. The exposed conductive path 8 is plated with a conductive reinforcing material such as nickel or gold, and the electrode terminal portion 10 is formed. Is formed.

可撓性配線基板２の電極端子部１０と液晶表示素子１の前記電極端子部とは、電気的に接続されている。本実施形態では、可撓性配線基板２の電極端子部１０と液晶表示素子１の前記電極端子部との間に異方性導電膜を介して電気的に接続されている。   The electrode terminal portion 10 of the flexible wiring board 2 and the electrode terminal portion of the liquid crystal display element 1 are electrically connected. In the present embodiment, the electrode terminal portion 10 of the flexible wiring board 2 and the electrode terminal portion of the liquid crystal display element 1 are electrically connected via an anisotropic conductive film.

また、液晶表示素子１の端面１１と可撓性配線基板２との間に補強材１２が塗布されて設けられている。本実施形態では、補強材１２は、紫外線硬化型のアクリル系の接着剤である。   A reinforcing material 12 is applied between the end face 11 of the liquid crystal display element 1 and the flexible wiring board 2. In this embodiment, the reinforcing material 12 is an ultraviolet curable acrylic adhesive.

可撓性配線基板２には、補強材１２の供給量を規定する目印１３が形成されている。この目印１３は、導電路８と同一材料にて形成されており、導電路８形成時に同時に形成される。   On the flexible wiring board 2, a mark 13 that defines the supply amount of the reinforcing material 12 is formed. The mark 13 is made of the same material as that of the conductive path 8 and is formed at the same time when the conductive path 8 is formed.

目印１３は、複数形成された導電路８のうち、両端の導電路８ａに形成されている。目印１３は、両端の導電路８ａから液晶表示素子１の端面１１に沿って形成されており、さらに、液晶表示素子１の端面１１に対して垂直方向の幅Ｗを備えた帯状をしており、液晶表示素子１の端面１１に沿って塗布される補強材１２の端部１２ａが帯状の２つの目印１２の幅Ｗの中に位置している。目印１３の幅Ｗの間に、補強材１２の端部１２ａが位置していれば、補強材１２の供給量が適切である。   The marks 13 are formed on the conductive paths 8a at both ends among the plurality of conductive paths 8 formed. The mark 13 is formed along the end surface 11 of the liquid crystal display element 1 from the conductive paths 8a at both ends, and has a strip shape with a width W in the direction perpendicular to the end surface 11 of the liquid crystal display element 1. The end portion 12a of the reinforcing material 12 applied along the end surface 11 of the liquid crystal display element 1 is positioned within the width W of the two band-shaped marks 12. If the end portion 12a of the reinforcing material 12 is located between the widths W of the marks 13, the supply amount of the reinforcing material 12 is appropriate.

なお、両端の導電路８ａは、液晶表示素子１と可動性配線基板２との電気的な接続には、関係していない。また、この両端の導電路８ａには、可撓性配線基板２と液晶表示素子１との位置を決める位置決めマーク１４が設けられている。この位置決めマーク１４は、導電路８ａと一体に形成されたものであり、本実施形態では、液晶表示素子１の端面１１に沿った凸部である。   Note that the conductive paths 8a at both ends are not related to the electrical connection between the liquid crystal display element 1 and the movable wiring board 2. Further, positioning marks 14 for determining the positions of the flexible wiring board 2 and the liquid crystal display element 1 are provided in the conductive paths 8a at both ends. The positioning mark 14 is formed integrally with the conductive path 8a, and is a convex portion along the end surface 11 of the liquid crystal display element 1 in this embodiment.

このように、液晶表示素子１と可撓性配線基板２との位置決めマーク１４を設けた導電路８ａに補強材１２の供給量を規定する目印１３を設けたことによって、液晶表示素子１と可撓性配線基板２との固定位置を所定の位置に固定することができるとともに、液晶表示素子１の端面１１から目印１３までの位置も所定の位置に定めることができる。   In this way, by providing the mark 13 for defining the supply amount of the reinforcing material 12 in the conductive path 8a provided with the positioning mark 14 between the liquid crystal display element 1 and the flexible wiring board 2, the liquid crystal display element 1 can be used. The fixing position with the flexible wiring board 2 can be fixed at a predetermined position, and the position from the end surface 11 of the liquid crystal display element 1 to the mark 13 can also be set at the predetermined position.

また、両端の導電路８ａの一つ内側の導電路８ｂも目印１３の一部を構成するものであり、目印１３の液晶表示素子１から離れた側の辺を構成するものである。   Further, the conductive path 8b inside one of the conductive paths 8a at both ends also constitutes a part of the mark 13, and constitutes the side of the mark 13 on the side away from the liquid crystal display element 1.

以上のように構成したことによって、補強材１２を供給する量を過不足無く適切にすることができ、導電路８の断線の発生や、供給量の過剰にともなうコストの増大を抑えることができる。   By comprising as mentioned above, the quantity which supplies the reinforcing material 12 can be made appropriate without excess and deficiency, and generation | occurrence | production of the disconnection of the conductive path 8 and the increase in cost accompanying the excess supply quantity can be suppressed. .

また、目印は、第１実施形態のように導電路８ａと同一の材料で形成する必要はなく、例えば、図４で示す第２実施形態のように、目印１５は、シルク印刷によって形成されるパターンであってもよい。この場合、目印１５は、カバーフィルム９上に形成される。本実施形態においても、補強材１２を供給する量を過不足無く適切にすることができ、導電路８の断線の発生や、供給量の過剰にともなうコストの増大を抑えることができる。   Further, it is not necessary to form the mark with the same material as that of the conductive path 8a as in the first embodiment. For example, as in the second embodiment shown in FIG. 4, the mark 15 is formed by silk printing. It may be a pattern. In this case, the mark 15 is formed on the cover film 9. Also in the present embodiment, the amount of the reinforcing material 12 supplied can be made appropriate without excess or deficiency, and the occurrence of disconnection of the conductive path 8 and the increase in cost due to the excessive supply amount can be suppressed.

本発明の第１実施形態の正面図。The front view of 1st Embodiment of this invention. 図１中Ａ−Ａ線の断面図。Sectional drawing of the AA line in FIG. 同実施形態の可撓性配線基板の正面図。The front view of the flexible wiring board of the embodiment. 同発明の第２実施形態の可撓性配線基板の正面図。The front view of the flexible wiring board of 2nd Embodiment of the invention.

符号の説明Explanation of symbols

１ 液晶表示素子
２ 可撓性配線基板
７ 基材
８ 導電路
９ カバーフィルム
１２ 補強材
１３、１５ 目印
Ｗ 幅 DESCRIPTION OF SYMBOLS 1 Liquid crystal display element 2 Flexible wiring board 7 Base material 8 Conductive path 9 Cover film 12 Reinforcement material 13, 15 Mark W width

Claims (4)

液晶表示素子と、導電路を備えた可撓性配線基板と、を備え、前記液晶表示素子の電極端子部と前記可撓性配線基板の電極端子部とを電気的に接続するとともに、前記液晶表示素子と前記可撓性配線基板との間に補強材を設けた液晶表示素子の可撓性配線基板接続構造において、前記可撓性配線基板に前記補強材の供給量を規定する目印を形成したことを特徴とする液晶表示素子の可撓性配線基板接続構造。 A liquid crystal display element and a flexible wiring board having a conductive path, and electrically connecting the electrode terminal portion of the liquid crystal display element and the electrode terminal portion of the flexible wiring board; In a flexible wiring board connection structure of a liquid crystal display element in which a reinforcing material is provided between the display element and the flexible wiring board, a mark for defining a supply amount of the reinforcing material is formed on the flexible wiring board A flexible wiring board connection structure for a liquid crystal display element, characterized by comprising: 前記目印を前記導電路と同一材料としたことを特徴とする請求項１に記載の液晶表示素子の可撓性配線基板接続構造。 The flexible wiring board connection structure for a liquid crystal display element according to claim 1, wherein the mark is made of the same material as the conductive path. 前記目印をシルク印刷パターンとしたことを特徴とする請求項１に記載の液晶表示素子の可撓性配線基板接続構造。 The flexible wiring board connection structure for a liquid crystal display element according to claim 1, wherein the mark is a silk print pattern. 前記目印は帯状をしており、前記補強材の端部が前記帯状の目印の幅の中に位置することを特徴とする請求項１に記載の液晶表示素子の可撓性配線基板接続構造。 2. The flexible wiring board connection structure for a liquid crystal display element according to claim 1, wherein the mark has a band shape, and an end portion of the reinforcing material is positioned within the width of the band mark.
JP2008114949A 2008-04-25 2008-04-25 Flexible wiring board connection structure of liquid crystal display element Active JP5013111B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008114949A JP5013111B2 (en) 2008-04-25 2008-04-25 Flexible wiring board connection structure of liquid crystal display element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008114949A JP5013111B2 (en) 2008-04-25 2008-04-25 Flexible wiring board connection structure of liquid crystal display element

Publications (2)

Publication Number Publication Date
JP2009267086A JP2009267086A (en) 2009-11-12
JP5013111B2 true JP5013111B2 (en) 2012-08-29

Family

ID=41392555

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008114949A Active JP5013111B2 (en) 2008-04-25 2008-04-25 Flexible wiring board connection structure of liquid crystal display element

Country Status (1)

Country Link
JP (1) JP5013111B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8929810B2 (en) 2012-04-23 2015-01-06 Qualcomm Incorporated Methods and apparatus for improving NFC connection through device positioning
US9008574B2 (en) 2009-09-14 2015-04-14 Qualcomm Incorporated Focused antenna, multi-purpose antenna, and methods related thereto

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5738122B2 (en) * 2011-08-25 2015-06-17 京セラ株式会社 Wiring board and input device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2792958B2 (en) * 1989-11-15 1998-09-03 三洋電機株式会社 Hybrid integrated circuit device
JPH104248A (en) * 1996-06-17 1998-01-06 Teikoku Tsushin Kogyo Co Ltd Board connection structure
JPH10270820A (en) * 1997-03-27 1998-10-09 Matsushita Electric Ind Co Ltd Composite printed board and method for mounting electronic circuit board
JPH1117301A (en) * 1997-06-20 1999-01-22 Seiko Epson Corp Reinforcement of heat-seal connection-portion in module using heat seal
JP3915765B2 (en) * 2003-10-03 2007-05-16 松下電器産業株式会社 Joining method
JP2007292838A (en) * 2006-04-21 2007-11-08 Optrex Corp Display device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9008574B2 (en) 2009-09-14 2015-04-14 Qualcomm Incorporated Focused antenna, multi-purpose antenna, and methods related thereto
US8929810B2 (en) 2012-04-23 2015-01-06 Qualcomm Incorporated Methods and apparatus for improving NFC connection through device positioning

Also Published As

Publication number Publication date
JP2009267086A (en) 2009-11-12

Similar Documents

Publication Publication Date Title
US7965366B2 (en) Flexible printed circuit board with alignment marks in particular positions
US8031316B2 (en) Liquid crystal display device
US7812913B2 (en) Display device
US8779292B2 (en) Substrate and substrate bonding device using the same
US7234965B2 (en) Wiring structure using flexible printed circuit board and optical module using the same
JP5013111B2 (en) Flexible wiring board connection structure of liquid crystal display element
JP2007281378A (en) Flexible wiring board and electronic component
US9506637B2 (en) Circuit board and lighting device having the circuit board
JP2006237320A (en) Flexible mounting substrate
CN106838836B (en) Planar illuminating device
JP2008294114A (en) Flexible printed circuit board and liquid crystal display device
JP2007194459A (en) Flexible circuit substrate
JP2008226598A (en) Light source device
JP4553306B2 (en) connector
KR20030028381A (en) Electronic card
JP2005338699A (en) Liquid crystal display
JP2009016397A (en) Printed wiring board
JP2007293084A (en) Wiring substrate and display device
JP4105178B2 (en) Liquid crystal display element
JP2007180221A (en) Flexible circuit board
JP2005191162A (en) Rigid-flexible wiring board and electronic apparatus using the same
JP4347710B2 (en) Flexible wiring board
JP2009158833A (en) Connection structure for flexible printed wiring board
JP5761744B2 (en) FPC board for strain gauge
JP5467589B2 (en) Electronic circuit components and electronic equipment

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110317

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120509

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120522

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150615

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 5013111

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250