JP3904581B2 - 欠陥検査装置およびその方法 - Google Patents

欠陥検査装置およびその方法 Download PDF

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Publication number
JP3904581B2
JP3904581B2 JP2005172304A JP2005172304A JP3904581B2 JP 3904581 B2 JP3904581 B2 JP 3904581B2 JP 2005172304 A JP2005172304 A JP 2005172304A JP 2005172304 A JP2005172304 A JP 2005172304A JP 3904581 B2 JP3904581 B2 JP 3904581B2
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JP
Japan
Prior art keywords
illumination
optical system
defect
detection
light
Prior art date
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Expired - Lifetime
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JP2005172304A
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English (en)
Japanese (ja)
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JP2005300553A (ja
JP2005300553A5 (enExample
Inventor
稔 野口
良正 大島
英利 西山
俊一 松本
行雄 見坊
良治 松永
恵寿 酒井
隆典 二宮
哲也 渡邊
寿人 中村
孝広 神宮
良夫 森重
秀一 近松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi High Tech Corp
Original Assignee
Hitachi High Technologies Corp
Hitachi Ltd
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Application filed by Hitachi High Technologies Corp, Hitachi Ltd filed Critical Hitachi High Technologies Corp
Priority to JP2005172304A priority Critical patent/JP3904581B2/ja
Publication of JP2005300553A publication Critical patent/JP2005300553A/ja
Publication of JP2005300553A5 publication Critical patent/JP2005300553A5/ja
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Publication of JP3904581B2 publication Critical patent/JP3904581B2/ja
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  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2005172304A 1998-07-28 2005-06-13 欠陥検査装置およびその方法 Expired - Lifetime JP3904581B2 (ja)

Priority Applications (1)

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JP2005172304A JP3904581B2 (ja) 1998-07-28 2005-06-13 欠陥検査装置およびその方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP21305698 1998-07-28
JP2005172304A JP3904581B2 (ja) 1998-07-28 2005-06-13 欠陥検査装置およびその方法

Related Parent Applications (1)

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JP2004146031A Division JP3904565B2 (ja) 1998-07-28 2004-05-17 欠陥検査装置およびその方法

Publications (3)

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JP2005300553A JP2005300553A (ja) 2005-10-27
JP2005300553A5 JP2005300553A5 (enExample) 2006-09-07
JP3904581B2 true JP3904581B2 (ja) 2007-04-11

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ID=35332205

Family Applications (1)

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JP2005172304A Expired - Lifetime JP3904581B2 (ja) 1998-07-28 2005-06-13 欠陥検査装置およびその方法

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006330007A (ja) * 1998-07-28 2006-12-07 Hitachi Ltd 欠陥検査装置およびその方法

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4996856B2 (ja) 2006-01-23 2012-08-08 株式会社日立ハイテクノロジーズ 欠陥検査装置およびその方法
TW200745771A (en) * 2006-02-17 2007-12-16 Nikon Corp Adjustment method, substrate processing method, substrate processing apparatus, exposure apparatus, inspection apparatus, measurement and/or inspection system, processing apparatus, computer system, program and information recording medium
JP4851960B2 (ja) * 2006-02-24 2012-01-11 株式会社日立ハイテクノロジーズ 異物検査方法、および異物検査装置
JP4928862B2 (ja) 2006-08-04 2012-05-09 株式会社日立ハイテクノロジーズ 欠陥検査方法及びその装置
JP2008020374A (ja) * 2006-07-14 2008-01-31 Hitachi High-Technologies Corp 欠陥検査方法およびその装置
US7664608B2 (en) 2006-07-14 2010-02-16 Hitachi High-Technologies Corporation Defect inspection method and apparatus
WO2010113228A1 (ja) * 2009-03-31 2010-10-07 株式会社 日立ハイテクノロジーズ 検査装置及び検査方法
JP5581343B2 (ja) * 2012-01-13 2014-08-27 株式会社日立ハイテクノロジーズ 欠陥検査方法およびその装置
JP6559601B2 (ja) * 2016-03-23 2019-08-14 信越半導体株式会社 検出装置及び検出方法
KR102014171B1 (ko) * 2018-08-20 2019-08-26 케이맥(주) 유기발광소자의 혼색 불량 검출장치 및 검출방법
JP7227198B2 (ja) * 2020-07-28 2023-02-21 アンリツ株式会社 移動端末試験装置、及び移動端末試験方法
JP7614058B2 (ja) * 2021-09-15 2025-01-15 株式会社日立ハイテク 欠陥検査システム及び欠陥検査方法
CN114034713B (zh) * 2021-11-10 2024-10-01 天津大学 一种基于干涉粒子成像技术的液体体系异物检测方法
CN114839063B (zh) * 2022-05-11 2025-11-14 淮南文峰光电科技股份有限公司 一种扁平预埋线束耐高温测试系统

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6129712A (ja) * 1984-07-23 1986-02-10 Hitachi Ltd 微細パタ−ンの欠陥検出方法及びその装置
JP2512093B2 (ja) * 1988-07-29 1996-07-03 株式会社日立製作所 異物検出装置及び方法
JPH0494148A (ja) * 1990-08-10 1992-03-26 Hitachi Ltd 異物検出方法およびその装置
JPH05218163A (ja) * 1991-12-11 1993-08-27 Hitachi Ltd 異物検査方法及びその装置
JP2911274B2 (ja) * 1991-10-31 1999-06-23 株式会社日立製作所 異物検出方法及び装置
JPH05281154A (ja) * 1992-03-31 1993-10-29 Toshiba Corp パターン欠陥検査装置
JP3272036B2 (ja) * 1992-06-15 2002-04-08 アプライド マテリアルズ イスラエル リミテッド 物体表面の欠陥の光学的検査法とその装置
JPH06249791A (ja) * 1993-02-25 1994-09-09 Hitachi Ltd 欠陥検査装置
JPH06258047A (ja) * 1993-03-02 1994-09-16 Omron Corp バンプ検査用データの教示方法
JP3435187B2 (ja) * 1993-05-12 2003-08-11 株式会社日立製作所 欠陥検査方法及びその装置
JP3092892B2 (ja) * 1993-12-27 2000-09-25 シャープ株式会社 半導体チップの外観検査方法および装置
DE4413831C2 (de) * 1994-04-20 2000-05-31 Siemens Ag Verfahren zur Kontrolle von Halbleiterscheiben
JPH07318504A (ja) * 1994-05-23 1995-12-08 Hitachi Electron Eng Co Ltd ウエハの異物検出受光系
JP3639636B2 (ja) * 1995-04-25 2005-04-20 株式会社ルネサステクノロジ 半導体ウェハの不良解析装置及び不良解析方法
JPH09210919A (ja) * 1996-02-05 1997-08-15 Nikon Corp 欠陥検査方法
JPH09243546A (ja) * 1996-03-13 1997-09-19 Shin Etsu Handotai Co Ltd 異物検査装置
JP3566589B2 (ja) * 1998-07-28 2004-09-15 株式会社日立製作所 欠陥検査装置およびその方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006330007A (ja) * 1998-07-28 2006-12-07 Hitachi Ltd 欠陥検査装置およびその方法

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JP2005300553A (ja) 2005-10-27

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