JP3903934B2 - 硬脆性材料の切断方法 - Google Patents
硬脆性材料の切断方法 Download PDFInfo
- Publication number
- JP3903934B2 JP3903934B2 JP2003066182A JP2003066182A JP3903934B2 JP 3903934 B2 JP3903934 B2 JP 3903934B2 JP 2003066182 A JP2003066182 A JP 2003066182A JP 2003066182 A JP2003066182 A JP 2003066182A JP 3903934 B2 JP3903934 B2 JP 3903934B2
- Authority
- JP
- Japan
- Prior art keywords
- ingot
- plate
- jig
- brittle material
- slicing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 title claims description 35
- 238000005520 cutting process Methods 0.000 title claims description 27
- 238000000034 method Methods 0.000 title claims description 27
- 239000013078 crystal Substances 0.000 claims description 34
- 235000012431 wafers Nutrition 0.000 claims description 34
- 238000003825 pressing Methods 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 22
- 229910052710 silicon Inorganic materials 0.000 description 22
- 239000010703 silicon Substances 0.000 description 22
- 238000004140 cleaning Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
Images
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003066182A JP3903934B2 (ja) | 2002-03-29 | 2003-03-12 | 硬脆性材料の切断方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002093945 | 2002-03-29 | ||
| JP2003066182A JP3903934B2 (ja) | 2002-03-29 | 2003-03-12 | 硬脆性材料の切断方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004001409A JP2004001409A (ja) | 2004-01-08 |
| JP2004001409A5 JP2004001409A5 (enExample) | 2004-11-04 |
| JP3903934B2 true JP3903934B2 (ja) | 2007-04-11 |
Family
ID=30446314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003066182A Expired - Lifetime JP3903934B2 (ja) | 2002-03-29 | 2003-03-12 | 硬脆性材料の切断方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3903934B2 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4406878B2 (ja) | 2004-09-17 | 2010-02-03 | 株式会社Ｓｕｍｃｏ | 単結晶インゴットの当て板 |
| WO2009072176A1 (ja) * | 2007-12-03 | 2009-06-11 | Mitsubishi Electric Corporation | マルチワイヤソーおよびインゴットの切断方法 |
| JP2009202406A (ja) * | 2008-02-27 | 2009-09-10 | Seiko Instruments Inc | ウエハの作製方法およびウエハの製造装置 |
| DE102008051673B4 (de) * | 2008-10-15 | 2014-04-03 | Siltronic Ag | Verfahren zum gleichzeitigen Auftrennen eines Verbundstabs aus Silicium in eine Vielzahl von Scheiben |
| CN109270082B (zh) * | 2018-08-09 | 2021-05-11 | 宁夏中晶半导体材料有限公司 | 一种利用腐蚀方法及微观检测确定单晶硅晶线的方法 |
| CN109747057B (zh) * | 2019-02-14 | 2022-04-08 | 厦门芯光润泽科技有限公司 | 碳化硅晶棒多线切割方法 |
| CN109760223B (zh) * | 2019-02-14 | 2021-08-31 | 厦门芯光润泽科技有限公司 | 碳化硅晶棒多线切割方法 |
| WO2025024004A1 (en) * | 2023-07-21 | 2025-01-30 | Globalwafers Co., Ltd. | System and method for controlling wafer breakage during ingot slicing operations |
-
2003
- 2003-03-12 JP JP2003066182A patent/JP3903934B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004001409A (ja) | 2004-01-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6802928B2 (en) | Method for cutting hard and brittle material | |
| US7598156B2 (en) | Method of manufacturing device having adhesive film on back-side surface thereof including breaking the adhesive with tension | |
| JP3498638B2 (ja) | ワイヤーソー装置 | |
| CN107848092B (zh) | 工件支架及工件的切断方法 | |
| JPH07122524A (ja) | 半導体ウエハを研削するための回転研削盤用ワークホルダ及び該ワークホルダを位置決めするための方法 | |
| JP3903934B2 (ja) | 硬脆性材料の切断方法 | |
| JPH08281549A (ja) | ワイヤーソー装置 | |
| CN1207334A (zh) | 研磨装置及其研磨夹具和装于研磨夹具上的工件安装部件 | |
| US8642920B2 (en) | Wafer dividing apparatus and laser processing apparatus | |
| JP2004512251A (ja) | 単結晶を切断するための方法および装置ならびに調節装置ならびに結晶方位を決定するためのテスト方法 | |
| CN100348391C (zh) | 大直径SiC单晶的切割方法 | |
| US6422930B2 (en) | Apparatus for removing deposited film | |
| JP2011060985A (ja) | 電子部品の製造方法 | |
| JP2009032726A (ja) | ウエーハの分割方法 | |
| JP2006082211A (ja) | 単結晶インゴットの当て板 | |
| KR20140124948A (ko) | 평탄도 유지와 치핑방지에 용이한 반도체 제조설비용 진공 척 | |
| JP7176327B2 (ja) | ウエハの製造方法、及び、ウエハの押さえ治具 | |
| JP5276851B2 (ja) | 結晶方位測定装置、結晶加工装置及び結晶加工方法 | |
| JP2012028702A (ja) | 半導体結晶固定治具 | |
| JP2004311726A (ja) | 単結晶インゴットの加工方法 | |
| JP2004001409A5 (enExample) | ||
| JP6953788B2 (ja) | ウエハの製造方法、及び押さえ治具 | |
| KR20140092117A (ko) | 와이어 쏘 장치 | |
| EP3838483A1 (en) | Method of grinding workpiece | |
| JPS60227423A (ja) | インゴツトの接着方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RD05 | Notification of revocation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7425 Effective date: 20040721 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20051028 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20051108 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20051226 |
|
| RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20051226 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20060620 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060810 |
|
| A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20060828 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20061121 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20061124 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20061219 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20070101 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 3903934 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110119 Year of fee payment: 4 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120119 Year of fee payment: 5 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130119 Year of fee payment: 6 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |