JP3880218B2 - 超音波探触子 - Google Patents
超音波探触子 Download PDFInfo
- Publication number
- JP3880218B2 JP3880218B2 JP27428998A JP27428998A JP3880218B2 JP 3880218 B2 JP3880218 B2 JP 3880218B2 JP 27428998 A JP27428998 A JP 27428998A JP 27428998 A JP27428998 A JP 27428998A JP 3880218 B2 JP3880218 B2 JP 3880218B2
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- vibrator
- axis direction
- layers
- ultrasonic probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000523 sample Substances 0.000 title claims description 17
- 239000010410 layer Substances 0.000 description 52
- 238000009826 distribution Methods 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 5
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000009827 uniform distribution Methods 0.000 description 2
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- JQJCSZOEVBFDKO-UHFFFAOYSA-N lead zinc Chemical compound [Zn].[Pb] JQJCSZOEVBFDKO-UHFFFAOYSA-N 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/18—Methods or devices for transmitting, conducting or directing sound
- G10K11/26—Sound-focusing or directing, e.g. scanning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
- B06B1/064—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface with multiple active layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Multimedia (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27428998A JP3880218B2 (ja) | 1998-09-11 | 1998-09-11 | 超音波探触子 |
| US09/393,977 US6333590B1 (en) | 1998-09-11 | 1999-09-10 | Ultrasonic transducer having laminate structure, ultrasonic probe and production method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27428998A JP3880218B2 (ja) | 1998-09-11 | 1998-09-11 | 超音波探触子 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2000088822A JP2000088822A (ja) | 2000-03-31 |
| JP2000088822A5 JP2000088822A5 (enExample) | 2005-10-27 |
| JP3880218B2 true JP3880218B2 (ja) | 2007-02-14 |
Family
ID=17539580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27428998A Expired - Fee Related JP3880218B2 (ja) | 1998-09-11 | 1998-09-11 | 超音波探触子 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US6333590B1 (enExample) |
| JP (1) | JP3880218B2 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7356905B2 (en) * | 2004-05-25 | 2008-04-15 | Riverside Research Institute | Method of fabricating a high frequency ultrasound transducer |
| US20100171395A1 (en) * | 2008-10-24 | 2010-07-08 | University Of Southern California | Curved ultrasonic array transducers |
| KR101326308B1 (ko) | 2011-02-11 | 2013-11-11 | 삼성전자주식회사 | 초음파 프로브 |
| US9766328B2 (en) * | 2014-07-15 | 2017-09-19 | Garmin Switzerland Gmbh | Sonar transducer array assembly and methods of manufacture thereof |
| JP6728260B2 (ja) | 2018-03-22 | 2020-07-22 | 株式会社東芝 | 積層型超音波トランスデューサ及び超音波検査装置 |
| CN116116691B (zh) * | 2023-02-09 | 2025-03-21 | 中国科学院声学研究所东海研究站 | 活塞式压电复合板,水声换能器及制备方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4385255A (en) * | 1979-11-02 | 1983-05-24 | Yokogawa Electric Works, Ltd. | Linear array ultrasonic transducer |
| US4564782A (en) * | 1983-09-02 | 1986-01-14 | Murata Manufacturing Co., Ltd. | Ceramic filter using multiple thin piezoelectric layers |
| US5410208A (en) * | 1993-04-12 | 1995-04-25 | Acuson Corporation | Ultrasound transducers with reduced sidelobes and method for manufacture thereof |
-
1998
- 1998-09-11 JP JP27428998A patent/JP3880218B2/ja not_active Expired - Fee Related
-
1999
- 1999-09-10 US US09/393,977 patent/US6333590B1/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| US6333590B1 (en) | 2001-12-25 |
| JP2000088822A (ja) | 2000-03-31 |
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