JP3875350B2 - Game board manufacturing method, manufacturing apparatus therefor, and game board - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a game board having nails on a board surface such as a game board of a pachinko machine, and in particular, the board surface of the game board is formed from a hot melt material, and the nails are inserted on the board surface by softening or melting the board surface by heating. The present invention relates to a game board, a game board nail driving method, or a game board nail driving device in which nails are provided.
[0002]
[Prior art]
In recent years, game boards for pachinko machines have been formed not only from wood but also from synthetic resin. On the other hand, since a large number of nails are set up on the game board of the pachinko machine, when the game board is formed of synthetic resin, conventionally, as shown in FIG. The nail 2 was inserted into the nail hole 62 and the nail 2 was erected on the board surface 60.
[0003]
[Problems to be solved by the invention]
Therefore, when the game board is made of synthetic resin, the nail hole 62 for inserting the nail 2 has to be made in the mold according to the pattern, which takes time and labor to manufacture the mold. .
[0004]
Further, since the nail hole 62 is formed in the board surface 60 in advance, the position where the nail 2 is set up is fixed, and the position of the nail 2 cannot be changed even a little. It could not be used as a game board with other patterns.
[0005]
Further, since the nail 2 is fixed by being in close contact with the inner surface of the nail hole 62, in order to firmly fix the nail 2 on the board surface 60, the inner diameter of the nail hole 62 is formed slightly smaller than the diameter of the nail 2. Therefore, high accuracy is required for molding the nail hole 62. If the inner diameter of the nail hole 62 is larger than the required value, the fixing force of the nail 2 will be weakened, causing loosening or dropping off. Conversely, if the inner diameter is small, excessive force will be applied to the panel surface 60 during press-fitting. In addition, there were cases such as cracks and damage.
[0006]
[Means for Solving the Problems]
It is an object of the present invention to provide a nail at an arbitrary position on the board surface without applying an excessive force to the board surface.
[0007]
Therefore, in the present invention, heat is applied to the board surface made of synthetic resin, and the nail is inserted into the board surface using the softening and melting of the synthetic resin by heating, and the nail is provided at an arbitrary position on the board surface. In this way, if the nail is inserted into the inside while softening and melting the synthetic resin material forming the board surface, a nail hole is not required, so an arbitrary position on the board surface is selected and the nail is inserted. In addition, since the insertion is perforation due to softening and melting of heat, no excessive force is applied to the board surface, and cracks and the like do not occur. And since a synthetic resin hardens after a softening melt part cools, a nail is firmly fixed on a board surface.
[0008]
As a specific method for driving the nail by heating, for example, the nail is heated to a predetermined temperature in advance using a heater or the like, and the board surface is partially softened and melted with the heated nail and gradually inserted. In this case, the nail driving machine and the heating machine are configured separately, the nail is heated by the heating machine, and the heated nail is inserted by the driving machine, or the both may be configured integrally. Good. When the driving machine and the heating machine are integrated, the nail can be heated even during insertion, temperature drop due to natural heat dissipation of the nail can be prevented, and the nail can be smoothly inserted into the board surface.
[0009]
Cooling of the heated panel surface may be forced cooling by blowing cool air or the like, or natural cooling by leaving it alone.
[0010]
Hereinafter, other examples such as a driving method will be described.
[0011]
1. A pilot hole 4 is opened in advance at a position where a nail should be struck (see FIG. 2). The lower hole 4 is preferably formed at the same time as the board surface 6 is injection-molded, and may have a diameter sufficient to guide the nail 2 that is advanced while the board surface 6 is softened and melted. Further, if a predetermined angle or the like is provided in advance in the lower hole 4 with respect to the board surface 6, the nail 2 can be placed on the board surface 6 in a desired state according to the lower hole 4. Further, since the lower hole 4 is a guide for the nail 2, it may be thinner than the diameter of the nail 2 and can be easily filled, and a number of the lower holes 4 can be arbitrarily opened in the board surface 6 in advance. . Further, the lower hole 4 may be formed without penetrating the board surface 6 and the surface of the board surface 6 may be molded while being flat. At this time, a recess or the like indicating the position of the pilot hole 4 may be provided on the surface of the board surface 6. Moreover, it is good also as providing the lower hole 4 in the location common to the board surface 6 of several different patterns, and not providing the lower hole 4 in another location.
[0012]
2. A recess 8 is provided around the position where the nail 2 should be erected (see FIG. 3). It is assumed that the size of the recess 8 can offset the swelling of the resin around the nail 2 due to the insertion of the nail 2. In this way, even if the nail 2 is inserted into the board surface 6 by melting, the surface of the board surface 6 can be made flat. The shape of the recess 8 may be hemispherical, conical, or cylindrical. Moreover, you may connect the hollow 8 with the lower hole 4 (refer FIG. 4).
[0013]
3. A groove 10 extending in the axial direction is provided in the lower hole 4 (see FIG. 5). If it does in this way, when the nail 2 is inserted in the pilot hole 4, the surplus of the board surface 6 will enter into the groove part 10, and the swelling of the resin to the surface can be reduced. At this time, the inner diameter of the lower hole 4 is made smaller than the diameter of the nail 2 and the diameter connecting the bottom of the groove portion 10 is made larger than the diameter of the nail 2 so The swell of resin on the surface of the board surface 6 can be eliminated at all.
[0014]
4, Steps are provided in the diameters of the nail 2 and the lower hole 4 (see FIG. 6). That is, the inner diameter on the surface side of the lower hole 4 is formed larger than the inner diameter on the inner side, while the diameter on the tip side of the nail 2 is adapted to the inner diameter on the inner side of the lower hole 4, and the diameter on the head side of the nail 2 is 4 is adapted to the inner diameter of the surface side. Then, as shown in FIG. 6, the nail 2 is fitted in two places above and below the lower hole 4, and the fixing force on the board surface 6 can be strengthened. If the space 12 is formed by making the step position of the diameter of the lower hole 4 different from the position of the nail 2 as shown in FIG. Absorbs and eliminates surface swell.
[0015]
5. A knurl is provided in the pilot hole (not shown). Thereby, surplus meat can be escaped.
[0016]
6. A nail is formed hollow (not shown). In this way, when the nail is inserted, the resin penetrates into the hollow portion of the nail, and the holding power of the nail can be strengthened, and the rise of surplus meat on the surface of the board surface 6 can be reduced. The hollow part of the nail may penetrate the nail in the axial direction or the head of the nail may not penetrate.
[0017]
7. Protrusions 14 (see FIG. 7) or grooves are provided on the outer surface of the nail 2. The protrusion 14 may be either a single piece or a spherical shape, and may be inclined in the insertion direction of the nail 2 or may be a screw shape inclined with respect to the axial direction. The groove portion may be formed along the axial direction of the nail, or may be a spiral shape inclined with respect to the axial direction. If the protrusions 14 and the grooves are formed on the outer surface of the nail 2 in this way, the fixing force after insertion can be strengthened and the rise of the surface can be reduced.
[0018]
8. Heating for inserting the nail may be performed on the board surface. The heating device for heating the board surface may heat the entire board surface to a predetermined temperature, or may heat only the portion where the nail is to be hit. The heating need not be performed until the resin is completely melted, and the board surface 6 may be softened to such an extent that the nail 2 can be inserted with an appropriate pressing force. Further, both the nail 2 and the board surface 6 may be heated. Further, a plurality of the above examples may be combined as appropriate.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
An example of a nailing device according to the present invention will be described with reference to FIG.
[0020]
As shown in FIG. 1, the nail driving device 1 includes a pedestal portion 50, an XY movement device 20 installed on the pedestal portion 50, a fixing base 22 that fixes the board surface 6, and a nail 2 on the board surface 6. It comprises a driving machine 24 to be inserted, a supply device 26 for supplying the nail 2 to the driving machine 24, a control unit 30 for controlling the driving machine 24, the XY movement device 20, and the like.
[0021]
The fixed base 22 is a base for fixing the board surface 6 and is moved to an arbitrary position by the operation of the XY moving device 20. The board surface 6 is shape | molded from ABS resin, and the cell is stuck on the surface. In addition, you may form a pattern by printing instead of sticking a cell on the surface. The supply device 26 includes a container 40 that is vibrated by a vibration unit (not shown), a nail conveyance path 42 that extends from the outer periphery of the container 40, and the like. Are continuously fed to the driving machine 24 through the nail conveying path 42.
[0022]
The driving machine 24 is fixed to a beam portion 52 stretched above the pedestal portion 50, and includes a piston portion 34 that presses the nail 2, a grip portion 36 that takes out the nail 2 from the supply device 26, and the nail 2. The heating unit 38 is configured to be heated. The piston portion 34 includes a piston (not shown) that moves up and down by air pressure or the like, and presses the nail 2 downward by the piston. The gripping part 36 is a mechanism for gripping the nail 2, grips the nail 2 from the heating part 38, and moves it directly below the piston of the piston part 34. Further, the gripping part 36 appropriately releases the grip of the nail 2 in accordance with the operation of the piston.
[0023]
The heating unit 38 includes a heater (not shown) having a temperature adjustment function therein, stores a predetermined number of nails 2 sent from the nail conveyance path 42, and heats the nails 2 to about 170 ° C. . When the board surface 6 is made of an acrylic material, the heating temperature of the nail 2 is set to about 150 ° C. In addition, the heating temperature of the nail 2 by the heating unit 38 is not limited to the above example, and is appropriately adjusted according to the material of the board surface 6 and the outside air temperature, the temperature drop due to heat radiation, the pressing pressure of the piston on the nail 2, etc. A temperature that is necessary and sufficient to be softened or melted so that the nail 2 can be inserted into the board surface 6 without applying an excessive force is selected. For example, when the temperature of the nail 2 is too low, the insertion resistance of the nail 2 is increased and an unreasonable force is applied to the board surface 6. Conversely, when the heating temperature is too high, it takes time to lower the temperature after insertion. The temperature is set taking this into consideration. Note that a heating mechanism for the nail 2 may also be provided at the tip of the gripping portion 36 to heat the nail 2 during gripping or insertion into the board surface 6.
[0024]
Next, the operation of driving the nail 2 into the board surface 6 by the nail driving device 1 will be described. First, the board surface 6 is fixed to the fixed base 22, a nail pattern or the like of the board surface 6 is input to the control unit 30, and the nail 2 is inserted into the supply device 26. Then, the operation of the nailing device 1 is started. Then, the supply device 26 vibrates the nail 2 to align and send the nail 2 from the nail conveyance path 42. Further, the heating unit 38 is operated to heat the nail 2 sent from the nail conveyance path 42 to about 170 ° C.
[0025]
When the nail 2 is heated to a predetermined temperature, the gripping part 36 grips the nail 2 of the heating part 38 and moves the nail 2 under the piston part 34. The board surface 6 is moved by the operation of the XY moving device 20 so that the driving position of the nail coincides with the position directly below the nail 2 held by the holding portion 36. When the nail 2 and the nail driving position coincide with each other, the piston portion 34 is operated to press the nail 2 toward the board surface 6. Since the nail 2 is heated to about 170 ° C., that is, a temperature sufficient to soften and melt the board surface 6, the nail 2 easily enters the board surface 6. When the nail 2 is inserted to a predetermined depth, the piston portion 34 stops and moves backward. The nail 2 driven on the board surface 6 is securely fixed on the board surface 6 when the resin on the heated board surface 6 is cooled and hardened.
[0026]
When one nail 2 is erected, the gripping part 36 moves the new nail 2 from the heating part 38 and arranges it at the lower part of the piston part 34. Further, the XY moving device 20 is activated, and a predetermined position where a new nail 2 is to be hit is made to coincide with the bottom of the nail 2. When the predetermined arrangement of the nail 2 and the movement of the board surface 6 are completed, the piston portion 34 is operated in the same manner as described above to drive the nail 2 into the board surface 6. In this way, the nail 2 is driven continuously onto the board surface 6.
[0027]
Therefore, according to the nailing device 1, the nail 2 is heated to about 170 ° C. (a predetermined temperature corresponding to the material of the board surface 6) by the heating unit 38, so that the board surface 6 is softened or melted while being melted. The nail 2 enters the inside, is easily erected on the board surface 6, and is firmly fixed to the board surface 6 as the temperature of the heated resin decreases.
[0028]
In the above example, the heating unit 38 is installed in the vicinity of the piston unit 34. However, a heating device may be installed in the supply device of the nail 2 or the nail conveyance path to heat the nail. Further, the nail driving portion may be heated from the outside by a device that can heat the board surface in a spot manner, such as a laser device, instead of a nail. Furthermore, the heating temperature is not limited to the above example.
[0029]
【The invention's effect】
According to the board surface of the game board, the nail driving method and the nail driving device according to the present invention, the nail is driven while softening and melting the synthetic resin of the board surface by heat, so that the nail is easily driven into the board surface. In addition, since the pilot hole is not required, the nail can be set up at an arbitrary position. Further, since the nail is inserted into the board surface by the softening and melting of the resin, an excessive force is not applied to the board surface, and the board surface is not cracked by the nail driving.
[Brief description of the drawings]
FIG. 1 is a diagram showing an example of a nail driving device according to the present invention.
FIG. 2 is a cross-sectional view showing a board surface and a nail according to the present invention.
FIG. 3 is a cross-sectional view showing another example of a board surface and a nail according to the present invention.
FIG. 4 is a cross-sectional view showing another example of a board surface and a nail according to the present invention.
FIG. 5 is a diagram showing a pilot hole.
FIG. 6 is a cross-sectional view showing another example of a board surface and a nail according to the present invention.
FIG. 7 is a view showing a nail.
FIG. 8 is a view showing a conventional board surface.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Nail driving device 2 Nail 4 Pilot hole 6, 60 Board surface 8 Indentation 10 Groove part 12 Space 14 Protrusion 20 XY movement device 22 Fixing base 24 Driving device 26 Control device 34 Piston part 36 Gripping part 38 Heating part 40 Container 42 Nail conveyance path 50 Pedestal part 62 Nail hole

Claims (6)

A board surface of a game board used in a gaming machine is molded from a synthetic resin, and a nail forming a path of a game ball on the board surface of the game board is heated to at least the softening temperature of the synthetic resin, and the board surface of the game board A method of manufacturing a game board in which the nails are inserted while softening the board surface of the game board,
Providing a board with a narrower hole than the diameter of the nail at the driving position for driving the nail;
A game board manufacturing method, characterized in that a groove portion extending in the axial direction is provided inside the lower hole, and a space is provided for escaping surplus of the game board when the nail is driven. A board surface of a game board used in a gaming machine is molded from a synthetic resin, and a nail forming a path of a game ball on the board surface of the game board is heated to at least the softening temperature of the synthetic resin, and the board surface of the game board A method of manufacturing a game board in which the nails are inserted while softening the board surface of the game board,
A hole is provided at a driving position for driving the nail on the surface of the game board,
The nail has a shape in which a diameter on a tip side from a predetermined position in the axial direction of the nail is thinner than a diameter on a head side in the axial direction, and a step having a diameter at a predetermined position in the axial direction of the nail,
The inner diameter of the lower hole in the axial direction surface side is formed larger than the inner diameter of the inner side, and the diameter of the tip end side of the nail is smaller than the inner diameter of the lower hole in the axial direction surface side and deeper in the axial direction of the lower hole. It is thicker than the inner diameter, the head side diameter of the nail is thicker than the inner diameter of the surface side of the pilot hole,
When the nail is driven into the lower hole, the inner diameter on the axial surface side of the lower hole, the diameter on the tip side of the nail, the step position of the inner diameter of the lower hole, and the diameter of the nail A game board manufacturing method, characterized in that a space is formed between the position of the step and a space is provided to escape the surplus of the game board when the nail is driven.   The game board manufacturing method according to claim 1, wherein the nail is hollow. 2. The game board manufacturing method according to claim 1 , wherein the nail has a protrusion projecting from a diameter of a portion of the nail to be driven into the lower hole on the outer surface of the nail.   The method for manufacturing a game board according to any one of claims 1 to 4, wherein the board surface of the game board is heated, and the nails are driven into the board surface of the game board.   A game board manufactured by the method for manufacturing a game board according to claim 1.

Images