JP3856236B2 - Processed plate and manufacturing method thereof, product plate manufacturing method, and V-cut processing apparatus - Google Patents

Description

  The present invention relates to a processed board, a manufacturing method thereof, a manufacturing method of a product board, and a V-cut processing apparatus, and more specifically, 1 pushed back from a mother board (for example, a printed wiring mother board, a metal plate, etc.). Or a processed board (for example, a mounting board) including a product board (for example, a printed circuit board) formed of two or more pushback plates and / or a V-cut plate temporarily fixed to the frame portion by V-cut; The present invention relates to a manufacturing method thereof, a manufacturing method of such a product plate, and a V-cut processing apparatus used for manufacturing such a processed plate.

  In recent years, with the miniaturization of electronic devices, there has been an increasing demand for miniaturization and modification of printed circuit boards used in electronic devices. On the other hand, an electronic component automatic mounting machine (hereinafter referred to as “self-mounting machine”) such as a chip mounter or an automatic insertion machine for mounting electronic components on a printed circuit board is referred to as the size of a workpiece because of its conveyance. Have upper and lower limits. In addition, the external shape of the workpiece used in the self-machine is required to be substantially rectangular, that is, at least one side is a straight line, and all or a part of the side perpendicular to the straight line is required to be a straight line. The

  Therefore, when mounting electronic components on a small and irregular printed circuit board using a self-mounting machine, first, a plurality of printed circuit boards are formed on the printed wiring board, and the V-cut method and pushback method are used. Using a perforation method, etc., the printed circuit board is temporarily fixed to the original printed wiring board, and then the printed wiring board has a size and shape that can be conveyed by the self-equipment. A method of cutting a substrate (mounting substrate) is used.

Of these, the V-cut method uses a V-shaped groove (V-cut) along the boundary of the printed circuit printed on the printed wiring board, mounts electronic components on the printed circuit, and then cuts the V-cut. It is a method of breaking along.
In the pushback method, the printed circuit board is punched by using a blade having a predetermined shape while holding the printed wiring board between the upper mold and the lower mold, and then the punched printed circuit board is removed from the original hole. It is a method of fitting.
Further, the perforation method is a method in which a large number of small holes are formed along the boundary line of the printed circuit board, and the holes are broken along the small holes.

Each of these processing methods has advantages and disadvantages. For example, the pushback method is not particularly limited in the shape of the printed circuit board, and thus is an effective method especially when electronic components are automatically mounted on an irregular printed circuit board. However, the pushback method generally causes a large warp in the substrate after processing, and the material yield is also low.
On the other hand, the V-cut method has little warping of the substrate and a high material yield, but can be applied only to a printed circuit board having a linear outer shape and cannot be applied to an irregular printed circuit board.
Further, the perforation method is simple, but has a drawback that the accuracy of the external dimensions of the printed circuit board is low.

  In order to solve this problem, various methods have been conventionally proposed. For example, Patent Document 1 discloses a printed wiring board in which a printed circuit board punched out from a printed wiring board is fitted into the original hole, and a plurality of slits are provided at the ears of the printed wiring board. Is disclosed. This document discloses that warp that occurs during pushback processing can be reduced by providing a plurality of slits in the ears of the printed wiring board.

Further, in Patent Document 2, a U-shaped slit (through hole) is provided in a portion protruding in a convex shape, and the bottom of the portion protruding in a convex shape is V along a boundary line with an unnecessary substrate. A printed circuit board having grooves is disclosed.
Patent Document 3 discloses a multi-sided printed wiring board in which perforations are formed around a single substrate and shallow concave grooves are formed around the perforations. This document describes that by forming a shallow concave groove around the perforation, peeling of the substrate can be suppressed when breaking along the perforation.

  Further, Patent Document 4 discloses a printed circuit board in which a mark indicating a stop position is formed in front of a V groove processing stop position on a V groove processing line formed on the printed circuit board. In this document, when the V-groove processing ends in the middle from the edge to the edge of the substrate, if the mark is provided in front of the processing stop position, the processing stop position can be confirmed by visual observation. The point that can be stopped is described.

JP 2001-267700 A FIG. 1 of Japanese Patent Laid-Open No. 5-160539 FIG. 1 of Japanese Utility Model Laid-Open No. 4-38071 Fig. 3 of Japanese Utility Model Publication No. 63-73964

  Currently, resin boards are the mainstream of printed circuit boards used in various electrical devices. Since the resin substrate is hard and fragile, even if a large number of V cuts are formed on the surface of the resin substrate, the strength and flatness that can withstand automatic mounting can be maintained. Further, the substrate can be easily cracked simply by applying a bending stress along the V-cut, and can be easily separated into individual printed circuit boards. Furthermore, when the resin substrate is subjected to pushback processing, the printed circuit board can be easily cracked and the printed circuit board can be removed relatively easily by simply pushing out the printed circuit board from the frame or applying bending stress to the frame. be able to.

  On the other hand, metal substrates (for example, aluminum substrates) are also used for special applications (for example, applications that require high heat dissipation characteristics). If the above-described V-cut method or pushback method can be applied to this metal substrate, the manufacturing cost of the metal substrate can be greatly reduced.

However, the metal substrate has lower hardness and higher toughness than the resin substrate. Therefore, when forming a V-cut from one end to the other end of the metal substrate, if the depth of the V-cut increases, the metal substrate can be easily bent along the V-cut during handling, and can withstand automatic mounting. Strength and flatness cannot be maintained.
On the other hand, if the depth of the V-cut is reduced, the strength and flatness that can withstand automatic mounting can be maintained. However, even if a bending stress is applied to the metal substrate along the V-cut after the automatic mounting is completed, the substrate is only bent and is not easily separated into individual printed circuit boards. In extreme cases, it is difficult to even bend the metal substrate.
Further, when the pushback method is applied to the metal substrate, it is not easy to push out the printed circuit board from the frame part without deforming the printed circuit board because the fastening force by the frame part is strong. Further, even if bending stress is applied to the frame portion, the frame portion only bends and does not break, and it is not easy to separate the printed circuit board from the frame portion.

  Furthermore, it solves various problems as described above, and is obtained by using a V-cut method and / or pushback method suitable for a metal substrate, a processing machine for performing this, and using these methods or processing machines. There is no example in which a processed plate is proposed.

The problem to be solved by the present invention is a processed board (for example, a mounting board) that can withstand automatic mounting and can be easily separated into individual product boards (for example, printed circuit boards) regardless of the material. Is to provide.
Another problem to be solved by the present invention is to provide a method of manufacturing a processed plate that can manufacture such a processed plate at a low cost.
Another problem to be solved by the present invention is to provide a method of manufacturing a product plate that can easily and inexpensively separate the product plate regardless of its material.
Furthermore, another problem to be solved by the present invention is to provide a V-cut processing apparatus capable of easily manufacturing such a processed plate.

In order to solve the above problems, a processed plate according to the present invention communicates with a frame portion, a product plate temporarily fixed to the frame portion, at least around the product plate, and with an outer periphery of the frame portion. 1 or 2 or more V-cuts that are not
The product plate is
A pushback plate punched from the mother board including the frame portion and temporarily fixed to the frame portion by being fitted into the original hole;
A V-cut plate adjacent to the pushback plate and temporarily fixed to the frame portion via the V-cut;
At least both ends of the pushback plate are supported by the frame portion,
The V-cut includes a first V-cut formed on or near a common tangent line of the pushback plate and the frame portion and formed at both ends of the pushback plate .
Also, method for producing a sheet product according to the present invention is to break the frame portion along the V-cut provided in machining plate according to the present invention is summarized in that to separate the product plate from the frame portion.

  In addition, the V-cut processing device according to the present invention includes a table for fixing the mother plate, and a product plate that is disposed on at least one of the upper surface side and the lower surface side of the mother plate and is temporarily fixed to the mother plate. A drill for forming a V-cut that communicates at least with the periphery and does not communicate with the outer periphery of the frame portion for temporarily fixing the product plate, and the drill in a direction perpendicular to the surface of the mother plate And a driving means for moving the drill in a horizontal direction relative to the table surface.

Furthermore, the manufacturing method of the processed plate which concerns on this invention is connected to the at least circumference | surroundings of the product board temporarily fixed to the frame part using the V cut processing apparatus which concerns on this invention, and is connected to the outer periphery of the said frame part. The gist is to form one or two or more V-cuts.
In this case, in the manufacturing method of the processed plate, in the state in which the relative horizontal movement of the drill is stopped, the advance step of moving the drill in the vertical direction with respect to the base plate until reaching a certain cutting depth; A horizontal movement step of stopping the advance of the drill and moving the drill in a horizontal direction relative to the surface of the base plate, and a relative horizontal movement distance of the drill at a predetermined distance When it reaches, it is preferable to include a retreating step of stopping the relative horizontal movement of the drill and retreating the drill in a direction perpendicular to the base plate.
The product plate may be a V-cut plate temporarily fixed to the frame portion and / or another adjacent product plate via the V-cut. The product plate may be a pushback plate that is punched from a mother plate including the frame portion and temporarily fixed to the frame portion by being fitted into the original hole.

When a V-cut is formed that communicates with the periphery of the product plate temporarily fixed to the frame portion by the pushback method or the V-cut method and does not communicate with the outer periphery of the frame portion, the V-cut is formed on the outer periphery of the frame portion. A region that is not formed remains. Therefore, even when the processed plate is made of a metal substrate, the strength and flatness that can withstand automatic mounting can be maintained. After the automatic mounting is completed, the product plate can be separated very easily by bending the frame portion along the V-cut or cutting the end of the V-cut and the outer periphery of the frame portion with an appropriate tool. be able to.
Such a V cut advances the drill for forming the V cut in a direction perpendicular to the surface of the base plate, stops the advance of the drill when a certain depth of cut is reached, and then moves the drill to the base. To move horizontally relative to the surface of the plate, stop the relative horizontal movement of the drill when a certain depth of cut is reached, and retract the drill perpendicular to the surface of the base plate Can be formed.

  Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. In the following description, a printed wiring board, a printed circuit board (pushback board, V-cut board) obtained by processing the printed wiring board, and a mounting board on which the printed circuit board is temporarily fixed will be described. An example to which the invention is applied will be described. The present invention relates to a “mother board” other than a printed wiring board, a “product board” other than a printed circuit board obtained by processing the same, and such a product board. The present invention can also be applied to “processed plates” other than the mounting substrate to which is temporarily fixed. In addition, the present invention is particularly effective when applied to a metal substrate, but can naturally also be applied to a resin substrate.

  FIG. 1 (a), FIG. 1 (b), FIG. 1 (c) and FIG. 1 (d) respectively show a plan view of a mounting substrate according to the first embodiment of the present invention, and A BB 'line sectional view, its CC' line sectional view, and its DD 'line sectional view are shown. In FIG. 1, the dimensions of each part are appropriately enlarged / reduced from the actual dimensions for easy viewing.

  In FIG. 1, a mounting substrate 10 according to the present embodiment includes a frame portion 12 and product plates (pushback plates 14, 14... And V-cut plates 16, 16...) Temporarily fixed to the frame portion 12. 1 or 2 or more V cuts (the 1st V cut 18, 18 and the 2nd V cut 20, 20, ...) which are connected to the outer periphery of the product board at least and are not connected to the outer periphery of the frame part 12 are provided.

The frame portion 12 is for supporting these until the automatic mounting on the pushback plates 14, 14... And the V cut plates 16, 16. At the four corners of the frame portion 12, through holes 12a, 12a,... Serving as reference holes and sub-reference holes for automatic mounting are formed.
Further, one or more slits 12b, 12b that communicate with the outer periphery of the frame 12 and that do not communicate with the pushback plates 14, 14... And the V cut plates 16, 16. ... is formed. The slits 12b, 12b... Are for reducing warpage that occurs during pushback processing. Therefore, the optimal number and length of the slits 12b, 12b... Are selected according to the degree of warpage generated on the mounting substrate 10. In addition, when there is little curvature, you may abbreviate | omit slit 12b, 12b ....

The upper and lower ends (periphery) of the frame portion 12, on the extension lines of the first V cuts 18, 18 formed at both ends of the pushback plates 14, 14... And the V cut plates 16, 16. , 14... And the V-cut plates 16, 16... Are connected to the first V cuts 18, 18 and the second V cuts 20, 20. Uncut cutting tool guide grooves 12c, 12c... Are formed.
The cutting tool guide grooves 12c, 12c,... Are used to assign the cutting edge when the frame portion 12 is cut with a cutting tool such as a nipper after completion of automatic mounting. The cutting tool guide grooves 12c, 12c,... Are not always necessary, but the cutting work is facilitated when they are present. Further, the cutting tool guide grooves 12c, 12c... Do not need to be formed at the ends of all the V cuts, and may be provided at any one of them.

In the frame 12, pushback plates 14, 14... And V cut plates 16, 16... Are alternately arranged along the longitudinal direction of the first V cuts 18, 18. The ends are pushback plates 14 and 14, respectively.
The pushback plates 14, 14... Are punched out from a printed wiring board (mounting board before cutting the outer shape) and fitted into the original holes. The left and right ends of each pushback plate 14, 14... Are supported by the frame portion 12, and the upper and lower ends thereof are supported by the frame portion 12 or the adjacent V-cut plates 16, 16.
The V-cut plates 16, 16... Are areas that remain after the push-back plates 14, 14... Are punched from the mother board at a predetermined interval, and the left and right first V-cuts 18, 18 and the adjacent upper and lower push-back plates. 14, 14 is an area surrounded by 14. The V cut plates 16, 16... Are temporarily fixed to the frame portion 12 via the left and right first V cuts 18, 18.

Further, in the present embodiment, each pushback plate 14, 14... Is formed by integrating two or more first unit plates 14 a, 14 a. In addition, each V-cut plate 16, 16... Is formed by integrating two or more second unit plates 16 a, 16 a. The first unit plates 14a, 14a ... and the second unit plates 16a, 16a ... are printed circuit boards (product boards) which are final products.
The first shared straight line portion and the second shared straight line portion are arranged on a straight line, and the second V cuts 20, 20... Are formed on or near the second V cuts. Each first unit plate 14a, 14a... And each second unit plate 16a, 16a... Are appropriately formed with pin holes, through holes and the like for mounting electronic components.

In FIG. 1, the first unit plates 14a, 14a... And the pushback plates 14, 14 including the same, and the second unit plates 16a, 16a. Is also rectangular, but this is merely an example, and a shape including a curve may be used.
For example, the upper and lower sides of the pushback plates 14, 14... May include curves. In this case, the upper and lower sides of the V-cut plates 16, 16,.
Further, for example, the pushback plates 14, 14... In this case, the first V cuts 18 and 18 may be formed so as to contact the left and right sides of the arc shape.
Further, the left and right sides of the V-cut plates 16, 16... Only need to include straight lines, and it is not necessary for all of them to be straight lines. In this case, if a through hole having a predetermined shape is appropriately formed in the vicinity of the end portion of the V-cut plates 16, 16... (And the pushback plates 14, 14...), The vicinity of the end portions of the pushback plates 14, 14. The shape in the vicinity of the end portions of the V-cut plates 16, 16... Can be arbitrarily determined without being restricted by the shape.

In FIG. 1, “first unit plates 14a, 14a... And second unit plates 16a, 16a...”, “Pushback plates 14, 14. 14 ”and“ V cut plates 16, 16... ”Have the same shape, but they may be different from each other.
For example, the pushback plates 14, 14... And the V cut plates 16, 16... Have the same width, and the first V cuts 18 and 18 are formed in parallel with each other. The lateral width of the plates 16, 16... May be monotonously increased or decreased along the longitudinal direction of the first V cuts 18. In this case, the first V cuts 18 and 18 formed at both ends of the pushback plates 14, 14... Are not parallel to each other.
Similarly, instead of forming the second V-cuts in parallel with each other, forming the first unit plates 14a, 14a,... And the second unit plates 14b, 14b,. You can also.

The first V cuts 18, 18 are formed on or near the boundary line (common tangent line) between each pushback plate 14, 14 ... and the frame portion 12, and at both ends of each pushback plate 14, 14 .... .
Here, “the vicinity of the common tangent” means a position that does not affect the shape and quality of each pushback plate 14, 14... And each V-cut plate 16, 16. The first V-cuts 18 and 18 are most preferably formed immediately above the common tangent line, but the surface of the push-back plates 14, 14... And the V-cut plates 16, 16. This means that the printed circuit formed on the surface and the electronic components mounted on the surface thereafter may be slightly shifted from the common tangent to the right and left as long as they are not damaged.

Similarly, each first shared straight line portion and each second shared straight line portion are arranged on a straight line, and the second V-cuts 20, 20... Are on or in the first shared straight line portion and the second shared straight line portion. It is formed in the vicinity.
Here, “the vicinity of the first shared straight line portion and the second shared straight line portion” refers to a position that does not affect the shape and quality of the first unit plates 14a, 14a... And the second unit plates 16a, 16a. . The second V-cuts 20, 20... Are most preferably formed directly above the first shared straight line portion and the second shared straight line portion, but the first unit plates 14a, 14a... And the second unit plates 16a, 16a. When high dimensional accuracy is not required, from the first shared straight line portion and the second shared straight line portion as long as the printed circuit formed on the surface and the electronic components mounted on the surface thereafter are not damaged. It means that it may be slightly shifted left and right.

  Further, both ends of the first V cuts 18 and 18 extend (overrun) from the end portions of the pushback plates 14 and 14 disposed above and below to the outer periphery of the frame portion 12. The cutting tool guide groove 12 c provided in the structure 12 is not in communication with the cutting tool guide groove 12 c. Similarly, both ends of the second V-cuts 20, 20... Penetrate through the end sides of the pushback plates 14, 14 arranged above and below and extend toward the outer periphery of the frame portion 12 (overrun). The cutting tool guide groove 12c provided in the frame portion 12 is not in communication with the cutting tool guide groove 12c.

The overrun lengths of the first V cuts 18 and 18 and the second V cuts 20, 20... (Or the remaining width of the frame portion 12) are the thickness and usage of the mounting substrate 10, and the electronic components mounted on the mounting substrate 10. The optimum length is selected according to the weight of the etc. In general, the thicker the remaining width of the frame portion 12, the easier it is to maintain the strength and flatness that can withstand automatic mounting. However, if the remaining width is too thick, the cutting operation of the frame portion 12 becomes complicated.
For example, in the case of the mounting substrate 10 on which a relatively heavy electronic component is mounted, in order to maintain the strength and flatness that can withstand automatic mounting and to facilitate the cutting work of the frame portion 12 The remaining width of the frame portion 12 (the length of the region where the V-cut is not formed) is preferably about 5 mm to 10 mm.
On the other hand, in the case of the mounting substrate 10 on which a relatively lightweight electronic component is mounted, in order to maintain the strength and flatness that can withstand automatic mounting and to facilitate the cutting work of the frame portion 12, The remaining width of the portion 12 may be 5 mm or less, or about 2 to 3 mm.
In the case of the mounting substrate 10 shown in FIG. 1, since the cutting tool guide groove 12c is on the extension line of the first V cuts 18, 18 and the second V cuts 20, 20 ..., the first V cuts 18, 18 and the second V cuts 20, The distance from the tip of 20... To the tip of the cutting tool guide groove 12 c may be adjusted according to the use of the mounting substrate 10, required characteristics, and the like.

The first V cuts 18, 18 and the second V cuts 20, 20,... Are preferably formed on the upper and lower surfaces of the mounting substrate 10, as shown in FIG. As long as it is not, it may be formed only on one of the surfaces.
Further, as shown in FIG. 1, the first V cuts 18, 18 and the second V cuts 20, 20,... Are preferably V-shaped with apex angles of about 30 to 50 °, but the bottoms are U-shaped. It may have a mold cross section.
Further, the cutting depths of the first V-cuts 18 and 18 and the second V-cuts 20, 20... Facilitate the cutting operation of the frame portion 12, the pushback plates 14, 14. It is preferable to define as follows. In the mounting substrate 10 according to the present embodiment, since the V-cut does not communicate with the outer periphery of the frame portion 12, the strength and flatness that can withstand automatic mounting are maintained even if the cutting depth is relatively increased. can do.

Next, the operation of the mounting substrate 10 according to the present embodiment will be described. In the mounting substrate 10 according to the present embodiment, the first V cuts 18 and 18 and the second V cuts 20, 20... Are not communicated with the outer periphery of the frame part 12 and are stopped in the middle. The rigidity of is large.
Therefore, even when the mounting substrate 10 is made of a metal substrate, it is not bent along the V-cut during handling, and the strength and flatness that can withstand automatic mounting can be maintained. Moreover, even if the cutting depth of the V-cut is relatively deep, the strength and flatness that can withstand automatic mounting can be maintained.
Further, after the automatic mounting is finished, the pushback plates 14, 14... Are very easily obtained by bending the frame portion 12 along the overrunning V-cut or cutting the tip portion of the V-cut with a tool. And the V-cut plates 16, 16... Can be removed.

  Further, the mounting substrate 10 according to the present embodiment has pushback plates 14, 14... And V-cut plates 16, 16... Alternately arranged, so that only the pushback method is used. High material yield.

  Furthermore, as shown in FIG. 1, a mounting board in which rectangular printed circuit boards having the same dimensions are arranged in the vertical and horizontal directions can be produced only by the V-cut method. However, in this case, it is necessary to perform V-cut processing along the vertical boundary line and the horizontal boundary line, respectively. However, since the mounting substrate 10 according to the present embodiment has the pushback plates 14, 14... And the V cut plates 16, 16. Therefore, the man-hour required for V-cut processing can be significantly reduced, and the manufacturing cost can be reduced.

  Next, a mounting board according to a second embodiment of the present invention will be described. 2 (a), 2 (b), and 2 (c), respectively, a plan view of the mounting substrate according to the present embodiment, a cross-sectional view taken along line BB ′, and CC 'Show cross-sectional view. In FIG. 2, the dimensions of each part are appropriately enlarged / reduced from the actual dimensions for easy viewing.

  2, the mounting substrate 30 according to the present embodiment communicates with a frame portion 32, V cut plates 34, 34... Temporarily fixed to the frame portion 32, and at least around the V cut plates 34, 34. And one or more V-cuts 36, 36... Not communicating with the outer periphery of the frame portion 32.

The frame portion 32 is for supporting these until the automatic mounting to the V-cut plates 34, 34. In the four corners of the frame portion 32, through holes 32a, 22a,... Serving as reference holes and sub-reference holes for automatic mounting are formed.
Further, V cuts are provided on the upper and lower ends and the left and right ends (outer circumferences) of the frame portion 32 and on the extended lines of the V cuts 36, 36... Formed along the boundary lines of the V cut plates 34, 34. Cutting tool guide grooves 32c, 32c, ... that are not in communication with 36, 36 ... are formed. Other points regarding the cutting tool guide grooves 32c, 32c,... Are the same as those in the first embodiment, and thus description thereof is omitted.

  Each of the V cut plates 34, 34... Is composed of an area surrounded by four V cuts 36, 36..., And each of the V cut plates 34, 36. Temporarily secured to the board. The V-cut plates 34, 34... Are printed circuit boards (product boards) that are final products. Each V cut plate 34, 34... Is appropriately formed with pin holes, through holes, etc. for mounting electronic components, although not shown.

Incidentally, In Fig. 2, each V-cut plate 36 ... shape, although a rectangular shape, this is merely illustrative, there may be irregularities in either of the sides. In this case, in order to facilitate the separation of the V-cut plates 36, 36..., It is preferable to appropriately combine pushback processing, punching processing (such as punching processing using a die, router processing), perforation processing, and the like.
Further, the V cuts 36, 36... Arranged in the vertical direction and the V cuts 36, 36... Arranged in the horizontal direction may be formed in parallel with each other according to the shape of the V cut plates 34, 34. Alternatively, they may be formed non-parallel to each other.

The both ends of the V-cuts 36, 36... Extend from the end portions of the V-cut plates 34, 34... Toward the outer periphery of the frame portion 32. The tool guide groove 32c does not communicate with the tool guide groove 32c.
The remaining width of the frame portion 32 (the length of the region where the V cut is not formed) is preferably selected in accordance with the purpose, and the V cuts 36, 36. 30 is preferably formed on the upper and lower surfaces, the cross-sectional shape of the V-cuts 36, 36... Is not necessarily V-shaped, and the depth of cut of the V-cuts 36, 36. The points that are preferably determined so that the cutting operation of 34, 34... Is easy are the same as in the first embodiment.

Next, the operation of the mounting substrate 30 according to the present embodiment will be described. In the mounting substrate 30 according to the present embodiment, the V cuts 36, 36... Are not communicated with the outer periphery of the frame portion 32, and are stopped in the middle, so that the rigidity of the frame portion 32 is large.
Therefore, even when the mounting substrate 30 is made of a metal substrate, or even when the cut depth of the V cuts 36, 36,... Is relatively deep, it is not bent along the V cut during handling. The strength and flatness that can withstand automatic mounting can be maintained.
Further, after the automatic mounting is completed, the frame portion 32 is bent along the overrunning V-cut, or the tip portions of the V-cuts 36, 36. 34, 34 ... can be removed.

  Next, a mounting board according to a third embodiment of the present invention will be described. 3 (a), FIG. 3 (b), and FIG. 3 (c), respectively, a plan view of the mounting substrate according to the present embodiment, a cross-sectional view taken along line BB ′, and CC 'sectional view taken on the line is shown. In FIG. 3, the dimensions of each part are appropriately enlarged and reduced from the actual dimensions for easy viewing.

  In FIG. 3, the mounting substrate 40 according to the present embodiment includes a frame portion 42, a first pushback plate 44 (unit plates 44 a and 44 b) and a second pushback plate 46 that are temporarily fixed to the frame portion 42. V cuts 48, 48... That communicate with at least the outer periphery of the first pushback plate 44 and / or the second pushback plate 46 and do not communicate with the outer periphery of the frame portion 42.

The frame portion 42 is for supporting these until the automatic mounting on the first pushback plate 44 and the second pushback plates 46, 46. .. Are formed at the four corners of the frame portion 42 as reference holes and sub-reference holes for automatic mounting.
Further, one or two or more slits 42b communicating with the outer periphery of the frame portion 42 and not communicating with the first pushback plate 44 and the second pushback plates 46, 46,. 42b ... are formed. Since other points regarding the slit 42b are the same as those of the first embodiment, description thereof will be omitted.

  A V-cut 48 formed at the left end of the first pushback plate 44 at the upper and lower ends (outer periphery) of the frame portion 42, and a V-cut formed at the right ends of the first pushback plate 44 and the second pushback plate 46. 48 and cutting tool guide grooves 42c that are not in communication with the V-cuts 48, 48, respectively, are formed on the extended lines of the V-cuts 48 that are formed at substantially the center of the first pushback plate 44. . In addition, since it is the same as that of 1st Embodiment about the other point regarding the cutting tool guide grooves 42c, 42c ..., description is abbreviate | omitted.

The first pushback plate 44 and the second pushback plate 46 are both punched from a printed wiring board (a mounting board before cutting the outer shape) and fitted into the original holes. The periphery of the first pushback plate 44 and the second pushback plate 46 is supported by a frame portion 42, respectively.
Further, the first pushback plate 44 has an L shape, and the two unit plates 44a and 44b are integrated via a shared straight line portion. A V-cut 48 is provided on or in the vicinity of the shared straight line portion. Is formed. In the present embodiment, the two unit plates 44a and 44b and the second pushback plate 46 are printed circuit boards (product boards) as final products. Furthermore, although not shown, the first pushback plate 44 and the second pushback plate 46 are appropriately formed with pin holes, through holes, and the like for mounting electronic components.

  Note that the shapes of the first pushback plate 44 and the second pushback plate 46 shown in FIG. 3 are merely examples, and the V cuts 48, 48. The V-cuts 48, 48... Are not necessarily parallel to each other, and are formed on or near the tangent line (boundary line) of the first pushback plate 44 and / or the second pushback plate 46. The preferred point is the same as in the first embodiment.

  Both ends of the V cuts 48, 48... Extend from the end portion (or end side) of the first pushback plate 44 or the second pushback plate 46 toward the outer periphery of the frame portion 42 (overrun). However, the cutting tool guide groove 42c provided in the frame portion 42 is not in communication with the cutting tool guide groove 42c. Other points regarding the V-cuts 48, 48... Are the same as those in the first and second embodiments, and thus description thereof is omitted.

Next, the operation of the mounting substrate 40 according to the present embodiment will be described. In the mounting substrate 40 according to the present embodiment, the V cuts 48, 48... Do not communicate with the outer periphery of the frame portion 42 and are stopped in the middle thereof, so that the rigidity of the frame portion 42 is large.
Therefore, even when the mounting substrate 40 is made of a metal substrate, or even when the cut depth of the V cuts 48, 48... Is relatively deep, it is not bent along the V cut during handling. The strength and flatness that can withstand automatic mounting can be maintained.
Further, after the automatic mounting is finished, the first pushback plate 44 is formed by bending the frame portion 42 along the overrunning V-cut, or by cutting the tip portions of the V-cuts 48, 48. Further, the second pushback plate 46 can be removed and the first pushback plate 44 can be easily divided into the unit plates 44a and 44b.

  Next, the V cut processing apparatus according to the present invention will be described. 4 (a) and 4 (b) are respectively a front view and a right side view of a V-cut machining apparatus according to an embodiment of the present invention. In FIG. 4, the V-cut processing device 50 includes a table driving unit 60 and a drill unit 80. The table driving unit 60 is installed on the front side of the pedestal 52, and the drill unit 80 is installed on the back side of the pedestal 52.

  The table driving unit 60 includes a table 62 and a ruler 64 for moving the table 62 in the horizontal direction. The table 62 can be moved in a horizontal direction along a rail 64a provided on a ruler 64 by a driving means (not shown). The table 62 is for fixing the mother board to be processed, and a clamp 66 is provided on the upper surface on the back side. Further, on the upper surface on the right side of the table 62, a support column 68 provided with an air cylinder 68a is erected. The clamp 66 is fixed to a movable part of the air cylinder 68a, and the clamp 66 is moved up and down by operating the air cylinder 68a.

  A handle 70 for manually moving the ruler 64 in the front-rear direction with respect to the pedestal 52 is provided at the lower right side of the ruler 64. Further, limit switches 72 and 72 are provided on the left and right sides of the front surface of the ruler 64. The limit switches 72 and 72 are for stopping the V-cut processing by the drill unit 80 when the table 62 reaches a predetermined position, and the limit switches 72 and 72 are arranged according to the length of the V-cut to be processed. It can be fixed at any position in the horizontal direction.

  The drill unit 80 includes a base 82 erected on the back surface of the pedestal 52, a pair of main shafts 84, 84 projecting horizontally from the base 82 toward the ruler 64, and tips of the main shafts 84, 84. Drills 86, 86 attached in the vertical direction and drill moving means (not shown) for moving the main shafts 84, 84 to which the drills 86, 86 are attached in the vertical direction with respect to the base plate are provided. The main shafts 84, 84 support the drills 86, 86 and transmit the rotational force of a motor (not shown) to the drills 86, 86 at the same time. Further, the drill moving means is interlocked with the above-described limit switches 72 and 72, and when the table 62 moves in the horizontal direction and touches the limit switches 72 and 72, the spindles 84 and 84 are respectively moved to the mother board. It is made to move in the approaching direction or the direction away from the mother board.

  The tip shapes of the drills 86 and 86 are not particularly limited, and an optimum shape may be selected according to the type of the mother board. For example, the drills 86 and 86 may have a V shape with an apex angle of 30 ° to 50 °, or may have a U shape with a flat tip.

  Next, the manufacturing method of the processed plate using the V cut processing apparatus 50 shown in FIG. 4 is demonstrated. First, necessary processing is performed on the mother board in advance. For example, when manufacturing a processed board using the pushback method together, a pushback process is applied to the mother board using a known method. Further, a necessary printed circuit is formed on the surface of the mother board, or various through holes for mounting electronic components are opened. Alternatively, if necessary, the outer shape is first processed on the mother board to prepare the shape.

  Next, the mother board is placed on the table 62 of the V-cut machining apparatus 50, and alignment is performed. Next, the air cylinder 68 a is operated, and the mother board is sandwiched between the clamp 66 and the table 62. Further, the ruler 64 is moved in the front-rear direction by turning the handle 70 so that the tips of the drills 86, 86 are on the V-cut line of the mother board. Further, limit switches 72 and 72 are fixed at predetermined positions according to the length of the V-cut to be processed.

  Next, while driving a motor (not shown) and rotating the drills 86, 86, the spindles 84, 84 are brought close to the mother board using a drill moving means (not shown). When the drills 86 and 86 bite into the mother plate and reach a predetermined cutting depth, the movement of the main shafts 84 and 84 is stopped. Next, the driving means (not shown) is operated to move the mother board in the horizontal direction. Thereby, the rotating drills 86 and 86 can move in the horizontal direction of the mother board while maintaining a predetermined cutting depth, and a V-cut can be formed on the mother board surface. When the table 62 is moved horizontally to a predetermined position and the table 62 comes into contact with the limit switches 72, 72, the horizontal movement of the table 62 is stopped, and the spindles 84, 84 are used by using a drill moving means (not shown). Is moved away from the mother board.

In the case where all necessary processes such as outer shape processing have been performed on the base plate in advance, the processed plate according to the present invention is completed by performing V-cut processing on the base plate. Moreover, when an unprocessed part remains, such as an external shape process, the processed board which concerns on this invention is completed by performing these processes after a V cut process.
The obtained processed board is sent to an automatic mounting process, and various electronic components are mounted on the surface of the processed board. After the automatic mounting, if the frame is bent along the V-cut, or if the tip of the V-cut that is stopped in the middle of the frame is cut using a tool such as a nipper, the frame is temporarily fixed. The product plate can be easily separated.

Next, the operation of the V-cut processing apparatus according to the present invention and the method for manufacturing a processed plate using the same will be described.
Conventional V-cut processing is generally performed by disposing disk-shaped rotary blades on both sides of a base plate and cutting at a certain depth from one end of the base plate toward the other end. Accordingly, both ends of the V-cut are in communication with the outer periphery of the processed plate. Even if such a V-cut is formed on the resin substrate, the resin substrate is hard and has high rigidity, so that it can sufficiently withstand automatic mounting. However, when such a V-cut is formed on a metal substrate, the substrate is easily bent along the V-cut at the time of handling and cannot be automatically mounted. On the other hand, if the depth of the V-cut is reduced, it can withstand automatic mounting, but the product plate is extremely difficult to remove.

  On the other hand, if both ends of the V-cut are not communicated with the outer periphery of the frame portion and are stopped in the middle of the frame portion, the strength enough to withstand automatic mounting can be maintained even with a metal substrate. In order to form such a V-cut using a conventional V-cut processing device, it is necessary to start cutting in the middle of the mother board and stop the cutting in the middle of the mother board.

However, the conventional V-cut machining apparatus, as shown in FIG. 5A, moves the base plate 2 in the horizontal direction at a constant speed v _x and the pair of rotary blades 4, 4 at a constant speed v _y. It is structured to perform the operation of approaching and retracting in the vertical direction at the same time. Therefore, when trying to form a V-cut that is not communicated with both ends of the mother board 2 using such a V-cut machining device, when the cutting is started, the pair of rotary blades 4 and 4 are It approaches from the diagonally upper surface to the surface of 2. In addition, when the cutting is stopped after the movement of the rotary blades 4, 4 is stopped and a predetermined length (L) is cut at a fixed depth, the pair of rotary blades 4, 4 is Retreating obliquely upward with respect to the surface of the plate 2. As a result, regions (ΔL) having a shallow cut depth are formed on both sides of the cut having a certain depth (L). ΔL may reach several tens of mm depending on processing conditions.

On the other hand, in order to shorten ΔL, a method in which the movement of the mother board 2 in the horizontal direction and the movement of the rotary blades 4 and 4 in the vertical direction are performed in stages, that is, as shown in FIG.
(1) in a state in which the mother board 2 is stopped, moved closer to the base plate 2 a pair of rotary blades 4, 4 at a constant speed v _y to a predetermined cutting depth, then,
(2) in a state where movement was stopped rotary blades 4, 4, the base plate 2 is moved in the horizontal direction at a constant speed v _x, further,
(3) horizontal movement of the base plate 2 again to stop the process of retracting from the mother plate 2 rotating blades 4, 4 at a constant velocity v _y, it is also contemplated.
However, even with such a method, the depth of cut becomes shallower on both sides of the length (L) cut having a certain depth, depending on the diameter of the rotary blades 4 and 4 and the depth of cut. A region (ΔL) is generated.

  If the V-cut formed on the surface of the base plate has a region with a small cutting depth (ΔL), peeling or cracking may occur in the region near the V-cut when breaking along the V-cut. Generation | occurrence | production of peeling, a crack, etc. causes the circuit formed in the mother board surface to be lost, or causes the dimensional accuracy of the substrate to decrease. On the other hand, in order to avoid this, if the length (L) of the portion having a certain depth is increased, the V-cut reaches the outer periphery of the frame portion, and the strength of the substrate may be reduced.

On the other hand, a drill has a very small diameter compared with a rotary blade. Therefore, as shown in FIG. 5 (c), in place of the rotary blade, using a drill 86, and a lifting operation at a constant velocity _{v y} of the drill 86, a constant velocity v of the drill 86 _When the horizontal movement operation at _x is performed separately, V-cuts whose both ends are stopped in the middle of the mother board 2 can be easily formed. Moreover, the region (ΔL) where the cut depth of the V cut is shallow is substantially equal to the radius of the drills 86 and 86. Therefore, it is possible to efficiently manufacture a processed plate that can withstand automatic mounting and is extremely easy to remove the product plate.
Furthermore, the V-cut process using such a drill requires less material removal volume than the router process. Therefore, high-speed processing is possible compared with router processing, and the manufacturing cost of the processed plate can be greatly reduced.

Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the present invention.
For example, all of the V-cuts may be formed using the V-cut processing device 50 shown in FIG. 4, but the center portion of the V-cut is processed using a conventional V-cut processing device, and both ends of the V-cut are processed. Only the portion may be processed by the V-cut processing device 50 shown in FIG.

  Further, when forming a V-cut that communicates with the periphery of the product plate, the V-cut is not limited to being formed on or near the tangent line of the product plate, or on the shared straight line portion or in the vicinity thereof, It may be formed from an arbitrary point on the peripheral side of the product plate toward the outer periphery of the frame portion. If the V-cut processing apparatus 50 shown in FIG. 4 is used, even such a V-cut can be easily formed.

  In FIG. 1, the pushback plate 14 and the V-cut plate 16 are both unit plates integrated through a common straight line portion. However, the pushback plate 14 and the V-cut plate 16 are directly used as product plates. Can also be used. In this case, the second V cuts 20, 20,. Similarly, in FIG. 3, when the first pushback plate 44 is used as a product plate as it is, the V cut 48 on the shared straight line portion of the unit plates 44 a and 44 b may be omitted.

Further, the slit formed in the frame portion is for reducing the warp generated in the processed plate, and is therefore effective for the processed plate in which the product plate is temporarily fixed by the pushback method. You may form in the circumference | surroundings of the processed board to which the product board was temporarily fixed by the cutting method.
Furthermore, in the V-cut machining apparatus shown in FIG. 4, the drill is not moved in the horizontal direction, and the table is moved in the horizontal direction. In short, it is only necessary that the drill and the table can move relatively horizontally. . That is, the driving means may fix the table and move the drill in the horizontal direction.

The processed board and the manufacturing method thereof according to the present invention are used as a mounting board in which a printed circuit board made of a resin substrate or a metal substrate is temporarily fixed by a V-cut method and / or a pushback method, and a manufacturing method thereof. it can.
Moreover, the manufacturing method of the product board which concerns on this invention can be used as a manufacturing method of the printed circuit board which consists of a resin substrate or a metal substrate.
Furthermore, the V-cut processing apparatus according to the present invention can be used for V-cut processing on such a mounting substrate.

1 (a), FIG. 1 (b), FIG. 1 (c), and FIG. 1 (d) are respectively a plan view of a processed plate according to the first embodiment of the present invention, and B -B 'sectional view, CC' sectional view, and DD 'sectional view. 2 (a), 2 (b), and 2 (c) are a plan view of a processed plate according to a second embodiment of the present invention and a cross-sectional view taken along the line BB ′, respectively. And a sectional view taken along the line CC ′. 3 (a), 3 (b), and 3 (c) are a plan view of a processed plate according to a third embodiment of the present invention, and a cross-sectional view taken along line BB ′, respectively. And a sectional view taken along the line CC ′. FIG. 4A and FIG. 4B are a front view and a right side view of a V-cut machining apparatus according to an embodiment of the present invention, respectively. It is a schematic block diagram explaining the V cut processing method using the conventional V cut processing apparatus and the V cut processing apparatus which concerns on this invention.

Explanation of symbols

10 Mounting board (processed board)
12 Frame part 14 Pushback board 14a 1st unit board (product board)
16 V-cut plate 16a Second unit plate (product plate)
18 First V-cut (V-cut)
20 Second V-cut (V-cut)
30 Mounting board (processed board)
32 Frame 34 V-cut board (Product board)
36 V-cut 40 Mounting board (processed board)
42 Frame portion 44 First pushback plates 44a, 44b Unit plate (product plate)
46 Second pushback plate (product plate)
48 V-cut 50 V-cut processing device 62 Table 68 Drill

Claims (12)

A frame,
A product plate temporarily fixed to the frame portion;
Communicating with the periphery of at least the product sheet, and Bei example and one or more V-cut that is not communicating with the outer periphery of the frame portion,
The product plate is
A pushback plate punched from the mother board including the frame portion and temporarily fixed to the frame portion by being fitted into the original hole;
A V-cut plate adjacent to the pushback plate and temporarily fixed to the frame portion via the V-cut;
At least both ends of the pushback plate are supported by the frame portion,
The V-cut includes a first V-cut formed on or near the common tangent line of the pushback plate and the frame portion and formed at both ends of the pushback plate. The pushback plate is composed of two or more first unit plates integrated through a first shared straight line portion,
The V-cut plate is composed of two or more second unit plates integrated through a second shared straight line portion,
The first shared straight line portion and the second shared straight line portion are aligned on a straight line,
The V-cut, machining plate according to claim 1 comprising a first 2V cut formed on or near the first shared linear portion and the second shared linear portion. The processed plate according to claim 1 , further comprising a cutting tool guide groove that is on an extension line of the V-cut and is not communicated with the V-cut on an outer periphery of the frame portion. Communicating with the outer periphery of the frame portion, and machining plate according to any one of the product sheets according to claim 1, further comprising one or more slits do not communicate with the three or. The processed plate according to any one of claims 1 to 4 , wherein the frame portion and the product plate are made of a metal material. The manufacturing method of the product board which fractures | ruptures the said frame part along the said V cut with which the said processed board in any one of Claim 1-5 is equipped, and isolate | separates the said product board from the said frame part. A table for fixing the mother board;
An outer periphery of a frame portion that is disposed on at least one of the upper surface side and the lower surface side of the base plate, communicates with at least the periphery of the product plate temporarily fixed to the base plate, and temporarily fixes the product plate A drill for forming a V-cut that is not in communication with
Drill moving means for raising and lowering the drill in a direction perpendicular to the surface of the mother plate;
A V-cut machining apparatus comprising drive means for moving the drill relative to the table surface and in the horizontal direction. Using the V-cut processing device according to claim 7, one or more V-cuts communicating with at least the periphery of the product plate temporarily fixed to the frame and not communicating with the outer periphery of the frame are performed. A method for manufacturing a processed plate to be formed. An advancing step of advancing the drill in a direction perpendicular to the base plate until a certain depth of cut is reached with the relative horizontal movement of the drill stopped;
A horizontal movement step of stopping the advance of the drill and moving the drill in a horizontal direction relative to the surface of the mother plate;
Upon reaching distance relative horizontal movement distance of the drill is predetermined, the relative horizontal movement of the drill is stopped, the drill and a retraction step of retracting in a direction perpendicular to the base plate according Item 9. A method for producing a processed plate according to Item 8 .   The method for manufacturing a processed plate according to claim 8 or 9, wherein the product plate includes a V-cut plate temporarily fixed to the frame portion and / or another adjacent product plate via the V-cut.   The said product board contains the pushback board punched from the mother board containing the said frame part, and was temporarily fixed by the said frame part by being inserted in the original hole. Method of manufacturing processed plates.   The manufacturing method of the product board which fractures | ruptures the said frame part along the said V cut with which the said processed board obtained by the method in any one of Claim 8-11 is provided, and isolate | separates the said product board from the said frame part .

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