JP3853022B2 - Bonding method for bonding electronic parts - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component bonding bond coating method for coating a substrate with a bond for bonding an electronic component to a substrate.
[0002]
[Prior art]
In order to bond various kinds of electronic components to a substrate, a bond is applied to a predetermined position of the substrate. In this case, if the bond application amount is too small, the adhesive strength of the electronic component will be insufficient, and if it is excessive, problems such as the electronic component being buried in the bond will occur. Must be adjusted.
[0003]
[Problems to be solved by the invention]
The adjustment of the coating amount has been conventionally performed by changing the size of the air pressure for pressurizing the bond stored in the syringe, the pressurization time, and the like. However, when the bond is applied by the bond applicator, there are factors that affect the amount of bond applied in addition to factors such as the magnitude of air pressure and pressurization time. For example, the amount of bond applied to the substrate varies empirically depending on factors such as moving the syringe relative to the substrate, that is, the interval distance of the application timing, and the timing of applying the syringe by lowering the syringe onto the substrate. Known to. However, the relationship between these factors and the coating amount of the bond has not been clarified.Even if the coating amount is adjusted by changing the factor setting, each coating point must be applied when applying the bond to the substrate. However, there is a problem that variation in coating amount occurs.
[0004]
Therefore, the present invention provides an electronic component that does not vary in the amount of bond applied to a large number of application points on a substrate with different application conditions such as the moving distance of the syringe and application timing, and that can apply the bond stably at high speed. It is an object of the present invention to provide a method for applying an adhesive bond.
[0005]
[Means for Solving the Problems]
The present invention relates to a syringe that discharges from a nozzle and applies it to a substrate by pressurizing a bond stored in the inside with air pressure, a substrate positioning portion provided below the syringe, and a syringe relative to the substrate. A bonding table for bonding an electronic component by a bonding apparatus including a moving table that moves the plate in a horizontal direction and a recognition unit that optically recognizes the applied bond and obtains a coating amount of the bond, Each time the type of bond to be used or the type of nozzle changes, a test application of the bond according to a preset application pattern, and a bond at each application point that has been trial applied is optically recognized by the recognition means. From the step of obtaining the application amount, the obtained application amount data, and the position data of each application point, the start of pressurization of air pressure for causing the syringe to perform the discharge operation. Application condition adjustment data indicating the relationship between the parameters of the retroactive discharge time from the time when the syringe is moved horizontally to the time when the bond discharged to the lower end of the nozzle is applied to the substrate and the amount of bond applied to the substrate And adjusting the air pressure pressurization time based on the process of storing in the application condition adjustment data storage unit, the parameters of the ejection retroactive time obtained from the position data of the application point of each bond, and the application condition adjustment data And a step of performing.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
According to the present invention having the above-described configuration, the trial application of the bond is performed every time the type of the bond or the nozzle is changed, and the ejection retroactive time from the start of ejection from the nozzle to the application to the substrate is determined based on the result of the trial application. The application condition adjustment data representing the relationship between the parameter and the application amount is automatically generated, and when applying the bond, the pressurization time is adjusted based on the application condition adjustment data, so that the lower end of the nozzle at the application point It is possible to keep the adhesion amount of the bond adhering to the substrate constant, and therefore it is possible to apply the bond with a stable application amount.
[0007]
Next, embodiments of the present invention will be described with reference to the drawings. 1 is a perspective view of a bond coating apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view of a substrate showing a bond coating mode by the bond coating apparatus, and FIG. 3 is a control of the bond coating apparatus. 4A is a timing chart of the coating operation of the bond coating apparatus, FIG. 4B is an enlarged view of the nozzle of the bond coating apparatus, and FIG. 4C is the bond coating. FIG. 5A is a timing chart of the coating operation of the bond coating device, FIG. 5B is an enlarged view of the nozzle of the bond coating device, and FIG. 5 (c) is a graph showing the amount of bond adhesion at the lower end of the nozzle of the bond applicator, FIG. 6 (a) is a timing chart of the application operation of the bond applicator, and FIG. 6 (b) is the bond bond. Enlarged view of nozzle of coating device, Fig. 6 (c) shows the same bond FIG. 7 is a flowchart for feeding forward the coating amount of the bond coating device, and FIG. 8 is the movement distance and coating area of the syringe of the bond coating device. FIG. 9 is a graph showing the relationship between the pressurizing time and the coating area of the bonding apparatus, FIG. 10 is a flowchart for automatically generating coating condition adjustment data for the bonding apparatus, and FIG. Fig. 12 is a plan view of a dummy substrate of the bond applicator, and Fig. 12 is a graph showing the relationship between the moving distance of the syringe and the application area of the bond applicator.
[0008]
First, the overall structure of the bond coating apparatus will be described with reference to FIG. In FIG. 1, a transparent cover box 12 is covered on the upper part of a main body frame 11, and the components described below are arranged inside the cover box 12. Reference numeral 13 denotes an X table, and reference numeral 14 denotes a Y table disposed on both sides of the X table 13 so as to be orthogonal thereto. A head 15 is mounted on the X table 13. The head 15 holds a plurality of syringes 16 and a camera 10.
[0009]
Bonds are stored in each syringe 16, but the amount of bond applied by each syringe 16 is different and is selectively used according to the target substrate, target chip, and the like. The X table 13 and the Y table 14 which are moving tables are provided with motors Mx and My and a ball screw 18 which is driven by the motors Mx and My to rotate. When the motors Mx and My are driven, the head 15 Moves horizontally in the X and Y directions. For convenience of drawing, only a part of the motors Mx and My and the ball screw 18 are illustrated.
[0010]
Below the moving path of the head 15, a pair of left and right bar-shaped guide rails 19a and 19b are disposed. A conveyor belt 21 that conveys the substrate 20 is provided on the inner surfaces of the guide rails 19a and 19b. A clamper 19c is provided at the center of one guide rail 19a, and the substrate 20 is pressed against the other guide rail 19b and fixed. Therefore, the guide rail 19b and the clamper 19c constitute a positioning portion of the substrate 20. Then, a bond is applied to the substrate 20 thus positioned.
[0011]
Reference numeral 22 denotes a conveyor belt drive motor, and reference numeral 23 denotes a guide rail 19a that is connected to the other guide rail 19b with respect to the other guide rail 19b in order to adjust the distance between the guide rail 19a and the guide rail 19b. A motor 24 for moving in the lateral width direction (Y direction) is a guide for the motor.
[0012]
Next, the test application part 30 of the bond 1 provided on the side part of the guide rail 19b will be described. On the side of the guide rail 19 b, a supply reel 31 and a take-up reel 32 are provided so as to wind up the tape 33 wound around the supply reel 31 by the take-up reel 32. The tape 33 is a transparent or translucent light-transmitting tape and is made of a synthetic resin or the like.
[0013]
A light source portion (not shown) having a light source is disposed below the horizontal running portion of the tape 33 and irradiates light toward the tape 33. Reference numeral 34 denotes a cradle for the tape 33 disposed immediately below the horizontal running portion of the tape 33, which is used to hold the tape 33 horizontally, and is formed of a transparent or white light transmitting plate. . The horizontal running portion of the tape 33 serves as a stage for trial application of the bond.
[0014]
FIG. 2 shows how the bond is applied. The syringe 16 discharges the bond 1 from the nozzle 16a while horizontally moving on the substrate 20 in the X direction and the Y direction, and sequentially applies to predetermined application points P (P1, P2, P3,... Pn) of the substrate 20. To do. In the figure, D (D1, D2, D3,... Dn) is the moving distance of the syringe between the application points. Further, Ta (Ta1, Ta2, Ta3,... Tan) is a discharge retroactive time (described later) between the application points. As will be described in detail later, the bonding application apparatus applies air pressure into the syringe 16 in order to discharge the bond 1 from the nozzle 16a while moving the syringe 16 at high speed between the application points having different moving distances D. By adjusting the pressurizing time to be applied, stable application of the bond 1 with a uniform application amount at each application point P1 to Pn is realized.
[0015]
Next, the configuration of the control system of the bond coating apparatus will be described. In FIG. 3, reference numeral 40 denotes a main control unit which receives data from each unit described below and issues a command to each unit to control the overall operation. The application data storage unit 41 stores position data of each application point on the substrate 20 to be applied, that is, coordinates of each application point. The application condition storage unit 42 stores a pressurizing time for discharging the bond 1. The application condition adjustment data storage unit 43 stores the pressurization time adjustment data described above.
[0016]
The recognition unit 44 calculates the application area of the bond applied to each application point based on the image data of each application point captured by the camera 10. The camera 10 and the recognition unit 44 constitute recognition means for obtaining the application area. This application area is used as an index representing the amount of bond 1 applied at each application point. The motor drive unit 45 controls the motors Mx and My of each axis of the X table 13 and the Y table 14 that horizontally move the syringe 16 and the Z-axis motor Mz that moves the syringe 16 up and down. The valve drive unit 46 controls the operation of the pressurizing valve 47 that applies air pressure to the syringe 16.
[0017]
The teaching storage unit 50 includes the following components, and automatically generates application condition adjustment data. The application operation program storage unit 51 stores a sequence of application operation for trial application. The application operation data storage unit 52 stores coordinate data of each application point on which trial application is performed. The application condition adjustment data storage unit 53 stores data for adjusting application conditions when performing trial application. The application area data storage unit 54 stores application area data of each application point sent from the recognition unit 44. The teach operation program storage unit 55 stores a program for calculating a calculation formula for application condition adjustment data from the coordinate data of the trial application point and the application area data.
[0018]
The bond applicator has the above-described configuration. Hereinafter, a method for applying an electronic component bonding bond using the bond applicator will be described. First, before describing the specific operation of the coating apparatus, a method of applying the bond 1 using air pressure will be described with reference to FIG.
[0019]
In this bond coating apparatus, the nozzle 16a is lowered, and the bond 1 discharged and adhered to the lower end portion of the nozzle 16a (the amount Q of the bond 1 is hereinafter referred to as “attachment amount”) is transferred to the substrate 20. Since application of the bond 1 is performed, the timing at which the application is performed (as shown in (e) of FIG. 4B), the nozzle 16 a is lowered and the bond 1 discharged to the lower end of the nozzle 1 is landed on the substrate 20. The amount of adhesion (hereinafter referred to as “the amount of adhesion at the time of application”) Qe at the timing) influences the amount of bond 1 (hereinafter simply referred to as “the amount of application”) Qt actually applied to the substrate 20. That is, if the adhesion amount Qe during application is large, the application amount Qt increases. Conversely, if the adhesion amount Qe is small, the application amount Qt decreases. Therefore, in order to realize the stable application of the bond 1 with the uniform application amount Qt, it is required to make the adhesion amount Qe during application uniform. 4B shows the state immediately before the bond 1 lands on the substrate 20, and the adhesion amount Q at this time is considered to be substantially equal to the above-described adhesion amount Qe during application. Good.
[0020]
Therefore, the relationship between the application amount Qe during application, the timing of moving the syringe 16 in the XY direction and the Z direction, and the drive timing of the pressurizing valve 47 will be described with reference to FIGS. 4 to 6, (a) is a timing chart showing the horizontal direction (XY direction) speed pattern of the syringe 16, the vertical movement speed pattern (Z direction) of the nozzle 16 a, and the opening / closing timing of the pressurizing valve 47. is there. (B) shows the change in the adhesion amount Q of the bond 1 discharged by pressurizing the air pressure in the syringe 16 and the height of the nozzle 16a at each timing. Further, (c) shows a temporal change in the adhesion amount Q of the bond 1.
[0021]
As will be described later, the coating amount Qt of the bond 1 is such that the syringe 16 moves horizontally relative to the substrate 20 from the timing t0 when the pressurization of the air pressure for causing the syringe 16 to perform a discharge operation is started, and the nozzle It depends on a time Ta (referred to as “ejection retroactive time” in the present invention) Ta until the timing t5 at which the bond 1 discharged to the lower end of the nozzle 16a is lowered and applied to the substrate 20 and applied to the substrate 20 is applied ( (Refer to each figure for t0, t5 and Ta). That is, the discharge retroactive time Ta is a parameter of the coating amount Qt of the bond applied to the substrate 20. Further, since the discharge retroactive time Ta is substantially proportional to the distance travel distance D in which the syringe 16 moves from one application point to the next application point, the travel distance D is a parameter of the discharge retroactive time Ta (FIG. 2). FIG. 4 shows the case of the standard movement distance Ds where the movement distance D is a standard numerical value (for example, 10 mm) (that is, when the discharge retroactive time Ta is standard), and FIG. 5 shows the movement distance D of FIG. When it is shorter than Ds, FIG. 6 shows a longer case.
[0022]
In FIG. 4, the time origin t0 is a timing at which a series of operations starts, that is, a timing at which application at one application point is finished and movement to the next application point is started. First, at the time origin t0, the moving speed of the syringe 16 in the XY direction rises, reaches the highest speed at t1, then decelerates, and stops at t2. That is, the syringe 16 reaches the application point at this timing t2. Next, at this timing t2, the Z-axis motor Mz starts driving, and the nozzle 16a starts to descend. At the time origin t0, the pressurizing valve 47 is opened simultaneously with the start of the movement operation in the XY directions, and the discharge of the bond 1 is started from the lower end of the nozzle 16a. In FIG. 4B, broken line arrows A, B, C, and D indicate the flow direction of the bond in the nozzle 16a. The pressurizing valve 47 is opened for a preset time (pressurizing time Td). The pressurization time at the standard movement distance Ds is Tds.
[0023]
As shown in FIGS. 4B and 4C, the adhesion amount Q of the bond 1 discharged to the lower end portion of the nozzle 16a is based on the amount of the bond 1 at the operation start timing (a), that is, the initial adhesion amount Qi. It gradually increases and reaches the maximum amount Qm at the timing t4 when the pressurizing valve 47 is closed as shown in FIG. Thereafter, after the pressurizing valve 47 is closed, as shown by the broken line arrow C in (d), the bond 1 slightly flows backward in the nozzle 16a and the adhesion amount Q of the bond 1 is kept for a certain time (FIG. 4 ( During the period from t4 to t6 indicated by c), the decrease is continued little by little during the following “return time” Tw), and the phenomenon of “return” of the bond 1 is shown. In (D), a bond 1 indicated by a broken line indicates a state of the maximum amount Qm, and a bond 1 indicated by a solid line indicates a bond 1 that is decreasing due to “return”. After this time Tw has elapsed, the adhesion amount Q of the bond 1 becomes a certain amount Qr.
[0024]
Next, at timing t <b> 5, the nozzle 16 a reaches the bottom dead center of the lowering operation, and the bond 1 adhering to the lower end is landed on the surface of the substrate 20 and applied. The amount of bond 1 at this timing t5 is the above-mentioned adhesion amount Qe during application, and in this case, the adhesion amount Qes during application when the movement distance is the standard movement distance Ds. Among these, the application amount Qts (application amount when the movement distance is the standard movement distance Ds) is applied to the substrate 20. As a result, at timing t5, the bond adhesion amount Q decreases by Qts (coating amount when the movement distance is the standard movement distance Ds) as shown in FIG. 4C, and after that, during the return time Tw. It continues to decrease (see the broken line arrow D shown in FIG. 4B). Then, the amount becomes constant at timing t6. In FIG. 4C, a graph q ′ indicated by a chain line after timing t5 indicates an adhesion amount Q when the application is not performed, and a solid line graph q indicates an application amount of the chain line graph at timing t5. It is shifted downward by Qts. In addition, S shown in (f) means an application area of the bond 1 of the application amount Qts applied on the substrate 20, and (G) shows that the nozzle 16a is completely raised and returned at timing t7. As time Tw elapses, the adhesion amount Q becomes a constant amount and remains at the lower end of the nozzle 16a (hereinafter referred to as “residual amount” Qn) Qns (residual amount when the movement distance is the standard movement distance Ds). Shows the state.
[0025]
Next, a case where the moving distance D of the syringe 16 is short (that is, a case where the discharge retroactive time Ta is short) will be described with reference to FIG. As shown in FIG. 5A, the acceleration / deceleration time in the XY directions from t0 to t2 is shorter than that in the case of the standard movement distance Ds in FIG. 4, that is, the movement distance D of the syringe 16 is short. Yes. In the graph showing the temporal change in the adhesion amount Q of the bond 1 in FIG. 5C, the graph a shown by a solid line is applied with the same standard pressurization time Tds as in the case of the standard moving distance Ds shown in FIG. Show the case. A graph q ′ indicated by a chain line after the timing t5 represents the adhesion amount Q of the bond 1 when the application is not performed as in the case of FIG. Moreover, the graph b shown with a broken line has shown the case where adjustment of pressurization time Td is performed, and this is mentioned later.
[0026]
When the moving distance D is short, the moving operation in the XY directions is completed before the time t4 when the pressurizing time Td is up (t2), and before and after the time t4 when the pressurizing valve 47 is closed. The lowering of the nozzle 16a is started, and the bond 1 is applied to the substrate 20 at timing t5. For this reason, application is performed in a state where the adhesion amount Q is not significantly reduced by the return, that is, the application adhesion amount is Qe1 (application amount when the moving distance D is short. Qe1> Qes). The application amount Qt1 of the bond 1 applied to the surface of the substrate 20 (application amount when the movement distance D is short) is larger than that in the case of FIG. In this case, the adhesion amount Q of the bond 1 continues to decrease during the return time Tw (t4 to t6) after the application timing t5 (broken lines indicated by (b) (f) and (g) in FIG. After that, the remaining amount Qn1 is constant (the remaining amount when the moving distance D is short). FIGS. 5B and 5H show a state in which the return of the bond 1 and the raising of the nozzle 16a are completed after the timings t6 and t7.
[0027]
Next, FIG. 6 shows the case where the movement distance D is long (that is, the discharge retroactive time Ta is long). As shown in the graph of FIG. 6A, the time (t1 to t1 ′) during which the constant speed is maintained after acceleration from t0 to t1 is long, and the moving distance D is long. In the graph showing the temporal change of the adhesion amount Q of the bond 1 in FIG. 6C, the graph c shown by a solid line is applied with the same standard pressurization time Tds as the standard moving distance Ds shown in FIG. Show the case. A graph q ′ indicated by a chain line after the timing t5 indicates the adhesion amount Q when the application is not performed. A graph d indicated by a broken line shows a case where the pressurization time Td is adjusted, which will be described later.
[0028]
When the moving distance D is long, the nozzle 16a starts to descend (t3), and at the timing t5 when the bond 1 that has reached the bottom dead center and adheres to the lower end thereof is applied to the substrate 20, the return of the bond 1 occurs. Has already been completed (t6), and the adhesion amount Q of the bond 1 is Qr. That is, the application amount Qe2 (application amount when the movement distance D is long) is equal to Qr (Qe2 = Qr <Qes). As a result, the application amount Qt2 (application amount when the movement distance D is long) is Less than in the case of the two examples of FIGS. FIGS. 6B and 6H show a state where the rise of the nozzle 16a is completed at the timing t7, and the adhesion amount Q is the residual amount Qn2 (the residual amount when the moving distance D is long).
[0029]
As described above, the application amount Qt of the bond 1 applied to the substrate 20 varies depending on the ejection retroactive time Ta (time between timings t0 and t5), but this variation is caused by the return phenomenon of the bond 1 described above. is there. That is, when the application is performed during the return time Tw in which the adhesion amount Q of the bond 1 varies due to the return phenomenon, the bond 1 that adheres to the lower end portion of the nozzle 16a at any timing during the return time Tw. This is because the adhesion amount Qe during application differs depending on whether it is applied on the surface 20 and thus the application amount Qt is different. Conventionally, the discharge retroactive time Ta is long, and the application timing is after the return time Tw has elapsed, that is, the adhesion amount Q of the bond 1 has become a constant amount Qr. This constant amount Qr was not a variation in the coating amount Qt. However, since the discharge retroactive time Ta is long, the tact time is increased as a result, which hinders speeding up.
[0030]
Therefore, in order to shorten the tact time, it is necessary to shorten the discharge retroactive time Ta, and the coating must be performed during the return time Tw. In this case, the adhesion amount Qe during coating is It varies depending on the discharge retroactive time Ta.
[0031]
The timing at which the syringe 16 starts to move horizontally is synchronized with the timing at which pressurization for applying Bond 1 is started, and the discharge retroactive time Ta is equal to the time during which the syringe 16 moves between application points. Further, the time required for this movement and the movement distance D by which the syringe 16 moves between the application points on the substrate 20 may be regarded as being substantially proportional. Therefore, this moving distance D can be used as a parameter for the ejection retroactive time Ta. That is, when the moving distances D are different, the application amount Qe varies, and as a result, the application amount Qt varies.
[0032]
Further, when considering the application conditions of each application point on the substrate 20 in an actual application apparatus, it is more convenient to use the intuitive movement distance D as the distance on the actual substrate 20. In this embodiment, a case where the movement distance D is used as a factor for controlling variation in the coating amount Qt will be described as an example.
[0033]
The actual arrangement of the application points on the substrate 20 varies, and the movement distance D when the syringe 16 moves between the application points is not constant (see application points P1 to Pn in FIG. 2). Therefore, in this case, if the application is performed under the same application condition for all application points, the application amount Qt varies as described above. For this reason, in order to obtain a uniform coating amount Qt, it is necessary to appropriately adjust the coating conditions for each coating point. Hereinafter, the feed-forward control of the coating conditions performed for this purpose will be described with reference to the drawings along the flow of FIG.
[0034]
First, when starting the coating operation, or when moving to the next coating point after finishing the coating of one coating point, the position data of each coating point stored in the coating data storage unit 41 (FIG. 3) according to the movement command. Based on the above, the moving distance D by which the syringe 16 moves is calculated (ST1). Next, a prediction calculation of variation in the coating area S is performed based on the moving distance D (ST2). A calculation formula serving as a reference for the prediction calculation is represented by a graph shown in FIG. FIG. 8 shows data obtained by systematic coating experiments in which the moving distance D is changed with the standard pressurization time Tds and approximated by two straight lines. When the movement distance D is given in ST1, the application area S in the standard pressurization time Tds is obtained from the graph of FIG. Accordingly, a difference ΔS between the application area S and a desired application area Sd is obtained, and this ΔS becomes a predicted variation in the application area S.
[0035]
Next, an adjustment pressurization time Δt corresponding to the variation ΔS of the application area S is obtained from the graph of FIG. 9 (ST3). In this graph as well, the relationship between the pressurization time Td and the coating area S is obtained from experimental data and approximated by a graph. Given the Sd and the variation ΔS to be adjusted, the corresponding Δt is determined as shown in FIG. These application condition adjustment data are stored in the application condition adjustment data storage unit 43 and sent to the main control unit 40 when necessary. The main control unit 40 adds the adjusted pressurization time Δt to the standard application time Tds to obtain an individual pressurization time Td. That is, the bond 1 is discharged and applied by different pressurization times Td adjusted according to the movement distance D of the syringe 16 for each application point.
[0036]
The case where application is performed by feed-forwarding the adjusted pressurization time Δt will be described with reference to FIGS. 5 and 6 again. In FIG. 5, Δt1 shown in the timing chart of (a) is the adjustment pressurization time Δt when the moving distance D is short. That is, in this case, adjustment is performed to shorten the pressurization time Td by Δt1 in order to reduce the adhesion amount Qe during application. As a result, the graph showing the adhesion amount Q of the bond 1 becomes a broken line graph b shown in (c), and the adhesion amount Qe at the time of application is represented by Qe′1 (= Qes) as shown in FIG. It is equal to the case of the distance Ds.
[0037]
In FIG. 6, Δt2 is the adjustment pressurization time Δt when the moving distance D is long. In this case, the pressurization time is adjusted to be increased by Δt2 in order to increase the adhesion amount Qe during application. As a result, the graph showing the adhesion amount Q of the bond 1 becomes a broken line graph d shown in (c), and the application amount Qe at the time of application is indicated by Qe′2 (= Qes), as shown in FIG. It is equal to the case of the distance Ds.
[0038]
As described above, even when the moving distance D of the syringe 16 is different, by adjusting the pressurizing time Td according to the moving distance D, it is possible to always obtain a uniform application amount Qe during application. In the above embodiment, the movement distance D is described as an example of the parameter of the discharge retroactive time Ta. However, the parameter of the retroactive time Ta may be the discharge retroactive time Ta itself, or an X-axis motor or a Y-axis motor. The driving time and the number of revolutions may be used. In short, a parameter having a correlation with the ejection retroactive time Ta may be used.
[0039]
Next, creation of coating condition adjustment data used for calculation of variation in coating amount will be described along the flow of FIG. 10 with reference to each drawing. This operation is performed every time the type of the nozzle 16a or the bond 1 is changed. Conventionally, a systematic application experiment is performed offline in advance, and the data is organized and stored in the application condition adjustment data storage unit 43 in the form of a calculation formula. In this embodiment, a bond application apparatus is used. This application condition adjustment data is created online.
[0040]
First, the position data of the trial application point is read (ST1). Thereby, the trial application point to which the syringe 16 should move is designated, and the syringe 16 moves according to the designation. Further, the movement distance D of the syringe 16 is calculated from this position data. FIG. 11 shows an example of the arrangement of the test application points 60 set on the dummy substrate 20 ′. As shown in FIG. 11, the trial application point 60 has a plurality of trial application points 60 set for each predetermined pitch P (P1, P2, P3,... Pn), and ensures data reliability. N number is sufficient.
[0041]
Next, the trial application of the bond 1 to the application point 60 is performed according to the application pattern determined by the arrangement of the application points and the application order set as described above (ST2). Each time the application operation to each trial application point 60 is completed, the camera 10 (FIGS. 1 and 3) images the trial application point 60 (ST3) and sends the image data to the recognition unit 44 (FIG. 3). Next, the bond size such as the application area of each trial application point 60 is calculated (ST4), and the calculation result is sent to the application area data storage unit 54 (FIG. 3).
[0042]
Next, an application area variation prediction calculation formula is calculated based on the application area data and the movement distance D. As shown in FIG. 12, the coating area data obtained in ST4 is represented as a set G (G1, G2,... Gn) of data points whose moving distances on the horizontal axis are P1 to Pn, respectively. The application area variation prediction calculation formula is calculated by expressing the data point with an appropriate approximate calculation formula that approximates the data points. In the present embodiment, an approximate expression is created by a broken line 61 composed of two straight lines. The graph shown in FIG. 12 corresponds to the graph of FIG. The application condition adjustment data created in this way is sent to the application condition adjustment data storage unit 43 and used for applying the bond 1 to the substrate 20.
[0043]
In the above embodiment, the coating area is used as an index representing the size of the applied bond, but the point is that it can express the amount of the applied bond quantitatively. An index, for example, the applied bond may be regarded as an approximate circle and its diameter may be used. In the above embodiment, the trial application pattern is defined by the arrangement of the trial application points 60, that is, the pitch P between the trial application points. However, the trial application pattern is limited to this. Instead, the application pattern of the trial application is set using parameters having a correlation with the above-described discharge retroactive time Ta, such as the discharge retroactive time Ta itself, the driving time and the rotational speed of the X-axis motor and the Y-axis motor You can also. In this case, the distances between the respective trial application points may be the same, and instead, the trial application is performed by changing the time interval of the application operation at each application point according to a parameter correlated with the ejection retroactive time Ta. The application pattern is set.
[0044]
As described above, in the present embodiment, trial application is performed to determine the bond size such as the application area, application condition adjustment data is created based on the result, and the syringe 16 is used using the application condition adjustment data. However, the variation of the coating amount caused by the difference in the moving distance D that moves between the coating points is adjusted.
[0045]
【The invention's effect】
The present invention performs trial application of the bond every time the type of the bond or nozzle changes, and based on the result of the trial application, the parameters and application area of the ejection retroactive time from the start of ejection from the nozzle to the application to the substrate The application condition adjustment data that expresses the relationship is automatically created, and when applying a bond to the substrate, the pressurization time is adjusted based on this application condition adjustment data, so the type of bond or nozzle is changed. However, even when applying the bond, the amount of the bond adhering to the lower end of the nozzle can be kept constant at the application timing, and the application amount can be reduced by adjusting the driving time of the pressure valve. A stable bond can be applied. Furthermore, since the amount of bond adhesion after discharging the bond from the nozzle is not stable and the bond can be applied by landing the nozzle on the substrate during the bond return time, the discharge retroactive time can be shortened, Therefore, the time interval of the coating operation at each coating point is shortened, and the total tact time can be significantly shortened. As a result, it is possible to apply the bond to the substrate at a high speed and a stable coating amount, which was impossible in the past.
[Brief description of the drawings]
FIG. 1 is a perspective view of a bonding apparatus according to an embodiment of the present invention.
FIG. 2 is a perspective view of a substrate showing a bond application mode by a bond application apparatus according to an embodiment of the present invention.
FIG. 3 is a block diagram of a control system of the bond coating apparatus according to the embodiment of the present invention.
FIG. 4A is a timing chart of the coating operation of the bond coating apparatus according to the embodiment of the present invention.
(B) The enlarged view of the nozzle of the bond coating device of one embodiment of the present invention
(C) The graph which shows the bond adhesion amount of the lower end part of the nozzle of the coating device of the bond of one embodiment of the present invention.
FIG. 5A is a timing chart of the coating operation of the bond coating apparatus according to the embodiment of the present invention.
(B) The enlarged view of the nozzle of the bond coating device of one embodiment of the present invention
(C) The graph which shows the bond adhesion amount of the lower end part of the nozzle of the coating device of the bond of one embodiment of the present invention.
FIG. 6A is a timing chart of the coating operation of the bond coating apparatus according to the embodiment of the present invention.
(B) The enlarged view of the nozzle of the bond coating device of one embodiment of the present invention
(C) The graph which shows the bond adhesion amount of the lower end part of the nozzle of the coating device of the bond of one embodiment of the present invention.
FIG. 7 is a flowchart for feeding forward the coating amount of the bond coating apparatus according to the embodiment of the present invention.
FIG. 8 is a graph showing the relationship between the moving distance of the syringe and the coating area of the bond coating device according to the embodiment of the present invention.
FIG. 9 is a graph showing the relationship between the pressurizing time and the coating area of the bond coating apparatus according to the embodiment of the present invention.
FIG. 10 is a flowchart for automatically generating coating condition adjustment data of the bond coating apparatus according to the embodiment of the present invention.
FIG. 11 is a plan view of a dummy substrate of the bond coating apparatus according to the embodiment of the present invention.
FIG. 12 is a graph showing the relationship between the moving distance of the syringe and the coating area of the bond coating device according to the embodiment of the present invention.
[Explanation of symbols]
1 Bond
10 Camera
11 X table
12 Y table
16 syringe
16a nozzle
19a guide rail
19b Guide rail
19c Clamper
20 substrates
31 Reel
32 Take-up reel
33 tapes
40 Main control unit
41 Application data storage unit
42 Application condition storage unit
43 Coating condition adjustment data storage unit
44 recognition unit
50 Teaching memory
51 Application program storage unit
52 Coating operation data storage unit
53 Coating condition adjustment data storage unit
54 Application area data storage unit
55 Teach operation program storage

Claims (1)

A syringe that discharges from a nozzle and applies it to a substrate by pressurizing the bond stored inside with air pressure, a substrate positioning portion provided below the syringe, and a syringe in a horizontal direction relative to the substrate A method of applying a bond for bonding an electronic component by a bond applicator provided with a moving table to be moved and a recognition means for optically recognizing the applied bond to determine the amount of the bond applied, Each time the type or type of nozzle changes, a test application of the bond is performed according to a preset application pattern, and the bond application amount is obtained by optically recognizing the bond at each application point applied by the test application. From the process and the obtained application amount data and position data of each application point, is the timing to start pressurizing the air pressure to cause the syringe to perform the discharge operation? Creates application condition adjustment data that shows the relationship between the parameters of the retroactive discharge time between the horizontal movement of the syringe and the application of the bond discharged to the lower end of the nozzle to the substrate and the amount of bond applied to the substrate And storing in the application condition adjustment data storage unit, and adjusting the air pressure pressurization time based on the parameters of the ejection retroactive time obtained from the position data of the application point of each bond and the application condition adjustment data And a method of applying a bond for bonding electronic parts.

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