CN110995986B - Flying shooting method and system and chip bonding method and system - Google Patents
Flying shooting method and system and chip bonding method and system Download PDFInfo
- Publication number
- CN110995986B CN110995986B CN201911150160.3A CN201911150160A CN110995986B CN 110995986 B CN110995986 B CN 110995986B CN 201911150160 A CN201911150160 A CN 201911150160A CN 110995986 B CN110995986 B CN 110995986B
- Authority
- CN
- China
- Prior art keywords
- photographing
- camera
- time
- bonding
- light source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/66—Remote control of cameras or camera parts, e.g. by remote control devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/70—Circuitry for compensating brightness variation in the scene
- H04N23/73—Circuitry for compensating brightness variation in the scene by influencing the exposure time
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/70—Circuitry for compensating brightness variation in the scene
- H04N23/74—Circuitry for compensating brightness variation in the scene by influencing the scene brightness using illuminating means
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
- Die Bonding (AREA)
Abstract
The invention discloses a flying shooting method and system and a chip bonding method and system, relating to the technical field of chip bonding, wherein the technical scheme comprises the following key points: the method comprises the following steps of installing chips at fixed positions, arranging bonding heads for bonding the chips above the chips, planning photographing positions of the chips according to the positions of the chips, planning movement paths of the bonding heads, setting smooth curves on the movement path sections where the photographing positions are located, fixing a camera on the bonding heads, finishing photographing through the camera, enabling the camera to move at a constant speed when the camera moves to the photographing positions, and enabling the product of the moving speed of the camera and the photographing time of the camera to be smaller than the length of pixels of the photos photographed by the camera. The invention improves the matching precision of vision and motion control, reduces the time spent on matching vision and motion control, and has the advantages of improving the precision and efficiency of bonding equipment.
Description
Technical Field
The invention relates to the technical field of chip bonding, in particular to a flying shooting method and system and a chip bonding method and system.
Background
The LED bonding equipment is semiconductor key equipment which is connected with a chip bonding pad and a packaging pin through a metal lead, and the main working principle is as follows: the metal wire and the pressure welding point are heated and ultrasonically treated simultaneously, the contact surface is plastically deformed, the oxide film of the interface is damaged to activate the metal wire and the pressure welding point, and the metal wire and the pressure welding point are mutually diffused to complete connection.
Referring to fig. 1, in the prior art, an LED bonding apparatus includes a worktable, a plurality of clamps for clamping a chip are disposed on the worktable, a bonding head for welding an electronic device in the chip is disposed on the worktable, a frame is provided with a movement mechanism for driving the bonding head to move, and a movement direction of the movement mechanism is controlled by a computer.
And controlling the motion path of the bonding head through a computer, and further welding the electronic device in the chip.
In the prior art, a method for controlling the welding of a bonding head by a computer is that a camera is fixedly connected to the bonding head, a picture is sent to the computer after the camera takes a picture, and the computer plans the moving direction of the bonding head through the picture and then controls the bonding head to weld a chip.
During the operation of the actual bonding apparatus, a plurality of jigs are provided on the table, and a workpiece to be bonded is mounted on each jig.
However, the camera has a limited photographing range, so that the camera only photographs the chip corresponding to the bonding head each time, and the chip is moved to the next chip for photographing after the soldering is completed.
The defects in the prior art are as follows: when the bonding head moves to the position above each chip, the bonding head needs to stop to photograph and then is welded, the acceleration of the bonding head from moving to stopping is large, the bonding head and the camera can vibrate to influence the photographing of the camera, the camera needs to photograph after the vibration stops, and the stay time influences the efficiency of chip bonding.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to: the optical light source controller for the LED bonding equipment has the advantage of improving bonding efficiency.
The technical purpose is realized by the following technical scheme that the flying shooting method comprises the following steps that a motion path is arranged according to a shooting position, the motion path comprises an acceleration area, a uniform speed area and a deceleration area, the shooting position is arranged in the uniform speed area, the shooting position on the motion path is arranged to be a smooth curve or straight line, and the product of the shooting time and the speed of the uniform speed area is smaller than the length of one pixel in a picture.
Through the technical scheme, the motion path is planned firstly, the photographing position can be in a uniform speed state, the motion path is smooth curvilinear motion, in the photographing process, photographing in motion can be achieved, images in the photos are composed of all pixel points, when the motion displacement is smaller than one pixel of the photos, the photos can be in a clear state, the uniform motion can enable the photos to be clearer, the flying photographing method is applied to bonding equipment, the bonding process can enable the bonding process to photograph continuously, the bonding head moves continuously without stopping at a certain photographing point and then moving, the situation that the images are not clear due to the vibration influence of the bonding head caused by stopping photographing well is avoided, or the time for waiting for stopping and waiting for vibration is longer, the bonding efficiency is improved, and the image definition degree is improved.
Furthermore, in the shooting process, light supplement is carried out, wherein the specific mode of light supplement is that the light source exposed before shooting is turned off after shooting, the light source exposed is started through a pulse signal, and the pulse signal is 4-6 times of rated current.
Through above-mentioned technical scheme, let exposure time shorten through pulse signal, shoot in the time that the light source of short time was lighted, improve pulse current, let the process of shooing have sufficient light filling intensity, shorten exposure time, replace the ordinary bright light with the pulse light, can reduce the consumption time of light source, and then can improve the life of light source.
Further, the exposure time point sets stroke compensation, the exposure starting time is a period of time before the photographing position to start the pulse signal, and the exposure advancing time is equal to the time required by the pulse signal to climb from the low potential to the high potential.
Through above-mentioned technical scheme, because the light source is used the pulse light, the signal changes the high level from the low level and needs the time, with the compensation of this part time, can let the exposure time shorter, because, if do not compensate, just need to prolong the exposure time in order to guarantee the time quantum of shooing in the exposure time quantum, so, can carboxylic acid exposure time after carrying out the stroke compensation, and then improve the life of light source.
The utility model provides a fly shooting system, includes motion route planning module, the module of shooing and exposure module, and motion route planning module shoots the position as required and plans the motion route, and in the motion route, the position of shooing that is located the module of shooing sets up to uniform motion, and the position of shooing on motion route sets up to slick and sly curve, the exposure module is used for carrying out light compensation before shooing and passes through above-mentioned technical scheme, and pulse signal can let the light source generate pulse light, and then can shorten the light source time of lighting, improves the signal intensity of light source.
Through the technical scheme, through the setting of motion path planning module, the module of shooing, the exposure module, in camera motion process, shoot, can shoot in succession, use this system in bonding equipment, can solve the bonding head when shooing, need stop the consumption to the time, the efficiency of bonding work has been improved, simultaneously can solve at camera and bonding head from the excessive time to stopping of motion, the vibrations of production, need not wait to shake and stop shooing, simultaneously also can not return because the influence of the vibrations of camera to the photo definition.
A chip bonding system comprises a controller, a bonding head coupled to the controller, a camera fixed to the bonding head and coupled to the controller, and a light source fixed to the camera and coupled to the controller, wherein the controller plans a motion path according to the position of a chip, the motion path sequentially passes through each chip, a photographing position is above the chip, an exposure time point of the light source is before photographing, a closing time point of the light source is after photographing, the motion path is set to be a smooth curve at the photographing position, and the speed of the camera at the photographing point is constant.
Through the technical scheme, the controller controls the motion of the camera, the bonding head and the light source, the motion of the camera, the light source and the bonding head can be enabled to move in a specified path in advance through planning of a motion path, the photographing position is set to be smooth and curved motion at a constant speed, photographing can be enabled to be clearer, the camera does not need to pause between adjacent two photographing, all photos are photographed and then bonded, and the photographing process is enabled to be coherent.
Furthermore, the product of the moving speed of the camera at the shooting point and the shooting time of the camera is less than the length of one pixel of the shot photo.
Through the technical scheme, the image in the photo is composed of each pixel point, and when the moving displacement is smaller than one pixel of the photo, the photo is in a clear state.
Furthermore, a formation compensation unit is arranged in the controller, the formation compensation unit defines a time axis, the time point is represented by a particle on the time axis, the terminal of the starting time point and the terminal of the ending time point of the exposure time are advanced relative to the midpoint of the starting time point and the ending time point of the photographing time, and the advanced length is the length of the time period of the climbing time of the pulse light signal.
Through above-mentioned technical scheme, what the light source was used is the pulse light, and the signal changes the high level from the low level and needs the time, with the compensation of this part time, can let the exposure time shorter because, if not compensate, just need prolong the exposure time in order to guarantee the time quantum of shooing in the exposure time quantum, so, can carboxylic acid exposure time after carrying out the stroke compensation, and then improve the life of light source.
A chip bonding method applying a fly-shooting method is characterized in that: the method comprises the following steps of installing chips at fixed positions, arranging bonding heads for bonding the chips above the chips, planning photographing positions of the chips according to the positions of the chips, planning movement paths of the bonding heads, setting smooth curves on the movement path sections where the photographing positions are located, fixing a camera on the bonding heads, finishing photographing through the camera, enabling the camera to move at a constant speed when the camera moves to the photographing positions, and enabling the product of the moving speed of the camera and the photographing time of the camera to be smaller than the length of pixels of the photos photographed by the camera.
Through the technical scheme, the shooting is carried out in a flying shooting mode, the time of camera pause can be reduced in the bonding process, the vibration caused by camera pause in the bonding process is reduced, the shooting definition is influenced, the time of waiting for vibration is reduced, the motion path required by bonding is planned first, and the situation that the motion is carried out to one chip every time is not needed to be shot.
Further, an error detection unit is arranged in the controller and used for monitoring the time sequences of light source lighting, camera triggering and light source closing in real time, and when the time sequences of the light source lighting, the camera triggering and the light source closing are wrong, the error detection unit sends a stop command to the controller, and the system stops running.
By the technical scheme, the error detection unit stops the system when an error occurs, and the use of unclear photos in the bonding process is reduced.
In conclusion, the invention has the following technical effects:
1. by presetting a path of a constant-speed curve, camera shake caused by stopping the bonding head can be reduced, and further time waste caused by waiting for the end of shake and image blurring caused by shake are reduced;
2. the light source only supplements light in the moment that the shutter is opened, shortens the time that the light source is lighted, can improve light source luminance and then shorten the light supplementing time of light source, and then can shorten the shutter time, because the shutter time is shorter, the pixel that allows is more little, and the image is more clear, and pulse signal can let the light source generate pulse light, and then can shorten light source lighting time, improves the signal intensity of light source, and the setting of the time of shooing can improve the definition of image.
3. The method comprises the steps of planning a motion path, enabling the position of a picture to be in a uniform speed state, enabling the motion path to be in smooth curvilinear motion, enabling the picture to be shot in motion in the picture taking process, enabling the picture to be in a clear state when the motion displacement is smaller than one pixel of the picture, enabling the picture to be clearer due to the uniform speed motion, applying the flying picture shooting method to bonding equipment, enabling the bonding process to be continuously shot, enabling a bonding head to continuously move in the bonding process, not needing to stop at a certain picture taking point and then move, avoiding the situation that the picture is not clear due to the vibration influence of the bonding head caused by stopping and shooting, or enabling the waiting time for stopping and waiting for vibration to be longer, improving the bonding efficiency and improving the image definition degree.
4. Through using flying to clap in bonding equipment, promoted vision and motion control complex precision, reduced the time that vision and motion control complex spent, have the advantage that improves bonding equipment's precision and efficiency.
Drawings
FIG. 1 is a schematic view of a bonding apparatus according to embodiment 1;
FIG. 2 is a flow chart of a method of bonding chips;
FIG. 3 is a schematic diagram of photo site selection;
fig. 4 is a system diagram of a die bonding system.
Reference numerals: 1. a frame; 2. a jig table; 3. a clamp; 4. a chip; 5. a bond head; 6. a camera; 7. and a bonding workbench.
Detailed Description
The embodiment, LED bonding equipment, refer to fig. 1, including frame 1, fixedly connected with anchor clamps workstation 2 on the frame 1, fixedly connected with a plurality of anchor clamps 3 on the anchor clamps workstation 2, anchor clamps workstation 2 top is provided with bonding workstation 7, and bonding workstation 7 is close to anchor clamps workstation one side fixedly connected with bonding head 5.
The chip 4 is fixed on the fixture 3, and the chip 4 is welded and bonded through the bonding head 5.
The bonding head 5 is fixedly connected with a camera 6 with a lens facing the clamp 3, the camera 6 is electrically connected with a computer, a moving mechanism for controlling the movement of the bonding head 5 is arranged on the frame 1, the computer carries out path planning after receiving a picture shot by the camera 6, and the computer controls the bonding head 5 to move according to a specified path so as to weld the electronic device on the chip 4.
A bonding method of a chip 4, which combines fig. 2 and fig. 3.
In the first step, the first step is that,
placing the chips 4 on a fixture worktable 2, and fixing each chip 4 through a fixture 3;
in the second step, the first step is that,
planning a welding sequence of the chips 4, planning a path of the bonding head 5 according to the position of each chip 4 to obtain a welding path diagram, wherein a moving path of the bonding head 5 between the two chips 4 in the path diagram is set to be a smooth curve, the bonding head 5 moves between the two chips 4 as the curve shown in fig. 3, the bonding head 5 moves from a point A to a point B, and the positions passing through P0, P1, P2 and P3 are smooth curve points, so that the vibration of the camera 6 can be reduced, the camera 6 can take pictures in the moving process, a clear picture can be obtained, the waiting for the stop of the vibration is not needed, and the working efficiency is improved.
And thirdly, planning the movement speed of each point of the bonding head 5 on the path diagram, and enabling the smooth curve positions P0, P1, P2 and P3 between the two chips 4 on the path diagram to move at a constant speed.
Because the path planning is already done, the travel of the bond head 5 required to move can be obtained, the moving speed of each point on the path diagram is set by setting the moving time of each section of travel, and the positions P0, P1, P2 and P3 move at a constant speed.
Fourthly, setting the photographing time of the camera 6, and enabling the photographing position of the camera 6 to be at the tangent point position of the smooth curve of P0, P1, P2 or P3 shown in FIG. 3.
Because the path and the speed are planned, the photographing position can be set by setting the photographing time, the speed of the smooth curve position is constant, the instantaneous motion direction of the bonding head 5 on the curve is the tangential direction of the curve, so that the bonding head 5 does constant linear motion, the vibration of the bonding head 5 is small, and the photographing time of the camera 6 is set to enable the picture to be more cleaned at the moment.
In the whole process, the bonding head 5 does not stop in the process of moving from one chip 4 to another chip 4, and the bonding efficiency is improved.
The photographing mode of the camera 6 in this embodiment is an instantaneous exposure mode, and the light emitted from the light source passes through a pulse current to provide instantaneous exposure for the camera 6.
The exposure time is T0, the speed of the bond head 5 at the photo spot is V0, the displacement of the exposure is S0, and the relationship between T0, V0 and S0 is: s0= V0 × T0.
To ensure the clarity of the picture, S0 is less than the length of one pixel on the picture.
A control system for chip bonding, refer to FIG. 2, includes a photographing module, an exposure module, a motion controller and an operation module, wherein the motion controller calculates a motion path, a motion speed, an exposure time and a photographing time, the photographing module can be a camera or a video camera 6, in this embodiment, the camera exposure module is selected as a light source made of a light emitting diode, and the motion controller is used for controlling the motion of a bonding head 5 after receiving an instruction of the operation module.
The exposure module and the operation module are provided with a forming compensation module in time, a light source signal of the light emitting diode is pulse light, and the forming compensation module is used for compensating the climbing time between the brightness of the diode and the brightness of the diode, namely the time required by the pulse signal to climb from a low level to a high level.
In this embodiment, the operation module and the compensation forming module are implemented by the same hardware device, and this embodiment is implemented by a computer.
The operation module calculates a motion path and then sends a motion signal to the motion controller, the motion controller receives the motion signal and then controls the bonding head 5 to move according to the preset motion path and motion speed, the bonding head 5 is fixedly connected with the camera, the operation module calculates photographing time and shutter opening time and then sends a photographing time signal to the photographing module, the photographing module receives the photographing time signal and starts timing, a light source is lightened after timing is finished, and the shutter of the camera triggers the light source to be turned off to finish photographing.
In the specific implementation process, the chip 4 is fixed on the fixture workbench 2 through the fixture 3, the motion path of the bonding head 5 and the motion speed of the bonding head 5 are planned, photographing is carried out at a uniform smooth curve position, the photographing mode is to light the light source, open a shutter of the camera to close the light source, photographing is completed, and the bonding head 5 bonds the chip 4 according to the photographed picture.
In order to reduce the occurrence of errors in the bonding process, an error detection unit is arranged in the controller and used for monitoring the time sequences of light source lighting, camera triggering and light source closing in real time, and when the time sequences of the light source lighting, the camera triggering and the light source closing are wrong, the error detection unit sends a stop command to the controller and the system stops running. And the staff carries out inspection and maintenance.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications of the present embodiment without inventive contribution as needed after reading the present specification, but all of them are protected by patent law within the scope of the claims of the present invention.
Claims (8)
1. A fly-shooting method is characterized in that: the method comprises the following steps of setting a motion path according to a photographing position, wherein the motion path comprises an acceleration area, a uniform speed area and a deceleration area, the photographing position is arranged in the uniform speed area, the photographing position on the motion path is set to be a smooth curve or straight line, the product of photographing time and the speed of the uniform speed area is smaller than the length of one pixel in a picture, in the photographing process, light supplementing is carried out, the specific mode of the light supplementing is that a light source exposed before photographing is turned off, the light source exposed after photographing is turned on through a pulse signal, the pulse signal is 4-6 times of rated current, stroke compensation is set at an exposure time point, the starting time of exposure is that the pulse signal is started at a time before the photographing position, and the time in advance of the exposure is equal to the time required by the pulse signal to climb from low potential to high potential.
2. A method of fly-shooting as claimed in claim 1, characterized in that: the light source comprises a programmable red and blue light set.
3. A flying photography system to which the flying photography method according to any one of claims 1 to 2 is applied, characterized in that: the device comprises a motion path planning module, a photographing module and an exposure module, wherein the motion path planning module plans a motion path according to a photographing position as required, the photographing position of the photographing module is set to be in uniform motion in the motion path, the photographing position of the motion path is set to be a smooth curve, and the exposure module is used for performing light compensation before photographing.
4. A chip bonding control system to which the flying photography method according to any one of claims 1 to 2 is applied, characterized in that: the controller plans a motion path according to the position of the chip, the motion path sequentially passes through each chip, a photographing position is above the chip, an exposure time point of the light source is before photographing, a closing time point of the light source is after photographing, the motion path is set to be a smooth curve at the photographing position, and the speed of the camera at the photographing point is at a constant speed.
5. The chip bonding control system of claim 4, wherein: the product of the moving speed of the camera at the shooting point and the shooting time of the camera is less than the length of one pixel of the shot photo.
6. The control system for chip bonding according to claim 5, wherein: the controller is internally provided with a formation compensation unit which defines a time axis and represents time points by mass points on the time axis, the terminal of the starting time point and the terminal of the ending time point of the exposure time are advanced relative to the midpoint of the starting time point and the ending time point of the photographing time, and the advanced length is the length of the time period of the climbing time of the pulse light signal.
7. A chip bonding method to which the flying photography method according to any one of claims 1 to 2 is applied, characterized in that: the method comprises the following steps of installing chips at fixed positions, arranging bonding heads for bonding the chips above the chips, planning photographing positions of the chips according to the positions of the chips, planning movement paths of the bonding heads, setting smooth curves on the movement path sections where the photographing positions are located, fixing a camera on the bonding heads, finishing photographing through the camera, enabling the camera to move at a constant speed when the camera moves to the photographing positions, and enabling the product of the moving speed of the camera and the photographing time of the camera to be smaller than the length of pixels of the photos photographed by the camera.
8. The chip bonding method according to claim 7, wherein: the controller is internally provided with an error detection unit which is used for monitoring the time sequences of light source lighting, camera triggering and light source closing in real time, and when the time sequences of the light source lighting, the camera triggering and the light source closing are wrong, the error detection unit sends a stop command to the controller, and the system stops running.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911150160.3A CN110995986B (en) | 2019-11-21 | 2019-11-21 | Flying shooting method and system and chip bonding method and system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911150160.3A CN110995986B (en) | 2019-11-21 | 2019-11-21 | Flying shooting method and system and chip bonding method and system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110995986A CN110995986A (en) | 2020-04-10 |
| CN110995986B true CN110995986B (en) | 2021-08-31 |
Family
ID=70085587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911150160.3A Active CN110995986B (en) | 2019-11-21 | 2019-11-21 | Flying shooting method and system and chip bonding method and system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110995986B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113994657B (en) * | 2020-10-20 | 2023-10-17 | 深圳市大疆创新科技有限公司 | Track delay shooting method and device, cradle head camera, unmanned aerial vehicle and handheld cradle head |
| CN112964721B (en) * | 2021-02-01 | 2024-01-30 | 苏州百迈半导体技术有限公司 | Multi-target random array fly-swatter visual detection method and detection system |
| CN112947578A (en) * | 2021-03-18 | 2021-06-11 | 广东安达智能装备股份有限公司 | Non-contact high-precision flying photographing positioning method |
| CN118553650B (en) * | 2024-07-24 | 2024-10-11 | 深圳市德沃先进自动化有限公司 | Measuring method, control device and chip bonding system for chip multidimensional data |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3872566A (en) * | 1974-02-27 | 1975-03-25 | Gca Corp | Multiplexed integrated circuit chip bonding system |
| CN1772428A (en) * | 2004-11-12 | 2006-05-17 | 日立比亚机械股份有限公司 | Laser processing machine and method |
| KR20120129071A (en) * | 2011-05-19 | 2012-11-28 | 주식회사 탑 엔지니어링 | Die bonder constituting User Interface for real-time driving |
| CN103358023A (en) * | 2013-07-18 | 2013-10-23 | 江苏和昊激光科技有限公司 | Automatic alignment laser tailor-welding system |
| CN103426787A (en) * | 2012-05-08 | 2013-12-04 | 韩美半导体株式会社 | Method of inspecting printed circuit board for semiconductor package |
| CN110018166A (en) * | 2019-03-19 | 2019-07-16 | 深圳市派科斯科技有限公司 | A kind of device and method for product appearance defect detection |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103108137B (en) * | 2011-11-14 | 2017-04-12 | 豪威科技股份有限公司 | Common terminal of image sensor system used for transmitting clock signals and control signals |
| WO2017219223A1 (en) * | 2016-06-21 | 2017-12-28 | Shenzhen Genorivision Technology Co. Ltd. | An image sensor with large dynamic range |
| CN207283672U (en) * | 2017-10-10 | 2018-04-27 | 鸿源阳金属制品（昆山）有限公司 | Infrared camera shell module |
-
2019
- 2019-11-21 CN CN201911150160.3A patent/CN110995986B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3872566A (en) * | 1974-02-27 | 1975-03-25 | Gca Corp | Multiplexed integrated circuit chip bonding system |
| CN1772428A (en) * | 2004-11-12 | 2006-05-17 | 日立比亚机械股份有限公司 | Laser processing machine and method |
| KR20120129071A (en) * | 2011-05-19 | 2012-11-28 | 주식회사 탑 엔지니어링 | Die bonder constituting User Interface for real-time driving |
| CN103426787A (en) * | 2012-05-08 | 2013-12-04 | 韩美半导体株式会社 | Method of inspecting printed circuit board for semiconductor package |
| CN103358023A (en) * | 2013-07-18 | 2013-10-23 | 江苏和昊激光科技有限公司 | Automatic alignment laser tailor-welding system |
| CN110018166A (en) * | 2019-03-19 | 2019-07-16 | 深圳市派科斯科技有限公司 | A kind of device and method for product appearance defect detection |
Non-Patent Citations (1)
| Title |
|---|
| 《【飞拍技术】在贴装中的应用案例》;欧姆龙公司;《https://www.fa.omron.com.cn/info/18116.html》;20190322;全文 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110995986A (en) | 2020-04-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110995986B (en) | Flying shooting method and system and chip bonding method and system | |
| CN110018166A (en) | A kind of device and method for product appearance defect detection | |
| WO2021022590A1 (en) | Automatic adhesive injection robot and system thereof | |
| CN107359134B (en) | Method and device for realizing BGA chip repair by using laser | |
| KR20130079148A (en) | Laser soldering system | |
| CN109332840A (en) | A kind of Intelligent welding system and method | |
| CN109484012A (en) | A kind of write-through screen printing system and method with vision-based detection | |
| CN105245871A (en) | Camera module testing machine | |
| JP2000124683A (en) | Image pickup of electronic component and electronic component mounting equipment | |
| KR101021312B1 (en) | Apparatus for alignmenting bonder | |
| CN107655407A (en) | The method for detecting the apparatus and method and mounted lens of the position of LED phosphor | |
| CN1702847A (en) | Ultrasonic wave wire soldering method and wire soldering apparatus | |
| JP2015133404A (en) | Laser type soldering device and soldering method | |
| CN105914171A (en) | Machine visual flight system | |
| CN111367089A (en) | Reflective projection lens adjusting device and automatic adjusting method | |
| CN203509364U (en) | Laser welding correcting device for electronic detonator pin wires | |
| CN206741110U (en) | A kind of optics display module accurate assembly system | |
| CN212463312U (en) | Shooting device, chip mounter module and chip mounter | |
| TWI743603B (en) | Assembly device and manufacturing method of semiconductor device | |
| CN210060038U (en) | Device for loading and unloading chips of multi-path pumping module | |
| CN209505177U (en) | A kind of write-through screen printing system with vision-based detection | |
| EP3863391B1 (en) | Camera for capturing component images, and component mounting machine | |
| JP3987510B2 (en) | Semiconductor bare chip mounting equipment | |
| CN217509149U (en) | Fixed-point induction heating circuit board repair machine | |
| JP4112563B2 (en) | Electronic component mounting method and electronic component mounting apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |