JP2000277546A - Paste applying device and method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a paste applying device which is capable of discharging paste uniformly from an applying nozzle and a paste applying method. SOLUTION: A paste application method is carried out through a manner where an application nozzle 15a is moved with paste 7 discharged, and the paste 7 is applied to an application area demarcated on a lead frame drawing application lines L1 and L2. When the application nozzle 15a is moved based on data as to an application pattern, the intersection height H2 of the application nozzle 15a is controlled by a nozzle height control means at an intersection of the application line L1 and the application line L2 where paste 7 is applied already so as to be higher than an application height H1. By this setup, the paste 7 can be stably discharged at the intersection.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a paste application method for applying a bonding paste in an application area set on an application object such as a substrate.

[0002]

2. Description of the Related Art In die bonding for bonding a chip to a substrate such as a lead frame, a bonding paste is applied to the surface of the substrate. As one of the paste application methods, drawing application is used in which a required application is performed in an application area on a substrate surface by moving an application nozzle while discharging a paste from an application nozzle by a dispenser. In this method, a moving path of a coating nozzle from a coating start point to a coating end point is set in a coating area set according to a chip shape.
This movement path has various shapes according to the application pattern. For example, for a rectangular application area, a cross shape in which the application nozzle is moved in an X shape, or an asterisk shape in which a cross is further superimposed on the cross shape, etc. Is used.

[0003]

In the method using drawing application, drawing application is performed by combining a plurality of paste application lines in an application area based on a predetermined drawing pattern. Here, a new application may occur across the preceding application line on which the paste has already been applied, depending on the application sequence. At the intersection of such application lines, the paste ejected from the application nozzle is ejected onto the already applied application line, so that the paste existing immediately below the ejection port of the application nozzle changes the ejection state such as ejection resistance. As a result, the discharge amount may locally vary. As described above, in the conventional drawing application of the paste, there is a problem that the ejection from the application nozzle is not uniformly performed due to the intersection of the application lines, and the ejection amount varies.

Accordingly, an object of the present invention is to provide a paste coating apparatus and a paste coating method capable of uniformly discharging from a coating nozzle.

[0005]

According to a first aspect of the present invention, there is provided a paste coating apparatus which discharges a paste from a discharge port of a coating nozzle while relatively moving a coating nozzle with respect to the coating target, and discharges the paste from the discharge nozzle of the coating nozzle. A paste application device that applies paste while drawing an application line in an application area set on a surface, wherein a discharge unit that discharges paste from the discharge port, and the application nozzle is relatively moved with respect to an application target. Moving means for moving, storage means for storing the data of the application pattern, control means for controlling the moving means based on the data of the application pattern, the application line and the preceding application line on which the paste has already been applied. Nozzle height control means for controlling the height of the application nozzle at the intersection of.

According to a second aspect of the present invention, the paste is ejected from an ejection port of the application nozzle while moving the application nozzle relatively to the object to be applied, and the paste is set on the surface of the object to be applied. A paste application method of applying a paste while drawing an application line in an area, wherein when the application nozzle is moved by a moving unit based on data of an application pattern, the application line and the pre-application where the paste is already applied are applied. The height of the coating nozzle at the intersection with the line is controlled by the nozzle height control means.

According to the present invention, the discharge of the paste at the intersection is stabilized by controlling the height of the application nozzle at the intersection between the application line in the application area and the preceding application line on which the paste has already been applied. be able to.

[0008]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a perspective view of a die bonding apparatus according to an embodiment of the present invention, FIG. 2 is a block diagram showing a configuration of a control system of the die bonding apparatus, FIG. 3 is an explanatory view of the paste application pattern, and FIG. FIGS. 5A, 5B, and 5C are graphs showing a moving pattern of the application nozzle in the paste application pattern, and FIGS.

First, the structure of a die bonding apparatus will be described with reference to FIG. In FIG. 1, a wafer sheet 2 is held by a chip supply unit 1 by a holding table (not shown). A large number of chips 3 as semiconductor elements are attached to the wafer sheet 2. A transport path 5 is provided on the side of the chip supply unit 1, and the transport path 5 transports the lead frame 6 and positions the lead frame 6 at the paste application position and the bonding position. A bonding head 4 is provided above the chip supply unit 1, and the bonding head 4 is moved horizontally and vertically by a moving mechanism (not shown).

A paste application section 9 is provided on the side of the transport path 5. The paste application unit 9 includes a moving table 10
Syringe 1 of dispenser provided with application nozzle 15a
5 is mounted. The moving table 10 is Y
The X-axis table 12 is stacked on the axis table 11, and the Z-axis table 1 is further placed thereon via the L-shaped bracket 13.
4 in the vertical direction. The Y-axis table 11, the X-axis table 12, and the Z-axis table 14 are respectively a Y-axis motor 11a, an X-axis motor 12a, and a Z-axis motor 1.
4a.

The syringe 15 is driven by driving the X-axis motor 12a, the Y-axis motor 11a, and the Z-axis motor 14a.
Moves horizontally and vertically on the lead frame 6. A paste 7 for adhering the chip 3 to the lead frame 6 is stored inside the syringe 15, and the valve 15 b that opens and closes the application nozzle 15 a while applying air pressure to the inside of the syringe 15 is opened, so that the application is performed. The paste is discharged from the discharge port of the nozzle 15a. The Z-axis table 14 provided with the Z-axis motor 14a serves as a nozzle height control unit.

A chip bonding portion 6a of the upper surface of the lead frame 6 to which the chip 3 is bonded is an application area 6a to which the paste is applied, and a coating nozzle 15a
Is positioned within the application area 6a, and the application nozzle 1
By moving the application nozzle 15a while discharging the paste from 5a, the paste 7 is applied in an X-shaped drawing pattern in the application area 6a set on the surface of the lead frame 6 to be applied. Syringe 1
5. The air pressure applying means for applying air pressure to the application nozzle 15a and the syringe 15 is a paste discharging means, and the moving table 10 is a moving means for moving the discharge port of the coating nozzle 15a.

After the application of the paste, the lead frame 6 is sent to the bonding position 8 on the transport path 5 and positioned. Then, the chip 3 picked up from the chip supply unit 1 by the nozzle 4a of the bonding head 4 is bonded onto the paste 7 applied in the application area 6a.

Next, a control system of the die bonding apparatus will be described with reference to FIG. In FIG. 2, the air source 20
Is supplied through the regulator 21 into the syringe 15. The regulator 21 can remotely control the set pressure.
By controlling with 8, the pressure of the air supplied to the syringe 15 is adjusted, and the discharge amount of the paste discharged from the application nozzle 15a can be controlled. The valve driving unit 22 is a valve 15 that opens and closes the application nozzle 15a.
Drive b. By controlling the valve driving unit 22 by the control unit 28, the discharge of the paste from the application nozzle 15a can be interrupted. Note that the set pressure of the regulator 21 may not be controlled by the control unit 28 but may be set manually to obtain a required discharge amount.

The X-axis motor drive unit 23, the Y-axis motor drive unit 24, and the Z-axis motor drive unit 25 correspond to the X-axis motor 12a, the Y-axis motor 11a, and the Z-axis motor 11a of the moving table 10, respectively.
The shaft motor 14a is driven. Control unit 28 as control means
X-axis motor drive unit 23, Y-axis motor drive unit 24
By controlling the Z-axis motor drive unit 25, the operation of the moving table 10 is controlled.

The storage unit 26 stores the data of the application pattern by the application nozzle 15a, that is, the data such as the position of the application start point and the application end point set in the application area, the moving speed pattern of the application nozzle 15, and the discharge of the paste. Data such as the amount and the height position data of the application nozzle at the time of application are stored. That is, the storage unit 26 is a storage unit. The moving operation of the application nozzle 15a driven by the moving table 10 by the control unit 28 based on the data stored in the storage unit 26 and the nozzle 15a of the syringe 15
By controlling the discharge operation of the paste from the paste, the paste can be applied to the application area 6a in a predetermined drawing pattern and at a predetermined nozzle height. The bonding head driving unit 27 drives the bonding head 4 under the control of the control unit 28.

Next, the application pattern of the paste applied in the application area 6a will be described with reference to FIG. As shown in FIG. 3, application lines L1 and L2 of the paste 7 forming the X shape are formed in the application area 6a. Application line L
1, L2 are the coating start point P1 and the coating end point P2, respectively.
The position is determined by the application start point P3 and the application end point P4. The application line L1 is applied before the application line L2. Therefore, the application line L1 is a preceding application line of the application line L2, and the application line L2 intersects the intersection C with the application line L1.
Intersect at P.

This bonding apparatus is configured as described above, and the operation of the bonding apparatus will be described below. In FIG. 1, a lead frame 6 is transported on a transport path 5 and positioned below a paste application section 9. Next, the moving table 10 is driven to position the application nozzle 15 a of the syringe 15 on the application area 6 a of the lead frame 6. First, the application nozzle 15a is lowered to the application start point P1, and the application nozzle 15a is discharged while discharging the paste.
Is moved to the application end point P2 to thereby apply the application line L1.
To form Thereafter, the application nozzle 15a is moved to the application end point P2.
To the next application start point P3 without discharging the paste. The application line L2 is formed by moving the application nozzle 15a from the application start point P3 to the application end point P4 while discharging the paste. During this movement, the coating line L2 intersects the preceding coating line L1 at the intersection CP.
Meet at

At the intersection CP, the condition of the paste discharged from the discharge port of the coating nozzle 15a, which affects the discharge amount such as the discharge resistance, changes due to the presence of the paste of the coating line L1 that has already been coated, and the paste is uniformly discharged. May not be performed. Therefore, the following operation is performed in order to prevent such a variation in the ejection state. Hereinafter, the nozzle control at the intersection of the application lines will be described with reference to FIGS. FIG. 4 shows the nozzle moving speed V, the paste discharge amount Q, and the coating nozzle 15 of the coating nozzle 15a in the drawing coating.
The change of the nozzle height H indicating the distance between the lower end portion of “a” and the application surface is shown by a graph.

As shown in FIG. 4, when the coating line L1 is formed, a period from a timing t0 when the coating nozzle 15a starts moving from the coating start point P1 to a timing t1 when the coating nozzle 15a reaches the coating end point P2 is set. The moving speed V is a set speed V0 set as a normal moving speed from 0 in a trapezoidal pattern.
Similarly, during this period, the paste discharge amount from the application nozzle 15a also changes from 0 to the set discharge amount Q0. During this time, the nozzle height is changed from the rising position height H0 to the coating height H1.
And the coating height H1 is maintained. Then, while the application nozzle 15a moves from the application end point P2 to the application start point P3 of the application line L2, the paste discharge amount Q is 0, and no discharge is performed.

Thereafter, while the application of the application line L2 is performed, the same pattern as the application of the application line L1 is repeated for the nozzle moving speed V and the paste discharge amount Q. The timing t4 at which the coating line L2 crosses the preceding coating line L1
From time t5 to time t5, the nozzle height is
From the application height H1 shown in FIG. 5 to the cross height H2 shown in FIG.
, And returns to the coating height H1 after the timing t5. That is, at the intersection of the application lines, the application height is changed to a height in consideration of the application height of the preceding application line.

Thus, when the paste 7 is discharged above the previously applied line L1 already applied at the intersection of the applied lines, the discharge state from the discharge port of the application nozzle 15a is determined by the presence of the paste of the previous applied line L1. And the paste is uniformly discharged. As described above, by controlling the height position of the application nozzle 15a at the intersection of the application lines in the application area, the paste ejection from the application nozzle 15a can be made uniform and a predetermined application amount without variation can be secured. it can.

[0023]

According to the present invention, the height of the application nozzle is controlled at the intersection between the application line in the application area and the preceding application line on which the paste has already been applied. It is possible to stabilize the ejection and prevent a variation in the application amount.

[Brief description of the drawings]

FIG. 1 is a perspective view of a die bonding apparatus according to an embodiment of the present invention.

FIG. 2 is a block diagram showing a configuration of a control system of the die bonding apparatus according to the embodiment of the present invention;

FIG. 3 is an explanatory diagram of a paste application pattern according to an embodiment of the present invention.

FIG. 4 is a graph showing a moving pattern of a coating nozzle in a paste coating pattern according to an embodiment of the present invention.

5A is a diagram illustrating a paste application process according to one embodiment of the present invention. FIG. 5B is a diagram illustrating a paste application process according to one embodiment of the present invention. Illustration of coating process

[Explanation of symbols]

 Reference Signs List 6 Lead frame 6a Application area 7 Paste 10 Moving table 15 Syringe 15a Application nozzle 22 Valve drive unit 26 Storage unit 28 Control unit

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Jin Mukaijima 1006 Kazuma Kadoma, Osaka Pref.Matsushita Electric Industrial Co., Ltd. 72) Inventor Nobuyuki Suedo 1006 Kadoma Kadoma, Kadoma-shi, Osaka Matsushita Electric Industrial Co., Ltd. F-term (reference) 5F047 BB11 FA22

Claims (2)

[Claims] 1. A paste is discharged from a discharge port of a coating nozzle while moving a coating nozzle relative to a coating target, and a coating line is drawn in a coating area set on a surface of the coating target. A paste application device for applying paste, a discharge unit for discharging paste from the discharge port, a moving unit for moving the coating nozzle relatively to a coating target, and storing data of the coating pattern. A storage unit, a control unit that controls the moving unit based on the data of the application pattern, and a nozzle height that controls the height of the application nozzle at an intersection of the application line and the preceding application line on which the paste is already applied. And a controller for controlling the paste application. 2. The method according to claim 1, wherein the paste is discharged from a discharge port of the coating nozzle while the coating nozzle is relatively moved with respect to the coating target, and a coating line is drawn in a coating area set on the surface of the coating target. A paste application method for applying a paste, wherein when the application nozzle is moved by moving means based on data of an application pattern, the application nozzle is provided at an intersection between the application line and a preceding application line on which the paste has already been applied. The height of the paste is controlled by a nozzle height control means.