JP3850275B2 - Electronic component equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component device used in a mobile communication device, and more particularly to a structure in which components that are easily influenced by surroundings such as a surface acoustic wave element are sealed inside.
[0002]
[Prior art]
Mobile communication devices such as mobile phones are increasingly required to be smaller, thinner and more functional. In order to meet this demand, an increasing number of electronic component devices are equipped with a plurality of electronic component elements.
[0003]
The structure of a conventional electronic component device is shown in FIG. In the figure, 31 is a laminated substrate, 32 is a dielectric layer, 34 is an input / output electrode, 35 and 36 are ground electrodes, 37 is an external electrode, 38 is a GND pattern, 39 is an external terminal, 40 is a metal lid, 41 is A surface acoustic wave element as a first electronic component element, 42 is a comb-shaped electrode, 43 is a metal bump, 46 is a second electronic component element (hereinafter simply referred to as an electronic component element), 47 is a wiring pad, and 48 is a flat plate It is a lid of the shape. Here, the first electronic component element is a surface acoustic wave element 41 or the like, and is an electronic component element that requires hermetic sealing to ensure operational reliability. Electronic component devices requiring these hermetic seal is housed in a chamber called cavity C, the cavity opening had sealed adhesive sealed with Li head 4 8. In addition, the adhesion of here refers to the adhesive using the adhesive of brazing or organic and inorganic to use solder or silver brazing. The structure of FIG. 5 is a structure in which the cavity C is formed on the upper surface of the laminated substrate 31. A surface acoustic wave element 41 is mounted face down in the cavity C, and the opening of the cavity C is sealed with a lid 48. In this structure, since the electronic component element 46 cannot be disposed on the upper surface of the lid 48, a large dead space is generated on the laminated substrate 31, and it is difficult to reduce the size thereof.
[0004]
In addition, since the comb electrode 42 of the surface acoustic wave element 41 and the GND pattern 38 on the lower surface of the multilayer substrate come close to each other, the characteristics of the surface acoustic wave element 41 may be disturbed. Further, since the cavity C is present in the laminated substrate 31, internal wiring cannot be provided freely, and conversely, because the internal wiring is provided freely, a large amount of dielectric electricity constituting the laminated substrate 31 is not laminated. In other words, there is a problem that the thickness of the multilayer substrate 31 is increased and the height of the entire electronic component device is increased.
[0005]
The structure of FIG. 6 is a structure in which the cavity C is formed from the mother board mounting surface that is the lower surface of the multilayer substrate 131. A surface acoustic wave element 141 is mounted face down in the cavity C, and the opening of the cavity C is sealed with a lid 148. At this time, there is no dead space on the surface of the multilayer substrate 131, and the electronic component element 146 can be freely arranged, which is advantageous for downsizing. However, since the comb-shaped electrode 142 of the surface acoustic wave element 141 and the electronic component element 146 are close to each other, they may affect each other and the characteristics may be disturbed.
[0006]
In addition, since the cavity C exists in the multilayer substrate 131, there is a restriction on the degree of freedom in designing the internal wiring, and the multilayer substrate 131 has to be thickened to solve this.
[0007]
In addition, the GND pattern on the lower surface of the multilayer substrate 131 cannot be formed, and is easily affected by the mother board. Structure of FIG. 7 is 5, Ru Tei a laminated substrate 231 in which the cavity is not formed to overcome the problems of FIG. As a result, the internal wiring 245 can be installed. The input / output electrode 234 and the ground electrode 235 are prevented from interfering with the input / output electrode 234 connected to the surface acoustic wave element 241 and the ground electrode 235 to which the first metal lid 244 covering the surface acoustic wave element 241 is joined. It is necessary to take a large interval. Therefore, the opening shape of the first metal lid 244 becomes large, occupies a large area on the laminated substrate 231, and the installation space of the electronic component element 246 is compressed.
[0008]
In this structure, the input / output electrode 234 of the surface acoustic wave element 241 must be led out into the multilayer substrate 231 with a via-hole conductor so that the input / output electrode 234 of the surface acoustic wave element 241 is not short-circuited with the ground electrode 235. The design freedom in the lead conductor from H.234 was lost.
[0009]
[Problems to be solved by the invention]
In the structure of the conventional electronic component device described above, it is difficult to further reduce the size and the height because of the existence of the internal wiring and the internal strip line inside the multilayer substrate 31 to satisfy the structure and electrical characteristics of the cavity C. There was a problem that there was.
[0010]
In particular, antenna switch modules and filters used for the front end of mobile communication devices have a large difference in transmission power during transmission and reception, so performance and dimensions are inversely related, reducing power loss. The smaller the size, the larger the size, which hinders miniaturization and low profile of the antenna switch module and filter. Conversely, the miniaturization of the electronic component device equipped with the antenna switch module and the filter from the limitations of size and design of the mobile communication apparatus, the electrical characteristics of the electronic component device unsatisfactory, their communication equipment Will not be able to demonstrate sufficient performance.
[0011]
The present invention has been devised in view of such problems, and provides an electronic component device in which the characteristics of the first electronic component element are stable and the size and height can be reduced. It is.
[0012]
[Means for Solving the Problems]
This onset Ming has a cavity on the surface, a laminated substrate formed by laminating a plurality of dielectric layers, a first electronic component elements disposed in the cavity, are mounted on the laminated substrate surface An electronic component device comprising: a second electronic component element; a first metal lid that covers the first electronic component element; and a second metal lid that covers the entire surface side of the laminated substrate. The first electronic component element has an upper surface protruding from the cavity opening , and opens a portion corresponding to the upper surface of the first metal lid body of the second metal lid body. An electronic component in which the upper surface of the metal lid is substantially flush with the upper surface of the second metal lid, and the upper surface of the first metal lid and the upper surface of the second metal lid are connected by a coupling portion Device.
[0013]
Further, according to the present invention, in the above configuration, the first metal lid has a housing shape with an opening on one surface of the laminated substrate side, and the first metal lid is formed around the cavity. it is a child component device electrostatic you wherein the wear stepped portion preparative metal lid is bonded to the opening of the body is formed.
[0014]
That is, the depth of the cavity can be made very shallow by bringing the upper surface of the first electronic component element disposed in the cavity close to the inner surface of the first metal lid so as not to contact. Then, as the cavity depth becomes shallower, the thickness of the multilayer substrate in the bottom area of the cavity increases, and the internal wiring pattern is freely drawn in the multilayer substrate as compared with the conventional electronic component device shown in FIG. it can, at the same time, can be subjected to a design that meets the electrical characteristics by matching the impedance of the electronic component device.
[0015]
Therefore, compared with the conventional electronic component device shown in FIG. 7, the electronic component device can be reduced in size and height by the depth of the cavity. At the same time, since the first electronic component element is accommodated in the cavity, mutual interference between the first electronic component element and the second electronic component element can be effectively suppressed.
[0016]
The second electronic component element is mounted on the surface of the multilayer substrate, and the surface region of the multilayer substrate including the second electronic component element is covered with a second metal lid. Then, the amount of projection of the first metal lid projecting from the laminated substrate (height of the top surface) is higher than the height of the second electronic element, and substantially equal to the height of the second metal Shokufutatai Or less. Thus, the second metal lid body for covering the second electronic element, since it you to place the first metal lid, is not the electronic component device is increased in size. Further, by electrically joining the two metal lid, only one of the metal lid if shielded, whole can shield to Rukoto.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an electronic component device of the present invention will be described with reference to the drawings.
[0018]
FIG. 1 is a cross-sectional view showing a first embodiment of an electronic component device according to the present invention. In the figure, 1 is a laminated substrate, 2 and 3 are dielectric layers which are part of the laminated substrate and are laminated on the surface side, 4 is an input / output electrode, 5 and 6 are ground electrodes, 7 is an external electrode, 8 is A GND pattern, 9 is an external terminal, 10 is a second metal lid (hereinafter referred to as a metal cap to be distinguished from the first metal lid), 11 is a surface acoustic wave element, 12 is a comb electrode, and 13 is a metal Bump, 14 is a housing-shaped first metal lid, 15 is an internal wiring pattern, 16 is an electronic component element, 17 is a wiring pad , and C is a cavity.
[0019]
The electronic component device configured as described above will be described. In this embodiment, the multilayer substrate 1 is formed by laminating a plurality of dielectric layers made of a low-temperature fired material that can be fired at 1000 ° C. or lower. In particular, the dielectric layers 2 and 3 are dielectric layers constituting the cavity C. An internal wiring pattern 15 is formed inside the multilayer substrate 1, and a via-hole conductor is formed (not shown).
[0020]
Specifically, an internal wiring pattern 15 to be a transmission line or the like is formed on a green sheet to be each dielectric layer by printing a conductor paste, and these are sequentially laminated and fired. In FIG. 1, the dielectric layers 2 and 3 are formed with a through hole in the region of the cavity C in order to form the cavity C. In particular, the green sheet forming the bottom of the cavity C, and to form a surface acoustic wave element 11 gaff E Lee scan down Bonn internal wiring patterns 15 that derives from the input and output electrodes 4 and the output electrode 4 is Dink It is necessary to keep. Further, it is necessary to form a ground electrode 5 to which the housing-like first metal lid 14 is joined around the opening of the through hole of the green sheet serving as the dielectric layer 2. Furthermore, it is necessary to form the ground electrode 6 to which the metal cap 10 is bonded and the wiring pad 17 to which the electronic component element 16 is bonded on the main surface side of the green sheet to be the dielectric layer 3. The total number of dielectric layers constituting these multilayer substrates 1 is, for example, nine. The firing temperature is 900 ° C., the fired laminated substrate 1 has a dielectric constant of 15 to 19, the internal wiring pattern 15 has a width of 100 to 150 μm, a thickness of about 5 to 25 μm, and the thickness of each dielectric layer. is position 50 to 100 [mu] m, the depth of the cavity C is 100~150μm extent.
[0021]
Next, the external electrode 7, the GND pattern 8, and the external terminal 9 are formed. For example, the coating or printing of the conductive paste after put-out sintered have rows, subjected to nickel / gold plating. For example, an Ag-Pt paste is used as the conductive paste. In addition to the Ag to Ag-Pt system, Cu is used as a paste for forming the input / output electrode 4, the ground electrodes 5 and 6, the external electrode 7, the external terminal 9, and the internal wiring pattern 15 (strip line and capacitor electrode). It may be a system paste. Moreover, the dielectric material which comprises a laminated substrate should just be a low-temperature baking material which can be baked at 1000 degrees C or less, for example, can use an alumina glass-type material. The surface acoustic wave element 11 as the first electronic component element is formed by depositing, for example, an aluminum comb-shaped electrode 12 on a piezoelectric substrate such as lithium tantalate, lithium niobate, lithium borate, or quartz. The comb electrodes 12 to form the input and output electrodes simultaneously deposited form. On this input and output electrodes, the metal bumps 13 such as gold or Al mini um is formed.
[0022]
Specifically, the surface acoustic wave element 11, for example using a tantalate lithium single crystal plate, using conventional photolithographic techniques, made of a metal mainly containing aluminum on one main surface of the piezoelectric substrate comb The electrode 12 is formed. Incidentally, the surface acoustic wave element 1 1 and the resonance element, and the like filter elements, used as interstage filter of a high-frequency circuit of a mobile communication device if e example. Such a surface acoustic wave element 11 is attached face down by applying ultrasonic waves through the metal bumps 13.
[0023]
The surface acoustic wave element 11 fixed to the cavity C is hermetically sealed to ensure reliability. For example, it is sealed with a casing-shaped first metal lid 14. The material of the first metal lid 14 is not particularly limited, but iron, iron - nickel alloy, iron-nickel-cobalt alloy , SUS, and the like are preferable. The one used in this example is a 45Ni-Fe alloy, on which an electrolytic Ni plating (1 to 5 [mu] m) is applied as a base, and Au flash plating (0.01 to 0.05 [mu] m) is applied thereon. Moreover, the sealing material used for sealing can be suitably selected from brazing materials such as Au—Sn, solder, and silver brazing , low-melting glass, and resin adhesive. Here, the step part for attaching the metal lid is a part where the ground electrode 5 formed around the opening of the cavity is formed. That is, the dielectric layer 2 is exposed by the displacement of the through-hole shape between the dielectric layer 2 and the dielectric layer 3.
[0024]
Here, the surface acoustic wave element 11, including the metal van flop 1 3, the height of the element is, for example, about 300-400. Therefore, when arranged in the cavity C having a depth of about 50 to 150 μm, the upper surface of the surface acoustic wave element 11 is projected from the opening of the cavity C, that is, from the surface of the multilayer substrate 1 with a difference of about 150 to 350 μm. It will protrude. The first metal lid 14 has a casing shape, and is short-circuited between the surface acoustic wave element 11 and the inner surface of the first metal lid 11 even if the joining state of the metal bumps 13 is displaced. A gap that does not occur is formed. The second electronic component element 16 is a circuit component for achieving a predetermined operation together with the surface acoustic wave element 11. For example, a capacitor component, the resistance component, a coil component, varicap diodes, etc. transistor can be exemplified. The electronic component element 16 is bonded to a wiring pad 17 formed on the surface of the multilayer substrate 1 via solder or the like. Here, the position where the input and output electrodes 4 which the surface acoustic wave element 11 is face-down bonding is formed, the position where the wiring pads 17 are formed, is displaced in the thickness direction of the multilayer substrate 1 . Thereby, the space | interval of both can be separated and mutual interference can be suppressed.
[0025]
The entire first electronic element 1 6 containing a metal lid 14, i.e., the upper portion of the front surface of the multilayer substrate is covered by a metal cap 10. Specifically, since the metal cap 10 is joined to the ground electrode 6, the whole functions as a shield case.
[0026]
FIG. 2 shows an application example of the electronic component device of the present invention. Specifically, it is used for an antenna module. In FIG. 2, the received signal input from the antenna terminal 24 is first demultiplexed by a high-pass filter and a low-pass filter called a diplexer 20. From the signal selected by the high pass filter, unnecessary frequency components are removed by the surface acoustic wave element 21 and output to the PCS receiving terminal 25. The signal selected by the low-pass filter is output to the GSM receiving terminal 28 after the surge voltage is cut off by the LC filter for countermeasures against electrostatic surge signals, and unnecessary frequency components are removed by the surface acoustic wave element 21. . In both the PCS and GSM signal bands, transmission and reception are switched by turning on and off the voltage applied to the transmission / reception switching terminal 27. When such a circuit is applied as an electronic component device, the external terminal of the multilayer substrate 1 is constituted by the side surface or the lower surface of the multilayer substrate 1. It is desirable that the PCS signal and the GSM signal demultiplexed by the diplexer are arranged on terminals on different surfaces so as not to interfere with each other. Therefore, the internal wiring pattern 15 of the PCS signal selected by the high-pass filter is guided to the terminal on the surface opposite to the surface having the antenna terminal and the GSM transmission / reception terminal. At this time, the internal wiring pattern 15 passes under the cavity C.
[0027]
The internal wiring pattern 15 must reduce transmission loss as much as possible, and should not interfere with other circuits and the surface acoustic wave element 11 in the cavity C.
[0028]
Since the internal wiring pattern 15 causes an electromagnetic induction phenomenon with the comb electrode 12 of the surface acoustic wave element 11, the physical distance between the internal wiring pattern 15 and the comb electrode 12 must be about 0.5 mm. . Further, the transmission loss characteristic is determined by the distance between the internal wiring pattern 15 and the GND pattern 8. This is because the internal wiring pattern 15 and the GND pattern 8 form a microstrip line, and therefore the distance between the internal wiring pattern 15 and the GND pattern 8 determines the characteristic impedance of the internal wiring pattern 15. For this reason, it was optimal to provide each distance about 0.5 mm.
[0029]
For these reasons, the internal wiring pattern 15 is preferably disposed between the comb-shaped electrode 12 of the surface acoustic wave element 11 and the GND pattern 8, and the target characteristics can be secured. Even if the multilayer substrate 1 is thinned, the arrangement position of the internal wiring pattern 15 is a range that divides the interlayer distance between the bottom surface of the surface acoustic wave element 11, that is, the bottom surface of the cavity C and the GND pattern 8 from 4: 6 to 6: 4. It is effective to arrange them at a distance of.
[0030]
FIG. 3 shows a second embodiment of the present invention. 18 is a dam member in the figure are indicated by the same reference numerals the same as FIG. In the second embodiment, the ground electrodes 5 and 6 arranged in different layers (dielectric layer 2 and dielectric layer 3) in the first embodiment are connected to the same layer in which the electronic component element 16 is located. It is arranged in. The arrangement of the internal wiring pattern 15 is the same as in the first embodiment.
[0031]
The first metal lid 14 is bonded to the surface region of the laminated substrate 1 around the opening of the cavity C via the ground electrode 5. In addition, as a metal lid body mounting | wearing level difference part, it forms with the dam member 18 formed so that a cavity opening might be surrounded. That is, the cavity opening surrounding that Ri surrounded preparative the dam member 18 becomes worn stepped portion preparative metal lid, the ground electrode 5 is formed. The dam member 18 prevents not only serves as a guide during mounting of the first metal lid 14, the brazing material or adhesive for securing the ground electrode 5 of the first metal lid 14 leaks It serves to prevent leakage of the filler in the cavity C. The material of this for the dam member 18 may if those fulfill this role, a metal or a resin material separately made work, etc. may be mounted, the cover glass if the laminated board 1 is ceramic, solder resist if glass epoxy or the like It does not matter even if it is laminated. In the electronic component device according to the second embodiment configured as described above, the dam member 18 is provided, and the dielectric layer 3 can be reduced by one layer, so that the height can be further reduced as compared with the first embodiment. The cost of the multilayer substrate 1 can be suppressed. Further, the height of the first metal lid 14 can be reduced by bringing the upper surface (the top of the head) into contact with the inner surface of the ceiling of the metal cap 10 . At this time, if it can be electrically and mechanically coupled, the first metal lid 14 and the metal cap 10 can be set to the same potential, so that the resistance against external noise can be increased. The first metal lid 14 and the metal cap need only be electrically and mechanically coupled, and may be welded by laser or spot, in addition to bonding by solder or brazing material.
[0032]
If the first metal lid 14 and the metal cap 10 are completely coupled, the first metal lid 14 and the metal cap 10 have the same potential. Performance does not change. Therefore, man-hours is not Kakekara than the electronic component device shown in the first embodiment, it is possible to obtain a miniature electronic component device which is further lower profile.
[0033]
FIG. 4 shows a third embodiment of the present invention. FIG. 4A is a perspective view showing a third embodiment, and FIG. 4B is a sectional view. 19 is a bond portion in the figure, it is indicated by the same reference numerals the same as FIG. In this embodiment, a portion corresponding to the upper surface (the top of the head) of the first metal lid 14 of the metal cap 10 is opened, and the upper surface of the first metal lid 14 is substantially flush with the metal cap 10. It can be lower. Moreover, since the 1st metal cover body 14 and the metal cap 10 can be made into the same electric potential by connecting both by the coupling | bond part 19, tolerance can be improved with respect to the noise from the outside. At this time, the connecting portion 19 may be electrically and mechanically connected, and may be welded by laser or spot in addition to the connection by solder or brazing material.
[0034]
【The invention's effect】
As described above, in the present invention, a cavity for housing the first electronic component element is formed on the surface of the multilayer substrate formed by laminating a plurality of dielectric layers, and the second electronic component element is mounted. In the electronic component device, the first electronic component element is covered with a first metal lid, and the entire surface of the multilayer substrate is covered with a second metal lid. The first electronic component element is disposed so that an upper surface of the element protrudes from a cavity opening, and a portion corresponding to the upper surface of the first metal lid of the second metal lid is opened, The upper surface of the first metal lid is substantially flush with the upper surface of the second metal lid, and the upper surface of the first metal lid and the upper surface of the second metal lid are connected by a coupling portion. Is doing .
[0035]
As a result, the thickness of the bottom surface region of the cavity of the multilayer substrate can be secured, and even if the internal wiring pattern is arranged, transmission loss and impedance disturbance can be reduced. As a result, it is unnecessary to increase the thickness of the multilayer substrate. Therefore, it is possible to obtain an electronic component device that is small and low in profile and has good electrical characteristics.
[0036]
In addition, since the first metal lid is formed with a metal lid mounting stepped portion that surrounds the periphery of the first metal lid so that the first metal lid can be positioned on the surface of the laminated substrate, the sealing material And leakage of the internal filling can be prevented, and a reliable hermetic seal can be achieved.
[0037]
Further, an opening is provided on the upper surface portion corresponding to the first metal lid covering the electronic component element of the second metal lid, the and the upper surface of the first metal lid top surface of the second metal lid By making it one side , the overall height of the electronic component device can be suppressed, and an electronic component device with reduced man-hours can be obtained. Furthermore, since the upper surface of the first metal lid and the upper surface of the second metal lid are connected by the coupling portion, the first metal lid and the second metal lid can be set to the same potential. Therefore, by connecting only one metal lid to the ground electrode, both metal lids can be grounded, so that the number of ground electrodes can be reduced, the structure of the electronic component device can be simplified, and the external It is possible to increase resistance to noise from
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of an electronic component device according to a first embodiment of the present invention.
FIG. 2 is a block diagram of a circuit of the electronic component device according to the first embodiment of the present invention.
FIG. 3 is a cross-sectional view of an electronic component device according to a second embodiment of the present invention.
4A is a perspective view of an electronic component device according to a third embodiment of the present invention, and FIG. 4B is a cross-sectional view of the electronic component device according to the third embodiment of the present invention.
FIG. 5 is a cross-sectional view of a conventional electronic component device.
FIG. 6 is a cross-sectional view of another conventional electronic component device.
FIG. 7 is a cross-sectional view of another conventional electronic component device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Laminated substrate 2, 2 Dielectric layer 4 Input / output electrode 5, 6 Ground electrode 7 External electrode 8 GND pattern 9 External terminal 10 Metal cap (2nd metal cover body)
DESCRIPTION OF SYMBOLS 11 Surface acoustic wave element 14 1st metal cover body 15 Internal wiring pattern 16 Electronic component element (2nd electronic component element)
C cavity

Claims (2)

A laminated substrate having a cavity on the surface and formed by laminating a plurality of dielectric layers, a first electronic component element disposed in the cavity, and a second electron mounted on the surface of the laminated substrate In an electronic component device comprising: a component element; a first metal lid that covers the first electronic component element; and a second metal lid that covers the entire surface side of the multilayer substrate.
The first electronic component element has an upper surface projecting from the cavity opening, and a portion corresponding to the upper surface of the first metal lid body of the second metal lid body is opened. The upper surface of the lid is substantially flush with the upper surface of the second metal lid, and the upper surface of the first metal lid and the upper surface of the second metal lid are connected by a coupling portion. Electronic component device. The first metal lid has a housing shape in which one surface of the laminated substrate side is opened, and a metal lid joined to the opening of the first metal lid around the cavity. The electronic component device according to claim 1, wherein a body-mounting step portion is formed.

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