JP3844061B2 - Electronic component placement method and apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a disposition method and apparatus for an article wherein there is provided as a self-alignment process the whole process in which electronic parts placed on a substrate are guided to a recess provided at a desired position in of substrate and are fallen therein. <P>SOLUTION: When electronic patrs 21 are inserted into a recess 13 provided in a substrate 11, the electronic parts 21 are placed on the substrate 11 at random, and vibration is applied to the substrate 11 at least longitudinally to fall the electronic parts 21 into the recess 13. Kinetic energy is provided to the electronic parts 21 placed on the substrate 11 through the vibration of the substrate 11, whereby there is provided as a self-alignment process the whole process in which the electronic parts 21 are moved to the position of the recess 13 and fallen therein, and disposed at a desired position. <P>COPYRIGHT: (C)2003,JPO

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a arrangement method and apparatus for electronic components for charging the electronic component in the recess provided in the substrate, particularly, the self-alignment (self-aligned) electronic components using the arrangement method and arrangement apparatus It is about.
[0002]
[Prior art]
Conventional electronic component mounting methods include a method of mounting each component using a head having a suction mechanism, and a method of transferring the entire substrate.
[0003]
The mechanical alignment process of placing electronic components on a machine requires a lot of labor, time and cost, and it takes a great burden to secure and maintain the alignment accuracy. There is a strong demand for it.
[0004]
There are several methods for mounting a large number of sub-millimeter class electronic components in a desired position from various states, but they have not been put into practical use. The reason is that it is very difficult to handle such minute parts, it is difficult to mechanically perform micron-order positioning, physical phenomena such as wettability in the micro area, air viscosity, friction, etc. This is because it is in an intermediate area called a boundary area, and there are many problems that cannot be handled well by current physical simulation.
[0005]
[Problems to be solved by the invention]
FIG. 11 shows an example of mounting by the self-alignment process, and the goal is to arrange the electronic component 21 at a desired position on the substrate 11. In order to position the electronic component 21 at a target position, a concave portion 13 having a shape corresponding to the electronic component 21 is formed in advance at a target position of the substrate, and the state shown in FIG. As in b), the electronic component 21 is dropped into the recess 13. In this case, when the electronic component 21 is inserted, a slight clearance (gap) exists between the electronic component 21 and the recess 13.
[0006]
Although a method of guiding and dropping the electronic component 21 into the recess 13 is considered at the research stage, there are various problems in practical use, and a definitive method has not been established. However, a method in which the step of dropping the electronic component into the recess is a self-alignment process is disclosed in Japanese Patent Laid-Open No. 5-114800.
[0007]
In this known technique, a semiconductor chip processed into a rectangular shape is mounted in a rectangular recess formed on a substrate with a slight clearance from the semiconductor chip. At this time, an electronic component is inserted into the recess by a mechanical transfer means such as a suction head, or after the insertion, a micro vibration by ultrasonic waves is applied to at least one of the mounting substrate and the electronic component. By applying vibration to the base body, the electronic component can be prevented from being caught on the wall of the concave portion, and the electronic component can be reliably set at a predetermined position of the concave portion having a slight clearance. As a result, the positioning of the electronic component is substantially a self-alignment process.
[0008]
However, the use of minute vibration is limited to the process of setting the electronic component in the recess, and the process of transferring the electronic component to the position of the recess is performed by a mechanical transfer mechanism that is troublesome as before.
[0009]
An object of the present invention is to provide a a recess provided the electronic components placed on the substrate at a desired position on the substrate efficiently dropping method for arranging electronic components and apparatus.
[0010]
[Means for Solving the Problems]
That is, the present invention, when charged electronic components in a recess provided in the substrate, and placing the electronic components on the substrate in a direction intersecting at least the surface direction to the substrate (in particular vertical) by applying a vibration to, dropped the electronic components in the recess, it relates to a method for arranging electronic components and apparatus.
[0011]
According to the present invention, the since is vibrated in a direction intersecting at least a plane direction thereof The substrate, by applying energy of motion to the electronic components, the uplink like the electronic components is splashed on said substrate The probability of being dropped into the recess is improved, and it is easy to be placed at a desired position.
[0012]
Moreover, the electronic components is because it is only placed on the substrate, good productivity and efficiency compared with mechanical arrangement by the suction head or the like that has been done spending a great deal of labor and time and cost It can be a low cost and simple self-alignment process.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
In the present invention, by placing the electronic components randomly on the substrate, on one side of the substrate, provided an oscillator for applying said vibration, the vibration of 50Hz~500kHz to the substrate, It is preferable to apply in a direction perpendicular to the surface of the substrate and to make the amplitude of the vibration equal to or less than the depth of the recess. However, the frequency of this vibration is preferably selected according to the natural frequency of the substrate.
[0014]
The electronic component may be moved by lifting the electronic component by the vibration.
[0015]
Further, when inserting the electronic component into the plurality of recesses, the wavelength of the vibration is made to correspond to the pitch between the plurality of recesses, and the phase of the vibration is changed by a phase controller, and the center of the recess It is better to match the node of the vibration wave.
[0016]
Further, two vibration generating means are used, and each of them is arranged on one side of the base and the adjacent side thereof, and the wavelength of the vibration is set in the vertical direction between the plurality of recesses in the plane of the base. It is preferable to correspond to the directional pitch and the lateral pitch.
[0017]
In addition, it is preferable that the surface of the substrate is inclined, and in particular, an inclination or a step is provided toward the recess, and the surface of the substrate is inclined and held.
[0018]
Further, peeling of the adhesive material is applied to the bottom surface of the recess, or in advance by coating a thermoplastic resin on the bottom surface of the recess, with heating, it is preferable to charging the electronic component.
[0019]
Further, it is preferable that the center of the base is fixed, and a long-period vibration having a large amplitude in a direction perpendicular to the surface of the base is superimposed on the end of the base.
[0020]
In addition, it is preferable to add vibration in the surface direction of the base body to the vibration.
[0021]
In correspondence with the planar shape or / and a sectional shape of the recess in the electronic components, it is preferable to shape having no rotational symmetry.
[0022]
Further, the base body can be used as a mounting board, and the electronic component can be mounted on the mounting board.
[0023]
In the present invention, and moving said electronic component to a desired position, it and the setting to the desired position, also because sometimes incompatible optionally by appropriate conditions settings and various measures, such as the Both can be satisfied at the same time.
[0024]
As a result, the alignment process by a machine, which has conventionally been performed with a great deal of labor, time and cost, is converted into a self-alignment process, which can be greatly simplified and reduced in cost. This method is particularly effective when a large number of electronic components need to be arranged at regular intervals, such as mounting of an AM (active matrix) element such as an LED (Light Emitting Diode) or LCD (Liquid Crystal Display) display. It is.
[0025]
Article placement to is an electronic component such as a chip-shaped AM device and a passive element, a microlens, a microprism, optical fiber, micro-motors, may include a micro gears. Further, the base for forming the recess is not particularly limited, and may be selected according to the use such as a silicon substrate, a metal substrate, a ceramic substrate, and a plastic substrate.
[0026]
Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. Note that an electronic component is used as an example of an article and a silicon substrate is used as an example of a base.
[0027]
Fig.1 (a) is a schematic block diagram which shows an example of the arrangement | positioning apparatus of the electronic component 21 based on this invention.
[0028]
In this example, the vibration is applied from the upper surface of the substrate 11, but the vibration may be applied from the lower surface of the substrate 11. The vibration generated by the oscillator 41 is transmitted to the substrate 11 via the substrate holder 42, and a vibration wave is generated on the surface of the substrate 11 that vibrates in the direction perpendicular to the substrate surface and propagates on the substrate 11. Let The oscillator 41 includes a vibration generator using an electromagnet and an iron piece, or an electroacoustic transducer such as a piezoelectric transducer or a ferrite vibrator, and a power supply circuit for driving the electroacoustic transducer. By making the oscillator 41 a variable frequency type, it is not necessary to strictly design the natural frequency of the holder 42 and the substrate 11.
[0029]
FIG. 1B is a schematic configuration diagram showing another example of an electronic component placement apparatus according to the present invention, in which a phase controller 43 formed of a piezoelectric element is added to the apparatus of FIG. .
[0030]
The phase controller 43 can control the phase of the vibration wave on the substrate 11 and can change the position of the node of the vibration wave. For this reason, when positioning the board | substrate 11 with respect to the board | substrate holder 42, it is not necessary to position exactly | strictly and it is not necessary to calculate in advance and to design a holder.
[0031]
FIG. 2 shows the shape of the electronic component 21 suitable for the self-alignment process. It is necessary that the shape of the bottom surface of the electronic component 21 does not have rotational symmetry such as 90 ° rotational symmetry and 180 ° rotational symmetry so that the electronic component 21 does not fit into the recess 13 in the wrong direction. It is. For example, a square will be stuck in a recess even if it is misoriented 90 degrees, and a rectangle will be misaligned 180 degrees (reverse direction). The shape of the bottom surface of the electronic component 31 is set to a shape such as a trapezoid shown in FIG.
[0032]
The electronic component 21 is obtained by dicing a wafer (not shown) on a support into individual pieces by dicing. At this time, each piece is cut so that the cross-sectional shape is tapered. Is done. By using this, the cross-sectional shape of the electronic component 21 is cut so as to have a taper that widens upward, and the size of the recess 13 formed in the guide layer 12 on the substrate 12 is slightly smaller than the size of the bottom surface of the electronic component 21. If the size of the concave portion 13 is automatically reduced, the size of the concave portion 13 is automatically smaller than the size of the upper surface of the component. Therefore, the electronic component 21 is prevented from entering upside down and is inserted into the concave portion 13 in a normal posture. (FIG. 2 (b) is an enlarged cross-sectional view).
[0033]
FIG. 3 is a schematic view showing the positional relationship between the recess 13 formed in the guide layer 12 on the substrate 11, the oscillator 41, and the vibration wave. The vibration energy transmitted from the oscillator 41 to the substrate 11 via the substrate holder 42 forms a vibration wave that travels on the surface from one side where the oscillator 41 is placed to the opposite side. The wavefront of the vibration wave is parallel to the side on which the oscillator 41 is placed. The waveform attached to the lower part of FIG. 3A represents the waveform of the vibration wave at a certain point in time (the magnitude of the vertical displacement indicated by the surface of the substrate 11) and the waveform immediately after that by a solid line and a dotted line, respectively. Is.
[0034]
As the displacement of the surface of the substrate 11 in the vertical direction changes, electronic components (not shown) randomly placed on the substrate 11 are shaken up and down. When the vibration wave has a large energy and is vibrated strongly by this longitudinal vibration, there is a period in which the electronic component floats (bounces up) from the surface of the substrate 11 during one period. During this period, the proportion of the electronic components that have jumped up into the recesses 13 increases stochastically. In addition, during that period, the frictional force acting on the electronic component is reduced, so if a force in the direction of the surface acts on the electronic component for some reason, the electronic component moves on the surface and moves to the recess 13 where it is dropped. The probability of being inserted increases.
[0035]
Thus, even if the energy of the vibration wave is not so large that the electronic component is lifted, there is always a period in which the frictional force between the electronic component and the substrate 11 is smaller than during no vibration during one cycle. During this period, if a force in the surface direction acts on the electronic component for some reason, the electronic component moves more easily on the surface than when there is no vibration.
[0036]
As described above, by generating a vibration wave in a direction perpendicular to the surface of the substrate 11, the frictional force between the electronic component and the substrate 11 is reduced, and an environment in which the electronic component easily enters or moves into the recess 13 is prepared. This is the most important point.
[0037]
As shown in FIG. 3, in the substrate 11 in which the concave portions 13 are regularly arranged, the wavelength with respect to the frequency can be calculated from the elastic coefficient of the substrate 11. In FIG. 3B, the half-wave length of the vibration wave is adjusted to the pitch between the plurality of recesses 13, the phase of the vibration is adjusted by the phase controller 43, and the node of the vibration wave is at the center of the recess 13. This is an example in which matching standing waves are formed. The waveform attached to the bottom of FIG. 3B represents the waveform of the vibration wave at two different times (the magnitude of displacement in the vertical direction indicated by the surface of the substrate 11) by a solid line and a dotted line, respectively. .
[0038]
When adjusted in this way, the displacement is always zero at the position of the node, so that the electronic component once taken into the recess 13 is not swung by the vibration wave and jumps out of the recess 13. Therefore, even if an electronic component is already mounted in the recess 13, the next electronic component can be mounted in the other recess 13 by the above-described method without causing any trouble (this is described in the adhesive described later). This is even more reliable when using materials).
[0039]
The present invention is not limited to the above example, and the same effect can be obtained by adjusting the integral multiple of the half-wave length of the vibration wave to be equal to the pitch between the recesses 13.
[0040]
As in this example, it is possible to simultaneously realize a request to “move” an electronic component to a desired position and a request to “stop” to a desired position by various devices and appropriate condition settings. it can.
[0041]
In FIG. 4A, two oscillators 41 are used, each of which is arranged on one side of the substrate 11 and its adjacent side, and the wavelength of each vibration wave is set to the vertical pitch and the horizontal pitch between the recesses 13 on the substrate 11. In this example, the phase of the vibration wave is adjusted by the two phase controllers 43 so as to correspond to the direction pitch, and the node of the vibration wave is made to coincide with the center of the recess 13.
[0042]
In FIG. 4B, 31 indicates the position of the node in the vertical direction in the figure, and 32 indicates the position of the node in the horizontal direction in the figure.
[0043]
By using the two vibration waves, it is possible to more effectively realize the request for “moving” the electronic component to the position of the recess 13 and the request for “stopping” the recess 13.
[0044]
FIG. 5 is a schematic view showing how the electronic component 21 is arranged at a desired position by the self-alignment process according to the present invention.
[0045]
A recess 13 is provided on the surface of the base 11 at a desired position where the electronic component 21 is disposed. As a method for forming the recess 13, there are a method of patterning the guide layer (insulating layer) 12 using a resin having a resist property, a method of removing with a laser, and the like. The former is simple because the resin itself is patterned, but the concave portion is formed only once. The latter method can further process the recesses at other locations and then mount different types of parts.
[0046]
The guide layer (insulating layer) 12 is preferably provided with an inclination or a step so as to descend toward the recess 13 in the same manner as the recess 13 is provided. FIG. 5A shows an example in which a ridge (ridge line, a place one step higher than other positions on the substrate surface) 14 is formed by a step. By doing so, as shown in FIGS. 5A and 5B, even if the electronic component 21 is first placed on the ridge portion 14, the electronic component 21 moves with the help of the vibration wave. In the meantime, it is gradually led to the concave portion 13 located in the concave portion (a valley, a place one step lower than the other positions on the substrate surface) 15.
[0047]
Further, as shown in FIG. 5C, if the electronic component is held on the substrate 13 so as to be gently inclined during the self-alignment process of the electronic component 21 with the help of the vibration wave, the electronic component 21 will vibrate. While moving with the help of waves, it is gradually guided to the nearest recess 13.
[0048]
In this embodiment, the change in the effect due to the difference in the frequency of the applied vibration is small, but low-frequency to high-frequency sound waves or ultrasonic vibrations can be applied, and vibrations of 50 Hz to 500 kHz are preferably applied. In order to prevent the electronic component 31 once taken into the recess 13 from popping out again, it is desirable to set the amplitude of the vibration wave below the depth of the recess.
[0049]
According to the present embodiment described above, since the substrate 11 is vibrated at least in the direction intersecting the surface direction, by imparting kinetic energy to the electronic components 21 placed randomly, The electronic component 21 exhibits a behavior such as jumping up on the substrate 11, and the probability of being dropped into the recess 13 is improved, so that the electronic component 21 is easily placed at a desired position.
[0050]
In addition, since the electronic components 21 need only be randomly placed on the substrate 11, mass productivity and efficiency can be achieved as compared with the mechanical arrangement using the suction head or the like that has been performed with great effort, time, and cost. And a simple self-alignment process at a low cost.
[0051]
FIG. 6 shows a case where an electronic component is arranged with a peelable adhesive material (slightly adhesive material) 16 applied to the bottom surface of the recess 13.
[0052]
As a method of applying the adhesive material 16, there are a method of applying before forming the concave portion 13 and removing an excess portion other than the concave portion, and a method of forming the concave portion after applying the entire surface in advance.
[0053]
Since the adhesive of the peelable adhesive material 16 is weak, as the electronic component 21a shown in the figure, only a part of the adhesive material 16 touches the adhesive material 16 but is caught in the recess 13 by the adhesive material 16. Is never completely restricted. Therefore, while being swung by the vibration wave, the electronic component 21a gradually fits into the recess 13 gradually.
[0054]
On the other hand, the entire bottom surface of the electronic component 21 b that has been properly fitted in the recess 13 is in close contact with the adhesive material 16. In this case, the movement of the electronic component 21 b is largely limited by the adhesive material 16, so that the electronic component 21 b does not jump out of the recess 13 by being shaken by the vibration wave.
[0055]
Also by such a method, the request | requirement of "moving" the electronic component 21 to a desired position and the request | requirement of "stopping" to a desired position are simultaneously realizable.
[0056]
In addition, it is possible to obtain an effect of taking in an electronic component with adhesive force in the same manner even if a process of placing a thermoplastic resin in place of a peelable adhesive material and placing the electronic component while heating is performed. .
[0057]
FIG. 7 shows a state in the vicinity of the recess 13 when an IC (Integrated Circuit) chip 61 is mounted on a mounting substrate as an example of the electronic component 21.
[0058]
FIG. 7A shows a case where the solder bumps 62 of the IC chip 61 are joined to the wiring pattern 52 provided in the recess 13 when mounted on the insulating substrate 51 face down.
[0059]
FIG. 7B shows a case where mounting is performed face up, and the wiring pattern 52 provided on the insulating substrate 51 and the terminal 63 of the IC chip 61 are connected by wire bonding 64 . In this case, the effect that the peelable adhesive material or the thermoplastic resin described in the second embodiment takes in the IC chip 61 with the adhesive force can be used.
[0060]
FIG. 8 is a schematic configuration diagram showing another example of an electronic component arranging device according to the present invention. This apparatus is obtained by adding a large-amplitude long-period vibration generating means 44 to the apparatus shown in FIG. A large-amplitude long-period vibration generating means 44 may be added to the apparatus of FIG. The vibration generating means 44 includes a vibration generator made of, for example, an electromagnet and an iron piece, and a power supply circuit for driving the vibration generator.
[0061]
As shown in FIG. 8, when the center of the substrate 11 is supported by the support portion 45, one end of the large-amplitude long-period vibration generating means 44 is fixed with a wall surface and the other end is connected to the oscillator 41, the vibration generating means As the vibration is applied from 44, the substrate 11 performs a pendulum movement like a seesaw with the support portion 45 as a fulcrum.
[0062]
FIG. 9 shows the inclination of the surface of the substrate 11 and the movement of the electronic component 21 when such a seesaw motion is applied repeatedly. However, the substrate 11 is held so as to be slightly inclined when there is no large amplitude vibration, and the deflection angle of the seesaw motion is larger than this inclination.
[0063]
When there is no large-amplitude vibration, the surface of the substrate 11 is inclined in a certain direction, so that the electronic component 21 gradually slides down in the direction of this inclination with the help of vibration waves. As a result, the self-alignment process is successful if the electronic component 21 falls into the nearest recess 13. However, in some cases, it is possible to overshoot and get on the wall on the lower side of the recess 13 as shown in FIG. 9B.
[0064]
When there is no large amplitude vibration and the surface of the substrate 11 is inclined in a certain direction, it is difficult to correct such an overshoot. On the other hand, when there is a large amplitude vibration, as shown in FIG. 9C, there is always a period during which the inclination of the substrate 11 is reversed during one period, so it is easy to correct overshoot.
[0065]
FIG. 10 is a schematic configuration diagram showing another example of an electronic component placement apparatus according to the present invention, in which a vibration generator 46 in the plane direction is added to the apparatus of FIG. A vibration generator 46 in the plane direction may be added to the apparatus of FIG. The plane direction vibration generating means 46 may be the same type as the oscillator 41.
[0066]
Unlike the vibration in the vertical direction, the vibration in the surface direction has a small function of reducing the frictional force between the electronic component (not shown) and the substrate 11, but has a large function of rotating the electronic component and changing the direction. Using the substrate 11 having an inclination from the ridge 14 to the ridge 15 as shown in FIG. 5A and applying the action of changing the direction of the surface vibration, the electronic component 21 is smoothed. It is possible to guide to the concave strip portion 15 having the concave portion 13.
[0067]
It goes without saying that the embodiment described above can be further modified based on the technical idea of the present invention.
[0068]
For example, the vibration applied to the substrate described above may be in an oblique direction intersecting the substrate surface, in addition to being at least perpendicular to the substrate surface. Moreover, although the trapezoid has been described as an example of the bottom shape of the article to be arranged, the shape is not limited to this, and may be, for example, a pentagon. If the pentagonal shape is easier to be guided to the recess in relation to the substrate, even if the original shape of the article is trapezoidal, the number of vertices is deliberately added as a pentagonal article. It may be possible to optimize the alignment process.
[0069]
In addition, when the center of gravity of the article is lower, the article is more stable, and when the substrate surface is held so as to be inclined, the movement of the article on the substrate becomes smoother when the center of gravity is biased toward the tip. It is also conceivable to add weight to the article on purpose and optimize the center of gravity of the article for the self-alignment process.
[0070]
Since the success or failure of the self-alignment process of the present invention depends on whether or not an optimum relationship between the article to be placed and the substrate can be created, various ideas can be considered on a case-by-case basis.
[0071]
[Effects of the invention]
According to the present invention, since by vibrating the substrate in a direction intersecting at least a plane direction thereof, by applying energy of motion to the electronic components placed on a substrate, wherein on said substrate exhibits the behavior of the uplink such as electronic components is splashing improved probability of dropped into the recess, it is easily disposed in a desired position.
[0072]
Moreover, the electronic components is because it is only placed on the substrate, good productivity and efficiency compared with mechanical arrangement by the suction head or the like that has been done spending a great deal of labor and time and cost It can be a low cost and simple self-alignment process.
[Brief description of the drawings]
FIG. 1 is a schematic cross-sectional view showing two examples of an electronic component placement device according to an embodiment of the present invention.
FIG. 2 is a schematic top view, side view, plan view, and cross-sectional view showing the shape of an electronic component suitable for the self-alignment process, the shape of a concave portion of a substrate, and a state in which the electronic component is mounted in the concave portion. .
3 is a schematic plan view showing two examples of the positional relationship between an oscillator, a recess, and a vibration wave in the apparatus of FIG.
FIG. 4 is a schematic plan view showing an example of an electronic component arranging apparatus using two oscillators.
FIGS. 5A and 5B are a schematic plan view and a cross-sectional view showing how electronic components are arranged at desired positions by a self-alignment process. FIGS.
FIG. 6 is a schematic cross-sectional view showing a case where a peelable adhesive material is applied to the recesses.
FIG. 7 is a schematic cross-sectional view showing a state where an IC chip is mounted on an insulating substrate.
FIG. 8 is a schematic cross-sectional view showing another example of the electronic component arranging apparatus.
FIG. 9 is a schematic cross-sectional view showing the inclination of the substrate surface and the movement of the electronic component when large amplitude vibration is applied in an overlapping manner.
FIG. 10 is a schematic plan view showing another example of the electronic component arranging apparatus.
FIG. 11 is a schematic cross-sectional view showing a conventional self-alignment process.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 11 ... Board | substrate, 12 ... Guide layer (insulating layer), 13 ... Concave part, 14 ... Convex part,
15 ... concave part, 16 ... peelable adhesive, 21, 21a, 21b ... electronic component,
31 ... Node position (horizontal direction), 32 ... Node position (vertical direction),
41 ... Oscillator, 42 ... Substrate holder, 43 ... Phase controller,
44 ... Means for generating large amplitude long-period vibrations, 45 ... Supporting part
46 ... plane direction vibration generating means, 51 ... insulating substrate, 52 ... wiring pattern,
61 ... IC chip, 62 ... solder bump, 63 ... terminal,
64 ... Wire bonding

Claims (30)

Upon charged the electronic component in the recess provided in the substrate, and placing the electronic components on the substrate, by applying a vibration in a direction intersecting at least the surface direction to the substrate, the electronics dropping the goods in the recess, the arrangement method of the electronic components. Placing randomly the electronic components on the substrate, method for arranging electronic components according to claim 1. On one side of the substrate, providing an oscillator for applying said vibration, method for arranging electronic components according to claim 1. The vibration of 50Hz~500kHz to the substrate, is applied in a direction perpendicular to the plane of the substrate, method for arranging electronic components according to claim 1. It said lifted the electronic components due to vibration, moving the electronic component, method for arranging electronic components according to claim 1. When charged with the electronic components to the plurality of the recess, the wavelength of the vibration to correspond to the pitch between the plurality of recesses, the arrangement method of the electronic components according to claim 1. Changing the phase of the vibration by the phase control element, to match the node of the vibration wave in the center of the recess, the arrangement method of the electronic components according to claim 1. Using two means for generating the vibration, each is arranged on one side and the adjacent side of the base, and the wavelength of the vibration is set to a vertical pitch between the plurality of recesses in the plane of the base and to correspond to the transverse direction pitch arrangement method of electronic components according to claim 1. The amplitude of the vibration is less the depth of the recess, the arrangement method of the electronic components according to claim 1. Tilting the surface of the substrate, method for arranging electronic components according to claim 1. Preferably provided with inclined or stepped toward the recesses in the surface of the substrate, method for arranging electronic components according to claim 1. Previously coated with a peelable adhesive material on the bottom of the recess, the arrangement method of the electronic components according to claim 1. Leave applying a thermoplastic resin to the bottom surface of the recess is charged with the electronic components while heating method for arranging electronic components according to claim 1. Fixing the center of the base, the end portion of the substrate, is added on top of long period vibration having a large amplitude in the direction perpendicular to the surface of the substrate, method for arranging electronic components according to claim 1 . Wherein the vibration is added to overlap the vibration in the surface direction of the substrate, method for arranging electronic components according to claim 1. Corresponding to the planar shape or / and a sectional shape of the recess in the electronic components, a shape having no rotational symmetry, method for arranging electronic components according to claim 1. It said substrate and the mounting substrate, mounting the electronic component on the mounting board, method for arranging electronic components according to claim 1. An apparatus for charging a electronic component in the recess provided in the base body, at least by applying a vibration in a direction crossing the surface direction, the placed the electronic component on the substrate to the substrate having a vibration applying unit that dropped into the recess, the electronic component placing apparatus. Placing randomly the electronic components on the substrate, electronic components of the arrangement device according to claim 18. Wherein on one side of the substrate, providing an oscillator for applying said vibration, electronic components of the arrangement device according to claim 18. The vibration of 50Hz~500kHz to the substrate, is applied in a direction perpendicular to the plane of the substrate, arranging device of electronic components according to claim 18. It said lifted the electronic components due to vibration, moving the electronic components, electronic components of the arrangement device according to claim 18. When charged with the electronic components to the plurality of the recess, the wavelength of the vibration to correspond to the pitch between the plurality of recesses, electronic components of the arrangement device according to claim 18. Changing the phase of the vibration by the phase control element, to match the node of the vibration wave in the center of the recess, electronic components of the arrangement device according to claim 18. Using two means for generating the vibration, each of the vibration bases is arranged on one side and the adjacent side of the base, and the wavelength of the vibration is set to a vertical pitch between the plurality of recesses in the plane of the base and to correspond to laterally pitch, electronic components of the arrangement device according to claim 18. Wherein the amplitude of vibration to below the depth of the recess, electronic components of the arrangement device according to claim 18. Tilting the surface of the substrate, electronic components of the arrangement device according to claim 18. The center of the base is fixed, and vibration generating means is provided at the end of the base to apply a long-period vibration having a large amplitude in a direction perpendicular to the surface of the base. placement device the electronic components. Wherein the vibration, further provided with vibration generating means for applying superimposed oscillation in the surface direction of the substrate, electronic components of the arrangement device according to claim 18.   19. The electronic component placement device according to claim 18, wherein the substrate is a mounting substrate, and the electronic component is mounted on the mounting substrate.

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