JP3828983B2 - Chip component supply device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a chip component supply device and a cartridge-type component storage case, and in particular, is used for a component supply device that supplies bulk components arranged in a row and supplies such a chip component supply device. The present invention relates to a cartridge type component storage case. The chip component supply device and the cartridge-type component storage case of the present invention can be used, for example, in a component supply unit of an automatic mounting device for mounting a chip-type electronic component.
[0002]
[Prior art]
An extremely wide variety of chip components are mounted on the printed circuit board. At this time, an automatic mounting apparatus is used to transport and mount the chip components on the printed circuit board. In order to supply the chip component to the automatic mounting device, a chip component supply device is required. The chip component supply device is roughly classified into a vibration type, a rotary type, a swing type, a belt type, and the like, and the vibration type is most frequently used conventionally.
[0003]
As another example, a chip alignment / separation apparatus described in, for example, Japanese Patent Application Laid-Open No. 62-280129 is known. The chip alignment / separation apparatus described in this publication includes a chip storage chamber for storing a large number of chips stacked in bulk, so that the chip components can move to the lower part of the storage chamber under their own weight. In addition, the inner peripheral surface is inclined downward, or the chip storage chamber itself is inclined downward. The tip storage chamber is connected to the tip alignment hole at the lower end thereof, and further, an air outlet for intermittently ejecting air is provided in the vicinity of the installation location. The chips accumulated in the lower part of the chip storage chamber are blown up by the air blown out from the air outlet, then fall down by their own weight, and enter the inlets of the chip alignment holes. The chip alignment holes are formed in accordance with the shape of the chip, and only one chip can enter, so the chips are aligned one by one in the chip alignment hole. Thereafter, by pulling out the chips one by one from the chip alignment holes by appropriate means, it is possible to take out the chips that are in a stacked state one by one.
[0004]
As another example, a storage case for electronic components described in Japanese Patent Publication No. 7-48596 is known. In the electronic component storage case described in this publication, a chip component storage path is provided in a spiral shape in a case body, and chip components are supplied in a state of being packed in advance along the storage path.
[0005]
[Problems to be solved by the invention]
However, in the chip alignment / separation apparatus described in Japanese Patent Application Laid-Open No. 62-280129, whether or not the chip successfully enters the alignment hole depends on the falling posture of the chip that is blown off and dropped into a three-dimensional space. It depends heavily. For this reason, the probability that the chip does not enter the chip alignment hole is too large to be ignored. For this reason, it is difficult to reliably and efficiently enter the chip into the alignment hole. In addition, for parts that require front / back discrimination, it is necessary to discriminate after the chip enters the chip alignment hole, and then turn over, and the supply speed of the part is reduced accordingly. In addition, the structure of the apparatus is complicated, which is a factor that increases costs.
[0006]
On the other hand, in the electronic component storage case described in Japanese Examined Patent Publication No. 7-48596, chip parts can be stored in a state where the front and back surfaces are aligned. There is a problem that it is necessary to form it with high accuracy in accordance with the shape of the parts, and various types of storage cases are required, resulting in high costs. In addition, the number of chip components stored is limited to the length of the spiral passage, and there is a problem that a large amount of components cannot be supplied.
[0007]
Accordingly, the present invention has been made to solve the above-described problems of the prior art, and provides a chip component supply device that can reliably and efficiently supply chip components by a bulk supply method. It is aimed.
Another object of the present invention is to provide a chip component supply apparatus that can supply a large amount of components at a low cost with a relatively simple structure.
Another object of the present invention is to provide a chip component supply device that supplies chip components by storing the chip components in a front-and-back arrangement.
It is another object of the present invention to provide a cartridge type component storage case that can store chip components in a front-and-back arrangement and is detachable from a chip component supply device.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, a chip component supply apparatus according to the present invention is provided with a first component storage chamber for storing chip components in a stacked state, and in communication with the first component storage chamber. Are disposed in a space formed so as not to overlap each other in the thickness direction, a second component storage chamber for two-dimensionally storing the chip components, and a cross section of the chip component provided at the lower portion of the second component storage chamber. A component alignment passage formed to match the shape and arranged in one row for chip components, and provided between the first component storage chamber and the second component storage chamber, and the chip components are two-dimensionally aligned to form a first one. A first aligning / rotating means for moving from the one-part storage chamber to the second-part storage chamber; and a second-part storage chamber provided between the second-part storage chamber and the part-alignment passage to align the chip parts one-dimensionally. Second alignment to move from one to the part alignment passage And the rolling means is characterized by having a delivery means for feeding the chip components on the component alignment path to one at a predetermined position.
[0009]
In the present invention configured as described above, the chip parts stored in a bulk state in the first part storage chamber are moved to the second part storage chamber so that the chip parts do not overlap each other in the thickness direction. In the formed space, the chip parts are stored two-dimensionally, and finally, the chip parts are aligned in a row in the part alignment path. In this way, the chip parts are transferred from the stacked state (three dimensions) to one row (two dimensions) via the two dimensions, so that the chip parts can be supplied efficiently. . At that time, the first alignment rotation means and the second alignment rotation means can be used to reliably shift from three dimensions to two dimensions and from two dimensions to one column (one dimension).
[0010]
In the present invention, preferably, the component alignment passage has a component posture changing mechanism for changing the posture of the chip component by a predetermined angle.
[0011]
In the present invention, preferably, the first aligning / rotating means is First parts storage room When Second part storage room And a second aligning / rotating means having a second aligning / rotating plate rotating in the space between the second component storage chamber and the component aligning passage.
[0012]
In the present invention, preferably, the first component storage chamber has a bottom surface formed so as to be inclined so that the chip component can move downward by its own weight, and the second component storage chamber has the chip component downward by its own weight. It has a bottom surface portion that is inclined so that it can move.
[0013]
In the present invention, preferably, each of the first part storage chamber, the second part storage chamber, and the part alignment passage is provided.
[0014]
The present invention preferably further includes a single driving means for driving the first aligning and rotating means, the second aligning and rotating means, and the delivery means.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the accompanying drawings.
First, a first embodiment of the present invention will be described with reference to FIGS. Here, FIG. 1 is a front sectional view, FIG. 2 is a side sectional view, FIG. 3 is an enlarged sectional view of a main part of FIG. 2, FIG. 4 is a perspective view showing a chip component, and FIG. FIG. 6 is a perspective view showing a chip part posture changing mechanism. Reference numeral 1 denotes a chip component supply device. The chip component supply device 1 includes a housing 2. Reference numeral 4 denotes a component storage case (as this case, for example, one specified in the Japan Electronic Machinery Manufacturers Association standard EIAJ ET-7201 “bulk case for surface mount components”) can be used. In the component storage case 4, a large number (generally thousands to tens of thousands) of chip components A are stored in a stacked state in advance. Here, the chip component A is generally a rectangular parallelepiped component, for example, a chip capacitor (for example, length L × width W × thickness T = 1.0 mm × 0.5 mm × 0.5 mm). There are some, specified in EIAJ RC-2322 “Standard Dimensions of Fixed Multilayer Porcelain Chip Capacitors for Electronic Equipment” and chip resistors (for example, length L × width W × thickness) Some have dimensions of T = 1.6mm x 0.8mm x 0.45mm, and are defined in the Japan Electronic Machinery Manufacturers Association Standard EIAJ RC-2130 "General Rules for Chip Fixed Resistors for Electronic Equipment." FIG. 4 shows this chip resistor (chip component A). However, the chip component A is not limited to these.
[0017]
Above the inside of the housing 2 of the chip component supply device 1, a first component storage chamber 6 for storing chip components A in a stacked state is formed in a three-dimensional space. A second component storage chamber 8 for storing a large number of chip components A is formed in a two-dimensional space in a state where the components do not overlap with each other in the component thickness direction. Below 8, a part alignment passage 10 that aligns the chip parts A in a row is formed in a space formed to match the cross-sectional shape of the parts.
Here, the component storage case 4 is mounted in the upper opening 12 of the first component storage chamber 6 of the housing 2, whereby a large number of chip components A stored in the component storage case 4 are stored in the first component storage case 4. It is supplied into the chamber 6.
[0018]
As shown in FIG. 2, the bottom surface portion 14 of the first component storage chamber 6 forming the three-dimensional component arrangement space is formed so as to be inclined so that the chip component A can slide down by its own weight. It communicates with the second component storage chamber 8 that forms the target component placement space.
Between the first component storage chamber 6 and the second component storage chamber 8, a first alignment rotating plate 16 is provided. On one side surface 16a (see FIG. 3) of the first alignment rotating plate 16 facing the first component storage chamber 6 and the second component storage chamber 8, there are four protrusions 16b (see FIGS. 1 and 3) in the radial direction. ) Is formed. The distance B between the protrusion 16b and the inner surface of the housing 2 facing the protrusion 16b is set to be smaller than the thickness T of the chip part A. The first alignment rotating plate 16 rotates in a direction that moves the component in a direction (upward) opposite to its own weight direction (counterclockwise in FIG. 1).
[0019]
Further, the bottom surface portion 18 of the second component storage chamber 8 is formed so as to be inclined so that the components can slide down by its own weight, and further communicates with the component alignment passage 10 that aligns the components in a row.
A second alignment rotating plate 20 is provided between the second component storage chamber 8 and the component alignment passage 10. The circumferential surface 20a of the second alignment rotating plate 20 facing the second component storage chamber 8 and the component alignment passage 10 is formed of a material (for example, rubber) or a mechanism (for example, a knurled groove) that enhances frictional force, It rotates in a direction that moves the part in the direction opposite to its own weight direction (upward) (counterclockwise in FIG. 1).
[0020]
Below the component alignment passage 10 inside the housing 2 of the chip component supply device 1, a roller device 22 for component delivery is provided. The roller device 22 includes a first roller 22a provided on the upstream side of the component alignment passage 10, a second roller 22b provided on the downstream side, and the first roller 22a and the second roller 22b. It is constituted by a component conveying belt 22c for conveying A.
Here, as shown in FIG. 1, an automatic mounting device 24 is arranged on the chip component A supply side of the chip component supply device 1. A nozzle 26 for receiving the chip component A and an arm 28 for setting the supply timing of the chip component A are provided below the main body of the automatic mounting device 24 so as to extend downward.
[0021]
Further, as shown in FIG. 1, a driving roller 30 is provided on the side near the automatic mounting device 24 inside the housing 2 of the chip component supply device 1. A lever 32 is attached to the driving roller 30 via a driving mechanism (not shown) that rotates counterclockwise in FIG. The driving roller 30 is connected to the second alignment rotating plate 20 by the first driving belt 34, and the second alignment rotating plate 20 is connected to the roller device 22 by the first alignment rotating plate 16 and the second driving belt 36. The first roller 22a and the third drive belt 38 are connected to each other. Here, the drive mechanism of the drive roller 30 is a mechanism in which the drive roller 30 operates as follows by the operation of the lever 32. That is, the lever 32 is rotated counterclockwise by the downward movement operation of the arm 28. At this time, the drive roller 30 also rotates integrally with the lever 32, and as a result, the first drive belt moves counterclockwise. When the arm 28 moves up, the lever 32 automatically returns to the horizontal position shown in FIG. 1, but the driving roller 30 remains at that position without rotating.
[0022]
In the first embodiment, as described above, the driving roller 30 is driven at a predetermined timing by the vertical movement of the arm 28 of the automatic mounting device 24 and the rotation of the lever 32.
However, in this first embodiment, instead of the arm 28 and the lever 32 of the automatic mounting device 22, a cylinder mechanism or a thin motor (not shown) is provided in the housing 2, and these cylinder mechanism or thin motor The driving roller 30 may be synchronized with the automatic mounting device 24 and driven at a predetermined timing.
[0023]
Next, the operation of the first embodiment of the present invention configured as described above will be described. First, a component storage case 4 in which a large number of chip components A are stored in a stacked state is an upper opening 12 of a first component storage chamber 6 formed above the interior of the housing 2 of the chip component supply device 1. As a result, the chip component A in the component storage case 4 is supplied into the first component storage chamber 6.
Next, the chip component A stored in the three-dimensional space of the first component storage chamber 6 while being loosely stacked slides downward along the bottom surface portion 14 of the first component storage chamber 6 due to its own weight. At this time, the chip parts A may sometimes collect too much below the bottom surface part 14 and cannot be dropped toward the second part storage chamber 8. However, these chip components A are released upward by the upward movement of the protrusions 16b formed on the one side surface 16a by the first alignment rotating plate 16 rotating counterclockwise. As a result, the released chip parts A smoothly slide down toward the second part storage chamber 8 due to their own weight in a two-dimensional loosely stacked state that does not overlap each other in the part thickness direction.
Here, in this embodiment, four protrusions 16b are formed on one side surface 16a of the first alignment rotating plate 16, but each time the vertical movement of the arm 28 of the automatic mounting device 24 is performed once. The protrusions 16b are provided in such a number that the chip component A can be released upward at least once.
[0024]
Next, the components are first stored in a two-dimensional space in the second component storage chamber 8 that does not overlap each other in the thickness direction of the components, and then slide downward along the bottom surface portion 18 due to their own weight. At this time, between the bottom surface portion 18 of the second component storage chamber 8 and the components that are aligned in a row from the bottom surface portion 18 to the component alignment passage 10 and slide down by their own weight, and the circumferential surface 20 a of the second alignment rotating plate 20. The parts that have digged into the wedge shape are released upward by friction between the circumferential surface 20a and the parts generated by the rotation of the second alignment rotating plate 20. As a result, an interval through which the chip components A can pass in one row is formed, and the chip components A smoothly slide down toward the component alignment passage 10 due to their own weight, and are aligned in one row on the component alignment passage 10. .
[0025]
On the other hand, when the automatic mounting device 24 moves downward, the nozzle 26 receives the chip components A aligned in a row on the component alignment path 10 one by one.
At this time, the arm 28 is also lowered simultaneously, and the lever 32 is pushed downward. By the rotation operation of the lever 32, the drive roller 30 is rotated by a predetermined angle, whereby the first, second and third drive belts 34, 36 and 38 are driven simultaneously. Thereby, the first alignment rotating plate 16, the second alignment rotating plate 20, and the roller device 22 operate at a predetermined timing in synchronization with the lowering operation of the automatic mounting device 24. As a result, the first alignment rotary plate 16 and the second alignment rotary plate 20 rotate counterclockwise by a predetermined angle. Further, the first roller 22a of the roller device 22 also rotates by a predetermined angle. As the first roller 22a rotates, the chip component A on the component conveying belt 22c of the roller device 22 moves to the left in FIG. 1 by a predetermined distance. In this way, the chip components A on the component alignment passage 10 are sent one by one to a predetermined position, which is a position below the nozzle 23, at a predetermined timing by the roller device 22 for component supply.
[0026]
In the first embodiment of the present invention described above, when the cross-sectional shape of the chip component A is rectangular, it is necessary to convert the attitude of the chip component A by 90 degrees in a direction intersecting the component supply direction. A mechanism for converting the posture of the chip component A by 90 degrees in a direction intersecting the component supply direction will be described with reference to FIGS. When supplying the chip component A to the automatic mounting apparatus, the suction surface 74 that is the maximum surface of the rectangular parallelepiped chip component A is required to face upward. For this reason, the posture of the chip component A supplied to the component alignment passage 10 shown in FIG. 5A is converted by 90 degrees to the posture shown in FIG. 5B (the suction surface 74 faces upward). There is a need. For this reason, in the first embodiment, the component orientation conversion mechanism 76 in which the conversion groove 78 shown in FIG. 6 is formed is provided in the inclined portion on the upstream side of the component alignment passage 10. The component attitude changing mechanism 76 is manufactured from a resin processed product or the like. By this component posture changing mechanism 76, no mechanical pressure acts on the chip component A, and after the chip components A are aligned in a row, the posture thereof slides in the conversion groove 78 due to its own weight, and its posture is relative to the component supply direction. 90 degrees in the intersecting direction. As a result, if it is movable, the mechanism becomes complicated and expensive, but such a problem does not occur. Moreover, since it is structurally simple, machining is easy and reliability is high.
Further, the component posture changing mechanism 76 in which the conversion groove 78 is formed may be manufactured by a resin mold. In this case, complicated machining becomes unnecessary.
[0027]
Next, a second embodiment of the present invention will be described with reference to FIGS. In the second embodiment, the first alignment rotating plate 16 and the second alignment rotating plate 20 in the first embodiment shown in FIG. 1 are not provided, but instead an alignment plate that reciprocates vertically is provided. It is a thing.
7 is a front sectional view, FIG. 8 is a partial sectional view taken along line CC in FIG. 7, FIG. 9 is a partial sectional view seen along line DD in FIG. 7 is an enlarged cross-sectional view of a main part showing the second component storage chamber and its periphery in FIG. 7, FIG. 11 is a partially enlarged cross-sectional view of FIG. 10 viewed from the direction of arrow E, and FIGS. FIG. 14 and FIG. 15 are partial plan views for illustrating the operation of the component separating mechanism at the end of the roller device.
[0028]
As shown in FIGS. 7 to 9, reference numeral 100 denotes a chip component supply device, and this chip component supply device 100 includes a housing 102. Reference numeral 4 denotes a component storage case, in which a large number of chip components A are stored in a stacked state in advance.
Above the interior of the housing 102 of the chip component supply apparatus 100, a first component storage chamber 104 for storing the chip components A in a stacked state is formed in a three-dimensional space, and the first component storage chamber 104 is formed. A second component storage chamber 106 for storing a large number of chip components A is formed in a two-dimensional space in a state where the components do not overlap with each other in the component thickness direction. A part alignment passage 108 that aligns the chip parts A in a row is formed in a space formed so as to match the cross-sectional shape of the parts.
[0029]
Here, the component storage case 4 is mounted in the upper opening 110 of the first component storage chamber 104 of the housing 102, whereby a large number of chip components A stored in the component storage case 4 are stored in the first component storage case 4. It is supplied into the chamber 104.
As shown in FIGS. 7 and 10, the bottom surface portion 112 of the first component storage chamber 104 forming the three-dimensional component arrangement space is formed to be inclined so that the chip component A can slide down by its own weight. It communicates with a second component storage chamber 106 that forms a two-dimensional component arrangement space. Further, the bottom surface portion 120 of the second component storage chamber 106 is formed so as to be inclined so that the chip component A can slide down due to its own weight, and further communicates with a component alignment passage 108 that aligns the components in a row. .
[0030]
In a space communicating with the first component storage chamber 104, the second component storage chamber 106, and the component alignment passage 108, an alignment plate 114 that reciprocates in the vertical direction is provided. The alignment plate 114 has a first alignment portion 116 formed at an upper end portion thereof, and further a second alignment portion 118 formed below the first alignment portion 116. Here, as shown in FIG. 11, the first alignment portion 116 of the alignment plate 114 has a base end portion having a thickness F, and the chip component A is transferred from the first component storage chamber 104 to the second component storage chamber 106. An inclined surface 116a that is inclined to the extent of sliding down by its own weight is formed. Further, as shown in FIG. 11, the second alignment portion 118 is formed with an inclined groove 118 a having a thickness G. An inclined surface 118b is formed at the bottom of the inclined groove 118a so that the chip component A slides from the first component storage chamber 104 toward the second component storage chamber 106 due to its own weight. The thickness G is the thickness of the second component storage chamber 106. As a result, the inclined groove 118 a of the second alignment portion 118 of the alignment plate 114 moves up and down and functions as a part of the second component storage chamber 106.
[0031]
The alignment plate 114 moves up and down between a lowermost position shown in FIGS. 10 and 13 and an uppermost position shown in FIG. 14 at a predetermined timing, and the chip part A is moved to the first part storage chamber as will be described later. The component 104 is guided from 104 to the component alignment passage 108 via the second component storage chamber 106.
In the second embodiment, the first alignment portion 116 and the second alignment portion 118 are integrally formed as the alignment plate 114. However, the present invention is not limited to this, and the first alignment portion 116 and the first alignment portion The two alignment portions 118 may be formed on separate alignment plates.
[0032]
A component posture conversion mechanism 122 having the same function as the component posture conversion mechanism 76 shown in FIG. 6 is provided on the upstream side of the component alignment passage 108 inside the housing 102 of the chip component supply device 100. The posture of the chip component A is converted by 90 degrees in a direction intersecting the component supply direction so that the suction surface faces upward.
Further, a roller device 124 for feeding parts is provided on the downstream side of the parts alignment passage 108. The roller device 124 includes a driven roller 124a provided on the right side in FIG. 7, a driving roller 124b provided on the left side, and a component conveying belt 124c that couples the driven roller 124a and the driving roller 124b to convey the chip component A. Consists of.
[0033]
Further, as shown in FIGS. 14 and 15, a component separation mechanism 126 that separates the chip components A one by one and sends them to the outside at a predetermined timing is provided at the tip of the component conveying belt 124 c of the roller device 124. ing. The component separation mechanism 126 includes a stopper member 128 that stops the chip component A sent by the component conveying belt 124c at the front end of the belt 124c, and an upper cover member 130 that prevents the chip component A from jumping out from the component alignment passage 108. It is configured. The stopper member 128 is formed with a groove portion 128a having a size capable of receiving just one chip component A. The stopper member 128 is movable in a horizontal direction J that intersects the component traveling direction I by 90 degrees. Further, the upper cover member 130 is formed with a window portion 130a having a size that allows the chip component A to be taken out at a position where the stopper member 128 is moved horizontally (position shown in FIG. 15). The chip part A can be taken out to the outside. Here, FIG. 14 shows a position where the stopper member 128 receives the chip part A, and FIG. 15 shows a position where the chip part is taken out.
[0034]
As shown in FIG. 7, the automatic mounting device 24 is arranged on the chip component A supply side of the chip component supply device 100. A nozzle 26 for receiving the chip component A is provided at the lower part of the main body of the automatic mounting device 24.
The drive roller 124b, the alignment plate 114, and the stopper member 128 are connected to one drive source (not shown). As a drive source, an internal drive (for example, a motor, an air cylinder, etc.) built in the housing 102 is used. By this driving source, the driving roller 124b, the alignment plate 114, and the stopper member 128 are driven in synchronism with the vertical movement for taking out the components of the automatic mounting device 24 at a predetermined timing, and as a result, at this predetermined timing. Chip component A is sent out to the outside.
[0035]
Next, the operation of the second embodiment configured as described above will be described. First, the component storage case 4 in which a large number of chip components A are stored in a stacked state is an upper opening 110 of the first component storage chamber 104 formed above the interior of the housing 102 of the chip component supply device 100. As a result, the chip component A in the component storage case 4 is supplied into the first component storage chamber 104.
[0036]
Next, the chip component A stored in the three-dimensional space of the first component storage chamber 104 while being in a stacked state slides downward along its bottom surface 112 of the first component storage chamber 104 due to its own weight. Some of the chip components A smoothly and directly fall from the first component storage chamber 104 to the second component storage chamber 106. At this time, as shown in FIG. 10, below the bottom surface portion 112 of the first component storage chamber 104, the components that are aligned and about to slide down due to their own weight and the inclined surface 116 a of the first alignment portion 116 of the alignment plate 114. There are cases where the parts to be slid down concentrate too much and bite into a wedge shape and the aligned parts cannot be dropped into the second part storage chamber 106. However, in this embodiment, as shown in FIG. 12, the first alignment portion 116 of the alignment plate 114 moves upward, so that the component that slides down from the inclined surface 116 a of the first alignment portion 116 is upward. This releases the wedge-like bite. At this time, the chip components A are aligned again, and smoothly pass through the inclined grooves 118a of the second alignment portion 118 to the second component storage chamber 106 in a two-dimensionally stacked state that does not overlap each other in the thickness direction of the components. It slides down due to its own weight. In this way, the chip parts A are stored in the two-dimensional space in the second part storage chamber 106 so as not to overlap each other in the thickness direction of the parts. Thereafter, as shown in FIG. 13, the first alignment portion 116 of the alignment plate 114 moves downward, and the same operation is repeated at a predetermined timing.
[0037]
The chip component A housed in the second component storage chamber 106 in this manner slides downward along its bottom surface 120 of the second component storage chamber 106 due to its own weight. At this time, as shown in FIG. 10, from the bottom part 120 of the second part storage chamber 106, the parts that are aligned and about to slide down due to their own weight and the inclined grooves 118 a of the second alignment part 118 of the alignment plate 114. Parts that are about to slide down may concentrate too much and bite into a wedge shape, and the aligned parts may not fall into the part alignment passage 108. However, in the present embodiment, as shown in FIG. 12, the second alignment portion 118 of the alignment plate 114 moves upward, so that the component that is about to slide down from the inclined groove 118a of the second alignment portion 118 is upward. Thus, the wedge-shaped bite is eliminated. At this time, the chip components A are aligned again and smoothly slide down toward the component alignment passage 108. Thereafter, as shown in FIG. 13, the second alignment portion 118 of the alignment plate 114 moves downward, and the same operation is repeated at a predetermined timing.
[0038]
The chip component A guided to the component alignment passage 108 in this way slides down into the component posture changing mechanism 122 by its own weight, and after its posture is reversed by 90 degrees, it is guided to the component feeding roller device 124. The chip component A conveyed by the component conveying belt 124c of the roller device 124 comes into contact with the groove 128a of the stopper member 128 and stops (see FIG. 14). At this time, the stopped chip component A and the subsequent chip component A are in a state of sliding on the component conveying belt 124c.
After the groove 128a of the stopper member 128 has received the chip component A in this way, the stopper member 128 is in a direction intersecting with the component conveying direction of the component conveying belt 124c by 90 degrees as shown in FIG. Move horizontally by a predetermined distance. Since the chip component A is separated from the subsequent chip component A by the horizontal movement of the stopper member 128, the force that the chip component A in the groove 128a is pressed by the subsequent chip component A is released. As a result, the chip component A is released. The part A can be easily taken out.
[0039]
Further, since the upper cover member 130 is provided, the chip component A is prevented from popping out. The chip parts A are taken out one by one from the window 130 a formed in the upper cover member 130 by the nozzle 26 of the automatic mounting device 24.
In this embodiment, the alignment plate 114, the drive roller 124b, and the stopper member 128 are driven by one drive source in synchronization with each other at a predetermined timing.
[0040]
Next, a third embodiment of the present invention will be described with reference to FIGS. 16 is a front sectional view, FIG. 17 is a partial sectional view taken along line KK in FIG. 16, and FIG. 18 is a partial sectional view seen along line MM in FIG. FIG. 19 is a partial plan view for illustrating the operation (component receiving position) of the component separation mechanism at the end of the roller device, and FIG. 20 is the operation (component extraction position) of the component separation mechanism at the end of the roller device. It is a fragmentary top view for showing. In this 3rd Embodiment, the thing of the same structure as 2nd Embodiment mentioned above attaches | subjects the same code | symbol, and abbreviate | omits the description.
The third embodiment of the present invention has the same structure as the component storage case 4, the first component storage chamber 104, the second component storage chamber 106, and the component alignment passage 108 in the second embodiment. The front side (right side) and the back side (left side) are provided, and the housing, the alignment plate, the roller device, and the component separation mechanism are used in common.
[0041]
That is, the chip component supply device 150 according to the third embodiment of the present invention includes a housing 152, in which the component storage case 4, the first component storage chamber 104, the second component storage chamber 106, and the component alignment passage. 108 are provided on the front side and the back side of the chip component supply device 150 so as to be symmetrical with respect to the left and right when viewed in plan (see FIG. 18).
The housing 152 is provided with an alignment plate 154. The alignment plate 154 has a front / back symmetry (right / left point symmetry), and is similar to the alignment plate 114 of the second embodiment on the front and back sides. A first alignment portion and a second alignment portion each having a simple structure are provided.
The component separating mechanism 158 includes a stopper member 160 and an upper cover member 162. The stopper member 160 is provided with two grooves 160a so as to correspond to the two component alignment passages 108. Similarly, the upper cover member 162 is provided with two windows 162a. Here, FIG. 19 shows a position where the stopper member 160 receives the chip part A, and FIG. 20 shows a position where the chip part is taken out.
[0042]
Furthermore, as shown in FIG. 16, a roller device 156 is provided. The roller device 156 in the third embodiment employs a structure in which a driving operation is performed at a predetermined timing by the vertical movement of the arm 28 of the automatic mounting device 24. That is, the roller device 156 includes rollers 130 and 131 provided on the upstream side and the downstream side with respect to the component supply direction, a component conveying belt 132 that connects these rollers 130 and 131, and an arm 28 of the automatic mounting device 24. A first lever 133 that moves up and down with one end pushed down, a second lever 134 that has one end connected to the other end of the first lever 133, and a rotation that is connected to the other end of the second lever 134 The first turntable 135, the third lever 136 having one end connected to the first turntable 135, the other end of the third lever 136 is engaged with the other end, and the other end is the alignment plate 154 described above. An L-shaped fourth lever 137 connected to the lower end of the first lever, and a fifth lever 13 having one end connected to the first rotating disk 135 and the other end connected to the rotating shaft of the roller 131. A latch 139 that allows the roller 131 to rotate only in one direction (counterclockwise), a sixth lever 140 having one end connected to the first rotating plate 135, and a second end connected to the other end of the sixth lever 140. The second rotary plate 141 that performs the rotation operation and includes the stopper operating member 141a, and the first spring 142 that is urged so as to always push down the other end (the right end in FIG. 16) of the first lever 133. The second spring 143 that pulls one end (lower end) of the fourth lever 137 to the left in FIG. 16 so that the alignment plate 154 is positioned at the uppermost position, and the second turntable 141 is rotated clockwise. And a third spring 144 constantly biased.
[0043]
Next, the operation of the third embodiment configured as described above will be described. When the automatic mounting device 24 is positioned upward as shown in FIG. 16, the alignment plate 154 is positioned at the uppermost position. When the automatic mounting device 24 is lowered, the arm 28 of the automatic mounting device 24 is also lowered simultaneously, thereby moving the first lever 133, the second lever 134, the first rotating disk 135, the third lever 136, and the fourth lever 137. Thus, the alignment plate 154 descends toward the lowest position. At this time, the fifth lever 138 moves to the left in FIG. 16, but the roller 131 is locked by the latch 139 so that it does not rotate clockwise. At the same time, the sixth lever 140 rotates counterclockwise, and as a result, the second rotating plate 141 rotates clockwise, and the stopper operating member 141a moves the stopper member 160 in the horizontal direction. As a result, the stopper member 160 is in the position shown in FIG. Further, the nozzle 26 is lowered together with the automatic mounting device 24, and the nozzle 26 takes out the chip component A to the outside. Thereafter, the automatic mounting device 24 moves up. At this time, the roller device 156 returns to the position shown in FIG. 16 by the action of the first spring 142, the second spring 143, and the third spring 144. Further, as the automatic mounting device 24 is raised, the fifth lever 138 moves to the right in FIG. As a result, the roller 131 is driven counterclockwise by a predetermined distance, and the component conveying belt 132 conveys the chip component A by a predetermined distance in the counterclockwise direction.
In this manner, the alignment plate moves up and down at a predetermined timing, so that the chip components A stored in the separate component storage cases 4 are stored in the first component storage on the respective sides as in the second embodiment. The chamber 104 is guided to the component alignment passage 108 via the second component storage chamber 106 in a synchronized manner. Each chip component A guided by the two component alignment passages 108 on the component conveying belt 132 of the roller device 156 is accommodated in the groove portion 160a of the stopper member 160, and then the stopper member 160 moves horizontally to cover the upper cover. One by one is taken out from the window 162 a of the member 162 by the nozzle 26 of the automatic mounting device 24.
[0044]
According to the third embodiment, since the housing 152, the alignment plate 154, the roller device 156, and the component separation mechanism 158 are shared in this way, the cost can be reduced, and the two component alignment passages 108 are formed. Since it is provided, the parts supply capacity is doubled. Further, although the two component alignment passages 108 are provided, the component conveyance belt 132 having the same width as the component conveyance belt 124c of the second embodiment provided with one component alignment passage can be used. Thus, a thin and high-density component supply device can be provided.
[0045]
Next, a fourth embodiment of the present invention will be described with reference to FIG. In the fourth embodiment, the same components as those of the second embodiment shown in FIGS. 7 to 15 are denoted by the same reference numerals, and the description thereof is omitted.
As shown in FIG. 21, reference numeral 170 denotes a chip component supply device, and this chip component supply device 170 includes a housing 172. Reference numeral 54 denotes a cartridge type component storage case, in which a large number (generally thousands to tens of thousands) of chip components A are stored in advance. The cartridge type component storage case 54 is formed with a two-dimensional component arrangement space in which components do not overlap in the component thickness direction. For this reason, in the case of parts that need to be discriminated, the front and back sides are discriminated and front and back are aligned in this two-dimensional space (the chip parts are aligned so that the back side and the front side are in the same direction). The chip part A may be stored.
In the upper part of the housing 172 of the chip component supply device 170, a component storage for storing a large number of chip components A in a two-dimensional space in which the components do not overlap with each other in the thickness direction of the chip component supply device 170 so as not to be reversed. A chamber 174 is formed, and a component alignment passage 108 is formed below the component storage chamber 56. The component alignment passage 108 aligns the chip components A in a row in a space formed to match the cross-sectional shape of the components. Yes.
[0046]
Here, the cartridge type component storage case 54 is attached to the upper opening 176 of the component storage chamber 174 of the housing 172 so as to be inclined, so that a large number of chip components are stored in the cartridge type component storage case 54. A is supplied into the component storage chamber 174 in a two-dimensionally aligned state.
The bottom surface portion 178 of the component storage chamber 174 is formed so as to be inclined so that the components can slide down by its own weight, and further communicates with the component alignment passage 108 that aligns the chip components A in a row.
An alignment plate 180 that can move up and down is provided between the component storage chamber 174 and the component alignment passage 108. The alignment plate 180 has the same thickness as the component storage chamber 174 (the same thickness as G in FIG. 11), and an inclined surface 180a is formed at the upper end thereof. FIG. 21 shows a state where the alignment plate 180 is in the raised position.
Further, as in the second embodiment, a component posture changing mechanism 122, a roller device 124, a component separating mechanism 126, and the like are provided.
[0047]
The operation of the fourth embodiment of the present invention configured as described above will be described. First, a cartridge type component storage case 54 in which a large number of chip components A are stored in a two-dimensional state (in some cases, a state in which the front and back sides are discriminated and front and back are aligned) is installed inside the housing 172 of the chip component supply device 170. The component A is mounted in the upper opening 176 of the component storage chamber 174 formed above, so that the chip A in the cartridge-type component storage case 54 remains in a two-dimensional state (in some cases, a state where the front and back sides are discriminated). It is supplied into the storage chamber 174.
Next, the components are first accommodated in the two-dimensional space in the component storage chamber 174 that does not overlap each other in the component thickness direction, and then slide down downward along the bottom surface portion 178 due to their own weight. At this time, below the bottom surface portion 178 of the component storage chamber 174, the components that are aligned and try to slide down due to their own weight and the components that are about to slide down from the inclined surface 180a of the alignment plate 180 are too concentrated and bite into a wedge shape. The aligned parts cannot fall into the part alignment passage 108. However, in this embodiment, since the inclined surface 180a of the alignment plate 180 moves upward, the parts that are about to slide down from the inclined surface 180a of the alignment plate 180 are released upward, thereby eliminating the wedge-shaped bite. Is done. At this time, the chip components A are aligned again and smoothly slide down toward the component alignment passage 108. Thereafter, the inclined surface 180a of the alignment plate 180 moves downward, and the same operation is repeated at a predetermined timing.
[0048]
In this way, the chip part A guided to the part alignment passage 108 is passed through the part posture changing mechanism 122, the roller device 124, and the groove part 128a of the stopper member 128, as in the second embodiment, and the upper cover member 130. The chip parts A are taken out one by one from the window 130a formed by the nozzle 26 of the automatic mounting device 24 one by one.
[0049]
Next, a fifth embodiment of the present invention will be described with reference to FIG. FIG. 22A is a diagram corresponding to FIG. 11 and is a partially enlarged sectional view showing the chip component supply device. FIG. 22B is a diagram illustrating the alignment plate of FIG. FIG.
In the fifth embodiment, the housing 200 includes a main body 202, a back cover 204, and a front cover 206. In the main body 202 of the housing 200, a first component storage chamber 104 and a second component storage chamber 106 are formed as in the second embodiment shown in FIG.
In the fifth embodiment, an inclined surface 202 a (fixed) is formed on the main body 202 of the housing 200.
An inclined surface 206a (fixed) is similarly formed in the front cover 206 of the housing 200. Further, a recess 104 a that functions as a part of the first component storage chamber 104 is formed in the front cover 206.
Reference numeral 210 denotes an alignment plate. The alignment plate 210 includes a first alignment portion 212 and a second alignment portion 214. The first alignment portion 212 is formed with an inclined surface 212a that is continuous with the inclined surface 202a of the main body portion 202 of the housing 200 when the alignment plate 210 is positioned below (shown by a solid line in the drawing). . The first alignment portion 212 of the alignment plate 210 is also formed inside the front cover 206, and similarly, an inclined surface 212b is formed. The inclined surface 212b is formed to be continuous with the inclined surface 206a provided inside the front cover 206 when it is positioned below. In the second alignment portion 214 of the alignment plate 210, an inclined groove 214a is formed as in the second embodiment shown in FIG. 7 and the like, and chip components are placed in the second component storage chamber 106 at the bottom of the inclined groove 214a. An inclined surface 214b is formed which is inclined so as to slide down due to its own weight toward the parts alignment passage. In FIG. 22, the phantom line indicates the position where the alignment plate 210 has moved upward.
[0050]
According to the fifth embodiment, when the chip component is guided from the first component storage chamber 104 to the second component storage chamber 106, the first alignment portion 212 of the alignment plate 210 moves upward, whereby the first component storage The wedge-shaped biting of the component in the chamber 104 is eliminated, and the chip component A slides downward by its own weight through the inclined groove 214a of the second alignment portion 214 toward the second component storage chamber 106. Further, the second alignment portion 214 of the alignment plate 210 moves upward, so that the wedge-like biting of the components in the second component storage chamber 106 is eliminated, and the chip component A smoothly moves toward the component alignment passage. Slide down.
On the other hand, in the second embodiment shown in FIG. 11, depending on the size, shape and material of the chip component, when the alignment plate 114 is raised, the inclined surface 116a of the first alignment portion 116 and the front cover of the housing 120 (FIG. 11). In this case, the chip component may be sandwiched between the inner wall surface of the front cover and the inner wall surface of the front cover. In such a case, according to the fifth embodiment, since the recess 104a is formed in the front cover 206, when the alignment plate 210 is raised, the front surface by the chip component as described above is used. Damage to the inner wall surface of the cover can be reliably prevented.
The structure of the fifth embodiment shown in FIG. 22 is applicable to the third embodiment shown in FIGS.
[0051]
Next, a sixth embodiment of the present invention will be described with reference to FIGS. In the sixth embodiment, the alignment plate 210 in the fifth embodiment shown in FIG. 22 is made a simpler shape. Here, FIG. 23 is a drawing corresponding to FIG. 11 and FIG. 22, and is a partially enlarged cross-sectional view showing the chip component supply device. FIG. 24 is a chip component supply device as seen from the PP direction of FIG. FIG.
In the sixth embodiment, the housing 300 includes a main body 302, a back cover 304, and a front cover 306. A first component storage chamber 104 and a second component storage chamber 106 are formed in the main body 302 of the housing 300. An inclined surface 302 a (fixed) is formed on the bottom surface of the main body 302 of the housing 300.
An inclined surface 306 a (fixed) is similarly formed in the front cover 306 of the housing 300. Furthermore, a recess 104 a that functions as a part of the first component storage chamber 104 is formed in the front cover 306.
Reference numeral 310 denotes an alignment plate. The alignment plate 310 includes a first alignment portion 312 at an upper end portion thereof, and further includes a second alignment portion 314 below the first alignment portion 312. The first alignment portion 312 is formed with an inclined surface 312 a located between the first component storage chamber 104 and the second component storage chamber 106. In addition, the second alignment portion 314 is formed with an inclined surface 314 a positioned between the second component storage chamber 106 and the component alignment passage 108. The thickness of the alignment plate 310 is the same as that of the second component storage chamber 106. The alignment plate 310 is movable up and down between a predetermined uppermost position (position shown in FIG. 24) and a predetermined lowermost position. These uppermost position and lowermost position can be arbitrarily changed.
[0052]
According to the sixth embodiment, when the chip component is guided from the first component storage chamber 104 to the second component storage chamber 106, the first alignment portion 312 of the alignment plate 310 moves upward as shown in FIG. As a result, the wedge-shaped biting of the component occurring in the lower part of the first component storage chamber 104 is eliminated, and the chip component A slides downward toward the second component storage chamber 106 due to its own weight. Further, by moving the second alignment portion 314 of the alignment plate 310 upward, the wedge-shaped biting of the components in the second component storage chamber 106 is similarly eliminated, and the chip component A can be smoothly moved to the component alignment path. It slides down by its own weight toward 108.
Furthermore, according to the sixth embodiment, as in the fifth embodiment shown in FIG. 22, the recess 104a is formed in the front cover 306. Therefore, when the alignment plate 310 is raised, the chip is raised. It is possible to reliably prevent damage to the inner wall surface of the front cover due to parts.
Similarly, the structure of the sixth embodiment shown in FIGS. 23 and 24 is applicable to the third embodiment shown in FIGS.
[0053]
The embodiment using the rotating plate or the alignment plate as the first alignment unit, the second alignment unit, and the alignment unit has been described above, but the present invention is not limited to this. That is, as the first aligning means, the second aligning means, and the aligning means of the present invention, in addition to the rotating plate or the aligning plate described above, a vibration type (bowl type, straight type and hopper type), a rotary type (drum type and horizontal type) ), Swing type (blade swing type and hopper swing type), belt type (escalator type and horizontal type), jet type (liquid type and air type), and the like can also be used.
[0054]
【The invention's effect】
As described above, according to the chip component supply apparatus of the present invention, chip components can be reliably and efficiently supplied by the bulk supply method. In addition, the structure is relatively simple and a large amount of parts can be supplied at low cost. Furthermore, according to the cartridge-type component storage case of the present invention, chip components can be stored in a two-dimensional component placement space with the front and back aligned.
[Brief description of the drawings]
FIG. 1 is a front sectional view showing a first embodiment of a chip component supply apparatus according to the present invention.
FIG. 2 is a side sectional view of FIG.
3 is an enlarged cross-sectional view of the main part of FIG.
FIG. 4 is a perspective view showing a chip component.
FIG. 5 is a perspective view showing a chip part whose 90-degree posture is changed.
FIG. 6 is a perspective view showing a chip component posture changing mechanism.
FIG. 7 is a front cross-sectional view showing a second embodiment of the chip component supply apparatus of the present invention.
8 is a partial cross-sectional view taken along line CC in FIG.
FIG. 9 is a partial cross-sectional view taken along line DD in FIG.
10 is an enlarged cross-sectional view of the main part showing the second component storage chamber of FIG. 7 and its surroundings.
FIG. 11 is a partially enlarged sectional view of FIG. 10 viewed from the direction of arrow E.
FIG. 12 is an enlarged cross-sectional view of a waist portion showing a state in which the alignment plate is raised and lowered.
FIG. 13 is an enlarged sectional view of a waist portion showing a state where the alignment plate is lowered.
FIG. 14 is a partial plan view for illustrating the operation (part receiving position) of the part separating mechanism at the end of the roller device;
FIG. 15 is a partial plan view for illustrating the operation (part removal position) of the part separation mechanism at the end of the roller device;
FIG. 16 is a front cross-sectional view showing a third embodiment of the chip component supply apparatus of the present invention.
17 is a partial cross-sectional view taken along line KK in FIG.
18 is a partial cross-sectional view taken along line MM in FIG.
FIG. 19 is a partial plan view showing the operation (part receiving position) of the part separating mechanism at the end of the roller device;
FIG. 20 is a partial plan view for illustrating the operation (part removal position) of the part separation mechanism at the end of the roller device.
FIG. 21 shows the first of the chip component supply apparatus of the present invention. 4 Front sectional view showing the cartridge type component storage case of the embodiment and the present invention
FIG. 22 is a front sectional view (FIG. 22A) showing a fifth embodiment of the chip component supply apparatus of the present invention and a partial sectional view seen from the NN direction (FIG. 22B)
FIG. 23 is a partially enlarged cross-sectional view showing a sixth embodiment of the chip component supply apparatus of the present invention.
24 is a partial cross-sectional view of the chip component supply device as seen from the direction P-P in FIG. 23;
[Explanation of symbols]
1,100,150,170 Chip component supply device
2,102,152,172,200 housing
4,54 Parts storage case
6,104 First part storage chamber
8,106 Second parts storage chamber
10, 58, 108 Parts alignment passage
12, 60, 110, 174 Upper opening
14, 62, 120, 178 Bottom portion
16 First alignment rotating plate
18 Bottom
20 Second alignment rotating plate
22, 124, 156 Roller device
24 Automatic mounting device
26 nozzles
28 arms
30 Drive roller
32 levers
34 First drive belt
36 Second drive belt
38 Third drive belt
56,174 Parts storage room
64 Alignment rotating plate
72 Drive lever device
74 Adsorption surface
76,122 Part posture conversion mechanism
78 Conversion groove
114,154,180,210,310 Alignment plate
116,212 first alignment portion
118, 214 Second alignment section
126 Parts separation mechanism
128,160 Stopper member
130, 162 Upper cover member
312 Inclined part

Claims (6)

A first part storage chamber (6) for storing chip parts in a stacked state;
A second component that is provided so as to communicate with the first component storage chamber (6) and that two-dimensionally stores the chip component in a space formed so that the chip components do not overlap each other in the thickness direction. Storage room (8),
A component alignment passage (10, 108) provided in a lower portion of the second component storage chamber (8), formed to match the cross-sectional shape of the chip component, and aligned in one row with the chip component;
Provided between the first component storage chamber (6) and the second component storage chamber (8), the chip components are two-dimensionally aligned, and the second component storage chamber is provided from the first component storage chamber (6). First aligning and rotating means (16) to be moved to the chamber (8);
Provided between the second component storage chamber (8) and the component alignment passages (10, 108), the chip components are aligned in a one-dimensional manner from the second component storage chamber (8) to the component alignment passages. Second alignment rotation means (20) to be moved to (10, 108);
Sending means (22) for feeding the chip parts on the part alignment passages (10, 108) one by one to a predetermined position;
A chip component supply device comprising:   The chip component supply device according to claim 1, wherein the component alignment passage (10, 108) has a component posture changing mechanism (76, 78) for changing the posture of the chip component by a predetermined angle. The first aligning and rotating means (16) has a first aligning and rotating plate (16) that rotates in a space between the first component storage chamber (6) and the second component storage chamber (8). The second aligning and rotating means (20) has a second aligning and rotating plate (20) that rotates in a space between the second component storage chamber (8) and the component aligning passage (10, 108). The chip component supply apparatus according to 2.   The first component storage chamber (6) has a bottom surface formed so as to be inclined so that the chip component can move downward by its own weight, and the second component storage chamber (8) has its chip component having its own weight. 4. The chip component supply device according to claim 1, further comprising a bottom surface portion that is formed to be inclined so as to be moved downward.   5. The chip component supply device according to claim 1, wherein the chip component supply device has two each of the first component storage chamber (6), the second component storage chamber (8), and the component alignment passages (10, 108). .   Furthermore, it has the single drive means (24) which drives the said 1st alignment rotation means (16), the said 2nd alignment rotation means (20), and the said delivery means (22), Any one of Claim 1 thru | or 5 The chip component supply device according to item.

Images