JP3808339B2 - Thin film formation method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a plasma CVD apparatus for forming a thin film such as a semiconductor, a liquid crystal, and an optical disk, and more particularly to a plasma CVD apparatus using a reaction chamber composed of a conductor chamber made of metal or the like and a cleaning method thereof. .
[0002]
[Prior art]
As a method for forming a thin film on a substrate, a sputtering method utilizing a sputtering phenomenon, a vacuum deposition method utilizing a vapor deposition phenomenon, a plasma CVD method utilizing a low temperature gas decomposition by plasma, and a thermal decomposition of a gas in a reduced pressure state. Known are thermal CVD methods, CVD (Chemical Vapor Deposition) methods such as a photo-CVD method in which gas is decomposed by short wavelength light or ultraviolet energy. In addition, many of these composite technologies and applied technologies have been researched and developed and used in actual manufacturing methods.
[0003]
Among the thin film formation techniques as described above, the plasma CVD method is a method in which a direct current or a high frequency voltage is applied to the reaction gas in a reduced pressure state, the reaction gas is decomposed and generated by glow discharge, and a film is deposited on the substrate. . Thin film formation by this method can decompose gas at a relatively low temperature (500 ° C. or lower) by plasma energy such as high electron temperature eV of plasma, or change the type of gas to form films with various compositions. Since it can be formed with high purity using vacuum, it has been implemented in various fields such as the semiconductor field, the liquid crystal field, the optical disk field, and the magnetic disk field.
[0004]
Until a while ago, when forming a thin film on a substrate, it was well known to use a batch type plasma CVD apparatus for processing a large number of substrates at once.
However, in the case of batch processing, even if processing is performed simultaneously, the characteristics of the thin film slightly change for each substrate. Therefore, it has been difficult to meet the demand for a highly accurate thin film due to large repeatability and variations between substrates.
In addition, a substrate holder for mounting the substrate and moving the substrate together is necessary to process a plurality of substrates (about 4 to 8) simultaneously. The substrate holder comes out of the plasma CVD apparatus when the film formation of the substrate is completed, and the next substrate is placed and processed again in the apparatus.
For this reason, a so-called peeling phenomenon occurs in which the film adhering to the substrate holder peels off in order to repeat vacuum heating and atmospheric pressure at room temperature.
[0005]
For the reasons described above, batch processing has not been used in general, such as thin film deposition etching, in recent years, and a single wafer type apparatus has been used instead.
[0006]
In the case of a single wafer type, the substrate is processed in order one by one without using a substrate holder that moves together with the substrate, and only the substrate is moved. A conventional plasma CVD apparatus using this method will be described with reference to FIGS.
[0007]
FIG. 2 shows a top view of the single-wafer plasma CVD apparatus. The chamber 201 is a load chamber for carrying in and out the substrate. The chambers 202 to 206 become reaction chambers.
[0008]
A plurality of substrates to be processed are set in the load chamber 201 using a cassette or the like. After the substrate is set in the load chamber 201, the pressure is reduced. When the pressure is reduced to a sufficient pressure, the gate valve 210 between the load chamber 201 and the common chamber 207 opens. The substrate transfer means 208 installed in the common chamber 207 moves one of the plurality of substrates set in the cassette in the load chamber 201 from the load chamber 201 to the common chamber 207. The moved state is shown in FIG. 2, and the substrate 209 moves to the reaction chamber for forming the thin film. The substrate 209 is moved by the substrate transfer means 208 to the reaction chamber.
[0009]
The common chamber 207, the reaction chambers 202 to 206, and the load chamber 201 are connected by a gate valve 210, and the gate valve of the chamber is opened when the substrate 209 is taken in and out of each chamber. Further, the load chamber 201, the reaction chambers 202 to 206, and the common chamber 207 are each evacuated by a vacuum exhaust means.
Thin film formation includes various types such as a laminated type such as an amorphous solar cell (P layer I layer N layer or the like) and a single layer like a semiconductor protective film. Therefore, the treatment in each chamber differs depending on the type of film to be formed and the laminated type.
[0010]
FIG. 3 is a cross-sectional view of the common chamber 207 and the reaction chamber 204 taken along the line AA in FIG.
[0011]
An electrode 211 and a substrate holder 212 are installed in the reaction chamber 204. The electrode 211 is connected to the power source 213, and the substrate holder 212 and the reaction chamber 202 are grounded. In addition, the substrate holder 212 includes a heater (not shown) for heating the substrate.
Unlike the batch type, the substrate holder 212 exists in the reaction chamber 204 and is not transferred together with the substrate 210.
[0012]
Then, the substrate 209 is placed on the substrate holder 212 from the common chamber 207, and the reaction gas is introduced from the introduction pipe 214. Then, a voltage is applied to the electrode 211 to generate plasma in a space indicated by 215 to form a thin film on the substrate.
The substrate 210 on which the thin film has been formed is moved again from the reaction chamber 204 to the common chamber 207 by the transfer means 208 in the common chamber 207 and is transferred to the next processing. Then, another substrate is carried into the reaction chamber 204, and a thin film forming process is performed in the same manner. In the series of processes, only the substrate is moved.
[0013]
Reference numerals 217 and 218 denote evacuation means, which keep the common chamber and the reaction chamber in a reduced pressure state. The exhaust means is usually provided independently for each chamber.
[0014]
The reaction chambers 203 to 206 have the same structure as the reaction chamber 202, and each reaction chamber is selectively used depending on the type and thickness of the film to be formed. For example, a silicon film is formed in the reaction chamber 202, a silicon oxide film is formed in the reaction chamber 203, and a silicon nitride film is formed in the reaction chamber 204.
Alternatively, the same process of laminating a silicon nitride film, a silicon film, and a silicon nitride film is performed in each reaction chamber to improve the overall throughput so-called productivity.
[0015]
Of course, by limiting the type of film to be formed for each chamber in order to suppress impurities extremely, it is possible to sequentially form each film without introducing impurities, which can increase the production efficiency. is there.
[0016]
Of the components of the plasma CVD apparatus described above, the constituent material of each chamber is mainly made of a conductor such as metal, for example, aluminum or stainless steel. As a material for the chamber of the plasma CVD apparatus, it is known to use quartz or alumina which is an insulator in addition to metal, but it is not used for a single wafer type apparatus. This is due to the following reasons.
[0017]
In the case of a single wafer plasma CVD apparatus, it is necessary to improve productivity by providing a plurality of reaction chambers in order to process substrates one by one. If a plurality of reaction chambers are provided, the size of the plasma CVD apparatus is inevitably increased. For this purpose, a material having strength is required. In the case of materials such as quartz and alumina, they have hardness but are easily damaged. The material of the vacuum chamber is so delicate that even a single hair can be injured and cannot be kept in a vacuum.
Furthermore, in order to increase the size and complexity, a material that is easy to process and has high processing accuracy is required. Moreover, the cheapest is better.
Searching for materials that satisfy the above conditions, at present, reaction chambers are often made using metal materials such as aluminum, aluminum alloys, and stainless steel.
[0018]
[Problems to be solved by the invention]
When the thin film is formed by the single wafer plasma CVD apparatus as described above, the reaction gas to be decomposed travels not only on the substrate but also on the entire reaction chamber. In thermal CVD or the like, a film is formed not only on the substrate but also on the entire reaction chamber in order to heat the entire reaction chamber. In the case of the plasma CVD method, it is ideal that the film is formed only on the substrate where the plasma is generated, but the film is also formed on a place other than on the substrate. That is, since the plasma 215 spreads outside the vicinity of the substrate 209, a film is also formed on the exposed portion such as the surface of the electrode 211 and the inner wall of the reaction chamber.
[0019]
This not only generates a plasma between the electrode and the substrate holder, but also because the reaction chamber is made of a metallic material, ie, a conductor, it is not only generated between the electrode and the substrate holder. The cause is that it spreads more than this. Unlike the substrate holder of the batch type plasma CVD apparatus, the film formed on the substrate other than the substrate does not come off immediately because it does not touch the atmosphere or repeat the room temperature-high temperature cycle.
[0020]
However, it continues to peel off as the film formation continues. This film falls as particles or flakes on the substrate or the bottom of the reaction chamber.
Therefore, it is necessary to periodically remove the film deposited and deposited in a place other than the substrate before it starts to peel off after the film is formed several times. The removal is performed by introducing an etching gas into the reaction chamber and generating plasma to etch the film.
[0021]
When film formation is severe, unnecessary discharge such as arc discharge occurs between the inner wall of the reaction chamber close to the electrode 211, for example, the space indicated by 216 in FIG. 3, and the film thickness on the inner wall is reduced. It may become thick and easily peel off as a result.
[0022]
The inner wall of the reaction chamber makes its surface relatively smooth. This is smoothed in order to suppress degassing from the walls to reduce impurities and to prevent arc discharge. Actually, it is in a state close to a mirror surface by # 400 or more buff polishing, electrolytic polishing, composite electrolytic polishing or the like. The film attached to the smooth surface has poor adhesion and is easily peeled off. The peeled film is deposited as particles or flakes in the reaction chamber. These deposits once peeled off to form particles, flakes, and the like are more difficult to remove by plasma etching than those deposited on the inner wall during film formation.
In practice, it cannot be completely removed. Although it is not theoretically known why it cannot be completely removed, as a rule of thumb, a film-like material can be etched, but solid bodies such as particles and flakes cannot be etched completely.
[0023]
Therefore, it is necessary to clean the reaction chamber long before the film attached to the substrate other than the substrate is peeled off. Therefore, the proportion of production contribution decreases due to the balance between the film formation time that contributes to production and the etching time that does not contribute to production in the operation time of the apparatus.
The unevenness of the reaction chamber surface can reduce the ease of film peeling, but the surface area increases and it takes time to evacuate, the amount of degassing from the uneven surface with increased surface area increases, It deviates from the original purpose of forming a high thin film.
[0024]
The present invention solves the above problems. That is, while maintaining the size of the device and ease of processing, it prevents unnecessary discharge such as arc discharge, reduces the amount of particles due to peeling of the film attached to the reaction chamber, and facilitates cleaning. The purpose is to shorten the cleaning time and increase the production contribution ratio of the operating time of the apparatus.
[0025]
[Means for Solving the Problems]
The invention disclosed in this specification is
A plasma CVD apparatus having a carry-in chamber, a common chamber, and a plurality of reaction chambers, the plurality of reaction chambers having an electrode, a substrate holder facing the electrode, and an insulator surrounding a space between the electrode and the substrate holder Cleaning method,
Nitrogen fluoride is introduced into a space surrounded by the electrode, the insulator, and the substrate holder to generate plasma, and the film attached to the electrode, the insulator, and the substrate holder is etched. The present invention relates to a cleaning method.
[0026]
Other inventions are:
A carry-in chamber, a common chamber and a reaction chamber composed of a conductor held in a reduced pressure state;
A conveying means installed in the common chamber for taking a substrate in and out of the reaction chamber;
An electrode supplied with electrical energy in the reaction chamber;
A substrate holder for holding the substrate facing the electrode;
A gas system for supplying gas to the reaction chamber;
A plasma CVD apparatus having at least an exhaust system for exhausting the reaction chamber, wherein plasma is generated in a space surrounded by the electrode, the substrate holder, and an insulator.
Furthermore, the said plasma CVD apparatus can also use the said insulator as a stopper when the said substrate holder operates and stops.
In the above structure, the insulator may be alumina.
[0027]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 shows a plasma CVD apparatus of the present invention. FIG. 1 shows a cross-sectional view of one of the common chamber 107 and one of the reaction chambers 104. The entire CVD apparatus includes a carry-in chamber, a common chamber, and a plurality of reaction chambers, for example, as shown in FIG. It is made up of.
[0028]
The common chamber 107 and the reaction chamber 104 are made of a metal material for the reason described above. The gate valve 110 is connected.
In the reaction chamber 104, an electrode 111 and a substrate holder 112 are installed. The electrode 111 is connected to a power source 113, and the substrate holder 112 and the reaction chamber 104 are grounded. The substrate holder 112 is provided with a heater for heating the substrate, although not shown.
[0029]
Reference numerals 117 and 118 denote evacuation means that keep the common chamber and the reaction chamber in a reduced pressure state. Reference numeral 114 denotes a tube for introducing a reaction gas into the reaction chamber 104. In the case of FIG. 1, the electrode 111 has a net shape, and the reaction gas is introduced into the reaction chamber 104 from the electrode 111 through the introduction tube 114.
[0030]
Then, as shown in FIG. 1, an insulator 120 such as alumina is attached. When voltage is applied to the electrode 111 in this state, the generated plasma 115 is surrounded by the electrode 111, the substrate holder 112, and the insulator 120.
Therefore, the insulator 120 can prevent unnecessary discharge such as arc discharge from occurring between the electrode 111 and the reaction chamber 104 without causing the plasma to spread from between the electrode and the substrate holder.
[0031]
In addition, the substrate 109 can be taken in and out of the reaction chamber 104 from the common chamber 107 by the transfer means 108. At this time, the substrate holder 112 is positioned below as indicated by a dotted line 112 ′ in FIG. By doing so, the substrate 109 can be placed by the transfer means 108 so that the insulator 120 does not become an obstacle.
[0032]
Furthermore, when a film is formed on the substrate 109, the substrate holder 112 is raised so that the plasma is surrounded by the electrode 111, the substrate holder 112, and the insulator 120. At this time, the insulator 120 serves as a stopper, and the substrate holder 112 is stopped. In this way, there is no possibility that the substrate holder 112 is raised too much and the substrate 109 comes into contact with the electrode 111, and the safety is increased in the automation of the apparatus.
[0033]
In this manner, since the plasma 115 does not spread, the plasma density is increased and unnecessary discharge such as arc discharge does not occur, so that the film formation rate on the substrate 109 is increased.
Further, during film formation, a film is formed mainly on the surface of the electrode 111 and the surface of the insulator 120. However, since the surface of the insulator 120 is uneven, the formed film has better adhesion than metal, and becomes difficult to fall off as particles or flakes. Therefore, the amount of particles and flakes can be reduced, and the reaction chamber can be easily cleaned by plasma etching.
Furthermore, since the coating is mainly formed on the surface of the electrode 111 and the surface of the insulator 120 and is hardly formed in the reaction chamber itself, the area to be cleaned is narrowed. Further, since the plasma does not spread as described above, the plasma density is increased.
[0034]
For the above reasons, the cleaning time can be shortened, and the production contribution ratio of the operating time of the apparatus can be increased.
[0035]
【Example】
Example 1
In this embodiment, the single-wafer plasma CVD apparatus according to this embodiment will be described with an example in which a silicon nitride film is formed on a substrate. FIG. 4 shows a cross-sectional view of the reaction chamber of the plasma CVD apparatus of this embodiment.
[0036]
In FIG. 4, an electrode 402 and a substrate holder 403 are installed in a reaction chamber 401. The electrode 402 has a mesh shape, and the reaction gas passes through the introduction tube 409 and is introduced from the mesh electrode 402 into the reaction chamber.
Further, insulators such as alumina 406 and 407 are disposed between the space 405 between the electrode 402 and the substrate holder 403 and the reaction chamber 401.
[0037]
A portion indicated by 410 is made of quartz. Quartz 410 is installed for the following reason. The reaction gas contacts between the walls of the reaction chamber through insulators 406 and 407. Accordingly, a film is also formed on the surface of the wall of the aluminum reaction chamber that comes into contact. Since this film is formed on aluminum, it becomes particles. In order to prevent this, quartz 410 is installed.
Reference numeral 411 denotes an exhaust pipe which is connected in the order of a turbo molecular pump and a rotary pump, and keeps the reaction chamber in a reduced pressure state. In this embodiment, first, the reaction chamber is set to 0.3 torr.
[0038]
Next, in a state where the distance between the substrate holder 403 and the electrode 402 is set to 65 mm, the glass substrate 404 is set on the substrate holder 403 by a conveying means (not shown). In this state, the insulators 406 and 407 do not become an obstacle when the substrate 404 is installed.
Then, the substrate holder is raised, and the distance between the substrate holder 403 and the electrode 402 is set to 15 to 25 mm, and the state shown in the figure is obtained. In this embodiment, it is 20 mm.
[0039]
In this way, the substrate holder 403 moves up and down. When placing the substrate 404, the substrate holder 403 and the insulator 407 are lowered sufficiently so that the substrate can be placed smoothly. When the film is formed on the top, it goes up as shown in FIG.
The position of the substrate (distance between the substrate and the electrode) can be adjusted. The insulator 407 also serves as a stopper when the substrate holder 403 is raised, and increases the safety when the substrate holder 403 is raised.
[0040]
Although not shown, a heater for heating the substrate 404 is provided in the substrate holder 403.
[0041]
Then, a mixed gas of silane, ammonia, nitrogen, and hydrogen is introduced from the mesh electrode 402 into the reaction chamber at silane / ammonia / nitrogen / hydrogen = 30/150/250/100 SCCM. Then, 100 to 300 W of RF is applied from the power source (not shown) to the electrode 402 under the conditions of the total pressure of 0.2 to 1 torr, and plasma is generated in the space 405. The substrate temperature at this time shall be 250-400 degreeC. In this embodiment, the total pressure is 0.5 torr, the RF is 200 W, and the substrate temperature is 325 ° C.
Further, since the size of the electrode is 200 mmφ, the voltage applied to the electrode is approximately 0.3 to 1 W / cm ² . The plasma generated at this time is not spread by the insulators 406 and 407, and no arc discharge or the like occurs between the walls of the reaction chamber and the electrodes.
[0042]
A silicon nitride film is formed as described above. The deposition rate of the silicon nitride film under the conditions of this example is about 1400 liters / min. When the film is formed by a conventional plasma CVD apparatus, the film forming speed is approximately 300 liters / min.
[0043]
Note that a film with better film quality can be obtained when the insulators 406 and 407 are parallel to each other as much as possible. In particular, when it is desired to obtain a film having good quality, it is preferable to make this interval slightly wider. In this embodiment, it is 3 to 5 mm.
[0044]
The silicon nitride film is also formed on the surface of the insulators 406 and 407 on the space 405 side. However, the surface of the reaction chamber is hardly coated.
Since these films are formed on the surface of alumina, they are hard to fall off as particles, and the amount of particles in the reaction chamber is reduced.
[0045]
Then, film formation is performed to some extent, and after a film is formed to some extent on the surfaces of the insulators 406 and 407, cleaning is performed. In this embodiment, the cleaning is performed when a film of about 10 to 20 μm is formed on the insulator.
[0046]
As the etching gas, a mixed gas of nitrogen fluoride and nitrogen is used. In the reaction chamber, nitrogen fluoride / nitrogen = 80/300 SCCM is used to flow the mixed gas to a total pressure of about 0.2 to 1 torr.
In this embodiment, it is performed at 0.5 torr.
The distance between the substrate holder 403 and the electrode is about 50 mm. This is because silicon nitride films are also attached to the respective surfaces between the insulators 408 and 407. In order to etch them, the substrate holder is lowered and a gap between the insulators 407 and 408 is left.
[0047]
Then, a high frequency of about 100 to 200 W is applied to the electrode to perform cleaning. In this embodiment, it is performed at 200W. In this case, the etching is completed in about 40 minutes. Conventionally, it took 5 to 6 hours, but the etching time is reduced to about 1/8 to 1/9.
[0048]
Thus, the surface of the insulator such as alumina is more uneven than the surface of the inner wall of the reaction chamber, that is, the metal surface. Therefore, the formed coating film is difficult to peel off, the amount of particles and the like falling on the bottom of the substrate and the reaction chamber can be reduced, and cleaning becomes easy.
Further, since the insulators 406 and 407 are provided, it is possible to prevent plasma from spreading. Therefore, unnecessary discharge such as arc discharge does not occur between the electrode and the inner wall of the reaction chamber, and the plasma density is high.
Furthermore, since the coating is hardly formed on the walls of the reaction chamber and is mainly coated on the insulator, electrodes, etc., the area that must be cleaned is small.
[0049]
From the above, cleaning is simplified, the time can be shortened, and the production contribution ratio of the operating time of the apparatus can be increased.
[0050]
(Example 2)
The case where a silicon oxide film is formed on a substrate using the apparatus shown in FIG. 4 will be described.
[0051]
In the apparatus shown in FIG. 4, the reaction gas is introduced into the reaction chamber at TEOS / oxygen = 10/300 SCCM, and the total pressure is about 0.5 to 1 torr. In this embodiment, it is performed at 0.75 torr.
[0052]
The substrate temperature is 300 to 400 ° C., RF is 150 to 300 W, the distance between the substrate and the electrode is 10 to 15 mm, and a silicon oxide film is formed on the substrate. In this embodiment, the substrate temperature is 350 ° C., the RF is 200 W, and the distance is 13.5 mm.
[0053]
The film formation rate at this time is about 2000 to 2300 liters / min, which is about three times the conventional film formation rate.
[0054]
Cleaning is performed in the same manner as in the first embodiment. However, the total pressure in the reaction chamber is about 1 torr, and the distance between the substrate holder 403 and the electrode is 50 to 60 mm.
[0055]
Also in this embodiment, the etching time is greatly reduced to 20 to 40 minutes.
[0056]
【The invention's effect】
As described above, in the plasma CVD apparatus, an apparatus that does not cause extra discharge such as arc discharge can be obtained while using a conductive material that is advantageous in terms of upsizing and easy processing. In addition, since the film does not adhere to the inner wall of the reaction chamber but adheres to the insulator surface, the amount of particles in the reaction chamber can be reduced.
Further, by using the cleaning method of the present invention, the cleaning time can be shortened and the production contribution ratio of the operating time of the apparatus can be increased.
[Brief description of the drawings]
1 is a cross-sectional view of a common chamber and a reaction chamber of the plasma CVD apparatus of the present invention. FIG. 2 is a top view of a single-wafer plasma CVD apparatus. FIG. 3 is a cross-section of a common chamber and a reaction chamber of a conventional plasma CVD apparatus. FIG. 4 is a cross-sectional view of a reaction chamber of an embodiment of the plasma CVD apparatus of the present invention.
104 Reaction chamber 107 Common chamber 108 Substrate transport means 109 Substrate 110 Gate valve 111 Electrodes 112, 112 'Substrate holder 113 Power supply 114 Reactant gas introduction tube 115 Plasma space 117, 118 Vacuum exhaust means 120 Insulator 401 Reaction chamber 402 Electrode 403 Substrate Holder 404 Substrate 405 Plasma space 406, 407, 408 Insulator 409 Introduction pipe 410 Quartz 411 Exhaust pipe

Claims (10)

Carry-in chamber, a common chamber and a plurality of reaction chambers, the substrate holder of the reaction chamber of said plurality of opposed electrodes, to the electrode, the two upper and lower insulator surrounding a space between the electrode and the substrate holder, and A thin film forming method using a plasma CVD apparatus having a parallel exhaust space between the two insulators ,
Installing a substrate on the substrate holder,
Introducing a reactive gas into a space surrounded by the electrode, the insulator and the substrate holder to generate plasma, forming a thin film on the substrate,
The reaction gas is exhausted through a parallel exhaust space between the two insulators,
After forming the thin film , nitrogen fluoride is introduced into a space surrounded by the electrode, the insulator, and the substrate holder to generate plasma, and the film attached to the electrode, the insulator, and the substrate holder is cleaned by etching. A method for forming a thin film, comprising : Carry-in chamber, a common chamber and a plurality of reaction chambers, the substrate holder of the reaction chamber of said plurality of opposed electrodes, to the electrode, the two upper and lower insulator surrounding a space between the electrode and the substrate holder, and A thin film forming method using a plasma CVD apparatus having a parallel exhaust space between the two insulators ,
Installing a substrate on the substrate holder,
Introducing a reactive gas into a space surrounded by the electrode, the insulator and the substrate holder to generate plasma, forming a thin film on the substrate,
The reaction gas is exhausted through a parallel exhaust space between the two insulators,
After forming the thin film , nitrogen fluoride and nitrogen are introduced into a space surrounded by the electrode, the insulator, and the substrate holder to generate plasma, and the film attached to the electrode, the insulator, and the substrate holder is etched. The thin film formation method characterized by cleaning by this. Carry-in chamber, a common chamber and a plurality of reaction chambers, the substrate holder of the reaction chamber of said plurality of opposed electrodes, to the electrode, the two upper and lower insulator surrounding a space between the electrode and the substrate holder, and A thin film forming method using a plasma CVD apparatus having a parallel exhaust space between the two insulators ,
Installing a substrate on the substrate holder,
Introducing a reactive gas into a space surrounded by the electrode, the insulator and the substrate holder to generate plasma, forming a thin film on the substrate,
The reaction gas is exhausted through a parallel exhaust space between the two insulators,
After forming the thin film, the substrate holder is lowered to widen the distance between the substrate holder and the electrode, and then nitrogen fluoride is introduced into the space surrounded by the electrode, the insulator and the substrate holder to generate plasma. is allowed, the electrode, a thin film forming method characterized in that the coating adhered to the insulating body and the substrate holder is cleaned by etching. Carry-in chamber, a common chamber and a plurality of reaction chambers, the substrate holder of the reaction chamber of said plurality of opposed electrodes, to the electrode, the two upper and lower insulator surrounding a space between the electrode and the substrate holder, and A thin film forming method using a plasma CVD apparatus having a parallel exhaust space between the two insulators ,
Installing a substrate on the substrate holder,
Introducing a reactive gas into a space surrounded by the electrode, the insulator and the substrate holder to generate plasma, forming a thin film on the substrate,
The reaction gas is exhausted through a parallel exhaust space between the two insulators,
After forming the thin film, the substrate holder is lowered to widen the distance between the substrate holder and the electrode, and then nitrogen fluoride and nitrogen are introduced into the space surrounded by the electrode, the insulator, and the substrate holder to generate plasma. to generate, the electrode, a thin film forming method characterized in that the coating adhered to the insulating body and the substrate holder is cleaned by etching. 5. The thin film forming method according to claim 1, wherein inner walls of the plurality of reaction chambers are made of a metal material. 6. The thin film forming method according to claim 1, wherein the insulator is alumina. 7. The thin film forming method according to claim 1, wherein a distance between the electrode and the substrate holder is adjustable. 8. The thin film forming method according to claim 1, wherein the inner wall of the reaction chamber has a mirror-like surface. 9. The thin film forming method according to claim 1, wherein the cleaning is performed by applying a high frequency to the electrode. 10. The thin film forming method according to claim 1, wherein the thin film is formed on the substrate in a state where the substrate holder is raised to a position limited by the insulator.

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