JP3802171B2

JP3802171B2 - Inspection jig

Info

Publication number: JP3802171B2
Application number: JP34114996A
Authority: JP
Inventors: 寿小黒
Original assignee: JSR Corp
Current assignee: JSR Corp
Priority date: 1996-12-20
Filing date: 1996-12-20
Publication date: 2006-07-26
Anticipated expiration: 2016-12-20
Also published as: JPH10185992A

Description

【０００１】
【発明の属する技術分野】
本発明は、内部に電子回路を有する被検査物における電子回路の非破壊試験に用いられる検査治具に関する。
【０００２】
【従来の技術】
電子機器などに実装される半導体集積回路は、実装される以前の段階で種々の試験が行われその潜在的欠陥が除去される。その試験は、熱的および機械的環境試験などに対応した電圧ストレス印加、高温動作、高温保存などにより非破壊的に実施される。その種々の試験のうちで初期動作不良集積回路の除去に有効とされる試験としては、高温条件のもとで一定時間の動作試験を行うバーンイン（ｂｕｒｎｉｎ）試験が行われている。
【０００３】
このバーンイン試験に用いられる検査治具は、例えば、図１１および図１２に示されるように、フレーム６上に配され所定の試験電圧が供給されるとともに被検査物からの短絡等をあらわす異常検出信号を送出する入出力部２Ａを有するプリント配線基板２と、プリント配線基板２上における所定の位置に配され被検査物としての半導体集積回路が収容される、例えば、表面実装形のＱＦＰ（ｑｕａｄｆｌａｔｐａｃｋａｇｅ）型の半導体素子１２が装着される収容部を有する被検査物収容部材１０と、半導体素子１２の上面に当接し所定の圧力で押圧する当接部８ａを有し、被検査物収容部材１０の上部を覆うカバー部材８と、カバー部材８および被検査物収容部材１０双方に係合しカバー部材８を被検査物収容部材１０に固定するフック部材１６とを含んで構成されている。
【０００４】
カバー部材８の一端部は、被検査物収容部材１０の一方の端縁部に設けられる支持軸１０ａにより回動可能に支持され被検査物収容部材１０に連結されている。これにより、カバー部材８は、フック部材１６が非係合状態とされるとき、被検査物収容部材１０に対して開閉可能に支持されることとなる。
【０００５】
また、カバー部材８の内面側部分における半導体素子１２に対向する部分には、半導体素子１２の外殻に当接し所定の圧力で下方に向けて押圧する当接部８ａが設けられている。
【０００６】
被検査物収容部材１０内部に装着される略正方形状の半導体素子１２における各辺からそれぞれ四方に伸びる各端子は、プリント配線基板２の各接続端子２ａに当接されて位置決めされている。また、各接続端子２ａにおける半導体素子１２の端子に接触する部分は円弧状に形成され弾性を有している。
【０００７】
さらに、各接続端子２ａは、図示が省略されるプリント配線網を介して入出力部２Ａに接続されている。これにより、カバー部材８が被検査物収容部材１０の収容室を覆うとき、半導体素子１２における各端子に所定の付勢力が作用されるもとで、半導体素子１２の端子とプリント配線基板２における各接続端子２ａとが電気的に導通状態とされることとなる。
【０００８】
かかる構成のもとで、半導体素子１２が被検査物収容部材１０内部に装着され、かつ、カバー部材８がフック部材１６が係合され閉状態とされて半導体素子１２の端子とプリント配線基板２における各接続端子２ａとが導通状態とされるとき、所定の試験電圧がプリント配線基板２の入出力部２Ａに供給されて例えば、バーンイン試験が行われることとなる。
【０００９】
【発明が解決しようとする課題】
上述のように半導体素子１２における各端子に所定の付勢力が作用されてその各端子の先端とプリント配線基板２における各接続端子２ａとが接触される場合、半導体素子１２の各端子の先端の曲がりなどに起因して装着された半導体素子１２の姿勢が、不適当な姿勢となることがある。このような場合、カバー部材８の当接部８ａにより押圧されてもその当接部８ａの一部が半導体素子１２の外殻に偏って当接され各端子に付勢力が均等に作用しないので安定した導通状態が得られない虞がある。
【００１０】
また、半導体素子１２の端子の高密度化に伴い、円弧状に形成され弾性を有している各接続端子２ａをプリント配線基板２に微少な相互間隔をもって設けることも容易ではなく、製造コストも嵩むこととなる。
【００１１】
以上の問題点を考慮し、本発明は、内部に電子回路を有する被検査物における電子回路の非破壊試験に用いられる検査治具であって、装着された半導体素子の姿勢に左右されることなく、その各端子に均等に圧力を加えることができ、しかも、高密度の端子を有する半導体素子についても容易に試験を行うことができる検査治具を提供することを目的とする。
【００１２】
【課題を解決するための手段】
上述の目的を達成するために、本発明に係る検査治具は、内部に電子回路が形成される被検査物の端子に電気的に接続される接点、および、入力信号が入力されるとともに該被検査物からの出力信号が送出される入出力部を有する基板と、基板の接点と被検査物の端子との間に配され、接点および端子に対応して設けられるシリコーンゴムおよび金属粒子からなる異方性導電ゴムにより形成され、所定の圧力が作用されるとき選択的に導通状態とする接続部であって、被検査物の各端子にそれぞれ接続される第１の端子部と、第１の端子部相互間距離よりも大なる相互間距離をもって形成され基板の接点および第１の端子部と接続される第２の端子部とを有する接続部を備え、接続部を介して被検査物の端子と基板の接点とを選択的に導通状態とする選択導電基板と、選択導電基板上に配される被検査物の端子と基板の接点とを接続させるべく被検査物における被押圧面部に所定の圧力をもって当接する当接部を有するブロック部材と、ブロック部材に揺動可能に連結される連結部が他端に形成される軸部を有する支柱部材と、支柱部材の軸部が所定の隙間をもって貫通される孔を有し、ブロック部材の当接部を被検査物における被押圧面部に対して付勢する付勢部材を介して支柱部材の軸部および連結部を揺動可能に支持するハウジング部材と、を備え、ブロック部材における当接部が付勢部材により付勢されるとともに、被検査物における被押圧面部に当接する場合、支柱部材およびブロック部材は、被検査物における被押圧面部に倣って揺動されることを特徴とする。
【００１３】
また、本発明に係る検査治具は、内部に電子回路が形成される被検査物の端子に電気的に接続される接点、および、入力信号が入力されるとともに被検査物からの出力信号が送出される入出力部を有する基板と、基板の接点と被検査物の端子との間に配され、接点および端子に対応して設けられるシリコーンゴムおよび金属粒子からなる異方性導電ゴムにより形成され、所定の圧力が作用されるとき選択的に導通状態とする接続部であって、被検査物の端子に接続される一端を有するとともに、基板の接点に接続される他端を有する接続部を備え、接続部を介して被検査物の端子と基板の接点とを選択的に導通状態とする選択導電基板と、選択導電基板上に配される被検査物の端子と基板の接点とを接続させるべく被検査物における被押圧面部に所定の圧力をもって当接する当接部を有するブロック部材と、ブロック部材に揺動可能に連結される連結部が他端に形成される軸部を有する支柱部材と、支柱部材の軸部が所定の隙間をもって貫通される孔を有し、ブロック部材の当接部を被検査物における被押圧面部に対して付勢する付勢部材を介して支柱部材の軸部および連結部を揺動可能に支持するハウジング部材と、を備え、ブロック部材における当接部が付勢部材により付勢されるとともに、被検査物における被押圧面部に当接する場合、支柱部材およびブロック部材は、被検査物における被押圧面部に倣って揺動されることを特徴とする。
【００１４】
さらに、被検査物の端子と選択導電基板の接続部の一端との間に、金属片もしくは金属薄膜で形成された被覆層が形成されてもよい。
【００１６】
【発明の実施の形態】
図１および図２は、本発明に係る検査治具の一例を示す。
【００１７】
図２に示される例においては、例えば、アルミウム合金材料、もしくは、ＰＰＳ（ポリフェニリンスルフィド）樹脂で作られた基台４２上に載置され試験電圧が供給されるとともに被検査物としての半導体素子３４からの出力信号を送出する入出力部２０Ａを有するプリント配線基板２０と、プリント配線基板２０上における所定の位置に所定の相互間隔をもって複数個一直線上に配列されるものが複数列設けられ半導体素子３４を収容する被検査物収容部材３２と、複数個一直線上に配列される各被検査物収容部材３２の上方に各被検査物収容部材３２に対向して配され被検査物収容部材３２内に装着された半導体素子３４に対して所定の圧力を作用させる押圧部材としての押圧機構部５２と、押圧機構部５２の両端部をそれぞれ基台４２上に選択的に支持する支持機構部５４とを含んで構成されている。
【００１８】
プリント配線基板２０には、図３に示されるように、入出力部２０Ａに図示が省略される導体を通じて接続される接点２０ａが設けられている。接点２０ａは、接点２０ａが半導体素子３４の端子数に応じて複数個設けられている。接点２０ａは後述する選択導電基板４４に各被検査物収容部材３２ごとに対応して設けられる複数の端子部４４ａにそれぞれ当接される。
【００１９】
プリント配線基板２０の接点２０ａの近傍の位置には、後述する被検査物収容部材３２のプリント配線基板２０に対する位置決め用の透孔２０ｂが所定の長さを有する略正方形の各隅にそれぞれ設けられている。
【００２０】
基台４２におけるプリント配線基板２０の透孔２０ｂにそれぞれ対応する位置の中央部には、図３に示されるように、後述する位置決め用ボルト４０の雄型のねじ部がはめあわされる雌型のねじ孔４２ｓが設けられている。
【００２１】
また、基台４２における押圧機構部５２の両端部にそれぞれ対向する位置には、図１に示されるように、プリント配線基板２０の透孔２０ｃを貫通する支持部材４６が、固定ボルト５０がその雌型のねじ孔４６ｓにはめ合わされることにより固定されている。支持部材４６の上端部には、押圧機構部５２における押圧ビーム２２を選択的に係止させる係止レバー２４が設けられている。
【００２２】
係止レバー２４は、ビス４８がその透孔２４ａに挿入され支持部材４６の上端部のねじ孔４６ａにはめ合わされることにより図１に二点鎖線で示されるように、支持部材４６の上端部に回動可能に支持されている。
【００２３】
被検査物収容部材３２は、例えば、ＰＰＳ樹脂、もしくは、耐熱性プラスチック材料としてのＰＥＳ（ポリエチレンスルホン）樹脂、ＰＥＩ（ポリエチレンイミド）樹脂で作られ、図３に示されるように、半導体素子３４がその中央部に収容される被検査物収容室３２ａを有している。被検査物収容室３２ａには、半導体素子３４の各端子群における両側部のそれぞれの位置を規制する壁面部３２ｗが設けられている。
【００２４】
被検査物収容室３２ａの周囲には、プリント配線基板２０の各透孔２０ｂにそれぞれ挿入され被検査物収容部材３２および選択導電基板４４のプリント配線基板２０に対する位置決めを行うための突起部３２ｂが設けられている。各突起部３２ｂの内部には、位置決め用ボルト４０が挿入される透孔３２ｃがそれぞれ設けられている。これにより、被検査物収容部材３２は、位置決め用ボルト４０がその透孔３２ｃを通じて基台４２のねじ孔４２ｓにはめ合わされることにより基台４２に固定されることとなる。
【００２５】
選択導電基板４４には、図４に示されるように、被検査物収容部材３２の被検査物収容室３２ａに収容される半導体素子３４の各端子にそれぞれ対応した端子部４４ｂが複合導電材料、例えば、シリコーンゴムと金属粒子からなるもので作られ設けられている。複合導電材料としては、異方性導電ゴムが用いられる。異方性導電ゴムは、その厚み方向に導電性を有し平面に沿った方向には導電性を有しない材料である。また、異方性導電ゴムには、分散タイプおよび偏在タイプがあり、いずれのタイプが用いられても良い。端子部４４ｂがこのような異方性導電ゴムで作られることにより半導体素子３４の各端子と端子部４４ａとが面接触により接続されるので接触不良が回避されるとともに半導体素子３４の各端子の端子部４４ａｂとの接触による損傷が回避されることとなる。
【００２６】
また、選択導電基板４４においてプリント配線基板２０における接点２０ａに対向する位置には、それぞれ、端子部４４ａが設けられている。端子部４４ａは、例えば、端子部４４ｂと同様に異方性導電ゴムで作られている。
【００２７】
各端子部４４ａは、各導体４４ｐにより各端子部４４ｂに接続されている。また、端子部４４ａの相互間隔ＰＡは、各導体４４ｐの長さが異なることにより端子部４４ｂの相互間隔ＰＢに比して大なるものとされる。さらに、端子部４４ａは、２列に交互に配列されるように設けられるので端子部４４ａの相互間隔ＰＡを充分に長く設定可能となる。これにより、選択導電基板４４が高密度化された端子を有する半導体素子にも対応できることとなる。
【００２８】
さらに、選択導電基板４４における４隅には、被検査物収容部材３２の突起部３２ｂが挿入される透孔４４ｃが被検査物収容部材３２の突起部３２ｂの位置に対応して設けられている。
【００２９】
なお、選択導電基板４４は、上述の例においては被検査物収容部材３２ごとに１個設けられているが、かかる例に限られることなく、複数個の被検査物収容部材３２に跨って１個設けられるように構成されてもよい。
【００３０】
押圧機構部５２は、図１および図２に示されるように、一列に配列された被検査物収容部材３２の上方に対向して配される押圧ビーム２２と、各被検査物収容部材３２ごとに対向して押圧ビーム２２の上面部に設けられるハウジング部材２６と、被検査物収容部材３２に装着された半導体素子３４の上面部に当接される当接面を有するブロック部材３６と、ハウジング部材２６内に挿入されてブロック部材３６に揺動可能に連結される支柱部材２８と、支柱部材２８の外周面とハウジング部材２６の内周面との間に配されブロック部材３６を下方に向けて、すなわち、半導体素子３４の上面部に向けて所定の圧力で付勢するコイルスプリング３０とを含んで構成されている。
【００３１】
押圧ビーム２２は、その両端部にそれぞれ支持部材４６が挿入される切欠部２２ａが設けられている。また、その切欠部２２ａに連なる端部には、所定の勾配を有する斜面部２２ｂが設けられている。押圧ビーム２２の上面部における被検査物収容部材３２に対向する部分には、ハウジング部材２６の下端部が固定される凹部２２ｇが略四角形に形成されている。凹部２２ｇの内周縁部を形成する突起部２２ｆの内方には、支柱部材２８が貫通される開口部２２ｄが設けられている。
【００３２】
ハウジング部材２６の内部には、上端部に設けられる透孔２６ｃと、押圧ビーム２２の突起部２２ｆが挿入される大径部２６ｄと、透孔２６ｃと大径部２６ｄとを連結させる小径部２６ｂとを含んで構成されている。
【００３３】
透孔２６ｃおよび小径部２６ｂには、支柱部材２８が挿入されている。また、支柱部材２８の外周面と小径部２６ｂとの間には、コイルスプリング３０が配されている。
【００３４】
支柱部材２８は、略六角形状の頭部２８ａと、頭部２８ａに一端が連結される軸部２８ｂとから構成されている。
【００３５】
軸部２８ｂの他端部には、ブロック部材３６が設けられている。ブロック部材３６は、球状の連結部２８ｃにスナップリング２８を介してその凹部３６ａに連結されている。支柱部材２８の軸部２８ｂの外周面と透孔２６ｃの周縁部との間には、所定の隙間が形成されている。これにより、支柱部材２８は、図１の一点鎖線で示されるように、揺動可能とされる。
【００３６】
また、ブロック部材３６は、コイルスプリング３０の付勢力により半導体素子３４の上面に向けて付勢されるもとで、連結部２８ｃに対して揺動可能に軸部２８ｂに連結されることとなる。
【００３７】
かかる構成のもとで、半導体素子３４の試験を行うにあたっては、先ず、半導体素子３４が、図３に示されるように、その端子部３４ａが壁面部３２ｗにより位置決めされて被検査物収容部材３２の被検査物収容室３２ａ内に装着される。その際、半導体素子３４の各端子部３４ａは、選択導電基板４４の各端子部４４ｂに接触している。
【００３８】
次に、各支持部材４６および図１に二点鎖線で示される状態の係止レバー２４が押圧ビーム２２の各切欠部２２ａ内に挿入されるとき、押圧ビーム２２および被検査物収容部材３２にそれぞれ設けられる図示が省略される位置決め用のマークが互いに一致されるもとでブロック部材３６の当接面が半導体素子３４の上面に当接されて配される。その際、押圧ビーム２２の位置は、図１に一点鎖線で示されるように、コイルスプリング３０の付勢力に応じた各支持部材４６の上端面よりも高い位置とされる。
【００３９】
続いて、各係止レバー２４が押圧ビーム２２の斜面部２２ｂに沿って回転されることにより図１に実線で示されるように、さらに、コイルスプリング３０の付勢力が加えられてブロック部材３６が半導体素子３４の上面に当接せしめられることとなる。
【００４０】
その際、図５に示されるように、半導体素子３４における相対向する端子部３４ａのうち一方の端子部３４ａが所定の角度以上に曲がっている場合、
支柱部材２８およびブロック部材３６の当接面は図５に二点鎖線で示されるように、当接した後、半導体素子３４の上面に倣って揺動され、ブロック部材３６の当接面は半導体素子３４の上面に均等に当接されることとなる。
従って、半導体素子３４の上面に均等に圧力が作用されることとなるので半導体素子３４の各端子部３４ａを介して選択導電基板４４の各端子部４４ｂに加わる押圧力が、均等に付与され、その結果、端子部４４ｂおよび４４ａとプリント配線基板２０の接点２０ａとの間が導通状態とされることとなる。
【００４１】
そして、所定の雰囲気中において、プリント配線基板２０の入出力部２０Ａを介して試験電圧が供給されて試験が行われる。また、入出力部２０Ａから得られる出力信号に基づいて図示が省略される診断装置により半導体素子３４の潜在的欠陥が判断されることとなる。
【００４２】
上述の図３に示される例では、選択導電基板４４において半導体素子３４の端子部３４ａが接触する端子部４４ｂと、プリント配線基板２０の接点２０ａに接触する端子部４４ａとを備え、端子部４４ａと端子部４４ｂとは導体４４ｐにより接続される構成であるが、図６および図７に示される例は、その選択導電基板４４に代えて、プリント配線基板６０における接点６０ａに対向する位置であって、かつ、半導体素子３４の端子部３４ａの先端に対向する位置に端子部５８ａが設けられる選択導電基板５８が設けられるものである。なお、図６に示される例および後述する他の例においては、図３に示される例において同一とされる構成要素については同一の符号を付して示し、その重複説明を省略する。
【００４３】
略正方形状とされる選択導電基板５８は、図７に示されるように、その４隅にそれぞれ被検査物収容部材３２の突起部３２ｂが挿入される透孔５８ｃが設けられている。また、選択導電基板５８における略中央部には、例えば、異方性導電ゴムで作られた端子部５８ａが選択導電基板５８上に載置される半導体素子３４の各端子部３４ａにそれぞれ対応した位置に、所定の間隔をもって相対向して埋め込まれている。
【００４４】
選択導電基板５８において、半導体素子３４の各端子部３４ａとプリント配線基板６０における接点６０ａとの間を選択的に導通状態にする端子部５８ａが各端子部３４ａおよび接点６０ａに対向して設けられるので端子部の配列構造が簡略化されるとともに各端子部３４ａと端子部５８ａとの接触面積の増大を図ることができ、その結果、端子相互間における安定した接触状態が得られる。
【００４５】
なお、半導体素子３４の端子部３４ａと端子部５８ａとの間には、図８に示されるように、例えば、導電性材料で作られた金属片、もしくは、金属薄膜で形成された被覆層６２が形成されてもよい。
【００４６】
上述の図３に示される例では、選択導電基板４４において半導体素子３４の端子部３４ａが接触する端子部４４ｂと、プリント配線基板２０の接点２０ａに接触する端子部４４ａとはそれぞれ異方性導電ゴムで作られたものであるが、図９に示される例は、半導体素子３４の端子部３４ａとプリント配線基板２０の接点２０ａとの間が異方性導電ゴムを用いることなく、電気的に接続されるものである。
【００４７】
図９においては、半導体素子３４が装着される収容室６４ａを有する被検査物収容部材６４における位置決め用ボルト４０が挿入される透孔６４ｃが形成される突起部６４ｂの外周部を含む全周囲にわたって凹部６４ｇが設けられている。凹部６４ｇには、シリコンゴムなどの緩衝部材７２が装着されている。
【００４８】
被検査物収容部材６４の下面部とプリント配線基板２０の上面部との間には、緩衝部材７０および選択導電基板６６が配設されている。
【００４９】
選択導電基板６６は、収容室６４ａ内に位置決めされた半導体素子３４の端子部３４ａの先端に対向する位置に端子部６６ａを有するとともにプリント配線基板２０上の接点２０ａに対向する位置に端子部６６ｂを有し緩衝部材７０の上面部に配されている。端子部６６ａおよび６６ｂは、それぞれ、銅合金で作られ、その接触面に金メッキが施されたものである。端子部６６ａと端子部６６ｂとの間は、導体６６ｐにより接続されている。また、端子部６６ａは緩衝部材７０の上方に位置している。さらに、端子部６６ｂは緩衝部材７２の下方に位置している。
【００５０】
緩衝部材７０は、例えば、所定の厚さを有する平板状のシリコンゴムで作られており、被検査物収容部材６４の突起部６４ｂが挿入される透孔７０ａと、端子部６６ｂが挿入される透孔７０ｂとを有している。
【００５１】
このように構成されることにより、半導体素子３４が押圧される場合、半導体素子３４の端子部３４ａの先端と選択導電基板６６の端子部６６ａとの接触が緩衝部材７０の弾性力により安定したものとされるとともにその接触面圧のばらつきが低減されることとなる。
【００５２】
図１０に示される例は、半導体素子３４の端子部３４ａとプリント配線基板２０の接点２０ａとの間が図９に示される例と同様に異方性導電ゴムを用いることなく、電気的に接続されるものである。
【００５３】
図１０においては、被検査物収容部材３２とプリント配線基板２０の上面部との間に選択導電基板７４が配設されている。
【００５４】
選択導電基板７４は、被検査物収容部材３２の全面にわたって広がる緩衝部材７４と、緩衝部材７４の上面部、側面部、および、下面部の一部を被覆する基板部材７６とから構成されている。
【００５５】
基板部材７６は緩衝部材７４の側面部に対向する位置でＵ字状に折り曲げられてその下面部に沿ってプリント配線基板２０の接点２０ａに対向する位置近傍まで伸びている。基板部材７６は、収容室３２ａに位置決めされた半導体素子３４の端子部３４ａに対向する位置に、端子部３４ａに当接する端子部７６ａを有し、また、プリント配線基板２０の接点２０ａに対向する位置に、端子部２０ａに当接する端子部７６ｂを有している。端子部７６ａおよび端子部７６ｂは、例えば、金属材料で作られている。端子部７６ａと端子部７６ｂとの間は、基板部材７６の表面に導電材料により形成される導電体７６ａにより接続されている。
【００５６】
このように構成されることにより、端子部７６ａの下方の位置および端子部７６ｂの上方の位置には、それぞれ、緩衝部材７４が設けられるので図９に示される例と同様な作用効果が得られることとなる。さらに、緩衝部材７４が、図９に示される例のように分散して配置する必要がないので、被検査物収容部材の内部構造が簡略化されることとなる。
【００５７】
【発明の効果】
以上の説明から明らかなように、本発明に係る検査治具によれば、選択導電基板上に配される被検査物の端子と基板の接点とを接続させるべく被検査物における被押圧面部に所定の圧力をもって当接する当接部を有するブロック部材と、ブロック部材に揺動可能に連結される連結部が他端に形成される軸部を有する支柱部材と、支柱部材の軸部が所定の隙間をもって貫通される孔を有し、ブロック部材の当接部を被検査物における被押圧面部に対して付勢する付勢部材を介して支柱部材の軸部および連結部を揺動可能に支持するハウジング部材と、を備え、ブロック部材における当接部が付勢部材により付勢されるとともに、被検査物における被押圧面部に当接する場合、支柱部材およびブロック部材は、被検査物における被押圧面部に倣って揺動されるので装着された半導体素子の姿勢に左右されることなく、その各端子に均等に圧力を加えることができる。
【００５８】
また、基板の接点と被検査物の端子との間に配され、接点および端子に対応して設けられるシリコーンゴムおよび金属粒子からなる異方性導電ゴムにより形成され、所定の圧力が作用されるとき選択的に導通状態とする接続部であって、被検査物の各端子にそれぞれ接続される第１の端子部と、第１の端子部相互間距離よりも大なる相互間距離をもって形成され基板の接点および第１の端子部と接続される第２の端子部とを有する接続部を備え、接続部を介して被検査物の端子と基板の接点とを選択的に導通状態とする選択導電基板を備えるので高密度の端子を有する半導体素子についても容易に試験を行うことができるという利点を有する。
【図面の簡単な説明】
【図１】本発明に係る検査治具の一例の要部を示す部分断面図である。
【図２】本発明に係る検査治具の一例の概略の構成を示す平面図である。
【図３】本発明に係る検査治具の一例の要部を示す部分断面図である。
【図４】本発明に係る検査治具の一例に用いられる選択導電基板を示す平面図である。
【図５】本発明に係る検査治具の一例の動作説明に供される図である。
【図６】本発明に係る検査治具の一例に用いられる選択導電基板の他の一例を示す断面図である。
【図７】本発明に係る検査治具の一例に用いられる選択導電基板のさらなる他の一例を示す平面図である。
【図８】本発明に係る検査治具のさらなる他の一例を示す断面図である。
【図９】本発明に係る検査治具の一例のさらなる他の一例を示す断面図である。
【図１０】本発明に係る検査治具の一例のさらなる他の一例を示す断面図である。
【図１１】従来の検査治具の概略の構成を示す平面図である。
【図１２】図１１に示される検査治具を示す断面図である。
【符号の説明】
２０プリント配線基板
２６ハウジング部材
２８支柱部材
３０コイルスプリング
３４半導体素子
３６ブロック部材
４４、５８、６６、７４選択導電基板[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an inspection jig used for a nondestructive test of an electronic circuit in an inspection object having an electronic circuit inside.
[0002]
[Prior art]
A semiconductor integrated circuit mounted on an electronic device or the like is subjected to various tests at a stage before being mounted, and potential defects thereof are removed. The test is performed non-destructively by voltage stress application, high temperature operation, high temperature storage, etc. corresponding to thermal and mechanical environment tests. Of these various tests, a burn-in test is performed as an effective test for removing an initially malfunctioning integrated circuit. The burn-in test performs an operation test for a predetermined time under a high temperature condition.
[0003]
For example, as shown in FIGS. 11 and 12, the inspection jig used in the burn-in test is arranged on the frame 6 to be supplied with a predetermined test voltage and to detect an abnormality that indicates a short circuit from the object to be inspected. A printed circuit board 2 having an input / output unit 2A for transmitting a signal, and a semiconductor integrated circuit as an inspection object disposed at a predetermined position on the printed circuit board 2, for example, a surface-mounted QFP (quad) a test package housing member 10 having a housing section in which a flat package type semiconductor element 12 is mounted, and a contact section 8a that abuts against the upper surface of the semiconductor element 12 and presses with a predetermined pressure. A cover member 8 that covers the upper portion of the member 10 and a hook that engages with both the cover member 8 and the inspection object accommodation member 10 to fix the cover member 8 to the inspection object accommodation member 10. It is configured to include a member 16.
[0004]
One end portion of the cover member 8 is rotatably supported by a support shaft 10 a provided at one end edge portion of the inspection object accommodation member 10 and is connected to the inspection object accommodation member 10. As a result, the cover member 8 is supported so as to be openable and closable with respect to the inspection object accommodation member 10 when the hook member 16 is brought into the disengaged state.
[0005]
Further, a contact portion 8 a that contacts the outer shell of the semiconductor element 12 and presses downward with a predetermined pressure is provided at a portion of the inner surface side portion of the cover member 8 that faces the semiconductor element 12.
[0006]
Each terminal extending in each direction from each side of the substantially square semiconductor element 12 mounted inside the inspection object accommodation member 10 is positioned in contact with each connection terminal 2 a of the printed wiring board 2. Moreover, the part which contacts the terminal of the semiconductor element 12 in each connection terminal 2a is formed in circular arc shape, and has elasticity.
[0007]
Further, each connection terminal 2a is connected to the input / output unit 2A via a printed wiring network (not shown). Thereby, when the cover member 8 covers the accommodation chamber of the inspection object accommodation member 10, a predetermined urging force is applied to each terminal of the semiconductor element 12, and the terminal of the semiconductor element 12 and the printed wiring board 2. Each connection terminal 2a is electrically connected.
[0008]
Under such a configuration, the semiconductor element 12 is mounted in the inspection object receiving member 10, and the cover member 8 is closed by the hook member 16 being engaged, and the terminal of the semiconductor element 12 and the printed wiring board 2. When each of the connection terminals 2a is in a conductive state, a predetermined test voltage is supplied to the input / output unit 2A of the printed wiring board 2 and, for example, a burn-in test is performed.
[0009]
[Problems to be solved by the invention]
As described above, when a predetermined biasing force is applied to each terminal in the semiconductor element 12 and the tip of each terminal comes into contact with each connection terminal 2 a in the printed wiring board 2, the tip of each terminal of the semiconductor element 12 is contacted. The posture of the semiconductor element 12 mounted due to bending or the like may be an inappropriate posture. In such a case, even if pressed by the contact portion 8a of the cover member 8, a part of the contact portion 8a is biased toward the outer shell of the semiconductor element 12, and the biasing force does not act equally on each terminal. There is a possibility that a stable conduction state cannot be obtained.
[0010]
Further, as the density of terminals of the semiconductor element 12 is increased, it is not easy to provide the connection terminals 2a formed in an arc shape and having elasticity with a minute mutual interval on the printed wiring board 2, and the manufacturing cost is also increased. It will be bulky.
[0011]
In view of the above problems, the present invention is an inspection jig used for a non-destructive test of an electronic circuit in an inspection object having an electronic circuit inside, and depends on the posture of the mounted semiconductor element. It is another object of the present invention to provide an inspection jig that can apply pressure equally to each terminal and can easily test a semiconductor element having high-density terminals.
[0012]
[Means for Solving the Problems]
In order to achieve the above object, an inspection jig according to the present invention has a contact electrically connected to a terminal of an object to be inspected in which an electronic circuit is formed, and an input signal as well as an input signal. From a substrate having an input / output unit to which an output signal from the object to be inspected is sent, and a silicone rubber and metal particles disposed between the contact of the substrate and the terminal of the object to be inspected and provided corresponding to the contact and the terminal A connecting portion that is formed of an anisotropic conductive rubber and is selectively conductive when a predetermined pressure is applied, the first terminal portion being connected to each terminal of the object to be inspected; A connecting portion having a distance between the terminals that is greater than the distance between the terminal portions and having a contact point of the substrate and a second terminal portion that is connected to the first terminal portion; Electrical connection between the terminal of the object and the contact of the board And a block member having an abutting portion that abuts against a pressed surface portion of the inspection object with a predetermined pressure so as to connect a terminal of the inspection object disposed on the selection conductive substrate and a contact of the substrate. And a column member having a shaft part formed at the other end of a connecting part that is swingably connected to the block member, and a hole through which the shaft part of the column member penetrates with a predetermined gap . And a housing member that swingably supports the shaft portion and the coupling portion of the support member via a biasing member that biases the contact portion against the pressed surface portion of the object to be inspected, and abutment on the block member When the portion is urged by the urging member and abuts against the pressed surface portion of the inspection object, the support member and the block member are swung following the pressed surface portion of the inspection object. .
[0013]
Further, the inspection jig according to the present invention has a contact electrically connected to a terminal of an inspection object in which an electronic circuit is formed, and an input signal is input and an output signal from the inspection object is received. Formed by anisotropic conductive rubber made of silicone rubber and metal particles, arranged between the substrate having the input / output part to be sent out, the contact of the substrate and the terminal of the object to be inspected, and provided corresponding to the contact and the terminal And a connection part that is selectively turned on when a predetermined pressure is applied, and has one end connected to the terminal of the object to be inspected and the other end connected to the contact of the substrate. A selective conductive substrate that selectively connects the terminal of the object to be inspected and the contact point of the substrate through the connection portion, and a terminal of the object to be inspected disposed on the selective conductive substrate and the contact point of the substrate. Surface to be inspected to be connected to be connected A block member having an abutting portion that abuts with a predetermined pressure, a support member having a shaft portion formed at the other end of a connecting portion that is swingably connected to the block member, and a shaft portion of the support member. The shaft portion and the connecting portion of the column member can be swung via a biasing member that biases the contact portion of the block member against the pressed surface portion of the object to be inspected. A support member, and when the abutting portion of the block member is urged by the urging member and abutted against the pressed surface portion of the inspection object, the support member and the block member are It is characterized by being swung along the pressing surface.
[0014]
Furthermore, a coating layer formed of a metal piece or a metal thin film may be formed between the terminal of the object to be inspected and one end of the connection portion of the selective conductive substrate.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
1 and 2 show an example of an inspection jig according to the present invention.
[0017]
In the example shown in FIG. 2, for example, a semiconductor as an object to be inspected is mounted on a base 42 made of an aluminum alloy material or PPS (polyphenylene sulfide) resin and supplied with a test voltage. The printed wiring board 20 having an input / output unit 20A for sending an output signal from the element 34 and a plurality of rows arranged in a straight line at predetermined positions on the printed wiring board 20 with a predetermined mutual interval are provided. An inspection object storage member 32 for storing the semiconductor element 34 and a plurality of inspection object storage members 32 arranged on a straight line are arranged to face the inspection object storage members 32 and are to be inspected. A pressing mechanism 52 as a pressing member that applies a predetermined pressure to the semiconductor element 34 mounted in the base 32, and both ends of the pressing mechanism 52 are mounted on the base 42. It is configured to include a support mechanism 54 for selectively supported.
[0018]
As shown in FIG. 3, the printed wiring board 20 is provided with a contact 20a connected to the input / output unit 20A through a conductor not shown. A plurality of contacts 20 a are provided according to the number of terminals of the semiconductor element 34. The contact 20a is brought into contact with a plurality of terminal portions 44a provided on the selective conductive substrate 44, which will be described later, corresponding to each inspection object accommodating member 32.
[0019]
At positions in the vicinity of the contact 20a of the printed wiring board 20, through holes 20b for positioning the object receiving member 32, which will be described later, with respect to the printed wiring board 20 are provided at each corner of a substantially square having a predetermined length. ing.
[0020]
As shown in FIG. 3, a female screw portion of a positioning bolt 40, which will be described later, is fitted in the central portion of the base 42 at a position corresponding to each of the through holes 20b of the printed wiring board 20. A screw hole 42s is provided.
[0021]
Further, as shown in FIG. 1, a support member 46 that penetrates the through hole 20 c of the printed wiring board 20 and a fixing bolt 50 are provided at positions facing the both ends of the pressing mechanism 52 on the base 42. It is fixed by being fitted into the female screw hole 46s. A locking lever 24 that selectively locks the pressing beam 22 in the pressing mechanism 52 is provided at the upper end of the support member 46.
[0022]
The locking lever 24 has an upper end portion of the support member 46 as shown by a two-dot chain line in FIG. 1 when a screw 48 is inserted into the through hole 24a and fitted into the screw hole 46a at the upper end portion of the support member 46. Is rotatably supported.
[0023]
The inspection object accommodation member 32 is made of, for example, PPS resin, or PES (polyethylenesulfone) resin or PEI (polyethyleneimide) resin as a heat-resistant plastic material. As shown in FIG. An inspection object storage chamber 32a is provided in the central portion. The inspection object storage chamber 32 a is provided with a wall surface portion 32 w that regulates the positions of both side portions of each terminal group of the semiconductor element 34.
[0024]
Around the inspection object storage chamber 32a, there are projections 32b inserted into the respective through holes 20b of the printed wiring board 20 for positioning the inspection object storage member 32 and the selective conductive substrate 44 with respect to the printed wiring board 20. Is provided. Inside each protrusion 32b, a through hole 32c into which the positioning bolt 40 is inserted is provided. Thus, the object receiving member 32 is fixed to the base 42 by fitting the positioning bolt 40 to the screw hole 42s of the base 42 through the through hole 32c.
[0025]
As shown in FIG. 4, the selective conductive substrate 44 includes terminal portions 44 b corresponding to the respective terminals of the semiconductor element 34 accommodated in the inspection object storage chamber 32 a of the inspection object storage member 32. For example, it is made of silicone rubber and metal particles. An anisotropic conductive rubber is used as the composite conductive material. Anisotropic conductive rubber is a material that is conductive in the thickness direction and not conductive in the direction along the plane. The anisotropic conductive rubber includes a dispersion type and an uneven distribution type, and any type may be used. Since the terminal portion 44b is made of such an anisotropic conductive rubber, each terminal of the semiconductor element 34 and the terminal portion 44a are connected by surface contact, so that contact failure is avoided and each terminal of the semiconductor element 34 is connected. Damage due to contact with the terminal portion 44ab is avoided.
[0026]
Further, terminal portions 44 a are provided at positions of the selective conductive substrate 44 facing the contacts 20 a on the printed wiring board 20. The terminal portion 44a is made of anisotropic conductive rubber, for example, like the terminal portion 44b.
[0027]
Each terminal portion 44a is connected to each terminal portion 44b by each conductor 44p. Further, the mutual interval PA of the terminal portions 44a is made larger than the mutual interval PB of the terminal portions 44b because the lengths of the respective conductors 44p are different. Furthermore, since the terminal portions 44a are provided so as to be alternately arranged in two rows, the mutual interval PA of the terminal portions 44a can be set sufficiently long. As a result, the selective conductive substrate 44 can be adapted to a semiconductor element having terminals with high density.
[0028]
Further, through holes 44 c into which the protrusions 32 b of the inspection object accommodation member 32 are inserted are provided at four corners of the selective conductive substrate 44 corresponding to the positions of the protrusions 32 b of the inspection object accommodation member 32. .
[0029]
In the above-described example, one selective conductive substrate 44 is provided for each inspection object storage member 32. However, the selection conductive substrate 44 is not limited to such an example, and 1 is provided across a plurality of inspection object storage members 32. You may comprise so that it may be provided.
[0030]
As shown in FIG. 1 and FIG. 2, the pressing mechanism 52 includes a pressing beam 22 disposed facing the inspection object accommodation member 32 arranged in a row, and each inspection object accommodation member 32. A housing member 26 provided on the upper surface portion of the pressing beam 22 so as to face the block member, a block member 36 having an abutting surface that comes into contact with the upper surface portion of the semiconductor element 34 mounted on the object receiving member 32, and a housing The column member 28 inserted into the member 26 and connected to the block member 36 so as to be swingable, and disposed between the outer peripheral surface of the column member 28 and the inner peripheral surface of the housing member 26, the block member 36 faces downward. That is, the coil spring 30 is configured to be biased toward the upper surface portion of the semiconductor element 34 with a predetermined pressure.
[0031]
The pressing beam 22 is provided with notches 22a into which the support members 46 are inserted at both ends thereof. In addition, a slope portion 22b having a predetermined gradient is provided at an end portion connected to the notch portion 22a. A concave portion 22g to which the lower end portion of the housing member 26 is fixed is formed in a substantially quadrangular shape at a portion of the upper surface portion of the pressing beam 22 that faces the inspection object accommodation member 32. An opening 22d through which the column member 28 penetrates is provided inward of the protrusion 22f that forms the inner peripheral edge of the recess 22g.
[0032]
Inside the housing member 26, a through hole 26c provided at the upper end, a large diameter part 26d into which the projection 22f of the pressing beam 22 is inserted, and a small diameter part 26b that connects the through hole 26c and the large diameter part 26d. It is comprised including.
[0033]
A strut member 28 is inserted into the through hole 26c and the small diameter portion 26b. Further, a coil spring 30 is disposed between the outer peripheral surface of the support member 28 and the small diameter portion 26b.
[0034]
The column member 28 includes a substantially hexagonal head portion 28a and a shaft portion 28b having one end connected to the head portion 28a.
[0035]
A block member 36 is provided at the other end of the shaft portion 28b. The block member 36 is connected to the concave portion 36a via a snap ring 28 to a spherical connecting portion 28c. A predetermined gap is formed between the outer peripheral surface of the shaft portion 28b of the column member 28 and the peripheral portion of the through hole 26c. Thereby, the support | pillar member 28 can be rock | fluctuated as shown with the dashed-dotted line of FIG.
[0036]
Further, the block member 36 is coupled to the shaft portion 28b so as to be swingable with respect to the coupling portion 28c while being biased toward the upper surface of the semiconductor element 34 by the biasing force of the coil spring 30. .
[0037]
In conducting the test of the semiconductor element 34 under such a configuration, first, as shown in FIG. 3, the semiconductor element 34 has its terminal portion 34a positioned by the wall surface portion 32w and the inspection object accommodation member 32. Is mounted in the inspection object storage chamber 32a. At that time, each terminal portion 34 a of the semiconductor element 34 is in contact with each terminal portion 44 b of the selective conductive substrate 44.
[0038]
Next, when the support members 46 and the locking levers 24 in the state indicated by the two-dot chain line in FIG. 1 are inserted into the notches 22 a of the press beam 22, The contact surfaces of the block member 36 are arranged in contact with the upper surface of the semiconductor element 34 with the positioning marks (not shown) provided respectively coincide with each other. At that time, the position of the pressing beam 22 is set to a position higher than the upper end surface of each support member 46 corresponding to the urging force of the coil spring 30 as shown by a one-dot chain line in FIG.
[0039]
Subsequently, as each locking lever 24 is rotated along the inclined surface portion 22b of the pressing beam 22, the urging force of the coil spring 30 is further applied as shown in FIG. It is brought into contact with the upper surface of the semiconductor element 34.
[0040]
At that time, as shown in FIG. 5, when one terminal portion 34 a of the terminal portions 34 a facing each other in the semiconductor element 34 is bent at a predetermined angle or more,
The abutting surfaces of the support member 28 and the block member 36 are swung along the upper surface of the semiconductor element 34 after abutting, as indicated by a two-dot chain line in FIG. 5, and the abutting surface of the block member 36 is a semiconductor. It will be in contact with the upper surface of the element 34 evenly.
Accordingly, since pressure is applied evenly to the upper surface of the semiconductor element 34, a pressing force applied to each terminal portion 44b of the selective conductive substrate 44 through each terminal portion 34a of the semiconductor element 34 is equally applied, As a result, the terminal portions 44b and 44a and the contact 20a of the printed wiring board 20 are brought into conduction.
[0041]
Then, in a predetermined atmosphere, a test voltage is supplied via the input / output unit 20A of the printed wiring board 20 to perform a test. Further, a potential defect of the semiconductor element 34 is determined by a diagnostic device (not shown) based on an output signal obtained from the input / output unit 20A.
[0042]
In the example shown in FIG. 3 described above, a terminal portion 44b that contacts the terminal portion 34a of the semiconductor element 34 in the selective conductive substrate 44 and a terminal portion 44a that contacts the contact point 20a of the printed wiring board 20 are provided. The terminal portion 44b and the terminal portion 44b are connected by the conductor 44p, but the example shown in FIGS. 6 and 7 is a position facing the contact 60a on the printed wiring board 60 in place of the selective conductive board 44. In addition, a selective conductive substrate 58 in which the terminal portion 58a is provided at a position facing the tip of the terminal portion 34a of the semiconductor element 34 is provided. In the example shown in FIG. 6 and other examples described later, the same components in the example shown in FIG. 3 are denoted by the same reference numerals, and redundant description thereof is omitted.
[0043]
As shown in FIG. 7, the selective conductive substrate 58 having a substantially square shape is provided with through holes 58 c into which the protrusions 32 b of the object receiving member 32 are inserted, respectively, at four corners thereof. In addition, in a substantially central portion of the selective conductive substrate 58, for example, a terminal portion 58a made of anisotropic conductive rubber corresponds to each terminal portion 34a of the semiconductor element 34 placed on the selective conductive substrate 58. It is embedded in the position opposite to each other with a predetermined interval.
[0044]
In the selective conductive substrate 58, terminal portions 58a for selectively conducting between the respective terminal portions 34a of the semiconductor element 34 and the contact points 60a in the printed wiring board 60 are provided to face the respective terminal portions 34a and the contact points 60a. Therefore, the arrangement structure of the terminal portions can be simplified and the contact area between the terminal portions 34a and the terminal portions 58a can be increased. As a result, a stable contact state between the terminals can be obtained.
[0045]
As shown in FIG. 8, between the terminal portion 34a and the terminal portion 58a of the semiconductor element 34, for example, a metal piece made of a conductive material or a covering layer 62 formed of a metal thin film. May be formed.
[0046]
In the example shown in FIG. 3 described above, the terminal portion 44b in contact with the terminal portion 34a of the semiconductor element 34 in the selective conductive substrate 44 and the terminal portion 44a in contact with the contact 20a of the printed wiring board 20 are each anisotropically conductive. Although made of rubber, the example shown in FIG. 9 is electrically connected between the terminal portion 34a of the semiconductor element 34 and the contact 20a of the printed wiring board 20 without using anisotropic conductive rubber. To be connected.
[0047]
In FIG. 9, the entire periphery including the outer peripheral portion of the protrusion 64b in which the through hole 64c into which the positioning bolt 40 is inserted is formed in the inspection object storage member 64 having the storage chamber 64a in which the semiconductor element 34 is mounted. A recess 64g is provided. A buffer member 72 such as silicon rubber is attached to the recess 64g.
[0048]
A buffer member 70 and a selective conductive substrate 66 are disposed between the lower surface portion of the inspection object accommodating member 64 and the upper surface portion of the printed wiring board 20.
[0049]
The selective conductive substrate 66 has a terminal portion 66a at a position facing the tip of the terminal portion 34a of the semiconductor element 34 positioned in the accommodation chamber 64a, and a terminal portion 66b at a position facing the contact 20a on the printed wiring board 20. And disposed on the upper surface of the buffer member 70. Each of the terminal portions 66a and 66b is made of a copper alloy, and its contact surface is gold-plated. The terminal portion 66a and the terminal portion 66b are connected by a conductor 66p. In addition, the terminal portion 66 a is located above the buffer member 70. Further, the terminal portion 66 b is located below the buffer member 72.
[0050]
The buffer member 70 is made of, for example, a flat-plate silicon rubber having a predetermined thickness, and the through hole 70a into which the protruding portion 64b of the inspection object accommodation member 64 is inserted and the terminal portion 66b are inserted. And a through hole 70b.
[0051]
With this configuration, when the semiconductor element 34 is pressed, the contact between the tip of the terminal portion 34 a of the semiconductor element 34 and the terminal portion 66 a of the selective conductive substrate 66 is stabilized by the elastic force of the buffer member 70. And variation in the contact surface pressure is reduced.
[0052]
In the example shown in FIG. 10, the terminal portion 34a of the semiconductor element 34 and the contact 20a of the printed wiring board 20 are electrically connected without using anisotropic conductive rubber as in the example shown in FIG. It is what is done.
[0053]
In FIG. 10, a selective conductive substrate 74 is disposed between the inspection object accommodation member 32 and the upper surface portion of the printed wiring board 20.
[0054]
The selective conductive substrate 74 includes a buffer member 74 that extends over the entire surface of the inspecting object housing member 32, and a substrate member 76 that covers a part of the upper surface portion, side surface portion, and lower surface portion of the buffer member 74. .
[0055]
The board member 76 is bent in a U shape at a position facing the side surface portion of the buffer member 74 and extends to the vicinity of the position facing the contact point 20a of the printed wiring board 20 along its lower surface portion. The board member 76 has a terminal part 76a that contacts the terminal part 34a at a position facing the terminal part 34a of the semiconductor element 34 positioned in the accommodation chamber 32a, and also faces the contact point 20a of the printed wiring board 20. The terminal portion 76b is in contact with the terminal portion 20a at the position. The terminal portion 76a and the terminal portion 76b are made of, for example, a metal material. The terminal portion 76a and the terminal portion 76b are connected to the surface of the substrate member 76 by a conductor 76a formed of a conductive material.
[0056]
By being configured in this manner, the buffer member 74 is provided at a position below the terminal portion 76a and a position above the terminal portion 76b, respectively. Therefore, the same operational effects as the example shown in FIG. 9 can be obtained. It will be. Furthermore, since the buffer members 74 do not need to be arranged in a distributed manner as in the example shown in FIG. 9, the internal structure of the object-receiving member is simplified.
[0057]
【The invention's effect】
As is clear from the above description, according to the inspection jig according to the present invention, the pressed surface portion of the inspection object is connected to the terminal of the inspection object disposed on the selected conductive substrate and the contact of the substrate. A block member having an abutting portion that abuts with a predetermined pressure, a column member having a shaft portion formed at the other end of a connecting portion that is swingably coupled to the block member, and a shaft portion of the column member is a predetermined portion It has a hole that penetrates with a gap, and supports the shaft part and the connecting part of the column member in a swingable manner via a biasing member that biases the contact part of the block member against the pressed surface part of the object to be inspected. And when the abutting portion of the block member is urged by the urging member and abuts against the pressed surface portion of the inspection object, the support member and the block member are pressed against the inspection object. Follow the face Since the swing without being affected by the posture of the semiconductor element is mounted, it can apply equally pressure to the respective terminals.
[0058]
Further, it is formed between the contact point of the substrate and the terminal of the object to be inspected, and is formed of an anisotropic conductive rubber made of silicone rubber and metal particles provided corresponding to the contact point and the terminal, and a predetermined pressure is applied. A connection portion that is selectively turned on when the first terminal portion is connected to each terminal of the object to be inspected, and is formed with a mutual distance greater than the distance between the first terminal portions. A connection portion having a contact point of the substrate and a second terminal portion connected to the first terminal portion, and a selection of selectively connecting the terminal of the object to be inspected and the contact point of the substrate through the connection portion Since the conductive substrate is provided, the semiconductor element having a high density terminal can be easily tested.
[Brief description of the drawings]
FIG. 1 is a partial cross-sectional view showing a main part of an example of an inspection jig according to the present invention.
FIG. 2 is a plan view showing a schematic configuration of an example of an inspection jig according to the present invention.
FIG. 3 is a partial cross-sectional view showing a main part of an example of an inspection jig according to the present invention.
FIG. 4 is a plan view showing a selective conductive substrate used in an example of an inspection jig according to the present invention.
FIG. 5 is a diagram for explaining an operation of an example of an inspection jig according to the present invention.
6 is a cross-sectional view showing another example of a selective conductive substrate used in an example of an inspection jig according to the present invention. FIG.
FIG. 7 is a plan view showing still another example of a selective conductive substrate used in an example of an inspection jig according to the present invention.
FIG. 8 is a cross-sectional view showing still another example of an inspection jig according to the present invention.
FIG. 9 is a cross-sectional view showing still another example of an example of an inspection jig according to the present invention.
FIG. 10 is a cross-sectional view showing still another example of an example of an inspection jig according to the present invention.
FIG. 11 is a plan view showing a schematic configuration of a conventional inspection jig.
12 is a cross-sectional view showing the inspection jig shown in FIG.
[Explanation of symbols]
20 Printed wiring board 26 Housing member 28 Strut member 30 Coil spring 34 Semiconductor element 36 Block member 44, 58, 66, 74 Selective conductive board

Claims

A substrate having a contact point electrically connected to a terminal of an inspection object in which an electronic circuit is formed, and an input / output unit to which an input signal is input and an output signal from the inspection object is sent ,
It is arranged between the contact point of the substrate and the terminal of the object to be inspected, and is formed by anisotropic conductive rubber made of silicone rubber and metal particles provided corresponding to the contact point and the terminal. A connection portion that is selectively turned on when the first terminal portion is connected to each terminal of the object to be inspected, and the distance between the first terminal portions is greater than the distance between the first terminal portions. A connection portion having a contact point of the substrate formed at a distance and a second terminal portion connected to the first terminal portion is provided, and the terminal of the object to be inspected and the contact point of the substrate through the connection portion And a selective conductive substrate that selectively makes the conductive state,
A block member having an abutting portion that abuts with a predetermined pressure on a pressed surface portion of the object to be inspected so as to connect a terminal of the object to be inspected and a contact point of the substrate disposed on the selective conductive substrate;
A strut member having a shaft portion formed at the other end of a connecting portion that is swingably connected to the block member;
The column member has a hole through which the shaft portion penetrates with a predetermined gap, and the column member via a biasing member that biases the contact portion of the block member against the pressed surface portion of the inspection object. A housing member that swingably supports the shaft portion and the connecting portion of
When the abutting portion of the block member is urged by the urging member and abuts against the pressed surface portion of the inspection object, the support member and the block member are placed on the pressed surface portion of the inspection object. An inspection jig characterized by being swung in accordance with it.

A substrate having a contact point electrically connected to a terminal of an inspection object in which an electronic circuit is formed, and an input / output unit to which an input signal is input and an output signal from the inspection object is sent ,
It is arranged between the contact point of the substrate and the terminal of the object to be inspected, and is formed by anisotropic conductive rubber made of silicone rubber and metal particles provided corresponding to the contact point and the terminal. A connection portion that is selectively turned on when the connection portion has one end connected to the terminal of the object to be inspected and the other end connected to the contact of the substrate, A selective conductive substrate that selectively connects the terminal of the object to be inspected and the contact point of the substrate through a connection portion;
A block member having an abutting portion that abuts with a predetermined pressure on a pressed surface portion of the object to be inspected so as to connect a terminal of the object to be inspected and a contact point of the substrate disposed on the selective conductive substrate;
A strut member having a shaft portion formed at the other end of a connecting portion that is swingably connected to the block member;
The shaft portion of the support member has a hole that penetrates with a predetermined gap, and the support member is connected to the support member through an urging member that urges the contact portion of the block member against the pressed surface portion of the inspection object. A housing member that swingably supports the shaft portion and the coupling portion,
When the abutting portion of the block member is urged by the urging member and abuts against the pressed surface portion of the inspection object, the support member and the block member are placed on the pressed surface portion of the inspection object. An inspection jig characterized by being swung in accordance with it.

The inspection jig according to claim 2, wherein a coating layer formed of a metal piece or a metal thin film is formed between a terminal of the object to be inspected and one end of a connection portion of the selective conductive substrate.