JP3797082B2

JP3797082B2 - Printed circuit board equipment

Info

Publication number: JP3797082B2
Application number: JP2000279694A
Authority: JP
Inventors: 和雄中村; 清典石田
Original assignee: Panasonic Corp; Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Corp; Panasonic Holdings Corp
Priority date: 2000-09-14
Filing date: 2000-09-14
Publication date: 2006-07-12
Anticipated expiration: 2020-09-14
Also published as: JP2002094264A

Description

【０００１】
【発明の属する技術分野】
本発明は、電子部品を装着したプリント配線基板装置に関する。
【０００２】
【従来の技術】
従来、ベースとなる親基板に複数の子基板を直角方向から固定する構成のプリント配線基板装置では、それぞれの子基板の間隔を十分とることにより、子基板の装着および取外し時の電子部品間の干渉を防いでいた。
【０００３】
図８に従来の電子部品間の干渉を防ぐ一般的基板構造を示している、図８において、１はベースとなる親基板、２と３は子基板、４と５は子基板２，３と親基板１とを接続するコネクタである。
【０００４】
【発明が解決しようとする課題】
このプリント配線基板装置においては、子基板上の電子部品間の干渉を防ぐためには、一般に子基板間の間隔を十分広く取ることが必要である。子基板間の間隔を十分に取らなければ、装着および取外し時に、子基板上の電子部品８が隣の子基板上の電子部品９や電子部品の一種である金属部品７に接触して干渉し、電子部品の破壊に至る場合がある。一方近年の電子機器の筐体は小型化が要望されている。
【０００５】
本発明は、小型化をしても、組み立て分解時に、子基板上の電子部品が隣の子基板上の電子部品に干渉しないプリント配線基板装置を実現することを目的とする。
【０００６】
【課題を解決するための手段】
この課題を解決するために本発明は、隣り合う子基板上の電子部品が互いに入り組んだ状態であっても、隣り合う子基板間の少なくとも一方にガイド部を設けることにより、子基板を親基板から取外しする途中においては、隣り合う子基板上の電子部品同志が接触する前にガイド部が他方の子基板の一部に先に当接することにより、基板を傾けるかスライドさせ、電子部品にストレスを与えることのない子基板の装着と取外しが可能となる。このことにより部品間の隙間を小さくし、電子機器の筐体の小型化を実現することができる。
【０００７】
【発明の実施の形態】
本発明の請求項１に記載の発明は、ベースとなる親基板に第１の子基板及び第２の子基板が前記親基板に対して直角の方向からコネクタで装着されたプリント配線基板装置に於いて、前記第１の子基板上に第１の電子部品を有し、前記第２の子基板上で、前記第１の電子部品に対して前記親基板から直角方向に離れる位置に設けられた第２の電子部品を有し、前記第１の子基板又は第２の子基板の少なくとも一方上にガイド部を有し、このガイド部は、前記第１の子基板を前記親基板から取外しする途中においては前記第１の電子部品と前記第２の電子部品との接触を防止すべく他方の子基板の一部もしくは前記他方の子基板上のガイド部に当接するものであり、この構成により、子基板を取外す時に、電子部品同志が接触してストレスを受けることを防止できる。
【０００８】
また、請求項２又は請求項３の発明は、一方の子基板上のガイド部が孔を有するガイド部材であり、他方の子基板上のガイド部が、第１の子基板が親基板に装着された状態では前記ガイド部材の孔に勘合し、前記第１の子基板を前記親基板から取外しする途中においては、前記ガイド部材の表面に当接する突起であるというものである。
【０００９】
また、請求項４の発明は、第１の子基板を親基板から取外しする途中において突起が当接するガイド部材の表面は、前記第１の子基板が親基板から取外しされるに従って第２の子基板から離れるべく傾斜を有したものである。
【００１０】
また、請求項５又は請求項６の発明は、一方の子基板上のガイド部がその子基板に設けられた孔であり、他方の子基板上のガイド部が、第１の子基板が親基板に装着された状態では前記孔に貫通し、前記第１の子基板を前記親基板から取外しする途中においては、前記一方の子基板に当接する突起であるというものである。
【００１１】
また、請求項７の発明は、第２の子基板上のガイド部が、第１の子基板が親基板に装着された状態では、前記第１の子基板の親基板に対して反対方向の端部上に間隔を空けて突出したガイド部材であるというものである。
【００１２】
以下、本発明の実施の形態について、図１ないし図７を用いて説明する。
【００１３】
（実施の形態１）
図１に、本発明の実施の形態１に係るプリント配線基板装置における組み立て途中の断面図を示す。図１中の図７と同じ構成部分は同じ記号を付し説明を省略する。これは、ベースとなる親基板１上に、子基板２と３がコネクタ４と５を介して接続される構造である。子基板２上に組立てガイド６を設け、子基板２の装着および取外し時、組立てガイド６の突起６ａが電子部品の一種である放熱板７の表面および表面の一部である傾斜部７ａに当たることにより、作業者に子基板２を図の左方向に傾けた状態でスライドさせることを促す。この状態では、電子部品８は子基板３上の放熱板７や電子部品９と接触して干渉することがないため、電子部品が破壊されることを防ぐ。この場合、放熱板７はガイド部材として働く。また、上記傾斜部７ａは、図に示すように傾斜を持たせているため、作業者は自然に子基板２を傾けることが出来る。
【００１４】
図２は、図１における子基板２が、ベースとなる親基板１に装着された状態を示し、子基板２上の組立てガイド６の突起６ａが子基板３上の放熱板７に設けられた孔７ｂに入り込んだ状態を示す。この状態では電子部品８は子基板３上の放熱板７や電子部品９と干渉しない。
【００１５】
このように、放熱板７および突起６で構成するガイド部を設けることにより、基板装着時および基板取り外し時には、ガイド部の作用で基板を傾けることになり、一方の子基板の電子部品と他方の子基板の電子部品とが接触して干渉することを防ぐことを実現している。
【００１６】
本実施の形態では、ガイド部として、子基板２に突起６ａを設け、子基板３に放熱板７を設けているが、逆に、子基板３に突起を設け、子基板２に放熱板を設けるようにしてもよい。
【００１７】
（実施の形態２）
図３は、本発明の実施の形態２に係るプリント配線基板装置の断面図である。図３中の図１と同じ構成部分は同じ記号を付し説明を省略する。図３において、６は組立てガイドであり、子基板２上の電子部品８を覆っており、その一部に傾斜部６ｂを有している、７はガイド部を構成する放熱板である。
【００１８】
子基板３を取外すときは、放熱板７が組立てガイド６の傾斜部６ｂに沿ってスライドし、さらに組立てガイド６の表面に当接することにより、作業者に子基板３を図の右方向に倒すよう促すため、子基板３上の放熱板７や他の電子部品が電子部品８に接触することを防止できる。
【００１９】
（実施の形態３）
図４は、本発明の実施の形態３に係るプリント配線基板装置の断面図である。図４中の図３と同じ構成部分は同じ記号を付し説明を省略する。図４の場合は、子基板２を取り外すとき、放熱板７が組立てガイド６の傾斜部６ｂに沿ってスライドし、さらに組立てガイド６の表面に当接することにより、作業者に子基板２を図の左方向に倒すように促すため、子基板３上の放熱板７や他の電子部品が電子部品８に接触することを防止できる。
【００２０】
（実施の形態４）
図５は、本発明の実施の形態４に係るプリント配線基板装置の断面図である。図５中の図２と同じ構成部分は同じ記号を付し説明を省略する。図５において、２ａは子基板２に設けられた孔であり、子基板２を親基板１に装着した状態では、突起６ａが貫通している。そして、子基板２を取り外すときは、突起６ａが子基板２の表面に当接することにより、作業者に子基板２を図の左方向に倒すように促すため、電子部品８が子基板３上の放熱板７や他の電子部品に接触することを防止できる。
【００２１】
（実施の形態５）
図６は、本発明の実施の形態５に係るプリント配線基板装置の断面図である。図６中の図２と同じ構成部分は同じ記号を付し説明を省略する。図６の場合は、子基板２を親基板１に装着した状態では、突起６ａは放熱板７に当接しないが、子基板２を取り外すときは、突起６ａが放熱板７の表面に当接することにより、作業者に子基板２を図の左方向に倒すように促すため、電子部品８が子基板３上の放熱板７や他の電子部品に接触することを防止できる。
【００２２】
（実施の形態６）
図７は、本発明の実施の形態６に係るプリント配線基板装置の断面図である。図７中の図５と同じ構成部分は同じ記号を付し説明を省略する。図７において、子基板２を親基板１に装着した状態では、突起６ａは子基板２に当接せず、子基板２の上方に間隔を空けて突出しているが、子基板２を取り外すときは、突起６ａが子基板２の表面に当接することにより、作業者に子基板２を図の左方向に倒すように促すため、電子部品８が子基板３上の放熱板７や他の電子部品に接触することを防止できる。この場合、突起６ａがガイド部材として働く。
【００２３】
【発明の効果】
以上のように本発明によれば、ベースとなる親基板に子基板を装着するとき、部品間の干渉による電子部品の破損を防止し、子基板間の間隔を小さくすることを実現するものである。
【図面の簡単な説明】
【図１】本発明の一実施の形態に係るプリント配線基板装置における組立て途中の状態を示す断面図
【図２】本発明の一実施の形態に係るプリント配線基板装置における、子基板装着状態を示す断面図
【図３】本発明の他の実施に形態に係るプリント配線基板を示す断面図
【図４】本発明の他の実施に形態に係るプリント配線基板を示す断面図
【図５】本発明の他の実施に形態に係るプリント配線基板を示す断面図
【図６】本発明の他の実施に形態に係るプリント配線基板を示す断面図
【図７】本発明の他の実施に形態に係るプリント配線基板を示す断面図
【図８】従来のプリント配線基板装置の断面図
【符号の説明】
１親基板
２子基板
２ａ孔
３子基板
４コネクタ
５コネクタ
６組立てガイド
６ａ突起
７放熱板
７ａ傾斜部
７ｂ孔
８電子部品
９電子部品[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a printed wiring board device on which electronic components are mounted.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, in a printed wiring board device configured to fix a plurality of child boards to a base mother board from a right angle direction, a sufficient interval between the child boards is sufficient to allow electronic components to be mounted and removed when the child boards are mounted and removed. The interference was prevented.
[0003]
FIG. 8 shows a general board structure for preventing interference between conventional electronic components. In FIG. 8, 1 is a base board serving as a base, 2 and 3 are sub boards, and 4 and 5 are sub boards 2 and 3. It is a connector for connecting the parent substrate 1.
[0004]
[Problems to be solved by the invention]
In this printed wiring board device, in order to prevent interference between electronic components on the sub board, it is generally necessary to make a sufficient interval between the sub boards. If there is not enough space between the sub-boards, the electronic component 8 on the sub-board contacts and interferes with the electronic component 9 on the adjacent sub-board or the metal component 7 which is a kind of electronic component when mounting and removing. In some cases, electronic components may be destroyed. On the other hand, downsizing of housings of recent electronic devices is demanded.
[0005]
An object of the present invention is to realize a printed wiring board device in which an electronic component on a sub board does not interfere with an electronic part on an adjacent sub board at the time of assembly and disassembly even if the size is reduced.
[0006]
[Means for Solving the Problems]
In order to solve this problem, the present invention provides a sub-board by providing a guide portion at least one of the sub-boards even when electronic components on the sub-boards are intertwined with each other. In the middle of removal, the guide part first contacts the part of the other child board before the electronic parts on the neighboring child board come into contact with each other, so that the board is inclined or slid to stress the electronic component. It is possible to attach and detach the sub-board without giving it. As a result, the gap between components can be reduced, and the size of the casing of the electronic device can be reduced.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
According to a first aspect of the present invention, there is provided a printed wiring board device in which a first sub board and a second sub board are mounted on a base board serving as a base by a connector from a direction perpendicular to the main board. The first electronic component is provided on the first sub-substrate, and is provided on the second sub-substrate at a position away from the main substrate in a direction perpendicular to the first electronic component. A second electronic component, and a guide portion on at least one of the first child substrate and the second child substrate, and the guide portion removes the first child substrate from the parent substrate. In the middle of the operation, the first electronic component and the second electronic component are brought into contact with a part of the other child substrate or the guide portion on the other child substrate in order to prevent the contact between the first electronic component and the second electronic component. Therefore, when removing the sub board, the electronic components come into contact with each other and receive stress. It is possible to prevent the Rukoto.
[0008]
Further, the invention of claim 2 or claim 3 is a guide member in which the guide portion on one of the sub-boards has a hole, and the guide portion on the other sub-board is attached to the first sub-board. In this state, the projection is fitted into the hole of the guide member, and the projection is in contact with the surface of the guide member in the middle of removing the first sub board from the main board.
[0009]
According to a fourth aspect of the present invention, the surface of the guide member with which the protrusion abuts in the middle of removing the first sub board from the main board is formed on the second sub board as the first sub board is removed from the main board. It has an inclination to leave the substrate.
[0010]
Further, in the invention of claim 5 or claim 6, the guide part on one of the sub-boards is a hole provided in the sub-board, and the guide part on the other sub-board is the first sub-board of the main board. In the state of being attached to the base plate, the projection penetrates through the hole and is in contact with the one sub-board in the middle of removing the first sub-board from the main board.
[0011]
According to a seventh aspect of the present invention, the guide portion on the second child board is opposite to the parent board of the first child board when the first child board is mounted on the parent board. It is a guide member protruding at an interval on the end portion.
[0012]
Hereinafter, embodiments of the present invention will be described with reference to FIGS.
[0013]
(Embodiment 1)
FIG. 1 shows a cross-sectional view during assembly in the printed wiring board device according to Embodiment 1 of the present invention. The same components in FIG. 1 as those in FIG. This is a structure in which child boards 2 and 3 are connected via connectors 4 and 5 on a base board 1 serving as a base. The assembly guide 6 is provided on the sub-board 2, and when the sub-board 2 is mounted and removed, the protrusion 6a of the assembly guide 6 hits the surface of the heat radiating plate 7 which is a kind of electronic component and the inclined portion 7a which is a part of the surface. As a result, the operator is urged to slide the child board 2 in a state tilted leftward in the figure. In this state, since the electronic component 8 does not contact and interfere with the heat sink 7 and the electronic component 9 on the sub board 3, the electronic component is prevented from being destroyed. In this case, the heat sink 7 functions as a guide member. Further, since the inclined portion 7a is inclined as shown in the figure, the operator can naturally tilt the sub board 2.
[0014]
FIG. 2 shows a state in which the sub board 2 in FIG. 1 is mounted on the base board 1 serving as a base, and the projection 6 a of the assembly guide 6 on the sub board 2 is provided on the heat dissipation plate 7 on the sub board 3. The state which entered the hole 7b is shown. In this state, the electronic component 8 does not interfere with the heat sink 7 and the electronic component 9 on the sub board 3.
[0015]
In this way, by providing the guide portion constituted by the heat radiating plate 7 and the protrusion 6, the substrate is inclined by the action of the guide portion when the substrate is mounted and when the substrate is removed. It is possible to prevent the electronic components of the sub board from contacting and interfering with each other.
[0016]
In the present embodiment, the protrusion 6a is provided on the sub board 2 and the heat radiating plate 7 is provided on the sub board 3 as the guide portion, but conversely, the protrusion is provided on the sub board 3 and the heat radiating plate is provided on the sub board 2. You may make it provide.
[0017]
(Embodiment 2)
FIG. 3 is a cross-sectional view of a printed wiring board device according to Embodiment 2 of the present invention. Components in FIG. 3 that are the same as those in FIG. In FIG. 3, reference numeral 6 denotes an assembly guide, which covers the electronic component 8 on the sub-board 2, and has an inclined portion 6 b in a part thereof, and 7 is a heat radiating plate constituting the guide portion.
[0018]
When the child board 3 is removed, the heat sink 7 slides along the inclined portion 6b of the assembly guide 6 and abuts against the surface of the assembly guide 6, thereby causing the operator to tilt the child board 3 to the right in the figure. Therefore, it is possible to prevent the radiator plate 7 and other electronic components on the sub board 3 from coming into contact with the electronic component 8.
[0019]
(Embodiment 3)
FIG. 4 is a cross-sectional view of a printed wiring board device according to Embodiment 3 of the present invention. The same components in FIG. 4 as those in FIG. In the case of FIG. 4, when the child board 2 is removed, the heat sink 7 slides along the inclined portion 6 b of the assembly guide 6 and further contacts the surface of the assembly guide 6, so that the worker can see the child board 2. Therefore, it is possible to prevent the radiator plate 7 and other electronic components on the sub board 3 from coming into contact with the electronic component 8.
[0020]
(Embodiment 4)
FIG. 5 is a cross-sectional view of a printed wiring board device according to Embodiment 4 of the present invention. In FIG. 5, the same components as those in FIG. In FIG. 5, reference numeral 2 a denotes a hole provided in the sub board 2, and the protrusion 6 a penetrates when the sub board 2 is attached to the main board 1. When the child board 2 is removed, the protrusions 6a come into contact with the surface of the child board 2 to urge the operator to tilt the child board 2 in the left direction in the figure. Can be prevented from coming into contact with the heat sink 7 and other electronic components.
[0021]
(Embodiment 5)
FIG. 6 is a cross-sectional view of a printed wiring board device according to Embodiment 5 of the present invention. The same components in FIG. 6 as those in FIG. In the case of FIG. 6, the protrusion 6 a does not contact the heat radiating plate 7 in a state where the child board 2 is mounted on the parent board 1, but the protrusion 6 a contacts the surface of the heat radiating plate 7 when removing the child board 2. As a result, the operator is urged to tilt the sub board 2 in the left direction in the figure, so that the electronic component 8 can be prevented from coming into contact with the heat sink 7 on the sub board 3 and other electronic components.
[0022]
(Embodiment 6)
FIG. 7 is a cross-sectional view of a printed wiring board device according to Embodiment 6 of the present invention. In FIG. 7, the same components as those in FIG. In FIG. 7, in a state where the child board 2 is mounted on the mother board 1, the protrusion 6 a does not contact the child board 2 and protrudes above the child board 2 with a gap, but when the child board 2 is removed. Since the protrusion 6a abuts on the surface of the child board 2 to urge the operator to tilt the child board 2 in the left direction in the figure, the electronic component 8 causes the heat sink 7 on the child board 3 and other electronic components It is possible to prevent contact with parts. In this case, the protrusion 6a serves as a guide member.
[0023]
【The invention's effect】
As described above, according to the present invention, when a child board is mounted on a base board serving as a base, it is possible to prevent damage to electronic components due to interference between parts and to reduce the distance between the child boards. is there.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a state in the middle of assembly in a printed wiring board device according to an embodiment of the present invention. FIG. 2 shows a child board mounted state in the printed wiring board device according to an embodiment of the present invention. FIG. 3 is a sectional view showing a printed wiring board according to another embodiment of the present invention. FIG. 4 is a sectional view showing a printed wiring board according to another embodiment of the present invention. FIG. 6 is a sectional view showing a printed wiring board according to another embodiment of the present invention. FIG. 6 is a sectional view showing a printed wiring board according to another embodiment of the present invention. FIG. 8 is a cross-sectional view of a related printed wiring board. FIG. 8 is a cross-sectional view of a conventional printed wiring board device.
1 parent board 2 child board 2a hole 3 child board 4 connector 5 connector 6 assembly guide 6a protrusion 7 heat sink 7a inclined portion 7b hole 8 electronic component 9 electronic component

Claims

In a printed wiring board device in which a first sub board and a second sub board are connected to a base parent board by a connector from a direction perpendicular to the main board, a first sub board is placed on the first sub board. A second electronic component provided on the second child substrate at a position perpendicular to the first electronic component from the parent substrate, and A guide portion is provided on at least one of the first sub-board and the second sub-board, and the guide portion has the first electronic component and the middle in the middle of removing the first sub-board from the main board. A printed wiring board device that contacts a part of the other sub-board or a guide portion on the other sub-board to prevent contact with the second electronic component.

The guide part on the second daughter board is a guide member having a hole, and the guide part on the first daughter board is in the hole of the guide member in a state where the first daughter board is mounted on the mother board. The printed wiring board device according to claim 1, wherein the printed wiring board device is a protrusion that abuts against the surface of the guide member during the removal of the first sub board from the main board.

The guide part on the first daughter board is a guide member having a hole, and the guide part on the second daughter board is in the hole of the guide member in a state where the first daughter board is mounted on the mother board. The printed wiring board device according to claim 1, wherein the printed wiring board device is a protrusion that abuts against the surface of the guide member during the removal of the first sub board from the main board.

The surface of the guide member with which the protrusion abuts during the removal of the first sub board from the main board has an inclination so as to be separated from the second sub board as the first sub board is removed from the main board. The printed wiring board device according to claim 2, wherein:

The guide portion on the second child substrate is a hole provided in the second child substrate, and the guide portion on the first child substrate is in the state where the first child substrate is mounted on the parent substrate. 2. The printed wiring board device according to claim 1, wherein the printed wiring board device is a protrusion that abuts against the second sub board in the middle of removing the first sub board from the main board through the hole.

The guide part on the first sub board is a hole provided in the first sub board, and the guide part on the second sub board is in the state where the first sub board is mounted on the main board. 2. The printed wiring board device according to claim 1, wherein the printed wiring board device is a protrusion that abuts against the first sub board in the middle of removing the first sub board from the main board through the hole.

The guide part on the second child board protrudes with an interval on the end of the first child board opposite to the parent board in a state where the first child board is mounted on the mother board. The printed wiring board device according to claim 1, wherein the printed wiring board device is a guide member.