JP2002094264A - Printed circuit board device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent electronic component reduced in size and disposed on adjacent boards from breaking due to a component interference when the board is assembled and removed. SOLUTION: The components can be disposed in a state in which the components are entangled between adjacent boards. An assembling guide 6 having a protrusion 6a on a slave board 2 is fixed, and a hole 7b for entering the protrusion 6a is opened at a heat sink 7 of a slave board 3 side. When the board is mounted and removed, the protrusion 6a is contacted with an oblique part 7a of the heat sink 7. Thus, the board 2 is surely necessary to be inclined to prevent an electronic component 8 on the board 2 from being directly interfered with the heat sink 7.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a printed wiring board device on which electronic components are mounted.

[0002]

2. Description of the Related Art Conventionally, in a printed wiring board device having a configuration in which a plurality of sub-boards are fixed to a base board serving as a base from a right angle direction, a sufficient interval between the sub-boards is provided.
This prevents interference between electronic components when mounting and removing the daughter board.

FIG. 8 shows a conventional general substrate structure for preventing interference between electronic components. In FIG. 8, reference numeral 1 denotes a parent substrate as a base, 2 and 3 denote child substrates, and 4 and 5 denote child substrates 2 , 3 and the parent board 1.

[0004]

In this printed wiring board device, it is generally necessary to make the spacing between the daughter boards sufficiently large in order to prevent interference between electronic components on the daughter boards. If there is not enough space between the daughter boards, the electronic component 8 on the daughter board contacts and interferes with the electronic component 9 on the adjacent daughter board and the metal component 7 which is a kind of the electronic component at the time of mounting and removal. In some cases, electronic components may be destroyed. On the other hand, in recent years, the housing of electronic devices has been demanded to be downsized.

An object of the present invention is to realize a printed wiring board device in which electronic components on a sub-substrate do not interfere with electronic components on an adjacent sub-substrate at the time of assembly and disassembly even if the size is reduced.

[0006]

SUMMARY OF THE INVENTION In order to solve this problem, the present invention provides a guide unit provided at least on one side between adjacent child substrates even when electronic components on the adjacent child substrates are intricate. By providing, during the removal of the child substrate from the parent substrate, the guide portion first contacts the part of the other child substrate before the electronic components on the adjacent child substrate come into contact with each other, so that the substrate is removed. By tilting or sliding, it is possible to mount and remove the child board without giving any stress to the electronic components. As a result, the gap between the components can be reduced, and the size of the housing of the electronic device can be reduced.

[0007]

According to a first aspect of the present invention, a first sub-board and a second sub-board are attached to a base board as a base by a connector from a direction perpendicular to the main board. In the printed wiring board device, a first electronic component is provided on the first sub board, and on the second sub board,
A second electronic component provided at a position perpendicular to the first electronic component with respect to the parent substrate, and a guide portion provided on at least one of the first and second child substrates; And the guide portion is provided on the other sub-board so as to prevent contact between the first electronic component and the second electronic component while the first sub-board is being removed from the parent board. The contact portion abuts on a guide portion on a part or the other sub-substrate. With this configuration, it is possible to prevent the electronic components from coming into contact with each other and receiving stress when the sub-substrate is removed.

According to a second or third aspect of the present invention, the guide portion on one of the sub-boards is a guide member having a hole, and the guide portion on the other sub-board is a guide member on the first sub-board. In the state of being mounted on the board, it fits into the hole of the guide member,
In the process of removing the first sub board from the main board, the first sub board is a projection that comes into contact with the surface of the guide member.

According to a fourth aspect of the present invention, the surface of the guide member with which the projection abuts during the removal of the first sub-board from the parent board is formed as the first sub-board is removed from the parent board. It has an inclination so as to be away from the second child substrate.

According to a fifth or sixth aspect of the present invention, the guide section on one of the sub boards is a hole provided in the sub board, and the guide section on the other sub board is the first sub board. Is a projection that penetrates through the hole when mounted on the parent board and abuts on the one sub-board in the process of removing the first sub-board from the parent board.

Further, in the invention according to claim 7, the guide portion on the second sub-board may be arranged such that the guide portion is disposed on the parent board of the first sub-board when the first sub-board is mounted on the parent board. It is a guide member projecting at an interval on the opposite end.

Hereinafter, an embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIG.

(Embodiment 1) FIG. 1 is a sectional view of a printed wiring board device according to Embodiment 1 of the present invention during assembly. The same components as those in FIG. 7 in FIG. This is a structure in which daughter boards 2 and 3 are connected via connectors 4 and 5 on a base board 1 serving as a base. An assembling guide 6 is provided on the daughter board 2 so that the projections 6a of the assembling guide 6 hit the surface of the radiator plate 7 which is a kind of electronic component and the inclined part 7a which is a part of the surface when the daughter board 2 is mounted and removed. Thus, the operator is prompted to slide the child board 2 while tilting it to the left in the drawing. In this state, since the electronic component 8 does not contact and interfere with the heat radiating plate 7 or the electronic component 9 on the daughter board 3, the electronic component is prevented from being destroyed. In this case, the heat sink 7 functions as a guide member. Also, the inclined portion 7a
Is tilted as shown in the figure, so that the operator can naturally tilt the daughter board 2.

FIG. 2 shows a state in which the sub board 2 in FIG. 1 is mounted on the parent board 1 serving as a base. The projections 6 a of the assembly guide 6 on the sub board 2 are attached to the heat radiating plate 7 on the sub board 3. It shows a state in which it has entered the provided hole 7b. In this state, the electronic component 8 does not interfere with the heat radiating plate 7 and the electronic component 9 on the daughter board 3.

As described above, by providing the guide portion composed of the heat radiating plate 7 and the projection 6, the substrate is tilted by the action of the guide portion when the substrate is mounted and when the substrate is removed. And the electronic components of the other sub-board are prevented from contacting and interfering with each other.

In the present embodiment, the projections 6a are provided on the child substrate 2 and the heat radiating plates 7 are provided on the child substrate 3 as the guide portions. A heat sink may be provided.

(Embodiment 2) FIG. 3 is a sectional view of a printed wiring board device according to Embodiment 2 of the present invention. The same components as those in FIG. 1 in FIG. 3 are denoted by the same reference numerals, and description thereof will be omitted. In FIG. 3, reference numeral 6 denotes an assembling guide, which covers the electronic component 8 on the daughter board 2, and a part of which is an inclined portion 6b.
Reference numeral 7 denotes a heat radiating plate that forms a guide portion.

When removing the sub-board 3, the radiator plate 7 slides along the inclined portion 6b of the assembly guide 6 and further comes into contact with the surface of the assembly guide 6, so that the operator can take the sub-board 3 rightward in the figure. In order to urge the electronic component 8 to fall in the direction, it is possible to prevent the heat sink 7 and other electronic components on the child substrate 3 from contacting the electronic component 8.

(Embodiment 3) FIG. 4 is a sectional view of a printed wiring board device according to Embodiment 3 of the present invention. The same components as those in FIG. 3 in FIG. 4 are denoted by the same reference numerals, and description thereof will be omitted. In the case of FIG. 4, when the child board 2 is removed, the heat sink 7 slides along the inclined portion 6b of the assembly guide 6,
Further, by contacting the surface of the assembly guide 6, the heat radiating plate 7 and other electronic components on the child board 3 come into contact with the electronic parts 8 in order to urge the worker to tilt the child board 2 leftward in the drawing. Can be prevented.

(Embodiment 4) FIG. 5 is a cross-sectional view of a printed wiring board device according to Embodiment 4 of the present invention. The same components as those in FIG. 2 in FIG. 5 are denoted by the same reference numerals, and description thereof will be omitted. In FIG. 5, reference numeral 2a denotes a hole provided in the sub board 2, and when the sub board 2 is mounted on the main board 1, the protrusions 6a are provided.
a penetrates. When the child board 2 is detached, the protrusion 6a comes into contact with the surface of the child board 2 so that
In order to urge the worker to tilt the child board 2 to the left in the figure,
The electronic component 8 can be prevented from contacting the heat radiating plate 7 on the daughter board 3 and other electronic components.

(Embodiment 5) FIG. 6 is a sectional view of a printed wiring board apparatus according to Embodiment 5 of the present invention. 6 that are the same as in FIG. 2 are given the same reference numerals and description thereof is omitted. In the case of FIG. 6, when the child board 2 is mounted on the parent board 1, the projections 6 a do not abut on the heat radiating plate 7.
When the electronic component 8 is removed, the projection 6a contacts the surface of the heat sink 7 to urge the worker to tilt the child board 2 leftward in the figure. Contact with other electronic components can be prevented.

(Embodiment 6) FIG. 7 is a sectional view of a printed wiring board device according to Embodiment 6 of the present invention. The same components as those in FIG. 5 in FIG. 7 are denoted by the same reference numerals, and description thereof will be omitted. In FIG. 7, when the child board 2 is mounted on the parent board 1, the protrusions 6 a do not abut on the child board 2 and protrude above the child board 2 with a space therebetween. In order to urge the worker to tilt the child board 2 to the left in the figure by contacting the surface of the child board 2 with the projection 6a, It is possible to prevent contact with parts. In this case, the projection 6a functions as a guide member.

[0023]

As described above, according to the present invention, when a child board is mounted on a parent board serving as a base, breakage of electronic components due to interference between components is prevented, and the distance between the child boards is reduced. Is realized.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a state during assembly in a printed wiring board device according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a mounted state of a child board in the printed wiring board device according to one embodiment of the present invention;

FIG. 3 is a sectional view showing a printed wiring board according to another embodiment of the present invention.

FIG. 4 is a sectional view showing a printed wiring board according to another embodiment of the present invention;

FIG. 5 is a sectional view showing a printed wiring board according to another embodiment of the present invention;

FIG. 6 is a sectional view showing a printed wiring board according to another embodiment of the present invention;

FIG. 7 is a sectional view showing a printed wiring board according to another embodiment of the present invention;

FIG. 8 is a cross-sectional view of a conventional printed wiring board device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Parent board 2 Sub board 2a Hole 3 Sub board 4 Connector 5 Connector 6 Assembly guide 6a Projection 7 Heat sink 7a Inclined part 7b Hole 8 Electronic component 9 Electronic component

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5E344 AA08 AA15 AA19 AA26 AA28 BB03 BB06 CC05 CD18 CD38 DD08 EE23 EE30 5E348 AA03 AA07 AA08 AA24

Claims (7)

[Claims] In a printed wiring board device, a first sub-board and a second sub-board are connected to a base board serving as a base from a direction perpendicular to the main board by a connector. A second electronic component having a first electronic component on the secondary substrate, and a second electronic component provided on the second secondary substrate at a position perpendicular to the first electronic component from the parent substrate; A guide portion on at least one of the first sub-board and the second sub-board, and the guide portion is provided with the first sub-board during the removal of the first sub-board from the parent board. A printed wiring board device which contacts a part of the other subsidiary board or a guide portion on the other subsidiary board in order to prevent the electronic component from contacting with the second electronic component. 2. The guide section on the second sub-board is a guide member having a hole, and the guide section on the first sub-board is the guide section when the first sub-board is mounted on the parent board. 2. The printed wiring board according to claim 1, wherein the projection is a projection that abuts on a surface of the guide member while the first sub-substrate is being removed from the master substrate while being fitted into a hole of the guide member. apparatus. 3. The guide section on the first sub-board is a guide member having a hole, and the guide section on the second sub-board is the guide section when the first sub-board is mounted on the parent board. 2. The printed wiring board according to claim 1, wherein the projection is a projection that abuts on a surface of the guide member while the first sub-substrate is being removed from the master substrate while being fitted into a hole of the guide member. apparatus. 4. A surface of a guide member with which a projection abuts during removal of the first child substrate from the parent substrate is to be separated from the second child substrate as the first child substrate is removed from the parent substrate. The printed wiring board device according to claim 2, wherein the printed wiring board device has an inclination. 5. The guide portion on the second child substrate is a hole provided in the second child substrate, and the guide portion on the first child substrate is mounted on the parent substrate with the first child substrate attached thereto. 2. The projection according to claim 1, wherein the projection is a projection that penetrates the hole in a state of being removed and abuts on the second child substrate while the first child substrate is being removed from the parent substrate. 3. Printed wiring board device. 6. The guide portion on the first child substrate is a hole provided in the first child substrate, and the guide portion on the second child substrate is mounted on the parent substrate with the first child substrate attached thereto. 2. The projection according to claim 1, wherein the projection penetrates the hole in a state in which the projection is in contact with the first sub board while the first sub board is being removed from the parent board. 3. Printed wiring board device. 7. The guide portion on the second sub-board, when the first sub-board is mounted on the parent board, on the end of the first sub-board opposite to the parent board. The printed wiring board device according to claim 1, wherein the printed wiring board device is a guide member projecting at an interval.