JP3791053B2 - Conductive adhesive and electronic component mounting apparatus - Google Patents

Conductive adhesive and electronic component mounting apparatus Download PDF

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Publication number
JP3791053B2
JP3791053B2 JP17190596A JP17190596A JP3791053B2 JP 3791053 B2 JP3791053 B2 JP 3791053B2 JP 17190596 A JP17190596 A JP 17190596A JP 17190596 A JP17190596 A JP 17190596A JP 3791053 B2 JP3791053 B2 JP 3791053B2
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adhesive
silane coupling
coupling agent
conductive adhesive
conductive
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JPH09328671A (en
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一秀 佐藤
幸男 児玉
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Denso Corp
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Denso Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

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  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【０００１】
【技術分野】
本発明は，シリコーン樹脂と導電性フィラー等よりなる導電性接着剤及びこれを用いた電子部品搭載装置に関する。
【０００２】
【従来技術】
従来，導電回路を設けたアルミナ基板に対し，導電性接着剤を介して電子部品を接着してなる電子部品搭載装置がある（後述の図６参照）。
上記電子回路と上記電子部品との間の電気的接合は，上記導電性接着剤により確保される。そのため，上記導電性接着剤は導電性に優れていることが要求される。
このような導電性接着剤には，従来，特開昭６１−２２８０７４号，特開平１−２９４７８４号に示すされるものが提案されていた。
【０００３】
【解決しようとする課題】
このような導電性接着剤では，導電性フィラーの粒径及び形状の改良をすることによって，導電性を向上させている。しかし，このような導電性接着剤において，たとえ，耐熱性の良好なシリコーン樹脂と導電性フィラーを採用したとしても，いまだ，十分な初期導電性を得ることができない。さらには，高温放置後の高温での十分な導電性を得ることができないという問題が生じる。
【０００４】
本発明は，上記問題に鑑み，導電性に優れ，かつ耐熱性を有する導電性接着剤及びこれを用いた電子部品搭載装置を提供しようとするものである。
【０００５】
【課題の解決手段】
そこで，本発明者らは，導電性，耐熱性に優れた導電性接着剤について鋭意研究を重ねたところ，接着硬化後の弾性率が導電性と相関関係にあることを見出した。
そもそも，導電性接着剤の導電性は，導電性フィラーの接触によりなる。そして，この導電性フィラーの接触は，樹脂の導電性フィラーの拘束力に起因している。
【０００６】
そこで，我々発明者らは，導電性フィラーの拘束力として，弾性率と導電性との関係を測定したところ，後述する図１に示すごとく，硬化後の接着剤の弾性率と抵抗値との間に相関関係があることを見出したのである。即ち，弾性率が高くなるにつれて，導電性フィラーの拘束力が増加し，体積抵抗率を急激に減少させることができ，導電性を急激に向上させることができることを見出したのである。
【０００７】
請求項１の発明は，シリコーン樹脂と導電性フィラーとからなる接着剤主体に対して，シランカップリング剤を添加してなると共に，
体積抵抗率が３×１０-3Ωｃｍ以下，接着硬化後の弾性率が５０ＭＰａ以上であり，
かつ上記シランカップリング剤は，エポキシ基またはメタクリロキシ基を含有するシランカップリング剤の１種または２種以上を用いてなることを特徴とする導電性接着剤にある。
【０００８】
上記シランカップリング剤として，エポキシ基を含有するものとしてはγ−グリシドキシプロピルトリメトキシシラン，β−（３，４エポキシシクロヘキシル）エチルトリメトキシシラン，γ−グリシドキシプロピルメチルジエトキシシラン，γ−グリシドキシプロピルトリエトキシシラン等がある。
【０００９】
また，メタクリロキシ基を含有するものとしてはγ−メタクリロキシプロピルトリエトキシシラン，γ−メタクリロキシプロピルメチルジメトキシシラン，γ−メタクリロキシプロピルトリメトキシシラン等がある。
そして，これらシランカップリング剤の１種または２種以上を用いる。
【００１０】
上記体積抵抗率は，上記導電性接着剤が硬化した後，常温において測定した値である（後述の実施形態例１参照）。
上記体積抵抗率が３×１０-3Ωｃｍより大きい場合には，導電性接着剤として充分な導電性が発揮されないおそれがある。
【００１１】
なお，上記体積抵抗率の下限は，上記導電性接着剤に含有される導電性フィラーの体積抵抗率に等しい。
従って，上記導電性フィラーとして，例えば，Ａｇを使用する場合には，銀の体積抵抗率，１．６×１０-6Ωｃｍが上記導電性接着剤の体積抵抗率の下限となる。
【００１２】
上記弾性率が，５０ＭＰａ未満である場合には，導電性接着剤の抵抗値が増大し，導電性接着剤としての役割が果たせなくなるおそれがある。
また，上記弾性率の上限は６ＧＰａであることが好ましい。
上記弾性率が６ＧＰａよりも大きい場合には，被着体である電子部品の特性変動やクラック発生，または導電性接着剤のクラックが発生するおそれがある。
【００１３】
また，上記シリコーン樹脂としては，例えば，オルガノポリシロキサン等を使用することができる。
上記導電性フィラーとしては，例えば，Ａｇ，Ｃ，Ｎｉ，Ｃｕ，Ａｕ等を使用することができる。
また，上記接着剤主体には，硬化促進を目的とし，例えば，Ｐｔ系等の触媒を添加することができる。
【００１４】
また，本発明においては，上記特定のシランカップリング剤を添加しているので，導電性接着剤の抵抗値が熱処理の前後において変化しない。従って，本発明の導電性接着剤は耐熱性にも優れている。
【００１５】
以上のように，本発明によれば，導電性に優れ，かつ耐熱性を有する導電性接着剤を提供することができる。
【００１６】
なお，本発明の導電性接着剤は，メタノールまたはエタノール等のアルコールと混合して使用または保管することができる。
即ち，本発明にかかる導電性接着剤はシランカップリング剤が添加されているため，硬化反応が速い。一方，上記メタノールまたはエタノール等アルコールとの混合により，この硬化反応が遅延する。そのため，接着作業が容易となる。また，上記導電性接着剤の保存安定性も高くなる。
【００１７】
次に，請求項２の発明のように，上記接着剤主体（１００重量％）に対してシランカップリング剤は，１〜８重量％添加してなることが好ましい。
上記シランカップリング剤の添加量が１重量％未満である場合には，弾性率が小さく，導電性が向上しないおそれがある。一方，上記シランカップリング剤の添加量が８重量％を越えた場合には，導電性フィラーの含有率が減少してしまい，導電性が低下するおそれがある。
【００１８】
なお，本発明にかかる導電性接着剤は，後述するごとく電子部品搭載装置における導電回路と電子部品との間の接着に使用する他，導電回路そのものに使用したり，電磁波シールド材として使用することができる。
【００１９】
次に，請求項３は，導電回路を設けた基板に導電性接着剤を介して電子部品を接着してなる電子部品搭載装置において，
上記導電性接着剤はシリコーン樹脂と導電性フィラーとからなる接着剤主体に対して，シランカップリング剤を添加してなると共に，
体積抵抗率が３×１０-3Ωｃｍ以下，接着硬化後の弾性率が５０ＭＰａ以上であり，
かつ上記シランカップリング剤は，エポキシ基またはメタクリロキシ基を含有するシランカップリング剤の１種または２種を用いてなることを特徴とする電子部品搭載装置にある。
【００２０】
本発明の電子部品搭載装置には，上述した優れた導電性を有する導電性接着剤が使用されている。このため，電子部品と導電回路との間の優れた導通を得ることができる。
また，上記電子部品搭載装置を作製する際に，例えば後述する蓋体の接着等のように加熱工程を行うことがある。上記導電性接着剤は，上述したごとく耐熱性に優れているため，上記加熱工程に伴う不良品の発生を防止することができる。以上のように，本発明によれば，導電性に優れ，かつ耐熱性を有する電子部品装置を提供することができる。
【００２１】
また，請求項４の発明のように，上記接着剤主体（１００重量％）に対してシランカップリング剤は，１〜８重量％添加してなることが好ましい。その理由は，上記と同様である。
【００２２】
【発明の実施の形態】
実施形態例１
本発明の実施形態例にかかる導電性接着剤及びその性質，性能につき，図１〜図５を用いて説明する。
本例の導電性接着剤は，シリコーン樹脂と導電性フィラーと触媒とからなる接着剤主体に対して，シランカップリング剤を添加してなる。
そして，上記導電性接着剤は硬化してゴム状となった状態における室温での体積抵抗率が３×１０-3Ωｃｍ以下，弾性率が５０ＭＰａ以上である。
【００２３】
また，本例において，上記シランカップリング剤はγ−グリドキシプロピルトリメトキシシランであり，このものはエポキシ基を含有しているものである。
上記導電性フィラーはＡｇ，上記触媒はＰｔ系である。
【００２４】
上記導電性接着剤の弾性率と抵抗値との関係につき，図１を用いて説明する。即ち，同図は導電性接着剤の弾性率を徐々に変えた場合の抵抗値の変化を示している。上記弾性率は接着剤主体１００重量％に対し，シランカップリング剤を各種の割合（重量％）で添加することにより調整したものである。
【００２５】
また，同図において試料ａはシリコーン樹脂１００重量部に対し導電性フィラーを４００重量部添加し，更に触媒を１０ｐｐｍ重量部混合した接着剤主体１００重量％に対し，シランカップリング剤を上記のごとく添加したものである。
また，試料ｂはシリコーン樹脂１００重量部に対し導電性フィラーを５６０重量部添加したものである。その他は試料ａと同様である。
【００２６】
次に，上記抵抗値の測定方法につき説明する。
まず，導電性接着剤よりなるシート状のダンベルの作製方法につき説明する。上記抵抗値はこのダンベルを用いて測定する。
図３（ａ），（ｂ）に示すごとく，幅５０ｍｍ×長さ５０ｍｍのセラミック基板３０を準備する。そして，その片面の全面にテフロン粘着テープ３１［トップ（名古屋科学機器）製，４０８２−０３］を貼った。
【００２７】
次に，上記テフロン粘着テープ３１を貼った面に，厚さ５０μｍのメンディングテープ３２［住友スリーエム株式会社製，８１０−１−１２］を，６枚重ね，厚さ３００μｍとし，図３に示すごとく，４ヶ所に貼着した。この時，メンディングテープ３２同士の間隙３９を５ｍｍとした。
【００２８】
次に，上記間隙３９にピストン攪拌した導電性接着剤を塗布し，幅１０ｍｍ以上のスキージ用ヘラを用いて印刷を行った。次いで，上記６枚重ねのメンディングテープ３２を剥した。
【００２９】
次に，上記セラミック基板３０を温度１５０℃に保持されたシリコーン樹脂硬化専用恒温槽に投入し，セラミック基板３０上の導電性接着剤を硬化させた。恒温槽投入１時間後に，上記セラミック基板３０を取出した。
そして，硬化した導電性接着剤を上記セラミック基板３０より剥がし，シート状のダンベル（幅５ｍｍ×長さ４０ｍｍ×厚さ０．３ｍｍ）とした。
【００３０】
次に，上記ダンベルを用いた抵抗値の測定方法につき説明する。
図４に示すごとく，温度調整可能な熱板４９の上に５０ｍｍ×５０ｍｍのセラミック基板４１を配置する。
次いで，上記セラミック基板４１の上に上記方法（図３）で作製したダンベル２を載置する。
次いで，上記ダンベル２の上に，下面の左右にそれぞれ電極４２を設けた測定治具４４を載置した。そして，上記測定治具４４の電極４２と導通した導線４３に対し，デジタルマルチメーター４０を接続した。
【００３１】
上記測定治具４４における２枚の電極４２間の距離，即ち測定ギャップａは５ｍｍ，電極４２の大きさは幅８ｍｍ×長さ８ｍｍ，また測定治具４４の重さは，上記抵抗値の測定に当たって，ダンベル２に対し１１０ｇの加圧力を加えることが可能な重さとした。
また，上記測定は３回行い，測定値の平均をとって抵抗値とした。
【００３２】
また，上記弾性率の測定方法につき説明する。
上述の方法（図３）にて製作したダンベル２の両端を，図５に示すごとく，チャック５０にて，チャック間距離ｂを１０ｍｍとなるように固定し，これを測定周波数１０Ｈｚで，粘弾性スペクトロメータ［岩本製作所（株）製，ＶＥＳ−ＨＣ］を用いて測定した。
なお，同図において符号５３は固定用ボルトである。
【００３３】
以上の測定を，試料ａ，試料ｂについて図１に示した。
同図によれば，弾性率の増大と共に抵抗値が激減することが分かった。
【００３４】
次に，図２を用いて，接着剤主体（１００重量％）に対するシランカップリング剤の添加量（重量％）と弾性率，抵抗値との間の関係を説明する。
同図において，上記試料ａにかかる接着剤主体に対し，シランカップリング剤の添加量を種々に変えたものを準備し，弾性率及び抵抗値は上述と同様の方法にて測定した。これらの値を図２にプロットした。
【００３５】
同図によれば，シランカップリング剤の添加量を，接着剤主体に対し１〜８重量％添加することにより，抵抗値が０．１Ω以下，弾性率が５０ＭＰａ以上となる導電性接着剤を得られることが分かる。
弾性率増加により導電性が向上するのは前述の様に導電性フィラーの接触が良好となるためである。この場合，およそ弾性率５０ＭＰａの付近を境として，導電性フィラーの接触は急激に良好となる。
なお，本例の測定法における上記抵抗値０．１Ωは，体積抵抗率に換算すると３×１０-3Ωｃｍである。
【００３６】
実施形態例２
本例は，本発明の導電性接着剤にかかる試料１，試料２を比較試料Ｃ１〜Ｃ４と比較説明したものである。
表１に示すごとく，試料１，２，比較試料Ｃ１〜Ｃ４は，それぞれ同成分の接着剤主体（１００重量％）に対し，シランカップリング剤の量（重量％）を変えて添加したものである。
試料１はエポキシ基を含有するシランカップリング剤を，試料２はメタクリロキシ基を含有するシランカップリング剤を添加した導電性接着剤である。
【００３７】
また，比較試料Ｃ１はシランカップリング剤を含有しない導電性接着剤である。比較試料Ｃ２はアミノ基を含有するシランカップリング剤を，比較試料Ｃ３はビニル基を含有するシランカップリング剤を添加した導電性接着剤である。
また，比較試料Ｃ４はエポキシ基を含有するシランカップリング剤を添加した導電性接着剤である。ただし，シランカップリング剤の添加量が試料１と比較して極めて少ない。
【００３８】
また，各試料１，２，比較試料Ｃ１〜Ｃ４の弾性率は，上記実施形態例１に示したように，導電性接着剤より作製したダンベルを用いて，実施形態例１と同様の方法にて測定した値を，表１の弾性率，『初期』の欄にそれぞれ記した。また，得られたダンベルを熱処理した後に同様に測定した弾性率を，表１の弾性率の『熱処理後』の欄に記した。
なお，上記熱処理は，ダンベルを温度３６５℃に設定したＮ2 連続炉に２回（計２０分）投入することにより行った。
【００３９】
また，各試料１，２，比較試料Ｃ１〜Ｃ４の抵抗値は，上記のごとく作製したダンベルを用いて，実施形態例１と同様の方法にて測定した。その値を，表１の抵抗値の『初期』の欄にそれぞれ記した。
ただし，上記測定はＲＴ（室温）及び上記ダンベルを温度１５０℃に保持した状態でそれぞれ行った。
【００４０】
温度１５０℃におけるダンベルの抵抗値の測定は，上記図４に示すごとく，ダンベル２を熱板４９の上に配置した後，上記熱板４９の温度を高め，セラミック基板４１の表面温度を１５０℃に昇温し，この状態のままダンベル２を３分間放置し，ダンベル２を昇温させた。その後，上記室温での測定と同様にしてダンベル２の抵抗値を測定した。
一方，同様に，上述の熱処理を施したダンベルについてＲＴ及び温度１５０℃において抵抗値を測定し，表１の抵抗値，『熱処理後』の欄に記した。
【００４１】
同表に示すごとく，試料１及び試料２の抵抗値は初期においても，熱処理後においてもほぼ同じ値で，常に優れた導電性を有していることが分かった。
また，比較試料Ｃ１，Ｃ３，Ｃ４は，初期のＲＴにおける抵抗値が試料１，試料２と比較して非常に大きく，導電性について大きく劣っていることが分かった。更に，比較試料Ｃ１，Ｃ３，Ｃ４の温度１５０℃における抵抗値はＲＴにおける抵抗値よりも更に大きく，温度が高まることにより，導電性が更に悪化することが分かった。
【００４２】
その上，熱処理後の抵抗値についても，比較試料Ｃ１，Ｃ３，Ｃ４の抵抗値は試料１，試料２と比較して非常に大きく，導電性について大きく劣っていることが分かった。更に，比較試料Ｃ１，Ｃ３については，温度１５０℃における抵抗値は４ＭΩを越えオーバーロード（表中のＯＬ）の状態となり，導電性が失われてしまうことが分かった。
また，比較試料Ｃ４の温度１５０℃における抵抗値は，比較試料Ｃ１，Ｃ３よりは低いが，試料１，試料２に比べると大きく劣っていることが分かった。
また，比較試料Ｃ２については，そもそも硬化しなかったことから，接着剤として使用不能であることが分かった。
【００４３】
以上により，本発明にかかるシランカップリング剤を接着剤主体に添加することにより得られた導電性接着剤は，優れた耐熱性と導電性とを有していることが分かった。また，シランカップリング剤であっても，ビニル基含有のもの，またアミノ基含有のものでは，本発明にかかる効果を得ることができないことが分かった。
【００４４】
【表１】

Figure 0003791053
【００４５】
実施形態例３
本例は実施形態例２の試料１にかかる導電性接着剤を使用した電子部品搭載装置につき図６を用いて説明する。
図６に示すごとく，上記電子部品搭載装置１０は，導電回路１２を設けた多層基板１９に，導電性接着剤１を介して電子部品１１を接着してなる。
上記多層基板１９には，導電パッド１２，スルーホール１５，内層回路１４，外層回路１２０よりなる回路が形成されている。多層基板１９は，アルミナ基板１９０を積層接着することにより構成されている。
【００４６】
なお，上記電子部品搭載装置１０の製造に当たっては，多層基板１９に形成された搭載凹部１９０の導電パッド１２に対し導電性接着剤１を塗布し，その上に電子部品１１を載置し，１５０℃に加熱して，接着硬化させる。
上記電子部品１１の硬化後には，導電回路１２５と電子部品１１との間をボンディングワイヤー１３にて接続する。
【００４７】
最後に，上記搭載凹部１９０を窒素ガスで充填しつつ，搭載凹部１９０の上端に封着用ガラス１０９を介して蓋体１００を積層固定する。
上記積層固定は３００℃程度の温度雰囲気にて，封着用ガラス１０９を溶融させて行った。
【００４８】
本例の電子部品搭載装置１０においては，導電性と耐熱性に優れた導電性接着剤１を用いて電子部品１１を取付けてある。このため，上記蓋体１００の積層固定の際に加熱されても，導電性接着剤１がその導電性を失うことがない。
【図面の簡単な説明】
【図１】実施形態例１における，導電性接着剤の抵抗値と弾性率との関係を示す線図。
【図２】実施形態例１における，導電性接着剤の弾性率及び抵抗値とシランカップリング剤の添加量との関係を示す線図。
【図３】実施形態例１における，導電性接着剤の抵抗値の測定の際に使用したダンベルの製造方法を示す説明図。
【図４】実施形態例１における，導電性接着剤の抵抗値の測定方法の説明図。
【図５】実施形態例１における，導電性接着剤の弾性率の測定方法の説明図。
【図６】実施形態例３における，電子部品搭載装置の断面説明図。
【符号の説明】
１．．．導電性接着剤，
１０．．．電子部品搭載装置，
１１．．．電子部品，[0001]
【Technical field】
The present invention relates to a conductive adhesive comprising a silicone resin and a conductive filler and an electronic component mounting apparatus using the same.
[0002]
[Prior art]
Conventionally, there is an electronic component mounting apparatus in which an electronic component is bonded to an alumina substrate provided with a conductive circuit via a conductive adhesive (see FIG. 6 described later).
The electrical connection between the electronic circuit and the electronic component is ensured by the conductive adhesive. For this reason, the conductive adhesive is required to have excellent conductivity.
As such a conductive adhesive, those shown in JP-A-61-228074 and JP-A-1-294784 have been proposed.
[0003]
[Problems to be solved]
In such a conductive adhesive, the conductivity is improved by improving the particle size and shape of the conductive filler. However, in such a conductive adhesive, even if a heat-resistant silicone resin and a conductive filler are used, sufficient initial conductivity cannot be obtained yet. Furthermore, there arises a problem that sufficient conductivity at a high temperature after being left at a high temperature cannot be obtained.
[0004]
In view of the above problems, the present invention intends to provide a conductive adhesive having excellent conductivity and heat resistance, and an electronic component mounting apparatus using the same.
[0005]
[Means for solving problems]
Accordingly, the present inventors have conducted extensive research on conductive adhesives having excellent conductivity and heat resistance, and found that the elastic modulus after adhesive curing is correlated with the conductivity.
In the first place, the conductivity of the conductive adhesive is based on the contact of the conductive filler. The contact of the conductive filler is caused by the restraining force of the resin conductive filler.
[0006]
Therefore, the inventors measured the relationship between the elastic modulus and the conductivity as the binding force of the conductive filler. As shown in FIG. 1 to be described later, the relationship between the elastic modulus and the resistance value of the cured adhesive was obtained. They found that there was a correlation between them. That is, it has been found that as the elastic modulus increases, the binding force of the conductive filler increases, the volume resistivity can be rapidly decreased, and the conductivity can be rapidly improved.
[0007]
The invention of claim 1 is obtained by adding a silane coupling agent to an adhesive main body composed of a silicone resin and a conductive filler,
The volume resistivity is 3 × 10 −3 Ωcm or less, and the elastic modulus after adhesive curing is 50 MPa or more.
And the said silane coupling agent exists in the electrically conductive adhesive characterized by using 1 type, or 2 or more types of the silane coupling agent containing an epoxy group or a methacryloxy group.
[0008]
As the silane coupling agent, those containing an epoxy group include γ-glycidoxypropyltrimethoxysilane, β- (3,4 epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, γ-glycidoxypropyltriethoxysilane and the like.
[0009]
Examples of those containing a methacryloxy group include γ-methacryloxypropyltriethoxysilane, γ-methacryloxypropylmethyldimethoxysilane, and γ-methacryloxypropyltrimethoxysilane.
One or more of these silane coupling agents are used.
[0010]
The volume resistivity is a value measured at room temperature after the conductive adhesive is cured (see Example 1 described later).
When the volume resistivity is larger than 3 × 10 −3 Ωcm, there is a possibility that sufficient conductivity as a conductive adhesive may not be exhibited.
[0011]
The lower limit of the volume resistivity is equal to the volume resistivity of the conductive filler contained in the conductive adhesive.
Therefore, for example, when Ag is used as the conductive filler, the volume resistivity of silver, 1.6 × 10 −6 Ωcm, is the lower limit of the volume resistivity of the conductive adhesive.
[0012]
When the elastic modulus is less than 50 MPa, the resistance value of the conductive adhesive increases, and the role as the conductive adhesive may not be achieved.
The upper limit of the elastic modulus is preferably 6 GPa.
When the elastic modulus is larger than 6 GPa, there is a possibility that characteristic fluctuations and cracks of the electronic parts as adherends or cracks of the conductive adhesive may occur.
[0013]
Moreover, as said silicone resin, organopolysiloxane etc. can be used, for example.
For example, Ag, C, Ni, Cu, Au, or the like can be used as the conductive filler.
In addition, for the purpose of accelerating curing, for example, a Pt-based catalyst or the like can be added to the adhesive main body.
[0014]
In the present invention, since the specific silane coupling agent is added, the resistance value of the conductive adhesive does not change before and after the heat treatment. Therefore, the conductive adhesive of the present invention is excellent in heat resistance.
[0015]
As described above, according to the present invention, a conductive adhesive having excellent conductivity and heat resistance can be provided.
[0016]
The conductive adhesive of the present invention can be used or stored by mixing with alcohol such as methanol or ethanol.
That is, the conductive adhesive according to the present invention has a fast curing reaction since a silane coupling agent is added. On the other hand, this curing reaction is delayed by mixing with the alcohol such as methanol or ethanol. Therefore, the bonding work becomes easy. In addition, the storage stability of the conductive adhesive is increased.
[0017]
Next, as in the invention of claim 2, it is preferable to add 1 to 8% by weight of the silane coupling agent with respect to the adhesive main body (100% by weight).
When the addition amount of the silane coupling agent is less than 1% by weight, the elastic modulus is small and the conductivity may not be improved. On the other hand, when the addition amount of the silane coupling agent exceeds 8% by weight, the content of the conductive filler decreases, and the conductivity may decrease.
[0018]
The conductive adhesive according to the present invention is used not only for bonding between a conductive circuit and an electronic component in an electronic component mounting apparatus as described later, but also for a conductive circuit itself or as an electromagnetic shielding material. Can do.
[0019]
Next, claim 3 is an electronic component mounting apparatus in which an electronic component is bonded to a substrate provided with a conductive circuit via a conductive adhesive.
The conductive adhesive is formed by adding a silane coupling agent to an adhesive mainly composed of a silicone resin and a conductive filler,
The volume resistivity is 3 × 10 −3 Ωcm or less, and the elastic modulus after adhesive curing is 50 MPa or more.
And the said silane coupling agent exists in the electronic component mounting apparatus characterized by using 1 type or 2 types of the silane coupling agent containing an epoxy group or a methacryloxy group.
[0020]
The electronic component mounting apparatus of the present invention uses the above-described conductive adhesive having excellent conductivity. For this reason, excellent conduction between the electronic component and the conductive circuit can be obtained.
Moreover, when producing the said electronic component mounting apparatus, a heating process may be performed like the adhesion | attachment of the cover body mentioned later, for example. Since the conductive adhesive is excellent in heat resistance as described above, it is possible to prevent the occurrence of defective products due to the heating process. As described above, according to the present invention, an electronic component device having excellent conductivity and heat resistance can be provided.
[0021]
Further, as in the invention of claim 4, it is preferable to add 1 to 8% by weight of the silane coupling agent with respect to the adhesive main body (100% by weight). The reason is the same as above.
[0022]
DETAILED DESCRIPTION OF THE INVENTION
Embodiment 1
A conductive adhesive according to an embodiment of the present invention and its properties and performance will be described with reference to FIGS.
The conductive adhesive of this example is obtained by adding a silane coupling agent to an adhesive mainly composed of a silicone resin, a conductive filler, and a catalyst.
The conductive adhesive has a volume resistivity at room temperature of 3 × 10 −3 Ωcm or less and a modulus of elasticity of 50 MPa or more in a cured and rubbery state.
[0023]
In this example, the silane coupling agent is γ-gridoxypropyltrimethoxysilane, which contains an epoxy group.
The conductive filler is Ag, and the catalyst is Pt.
[0024]
The relationship between the elastic modulus and resistance value of the conductive adhesive will be described with reference to FIG. That is, this figure shows a change in resistance value when the elastic modulus of the conductive adhesive is gradually changed. The elastic modulus is adjusted by adding a silane coupling agent in various proportions (% by weight) to 100% by weight of the adhesive.
[0025]
Further, in the same figure, sample a is obtained by adding 400 parts by weight of a conductive filler to 100 parts by weight of a silicone resin, and further adding a silane coupling agent as described above to 100% by weight of an adhesive mainly containing 10 ppm by weight of a catalyst. It is what was added.
Sample b is obtained by adding 560 parts by weight of a conductive filler to 100 parts by weight of silicone resin. Others are the same as the sample a.
[0026]
Next, a method for measuring the resistance value will be described.
First, a method for producing a sheet-like dumbbell made of a conductive adhesive will be described. The resistance value is measured using this dumbbell.
As shown in FIGS. 3A and 3B, a ceramic substrate 30 having a width of 50 mm and a length of 50 mm is prepared. Then, Teflon adhesive tape 31 [Top (Nagoya Scientific Instruments), 4082-03] was pasted on the entire surface of one side.
[0027]
Next, on the surface on which the Teflon adhesive tape 31 is affixed, six sheets of mending tape 32 (Sumitomo 3M Limited, 810-1-12) having a thickness of 50 μm are stacked to a thickness of 300 μm, as shown in FIG. As you can see, it was stuck in four places. At this time, the gap 39 between the mending tapes 32 was set to 5 mm.
[0028]
Next, a conductive adhesive with piston stirring was applied to the gap 39, and printing was performed using a squeegee spatula having a width of 10 mm or more. Next, the six-layered mending tape 32 was peeled off.
[0029]
Next, the ceramic substrate 30 was placed in a thermostat dedicated to curing a silicone resin maintained at a temperature of 150 ° C., and the conductive adhesive on the ceramic substrate 30 was cured. The ceramic substrate 30 was taken out after 1 hour from the introduction of the constant temperature bath.
Then, the cured conductive adhesive was peeled off from the ceramic substrate 30 to form a sheet-like dumbbell (width 5 mm × length 40 mm × thickness 0.3 mm).
[0030]
Next, a method for measuring the resistance value using the dumbbell will be described.
As shown in FIG. 4, a 50 mm × 50 mm ceramic substrate 41 is disposed on a temperature-adjustable hot plate 49.
Next, the dumbbell 2 produced by the above method (FIG. 3) is placed on the ceramic substrate 41.
Next, a measuring jig 44 provided with electrodes 42 on the left and right sides of the lower surface was placed on the dumbbell 2. A digital multimeter 40 was connected to the conductive wire 43 that was in electrical communication with the electrode 42 of the measuring jig 44.
[0031]
The distance between the two electrodes 42 in the measurement jig 44, that is, the measurement gap a is 5 mm, the size of the electrode 42 is 8 mm wide × 8 mm long, and the weight of the measurement jig 44 is the measurement of the resistance value. In this case, a weight capable of applying a pressure of 110 g to the dumbbell 2 was used.
The above measurement was performed three times, and the average of the measured values was taken as the resistance value.
[0032]
A method for measuring the elastic modulus will be described.
As shown in FIG. 5, both ends of the dumbbell 2 manufactured by the above method (FIG. 3) are fixed with a chuck 50 so that the distance b between chucks is 10 mm, and this is viscoelastic at a measurement frequency of 10 Hz. The measurement was performed using a spectrometer [Iwamoto Seisakusho Co., Ltd., VES-HC].
In the figure, reference numeral 53 denotes a fixing bolt.
[0033]
The above measurement is shown in FIG. 1 for sample a and sample b.
According to the figure, it was found that the resistance value drastically decreases as the elastic modulus increases.
[0034]
Next, the relationship between the addition amount (wt%) of the silane coupling agent with respect to the adhesive main body (100 wt%), the elastic modulus, and the resistance value will be described with reference to FIG.
In the same figure, the adhesive mainly applied to the sample a was prepared by changing the addition amount of the silane coupling agent in various ways, and the elastic modulus and resistance value were measured by the same method as described above. These values are plotted in FIG.
[0035]
According to the figure, a conductive adhesive having a resistance value of 0.1Ω or less and an elastic modulus of 50 MPa or more by adding 1 to 8% by weight of the silane coupling agent with respect to the adhesive main body. You can see that
The reason why the conductivity is improved by the increase in the elastic modulus is that the contact of the conductive filler becomes good as described above. In this case, the contact of the conductive filler is rapidly improved with the elastic modulus of about 50 MPa as a boundary.
The resistance value 0.1Ω in the measurement method of this example is 3 × 10 −3 Ωcm in terms of volume resistivity.
[0036]
Embodiment 2
In this example, Sample 1 and Sample 2 according to the conductive adhesive of the present invention are compared with Comparative Samples C1 to C4.
As shown in Table 1, Samples 1 and 2 and Comparative Samples C1 to C4 were added by changing the amount (% by weight) of the silane coupling agent with respect to the adhesive component (100% by weight) of the same component. is there.
Sample 1 is a conductive adhesive to which a silane coupling agent containing an epoxy group is added, and sample 2 is a conductive adhesive to which a silane coupling agent containing a methacryloxy group is added.
[0037]
Comparative sample C1 is a conductive adhesive that does not contain a silane coupling agent. Comparative sample C2 is a conductive adhesive to which an amino group-containing silane coupling agent is added, and comparative sample C3 is a vinyl group-containing silane coupling agent.
Comparative sample C4 is a conductive adhesive to which a silane coupling agent containing an epoxy group is added. However, the amount of silane coupling agent added is very small compared to Sample 1.
[0038]
In addition, the elastic modulus of each of the samples 1 and 2 and the comparative samples C1 to C4 is the same as that of the first embodiment using a dumbbell made of a conductive adhesive as shown in the first embodiment. The values measured in the above are shown in the elastic modulus and “initial” columns of Table 1, respectively. The elastic modulus measured in the same manner after heat-treating the obtained dumbbells is shown in the column of “After heat treatment” of the elastic modulus in Table 1.
The heat treatment was performed by placing the dumbbell twice (total 20 minutes) in a N 2 continuous furnace set at a temperature of 365 ° C.
[0039]
In addition, the resistance values of Samples 1 and 2 and Comparative Samples C1 to C4 were measured by the same method as in Example 1 using the dumbbells produced as described above. The values are shown in the “initial” column of the resistance values in Table 1, respectively.
However, the above measurement was performed with RT (room temperature) and the dumbbell held at a temperature of 150 ° C., respectively.
[0040]
As shown in FIG. 4, the measurement of the resistance value of the dumbbell at a temperature of 150 ° C. is performed by placing the dumbbell 2 on the hot plate 49 and then increasing the temperature of the hot plate 49 to increase the surface temperature of the ceramic substrate 41 to 150 ° C. The dumbbell 2 was left for 3 minutes in this state, and the dumbbell 2 was heated. Thereafter, the resistance value of the dumbbell 2 was measured in the same manner as the measurement at the room temperature.
On the other hand, similarly, the resistance values of the dumbbells subjected to the above-described heat treatment were measured at RT and a temperature of 150 ° C., and the resistance values in Table 1 are listed in the “After heat treatment” column.
[0041]
As shown in the table, it was found that the resistance values of Sample 1 and Sample 2 were almost the same both in the initial stage and after the heat treatment, and always had excellent conductivity.
In addition, it was found that the comparative samples C1, C3, and C4 had a very large resistance value at the initial RT compared to the samples 1 and 2, and the conductivity was greatly inferior. Further, it was found that the resistance values of the comparative samples C1, C3, and C4 at a temperature of 150 ° C. were larger than the resistance value at RT, and the conductivity further deteriorated as the temperature increased.
[0042]
In addition, the resistance values of the samples C1, C3, and C4 after the heat treatment were much larger than those of the samples 1 and 2, and the conductivity was greatly inferior. Furthermore, for the comparative samples C1 and C3, it was found that the resistance value at a temperature of 150 ° C. exceeded 4 MΩ and was in an overload state (OL in the table), and the conductivity was lost.
Further, it was found that the resistance value of the comparative sample C4 at a temperature of 150 ° C. is lower than that of the comparative samples C1 and C3, but greatly inferior to that of the sample 1 and the sample 2.
In addition, it was found that Comparative Sample C2 was not cured in the first place, so that it could not be used as an adhesive.
[0043]
From the above, it was found that the conductive adhesive obtained by adding the silane coupling agent according to the present invention to the adhesive main body has excellent heat resistance and conductivity. Moreover, even if it was a silane coupling agent, it turned out that the effect concerning this invention cannot be acquired by the thing containing a vinyl group and an amino group.
[0044]
[Table 1]
Figure 0003791053
[0045]
Embodiment 3
In this example, an electronic component mounting apparatus using a conductive adhesive according to Sample 1 of Embodiment 2 will be described with reference to FIG.
As shown in FIG. 6, the electronic component mounting apparatus 10 is formed by adhering an electronic component 11 to a multilayer substrate 19 provided with a conductive circuit 12 via a conductive adhesive 1.
On the multilayer substrate 19, a circuit comprising the conductive pads 12, the through holes 15, the inner layer circuit 14, and the outer layer circuit 120 is formed. The multilayer substrate 19 is configured by laminating and bonding an alumina substrate 190.
[0046]
In manufacturing the electronic component mounting apparatus 10, the conductive adhesive 1 is applied to the conductive pads 12 of the mounting recesses 190 formed in the multilayer substrate 19, and the electronic component 11 is placed on the conductive pad 12. Heat to ° C to cure.
After the electronic component 11 is cured, the conductive circuit 125 and the electronic component 11 are connected by the bonding wire 13.
[0047]
Finally, the lid 100 is laminated and fixed to the upper end of the mounting recess 190 via the sealing glass 109 while filling the mounting recess 190 with nitrogen gas.
The lamination fixing was performed by melting the sealing glass 109 in a temperature atmosphere of about 300 ° C.
[0048]
In the electronic component mounting apparatus 10 of this example, the electronic component 11 is attached using the conductive adhesive 1 excellent in conductivity and heat resistance. For this reason, even if it heats in the case of lamination | stacking fixation of the said cover body 100, the electroconductive adhesive agent 1 does not lose the electroconductivity.
[Brief description of the drawings]
FIG. 1 is a diagram showing the relationship between the resistance value and the elastic modulus of a conductive adhesive in Embodiment 1;
2 is a diagram showing the relationship between the elastic modulus and resistance value of a conductive adhesive and the amount of silane coupling agent added in Embodiment 1. FIG.
FIG. 3 is an explanatory view showing a method for manufacturing a dumbbell used in measuring the resistance value of the conductive adhesive in the first embodiment.
4 is an explanatory diagram of a method for measuring a resistance value of a conductive adhesive in Embodiment 1. FIG.
5 is an explanatory diagram of a method for measuring the elastic modulus of a conductive adhesive in Embodiment 1. FIG.
6 is a cross-sectional explanatory view of an electronic component mounting apparatus in Embodiment 3. FIG.
[Explanation of symbols]
1. . . Conductive adhesive,
10. . . Electronic component mounting equipment,
11. . . Electronic components,

Claims (4)

シリコーン樹脂と導電性フィラーとからなる接着剤主体に対して，シランカップリング剤を添加してなると共に，
体積抵抗率が３×１０-3Ωｃｍ以下，接着硬化後の弾性率が５０ＭＰａ以上であり，
かつ上記シランカップリング剤は，エポキシ基またはメタクリロキシ基を含有するシランカップリング剤の１種または２種以上を用いてなることを特徴とする導電性接着剤。A silane coupling agent is added to the adhesive mainly composed of silicone resin and conductive filler,
The volume resistivity is 3 × 10 −3 Ωcm or less, and the elastic modulus after adhesive curing is 50 MPa or more.
And the said silane coupling agent uses 1 type, or 2 or more types of the silane coupling agent containing an epoxy group or a methacryloxy group, The conductive adhesive characterized by the above-mentioned. 請求項１において，上記シランカップリング剤は，接着剤主体に対して１〜８重量％添加してなることを特徴とする導電性接着剤。2. The conductive adhesive according to claim 1, wherein the silane coupling agent is added in an amount of 1 to 8% by weight with respect to the adhesive main body. 導電回路を設けた基板に導電性接着剤を介して電子部品を接着してなる電子部品搭載装置において，
上記導電性接着剤はシリコーン樹脂と導電性フィラーとからなる接着剤主体に対して，シランカップリング剤を添加してなると共に，
体積抵抗率が３×１０-3Ωｃｍ以下，接着硬化後の弾性率が５０ＭＰａ以上であり，
かつ上記シランカップリング剤は，エポキシ基またはメタクリロキシ基を含有するシランカップリング剤の１種または２種を用いてなることを特徴とする電子部品搭載装置。In an electronic component mounting apparatus in which an electronic component is bonded to a substrate provided with a conductive circuit via a conductive adhesive.
The conductive adhesive is formed by adding a silane coupling agent to an adhesive mainly composed of a silicone resin and a conductive filler,
The volume resistivity is 3 × 10 −3 Ωcm or less, and the elastic modulus after adhesive curing is 50 MPa or more.
And the said silane coupling agent uses 1 type or 2 types of the silane coupling agent containing an epoxy group or a methacryloxy group, The electronic component mounting apparatus characterized by the above-mentioned. 請求項３において，上記シランカップリング剤は，接着剤主体に対して１〜８重量％添加してなることを特徴とする電子部品搭載装置。4. The electronic component mounting apparatus according to claim 3, wherein the silane coupling agent is added in an amount of 1 to 8% by weight with respect to the adhesive main body.
JP17190596A 1996-06-10 1996-06-10 Conductive adhesive and electronic component mounting apparatus Expired - Lifetime JP3791053B2 (en)

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