JP3779417B2 - Electronic component having a film resistor - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component having a film resistor.
[0002]
[Prior art]
Conventionally, a chip resistor X shown in FIG. 6 is well known as an electronic component having a film resistor. In order to obtain a desired resistance value, the chip resistor X performs laser trimming on a film resistor formed on a substrate in a pre-process of chip break.
[0003]
The manufacturing process of the conventional chip resistor X will be briefly described with reference to FIGS.
[0004]
First, as shown in FIG. 7 (a), vertical and horizontal break grooves 200 and 300 are provided in a lattice shape on an insulating substrate 100 made of ceramics to form a large number of unit regions 110, and then straddle the vertical break grooves 200. Then, the side electrode 400 for each unit region 110 is printed and fired (FIG. 7B).
[0005]
Next, as shown in FIG. 7 (c), in each unit region 110, a thick film-like resistor 500 is printed and fired so as to bridge the opposing side electrodes 400, 400, and a post-process is performed. In order to prevent the film resistor 500 from being scattered or oxidized at the time of laser trimming, the primary glass coat 600 is printed and baked so as to cover the trimming portion, as shown in FIG. 8 (d). In order to obtain the resistance value, the starting point of the laser is set at the horizontal break groove 300, and the trimming is started in the transverse direction of the film resistor 500 by moving in the direction of the vertical break groove 200. Trimming is performed in the direction of the break groove 300. 700 is a trimming portion.
[0006]
After that, in order to protect the trimmed film resistor 500, a secondary and tertiary protective glass coat 800 is applied if necessary (FIG. 8 (e)), and breaks along the vertical and horizontal break grooves 200,300. Thus, the chip resistor X shown in FIG. 6 is obtained. 6 and 8, reference numeral 750 denotes a trimming start end, and such trimming start end 750 is normally formed in the horizontal break groove 300 as shown in FIGS. 9 (a) and 9 (b).
[0007]
This is because it is difficult to accurately determine the laser trimming start position, and an error of about 10 μm is inevitably generated. Therefore, if the trimming start end 750 is taken in the vicinity of the film-like resistor 500, the trimming operation is already performed. This is because the trimming start end 750 is formed in the adjacent film-shaped resistor 500 whose resistance value has been corrected and the film-shaped resistor 500 may be cut off. Therefore, in order to prevent this, the trimming start end 750 needs to be positioned as far as possible from the film resistor 500.
[0008]
9A shows an example in which trimming is sequentially performed in the horizontal direction or the vertical direction for each unit region 110 of each column on the insulating substrate 100, and FIG. 9B shows a common trimming start end 750. In this example, trimming is performed for each of two adjacent unit regions 110 via the horizontal break groove 300. In any case, the trimming start end 750 is located on the horizontal break groove 300 for the reasons described above.
[0009]
[Problems to be solved by the invention]
However, in the conventional trimming described above, the side edge of the insulating substrate 100 and the side edges of the insulating substrate 100 are applied after the secondary and tertiary protective glass coats 800 are applied in order to obtain the trimming start end 750 in the lateral break groove 300 (see FIG. 9). In many cases, laser marks remained in the vicinity (see FIG. 6).
[0010]
Therefore, chipping or cracking of the protective glass coat 800 from the laser mark due to stress during chip breakage occurs, or the laser mark acts like a tunnel and the inside of the protective glass coat 800 communicates with the outside air. There has been a problem that the wettability is reduced, or the plating solution penetrates from the laser mark, and the plating adheres and grows as it is, resulting in an abnormal resistance value.
[0011]
An object of this invention is to provide the electronic component which has a film-like resistor which can solve the said subject.
[0012]
[Means for Solving the Problems]
Therefore, in order to solve the above problems, in the first aspect of the present invention, in the resistor forming region on insulation substrate, a resistor paste was printed and baked so as to leave the unformed portions of the film shaped resistor, In an electronic component having a film resistor in which a trimming start end for correcting a resistance value is provided in the non-formed portion and the resistance value is corrected by laser trimming, the non-formed portion is on the long side of the film resistor It was decided that it was formed as a concave cutout portion cut into a triangular shape.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
The present invention prints a resistor paste so that an unformed portion of a film resistor remains in a resistor forming region on an insulating substrate in an electronic component having a film resistor that performs resistance correction by laser trimming. Baking is performed, and a trimming start end for correcting a resistance value is provided in the unformed portion.
[0016]
Normally, trimming is performed with a laser, but in the present invention, the trimming start end is set in the resistor formation region on the insulating substrate. There is no exposure.
[0017]
Therefore, it is possible to prevent problems such as moisture entering the resistor portion from the laser mark, plating solution intruding, or chipping or cracking of the glass coat.
[0018]
Further, since there is no trimming start end in the break groove formed in the insulating substrate, chip break can be performed accurately, and the occurrence of break failure due to the trimming start end can be prevented.
[0019]
The unformed portion is formed in advance when the resistance paste is screen-printed. In particular, in the present invention, a concave notch portion that is notched in a triangular shape is formed on the long side of the film resistor .
[0021]
【Example】
Embodiments of the present invention will be specifically described below with reference to the drawings.
[0022]
FIG. 1 is a perspective view of a chip resistor A as an electronic component having a film resistor according to this embodiment. Side electrodes 2,2 are provided on opposite short sides of a rectangular chip substrate 1, A film resistor 3 is bridged between the electrodes 2 and 2. Further, the film resistor 3 is subjected to laser trimming for correcting the resistance value to a desired value. 4 is a trimming part, 5 is a primary glass coat, and 6 is a resistor protecting glass coat.
[0023]
According to the present invention, in the chip resistor A, the resistor paste is printed and fired so that the unformed portion 7 of the film resistor 3 remains in the resistor forming region 12 on the chip substrate 1. The feature is that a trimming start end for correcting the resistance value is provided in the portion 7.
[0024]
Here, the manufacturing process of the chip resistor A will be described with reference to FIGS.
[0025]
When manufacturing the chip resistor A, as shown in FIG. 2 (a), vertical and horizontal break grooves 8 and 9 are provided in a lattice shape on a large insulating substrate 10 made of ceramics. A large number of unit regions 11 are partitioned.
[0026]
Then, as shown in FIG. 2B, the side electrodes 2 and 2 for each unit region 11 are printed and fired so as to straddle the vertical break grooves 8.
[0027]
Next, as shown in FIG. 2 (c), the film resistance on the chip substrate 1 is bridged between the opposing side electrodes 2 and 2 in the resistor forming region 12 in each unit region 11. The body 3 is printed and fired. At this time, the resistor paste is screen-printed so that an unformed portion 7 of the film-like resistor 3 remains, and then fired. The unformed portion 7 in the present embodiment is formed as a rectangular concave cutout on the long side of the film resistor 3.
[0028]
Thereafter, in order to prevent the film resistor 3 from being scattered or oxidized during the laser trimming in the subsequent process, the primary glass coat 5 is printed and baked so as to cover the trimming position, as shown in FIG. In order to obtain a desired resistance value, the starting point 40 of the laser serving as the trimming start point is taken in the unformed portion 7 of the film-shaped resistor 3, and the film-shaped resistor 3 is moved in parallel along the vertical break groove 8 direction. Trimming is started so as to cross, and further, in the fine adjustment stage of the resistance value, the trimming is performed by moving parallel to the horizontal break groove 9 direction.
[0029]
Thereafter, as shown in FIG. 3 (d), a secondary resistor protective glass coat 6 is applied to protect the trimmed film resistor 3 as required (FIG. 3 (e)). Then, the chip resistors A shown in FIG. 1 are obtained by breaking along the vertical and horizontal break grooves 8 and 9 into chips.
[0030]
As described above, in this embodiment, the resistor paste is printed and baked so that the unformed portion 7 of the film resistor 3 remains in the resistor forming region 12 on the chip substrate 1. Since the inside of the concave notch to be formed is trimmed for correcting the resistance value with the laser starting point 40, when the chip break is performed after the resistor protecting glass coat 6 is applied, there is a laser mark in the lateral break groove 9. Therefore, it is possible to prevent the occurrence of chipping or cracking of each glass coat 6 from the laser mark due to stress at the time of breakage, and when plating the side electrodes 2 and 2, the plating solution is glass from the laser mark. There is no risk of entering the coat 6 and adhering to the film-like resistor 3 or causing an abnormal resistance value due to the ingress of water.
[0031]
In the present embodiment, the non-formed portion 7 of the film resistor 3 has been described as a rectangular concave notch formed on the long side of the film resistor 3, but as a modification thereof, FIG. The shape shown can also be used.
[0032]
That is, the one shown in FIG. 4 (a) is a semicircular concave notch.
[0033]
4 (b) shows a concave notch formed by cutting out a rectangular shape from the middle to the short side of the long side of the membrane resistor 3. FIG.
[0034]
In addition, what is shown in FIG. 4 (c) is an arch-shaped concave notch.
[0035]
In addition, what is shown in FIG. 4 (d) is a concave notch formed by notching a triangular shape on the long side of the film-like resistor 3, and forming this in a dot-like shape on the corresponding side. is doing. Note that the present invention is not limited to this case, and the concave notch portions shown in FIGS. 4A to 4C can also be formed on opposite sides. In that case, it is desirable to form it at a point target or a line target position.
[0036]
FIG. 5 shows another embodiment of the non-formed portion 7 of the film-like resistor 3. Here, the substantially circular perforated portion in which the non-formed portion 7 is provided inside the film-like resistor 3 is shown. It is said. Of course, the shape of the perforated portion is not limited to a circular shape, and various shapes can be adopted.
[0037]
【The invention's effect】
The present invention is implemented in the form as described above, and has the following effects.
[0038]
That is, in an electronic component having a film resistor whose resistance value is corrected by laser trimming, the resistor paste is printed and fired so that an unformed portion of the film resistor remains in the resistor forming region on the insulating substrate. By providing a trimming start end for correcting the resistance value in the non-formed portion, when a chip break is applied after glass coating, there is no laser mark in the break groove, so the laser mark due to stress at the time of the break In addition to preventing the occurrence of chipping and cracking of the glass coat, the plating solution penetrates into the glass coat from the laser marks and adheres to the film resistor when the side electrodes are plated. Or, there is no risk of an abnormal resistance value due to the ingress of water.
[Brief description of the drawings]
FIG. 1 is a perspective view of a chip resistor as an electronic component including a film resistor according to an embodiment.
FIG. 2 is an explanatory view showing the first half of the manufacturing process of the chip resistor.
FIG. 3 is an explanatory view showing the latter half of the manufacturing process of the chip resistor.
FIG. 4 is an explanatory view showing a modification of the film resistor according to the embodiment.
FIG. 5 is an explanatory view showing another embodiment of the film resistor.
FIG. 6 is a perspective view of a conventional chip resistor.
FIG. 7 is an explanatory view showing the first half of the manufacturing process of the conventional chip resistor.
FIG. 8 is an explanatory view showing the latter half of the manufacturing process of the conventional chip resistor.
FIG. 9 is an explanatory view showing a resistor trimming method of the conventional chip resistor.
[Explanation of symbols]
A Chip resistor 1 Chip substrate 3 Film resistor 4 Trimming part 7 Unformed part
10 Insulating substrate
12 Resistor formation region
40 Trimming start (laser start point)

Claims (1)

A resistor forming region on insulated substrate, film-like unformed portions remain as resistor paste of the resistor was printed and baked, said trimming start for resistance correction in the non-forming portion provided laser In an electronic component having a film resistor whose resistance value has been corrected by trimming,
An electronic component having a film resistor , wherein the non-formed portion is formed as a concave cutout formed in a triangular shape on the long side of the film resistor.

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