JP3765726B2 - Substrate processing liquid supply mechanism - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to various semiconductor wafers, glass substrates for liquid crystal display devices, plasma display panel (PDP) substrates, glass substrates and ceramic substrates for magnetic disks, or resin substrates for optical or magneto-optical disks. The present invention relates to a substrate processing liquid supply mechanism for supplying a processing liquid to the substrate.
[0002]
[Prior art]
In the manufacturing process of a semiconductor device or a liquid crystal display device, by supplying a processing liquid to a substrate to be processed such as a semiconductor wafer or a glass substrate for a liquid crystal display device, the surface of the substrate to be processed or a thin film formed on the surface is applied. The process of performing a process is included. For example, some substrate processing apparatuses for processing a semiconductor wafer supply a processing liquid from a discharge nozzle to the front surface and / or back surface of the semiconductor wafer held by a spin chuck.
[0003]
FIG. 2 is a diagram illustrating an example of a configuration for supplying the processing liquid to the discharge nozzle. A processing liquid to be supplied to the discharge nozzle (semiconductor wafer) is stored in the processing liquid tank 100. A processing liquid supply path 101 for supplying the processing liquid toward the discharge nozzle extends from the processing liquid tank 100, and air for starting / stopping the supply of the processing liquid is supplied to the processing liquid supply path 101. A valve 102 is interposed. The inside of the processing liquid tank 100 is pressurized with, for example, an inert gas such as nitrogen, and the supply of the processing liquid to the discharge nozzle can be started or stopped by opening and closing the air valve 102.
[0004]
[Problems to be solved by the invention]
However, when the air valve 102 is closed and the supply of the processing liquid is stopped, the pressure (liquid pressure) of the processing liquid in the processing liquid tank 100 is always directly applied to the air valve 102, There is a risk of causing a crack in the seal portion in the air valve 102. When the seal portion in the air valve 102 is cracked in this way, the sealing performance when the air valve 102 is closed is impaired (seal failure), so that the air valve 102 is closed. In some cases, the processing liquid circulates in the processing liquid supply path 101 and the processing liquid leaks from the discharge nozzle. Further, even if there is no crack in the seal portion, even when an unnecessary object is adhered to the seal portion, if the liquid pressure by the treatment liquid tank 100 is always directly applied to the air valve 102, the treatment liquid is similarly applied. Leakage can occur.
[0005]
When such an undesired leakage of the processing liquid occurs, the leaked processing liquid adheres to the semiconductor wafer after processing, and processing of the thin film formed on the semiconductor wafer (for example, etching processing, resist liquid coating processing, or There is a risk that inconveniences such as excessive development processing may occur. SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a substrate processing liquid supply mechanism that solves the above technical problems and can reliably prevent liquid leakage when the supply of processing liquid is stopped.
[0006]
[Means for Solving the Problems]
In order to achieve the above object, a first aspect of the present invention is directed to a processing liquid supply path connected to a processing liquid supply source for supplying a processing liquid for processing a substrate to the substrate, and the processing liquid. A first valve provided in the supply path and capable of switching between an open state permitting the flow of the processing liquid and a closed state blocking the flow of the processing liquid, and the processing liquid supply of the processing liquid supply path A second valve interposed between the source and the first valve and provided to be switchable between an open state permitting the flow of the processing liquid and a closed state blocking the flow of the processing liquid; When the supply of the treated liquid is stopped, switching of the open / close state of the first valve and the second valve is controlled so that the first valve is closed after the second valve is closed, and the substrate is supplied to the substrate. When the supply of the treatment liquid is started, As the second valve is opened after the blanking is opened, a substrate processing liquid supply mechanism which comprises a control unit for controlling the switching of the opening and closing state of the first valve and the second valve, the.
[0007]
According to this configuration, the processing liquid supply path is interposed from the side closer to the processing liquid supply source in the order of the second valve to the first valve, and when stopping the supply of the processing liquid to the substrate, After closing the second valve on the side closer to the processing liquid supply source (upstream with respect to the direction of flow of the processing liquid), the first valve on the side farther from the processing liquid supply source (downstream with respect to the direction of flow of the processing liquid) Is to be closed. According to this, first, the second valve is closed, and the section downstream of the second valve (the section including the first valve) is isolated from the processing liquid supply source, and then the first valve is closed. As a result, the supply of the processing liquid to the substrate is stopped.
[0008]
Therefore, while the supply of the processing liquid to the substrate is stopped, the processing liquid in the processing liquid supply path between the first valve and the second valve has almost no liquid pressure left by the processing liquid supply source. The hydraulic pressure can be kept low. For this reason, the burden due to the hydraulic pressure on the first valve provided on the downstream side with respect to the flow direction of the processing liquid is reduced, and as a result, the occurrence of cracks in the seal portion of the first valve can be suppressed and the life can be extended. . Even if a crack occurs in the seal portion in the first valve on the downstream side, the crack can be prevented from spreading due to the liquid pressure of the processing liquid in the processing liquid supply path, and the supply of the processing liquid is stopped. The liquid leakage at the time can be surely prevented. Further, even if an unnecessary object is attached to the seal portion in the first valve, similarly, the leakage of the processing liquid can be reliably prevented.
Further, when the supply of the processing liquid to the substrate is started, the second valve is opened after the first valve is opened. In this case, the influence of the liquid pressure on the seal portion in the first valve can be almost eliminated even when the discharge of the processing liquid is started. As a result, the life of the first valve can be further extended.
[0009]
The control unit may be anything that closes the first valve after closing the second valve when stopping the supply of the processing liquid to the substrate. For example, specifically, After a signal for closing the second valve (hereinafter referred to as a closing signal) is output to the second valve, the first closing signal is output after a predetermined time has elapsed (for example, after 0.1 to 2.0 seconds). It may be a control unit that outputs toward the valve. Alternatively, after the closing signal is output toward the second valve, the confirmation signal indicating that the second valve is closed is received from the second valve, and then the closing signal is output toward the first valve. It may be a control unit.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a system diagram showing a configuration of a substrate processing liquid supply mechanism according to an embodiment of the present invention. This substrate processing liquid supply mechanism 1 is applied to a substrate processing apparatus for performing an etching process, a cleaning process, etc. on a substrate, and supplies a processing liquid to a wafer W through a nozzle 3 disposed in the processing chamber 2. It is a mechanism to do.
[0011]
In the processing chamber 2, a spin chuck (not shown) for holding a wafer W, which is a substrate to be processed, horizontally is provided. The nozzle 3 is provided so as to discharge the processing liquid supplied by the substrate processing liquid supply mechanism 1 toward the upper surface of the wafer W held by the spin chuck. Examples of the treatment liquid include chemicals such as hydrofluoric acid and ammonia, and pure water.
[0012]
The substrate processing liquid supply mechanism 1 includes a processing liquid tank 4 for storing a processing liquid to be supplied to the wafer W, and a processing liquid supply pipe 5 extending from the processing liquid tank 4. The tip of the processing liquid supply pipe 5 is connected to the nozzle 3. A pump 6 for pumping out the processing liquid in the processing liquid tank 4 and pumping it is interposed in the processing liquid supply pipe 5. In this embodiment, the processing liquid tank 4 and the pump 6 constitute a processing liquid supply source.
[0013]
The treatment liquid supply pipe 5 is provided with a second discharge valve 8 on the downstream side of the pump 6 with respect to the flow direction of the treatment liquid and a first discharge valve 7 on the downstream side thereof in series. Yes. The discharge valves 7 and 8 are constituted by, for example, air valves, and are opened to permit the flow of the processing liquid and closed to prevent the processing liquid from flowing by a seal portion (not shown) provided inside. It is possible to switch to the state.
[0014]
Further, a controller 9 that can control switching of the open / close state of these discharge valves 7 and 8 is provided. The controller 9 opens and closes the discharge valves 7 and 8 by outputting an opening signal or a closing signal to each of the discharge valves 7 and 8.
[0015]
Therefore, in a state where the pump 6 is driven, the controller 9 sends an opening signal to the discharge valves 7 and 8, and controls both the discharge valves 7 and 8 to be in the open state, whereby the process of being pumped by the pump 6. The liquid can be discharged from the nozzle 3 toward the wafer W. Further, the controller 9 sends a closing signal to the discharge valves 7 and 8 to control both the discharge valves 7 and 8 to be closed, thereby stopping the discharge of the processing liquid from the nozzle 3 to the wafer W. be able to.
[0016]
When starting the processing of the wafer W, first, the pump 6 starts to be driven in a state where both the discharge valves 7 and 8 are closed. Then, after the liquid pressure in the processing liquid supply pipe 5 becomes constant, an opening signal is sent by the controller 9 to open the second discharge valve 8 to the first discharge valve 7 in this order. As a result, the processing liquid stored in the processing liquid tank 4 is supplied to the nozzle 3 through the processing liquid supply pipe 5 and discharged from the nozzle 3 toward the wafer W.
[0017]
When stopping the discharge of the processing liquid from the nozzle 3, a closing signal is sent by the controller 9 from the state in which the discharge valves 7 and 8 are both open, and the first discharge is sent from the second discharge valve 8. The valves 7 are closed in this order. Specifically, the controller 9 outputs the closing signal to the second discharge valve 8 and then outputs the closing signal to the first after a predetermined time (for example, 0.1 to 2.0 seconds). Output to the discharge valve 7. Thereby, the distribution of the processing liquid in the processing liquid supply pipe 5 is prevented, and the discharge of the processing liquid from the nozzle 3 is stopped.
[0018]
As described above, according to the present embodiment, the processing liquid supply pipe 5 is provided with the discharge valves 7 and 8 for controlling the supply and stop of the processing liquid to the wafer W. When the supply of the processing liquid is stopped, the controller 9 closes the second discharge valve 8 and then closes the first discharge valve 7.
[0019]
Therefore, while the supply of the processing liquid to the wafer W is stopped, the liquid pressure in the processing liquid supply pipe 5 between the discharge valves 7 and 8 can be kept low. The burden on the valve 7 is reduced, and as a result, the life of the first discharge valve 7 can be extended. Moreover, even if a crack occurs in the seal portion in the first discharge valve 7, the crack can be prevented from spreading due to the liquid pressure in the processing liquid supply pipe 5, and the liquid at the time of stopping the supply of the processing liquid can be prevented. Leakage can be reliably prevented. Moreover, even if an unnecessary object adheres to the seal portion in the first discharge valve 7, similarly, the leakage of the processing liquid can be reliably prevented.
[0020]
Although description of embodiment of this invention is as above, this invention is not limited to said embodiment. For example, in the above embodiment, when stopping the discharge of the processing liquid from the nozzle 3, the controller 9 outputs the closing signal toward the second discharging valve 8 and then closes after a predetermined time has elapsed. By outputting a signal toward the first discharge valve 7, these valves are closed in the order of the second discharge valve to the first discharge valve 7. However, the present invention is not limited to this. For example, after a closing signal is output to the second discharge valve 8, a confirmation signal indicating that the second discharge valve 8 is closed is received from the second discharge valve 8. After that, by outputting a closing signal toward the first discharge valve 7, these valves may be closed in order from the second discharge valve 8 to the first discharge valve 7. As a result, the second discharge valve 8 and the first discharge valve 7 can be reliably closed in this order.
[0021]
In the above embodiment, when the discharge valves 7 and 8 are opened, the controller 9 opens the second discharge valve 8 and the first discharge valve 7 in this order. , 8 may be opened simultaneously. Alternatively, contrary to the above-described embodiment, the first discharge valve 7 may be opened in the order of the second discharge valve 8, and in this case, the first discharge valve 7 is also used at the start of the discharge of the processing liquid. The influence of the hydraulic pressure on the inner seal portion can be almost eliminated, and the life of the first discharge valve can be further extended.
[0022]
Further, in the above embodiment, the discharge valves 7 and 8 are constituted by air valves that are driven to open and close by air, but may be constituted by electromagnetic valves that are driven to open and close by electromagnetic force. It may be a manual valve that is manually opened and closed.
[0023]
Further, in the above embodiment, the pump 6 is interposed in the processing liquid supply pipe 5 in order to send out the processing liquid in the processing liquid tank 4, but the processing liquid is sent out by this pump 6. Instead of the configuration, the processing liquid tank 4 is sealed, and an inert gas such as nitrogen is supplied into the processing liquid tank 4 to pressurize the processing liquid tank 4, so that the processing liquid is supplied from the processing liquid tank. It is good also as a structure to send out.
[0024]
Furthermore, in the above embodiment, the case where the substrate processing liquid supply mechanism according to the present invention is applied to an apparatus for supplying a processing liquid to a semiconductor wafer and processing it has been described. However, the substrate processing liquid supply mechanism according to the present invention includes a semiconductor wafer, a glass substrate for a liquid crystal display device, a PDP (plasma display panel) substrate, a glass substrate or ceramic substrate for a magnetic disk, or an optical or magneto-optical disk. The present invention can also be applied to an apparatus for processing various substrates such as a resin substrate.
[0025]
In addition, various design changes can be made within the scope of the technical matters described in the claims.
[0026]
【The invention's effect】
As described above in detail, according to the substrate processing liquid supply mechanism of the invention according to claim 1, the processing liquid between the first valve and the second valve in the processing liquid supply path depends on the processing liquid supply source. Since almost no liquid pressure remains, there is an effect that liquid leakage can be reliably prevented when supply of the processing liquid is stopped.
[Brief description of the drawings]
FIG. 1 is a system diagram showing a configuration of a substrate processing liquid supply mechanism according to an embodiment of the present invention.
FIG. 2 is a system diagram showing an example of a mechanism for supplying a processing liquid according to a conventional technique to a substrate.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Substrate processing liquid supply mechanism 2 Processing chamber 3 Nozzle 4 Processing liquid tank (processing liquid supply source)
5 Treatment liquid supply pipe (treatment liquid supply path)
6 Pump (Processing liquid supply source)
7 First discharge valve (first valve)
8 Second discharge valve (second valve)
9 Controller (control unit)
W wafer

Claims (1)

A processing liquid supply path connected to a processing liquid supply source for supplying the substrate with a processing liquid for processing the substrate;
A first valve provided in the processing liquid supply path and provided to be switchable between an open state allowing the flow of the processing liquid and a closed state blocking the flow of the processing liquid;
The treatment liquid supply path is interposed between the treatment liquid supply source and the first valve, and is provided so as to be switchable between an open state that permits the flow of the treatment liquid and a closed state that blocks the flow of the treatment liquid. A second valve,
Controlling the switching of the opening and closing states of the first valve and the second valve so that the first valve is closed after the second valve is closed when the supply of the processing liquid to the substrate is stopped ;
A control unit that controls switching of the open / close state of the first valve and the second valve so that the second valve is opened after the first valve is opened when starting the supply of the processing liquid to the substrate ;
A substrate processing liquid supply mechanism comprising:

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