JP3682019B2 - Resin sealing device and resin sealing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention is a resin sealing method in which a substrate is set in a mold in order to seal a member such as a semiconductor mounted on the substrate by compression molding a powdery resin put into the resin molding die. The present invention relates to an apparatus and a resin sealing method.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, there is a resin sealing method in which a predetermined amount of resin is put into a mold in advance and then compression molding is performed on a semiconductor element on a substrate, thereby achieving casting with high accuracy of the resin amount. As shown in FIG. 5, such a resin sealing method generally includes a fixed upper mold 1, a frame-shaped mold 2 that moves up and down by a drive unit 3, and a frame-shaped mold by a drive unit 5. Using a resin molding die constituted by a compression die 4 that moves up and down in 2 is performed as follows.
[0003]
That is, the fixed upper mold 1, the frame-shaped mold 2, and the compression mold 4 are preheated (preheated) to a predetermined temperature by a heater (not shown). Then, after the resin 7 molded in a tablet shape is put into the cavity formed by the frame-shaped mold 2 and the compression mold 4, the substrate 6 on which the semiconductor element 8 is mounted and electrically connected is mounted on the frame. Set on the mold 2. And the board | substrate 6 is inserted | pinched by raising the frame-shaped metal mold | die 2 with respect to the fixed upper metal mold | die 1. FIG. Further, the resin 7 heated and melted is crushed in the direction of the substrate 6 by raising the compression mold 4 and filled in the cavity to perform resin molding.
[0004]
[Problems to be solved by the invention]
By the way, when compression molding of the substrate 6 using the resin molding die as described above is performed, when the substrate 6 is supplied to the frame-shaped mold 2, the preheated frame-shaped mold 2 and the compression mold are used. The substrate 6 is heated by the heat of 4. For this reason, as shown in FIG. 6, the substrate 6 may be warped downward, or as shown in FIG. 7, the substrate 6 may be warped upward.
[0005]
In this way, when the substrate 6 is warped, as shown in FIG. 8, if the resin sealing is performed as it is, the substrate 6 is sealed in a deformed state, and the substrate is molded in the molded resin. 6 and the position of the semiconductor element 8 mounted on the substrate 6 will vary. This means that the thickness of the resin for sealing the semiconductor element 8 varies, and there is a possibility that the reliability of the semiconductor element 8 may be reduced and a sealing failure such as the semiconductor element 8 being exposed from the resin may be caused. .
[0006]
Further, when the substrate 6 is sandwiched between the fixed upper mold 1 and the frame-shaped mold 2, even if the substrate 6 is not warped, the heated substrate 6 expands and deforms over time after being sandwiched. In such a case, as shown in FIG. 9, wrinkles occur on the substrate 6 and the same problem as described above occurs.
[0007]
The present invention has been proposed in order to solve the above-described problems of the prior art, and the object is to depend on the mold temperature between the time when the substrate is supplied to the mold and the time when compression molding is performed. An object of the present invention is to provide a resin sealing device capable of preventing the substrate from warping and wrinkles. Another object of the present invention is to provide a resin sealing method capable of producing a highly reliable molded product by preventing the substrate from warping and wrinkles due to the mold temperature.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, the invention according to claim 1 is a resin seal in which a substrate on which the member is mounted is set in an upper die that is disposed opposite to a compression die for resin-sealing the member. In the stopper device, a tension part that pulls the substrate in a direction of extending the substrate is provided on a surface of the upper mold facing the compression mold.
[0009]
According to a third aspect of the present invention, there is provided a resin sealing method comprising: setting a substrate on which a member is mounted on an upper mold disposed opposite to a compression mold; and pulling the substrate in a direction in which the substrate extends. A resin is compression-molded with respect to the member mounted on the substrate by the compression mold.
[0010]
In the inventions according to claims 1 and 3 as described above, since the substrate can be stretched by pulling from the time when the substrate is set to the upper die until the compression molding is performed, even if heated by the die. The occurrence of warping and wrinkles of the substrate is prevented.
[0011]
According to a second aspect of the present invention, in the resin sealing device according to the first aspect, a support portion for supporting an end portion of the substrate is provided on a surface of the upper mold facing the compression mold. Features. In the invention according to the second aspect as described above, the supporting portion that supports the end portion of the substrate is prevented from falling off from the upper mold.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention (hereinafter referred to as embodiments) will be specifically described with reference to the drawings.
[First Embodiment]
A first embodiment of the present invention will be described with reference to FIGS. In addition, the member corresponding to the member shown by the above-mentioned prior art attaches | subjects the same code | symbol.
[0013]
(Constitution)
First, the configuration of the present embodiment will be described. That is, in the present embodiment, as shown in FIG. 1, a pair of support portions 21 are opposed to a fixed upper mold 1 that is an upper mold described in the claims. Each of the support portions 21 is provided on the fixed upper mold 1 so as to be movable up and down by a support portion drive mechanism 22. The support portion 21 has clamp claws 21 a that support both end portions of the substrate 6 at the lower portion of the fixed upper mold 1.
[0014]
As shown in FIG. 2, the fixed upper mold 1 is provided with positioning pins 23 in the vicinity of the clamp claws 21a. This positioning pin 23 is provided so as to be movable up and down in a vertical cylindrical hole 1a formed in the fixed upper mold 1, and has a tapered pulling portion 23a at its lower end. The tension portion 23 a is exposed from the lower surface of the fixed upper mold 1 and is provided so as to be able to be inserted into a hole 6 a formed in the substrate 6. On the other hand, a stopper 23b is provided at the upper end of the positioning pin 23 to prevent the positioning pin 23 from falling off by contacting the protruding portion 1b formed in the cylindrical hole 1a. Further, the positioning pin 23 is urged downward by a spring 24 provided in the cylindrical hole 1a.
[0015]
(Function)
The operation of the present embodiment as described above is as follows. First, the substrate 6 is supplied to the lower portion of the fixed upper mold 1 by a substrate transport mechanism (not shown). When the support unit drive mechanism 22 is operated to raise the support unit 21, the clamp claw 21 a lifts with the end of the substrate 6 being hooked, so that the substrate 6 is set on the lower surface of the fixed upper mold 1. . At this time, the force applied to the substrate 6 by the clamp claw 21a is such that the substrate 6 set on the fixed upper mold 1 can be freely extended even if it thermally expands.
[0016]
At the same time, the tensile portion 23a of the positioning pin 23 enters the hole 6a provided in the substrate 6 and biases the end of the hole 6a, whereby the substrate 6 is pulled outward (in the direction in which the substrate 6 extends). Then, the substrate 6 is sandwiched by raising the frame-shaped die 2 with respect to the fixed upper die 1, and further, the heated and melted resin 7 is crushed in the direction of the substrate 6 by raising the compression die 4. Then, the resin is molded by filling the cavity.
[0017]
As described above, the heat from the fixed upper mold 1, the frame-shaped mold 2, and the compression mold 4 heated in advance from the time when the substrate 6 is set to the fixed upper mold 1 until the compression molding is performed. The heated substrate 6 extends and the hole 6a moves outward. At the same time, however, the positioning pin 23 is lowered by the urging force of the spring 24, and the taper surface of the tension portion 23a pulls the hole 6a of the substrate 6 further outward, so that the substrate 6 expands. Therefore, warpage of the substrate 6 and generation of wrinkles can be prevented.
[0018]
(effect)
According to the present embodiment as described above, since the substrate 6 can be prevented from warping and wrinkles between the time when the substrate 6 is supplied to the resin molding die and the time when compression molding is performed, the substrate 6 after compression molding is prevented. Alternatively, the position of the semiconductor element 8 mounted on the substrate 6 becomes uniform, the reliability of the semiconductor element 8 is improved, and sealing defects such as the semiconductor element 8 being exposed from the resin can be prevented. In particular, since the structure of the positioning pin 23 is simple, there are few failures and the manufacturing cost can be kept low.
[0019]
[Second Embodiment]
Next, a second embodiment of the present invention will be described with reference to FIG. In addition, the member corresponding to the member shown by the above-mentioned prior art attaches | subjects the same code | symbol.
[0020]
(Constitution)
First, the configuration of the present embodiment will be described. That is, in the present embodiment, as shown in FIG. 3, a plurality of vent holes 10 and rails 11 are provided on the lower surface of the fixed upper mold 1. The air holes 10 merge into flow paths 10a formed inside the fixed upper mold 1, and the flow paths 10a are connected to a suction mechanism (not shown). The rail 11 is a support portion that supports the rail 6 along both ends thereof.
[0021]
(Function and effect)
The operational effects of the present embodiment as described above are as follows. First, the substrate 6 is supplied to the lower portion of the fixed upper mold 1 by a substrate transport mechanism (not shown), and the end portion of the substrate 6 is supported by the rail 11. Then, the substrate 6 is heated by the heat of the fixed upper mold 1. At this time, the suction mechanism is operated to suck air from the vent hole 10. Adhere to.
[0022]
Then, the substrate 6 is sandwiched by raising the frame-like die 2 with respect to the fixed upper die 1, and the resin 7 is heated and melted by crushing in the direction of the substrate 6 by raising the compression die 4. Resin molding is performed by filling the cavity with the resin 7.
[0023]
As described above, since the substrate 6 is in close contact with the lower surface of the fixed upper mold 1 after the substrate 6 is set in the fixed upper mold 1 until the compression molding is performed, the substrate 6 warps, Can be prevented. Therefore, the reliability of the product can be improved as in the first embodiment. Moreover, since it is not necessary to provide the mechanism part in the fixed upper mold 1, the configuration can be further simplified.
[0024]
[Other Embodiments]
The present invention is not limited to the embodiment as described above. For example, the tip of the positioning pin 23 in the first embodiment is not necessarily tapered, and has an inclined surface that urges the hole 6a in the direction of extending the substrate 6 according to the amount of protrusion. Good. The positioning pin 23 can be moved up and down by a drive source or the like. When the substrate 6 is supplied, the positioning pin 23 is raised to retract the tension portion 23a into the fixed upper mold 1 and is positioned after being supported by the clamp claw 21a. If the pin 23 is lowered and the pulling portion 23a is protruded and inserted into the hole 6a, the pulling portion 23a does not interfere with the supply of the substrate 6, and the setting operation becomes smooth. After the preheating of the substrate 6, the positioning pins 23 may be lowered and extended by the pulling portion 23a.
[0025]
Further, as shown in FIG. 4, the support portion 21 in the first embodiment is provided with a variable angle, and the clamp claw 21a is formed so as to engage with the hole 6b of the substrate 6, whereby the frame-shaped mold 2 side. The support portion 21 may be inclined when it contacts the inclined surface formed so that the clamp claw 21a functions as a tension portion that pulls the hole 6b in the direction in which the substrate 6 extends.
[0026]
Further, according to the present invention, the substrate 6 can be stretched and adsorbed regardless of the stage at which the substrate 6 is heated. For example, when preheating is already performed in the previous process of setting the fixed upper mold 1, when preheating is performed at the same time as setting the fixed upper mold 1, preheating is performed after setting the fixed upper mold 1. In any case, since the substrate 6 is stretched or adsorbed in the state where it is set on the fixed upper mold 1, the occurrence of warpage and wrinkles is prevented. Furthermore, the specific configuration of the tension portion, the suction portion, and the mold is not limited to the above-described embodiment as long as the above-described functions can be exhibited. For example, the tension portion can be configured by a roller, a clamping claw, or the like. Further, the upper mold may be movable without being fixed, and the frame-shaped mold may be fixed without being movable.
[0027]
【The invention's effect】
As described above, according to the present invention, the resin sealing that can prevent the substrate from warping and wrinkles due to the mold temperature between the time when the substrate is supplied to the mold and the time when compression molding is performed. An apparatus can be provided. In addition, according to the present invention, it is possible to provide a resin sealing method capable of manufacturing a highly reliable molded product by preventing the substrate from warping and wrinkles due to the mold temperature.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional view showing a first embodiment of a resin sealing device of the present invention.
FIG. 2 is an enlarged cross-sectional view showing a positioning pin in the embodiment of FIG.
FIG. 3 is a longitudinal sectional view showing a second embodiment of the resin sealing device of the present invention.
FIG. 4 is an enlarged cross-sectional view showing a clamp claw in another embodiment of the resin sealing device of the present invention.
FIG. 5 is a longitudinal sectional view showing a general resin molding die.
6 is a longitudinal sectional view showing a state in which the substrate is warped upward when the substrate is mounted on the resin molding die in FIG. 4;
7 is a longitudinal sectional view showing a state in which the substrate is warped downward when the substrate is installed by the resin molding die in FIG. 4;
8 is a longitudinal sectional view showing a state in which the substrate is warped downward when the substrate is clamped by the resin molding die of FIG. 4;
FIG. 9 is a longitudinal sectional view showing a state in which wrinkles are generated on the substrate when the substrate is held by the resin mold shown in FIG. 4;
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Fixed upper metal mold | die 1a ... Cylindrical hole 1b ... Projection part 2 ... Frame-shaped metal molds 3, 5 ... Drive part 4 ... Compression metal mold 6 ... Substrate 6a, 6b ... Hole 7 ... Resin 8 ... Semiconductor element 10 ... Air vent 10a ... channel 11 ... rail 21 ... support portion 21a ... clamp claw 22 ... support portion drive mechanism 23 ... positioning pin 23a ... tensile portion 23b ... stopper 30 ... resin molding die

Claims (3)

  In a resin sealing device that sets a substrate on which the member is mounted on an upper mold disposed opposite to a compression mold for resin-sealing a member, on the opposing surface of the compression mold in the upper mold, A resin sealing device, wherein a tension portion is provided for pulling the substrate in a direction in which the substrate is stretched. The resin sealing device according to claim 1, wherein a support portion that supports an end portion of the substrate is provided on an opposing surface of the compression mold in the upper mold. A substrate on which a member is mounted is set on an upper die placed opposite to the compression die, and the substrate is pulled in a direction in which the substrate is stretched. A resin sealing method comprising compression molding.

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