JP2003174047A - Device and method for sealing with resin - Google Patents
Device and method for sealing with resinInfo
- Publication number
- JP2003174047A JP2003174047A JP2001370673A JP2001370673A JP2003174047A JP 2003174047 A JP2003174047 A JP 2003174047A JP 2001370673 A JP2001370673 A JP 2001370673A JP 2001370673 A JP2001370673 A JP 2001370673A JP 2003174047 A JP2003174047 A JP 2003174047A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- mold
- resin
- upper mold
- compression
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、樹脂成形金型内へ
投入された粉状樹脂を圧縮成形することによって、基板
に搭載された半導体等の部材の封止を行なうために、基
板を金型にセットする樹脂封止装置及び樹脂封止方法に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for molding a resin such as a semiconductor mounted on a substrate by compression molding a powdery resin charged into a resin molding die to mold the substrate. The present invention relates to a resin sealing device and a resin sealing method set in a mold.
【０００２】[0002]
【従来の技術】従来から、金型内へあらかじめ所定量の
樹脂を投入した後、基板上の半導体素子に対して圧縮成
形することによって、樹脂量の高い精度での注型を図っ
た樹脂封止方法がある。このような樹脂封止方法は、一
般的には、図５に示すように、固定上金型１と、駆動部
３により上下動する枠状金型２と、駆動部５により枠状
金型２内を上下動する圧縮金型４とによって構成された
樹脂成形金型を用いて、以下のように行なわれる。2. Description of the Related Art Conventionally, a predetermined amount of resin is put into a mold in advance, and then compression molding is performed on a semiconductor element on a substrate so that the resin amount can be accurately cast. There is a stop method. In general, such a resin sealing method is, as shown in FIG. 5, a fixed upper mold 1, a frame-shaped mold 2 that moves up and down by a drive unit 3, and a frame-shaped mold by the drive unit 5. Using a resin molding die constituted by the compression die 4 which moves up and down in the inside 2, the following is performed.
【０００３】すなわち、固定上金型１、枠状金型２及び
圧縮金型４は、図示しないヒータによってあらかじめ一
定温度に加熱（プリヒート）されている。そして、枠状
金型２及び圧縮金型４によって形成されたキャビティ内
に、タブレット状に成形した樹脂７を投入した後、半導
体素子８が搭載され電気的な接続がなされた基板６を、
枠状金型２の上にセットする。そして、固定上金型１に
対して、枠状金型２を上昇させることによって基板６を
挟み込む。さらに、加熱溶融した樹脂７を、圧縮金型４
を上昇させることによって基板６方向に押し潰し、キャ
ビティ内に充満させて樹脂成形を行なう。That is, the fixed upper die 1, the frame-shaped die 2 and the compression die 4 are preheated to a constant temperature by a heater (not shown). Then, after the resin 7 molded into a tablet shape is put into the cavity formed by the frame-shaped mold 2 and the compression mold 4, the semiconductor element 8 is mounted and the electrically connected substrate 6 is mounted on the substrate 6.
Set on the frame-shaped mold 2. Then, by raising the frame-shaped mold 2 with respect to the fixed upper mold 1, the substrate 6 is sandwiched. Furthermore, the resin 7 that has been heated and melted is compressed into the compression mold 4.
Are crushed in the direction of the substrate 6 by raising, and the inside of the cavity is filled to perform resin molding.
【０００４】[0004]
【発明が解決しようとする課題】ところで、上記のよう
な樹脂成形金型を用いた基板６の圧縮成形を行なう場合
には、基板６を枠状金型２に供給した時点で、プリヒー
トされた枠状金型２及び圧縮金型４の熱によって、基板
６が加熱される。このため、図６に示すように、基板６
が下側に反り返ったり、図７に示すように、基板６が上
側に反り返ったりする場合がある。By the way, in the case of performing compression molding of the substrate 6 using the resin molding die as described above, it is preheated when the substrate 6 is supplied to the frame-shaped die 2. The substrate 6 is heated by the heat of the frame-shaped mold 2 and the compression mold 4. Therefore, as shown in FIG.
May warp to the lower side, or the substrate 6 may warp to the upper side as shown in FIG. 7.
【０００５】このように、基板６に反り返りが生じた場
合に、図８に示すように、そのまま樹脂封止を行なう
と、基板６が変形した状態で封止されてしまい、成形後
の樹脂内において、基板６や、基板６に搭載された半導
体素子８の位置にばらつきが生じることになる。これは
つまり、半導体素子８を封止する樹脂厚にばらつきが生
じることを意味し、半導体素子８の信頼性低下や、樹脂
から半導体素子８が露出するなどの封止不良を招く可能
性がある。In this way, when the substrate 6 is warped, as shown in FIG. 8, if the resin is directly sealed as shown in FIG. 8, the substrate 6 is sealed in a deformed state, and the inside of the resin after molding is sealed. In the above, the positions of the substrate 6 and the semiconductor element 8 mounted on the substrate 6 vary. This means that the thickness of the resin that seals the semiconductor element 8 varies, and there is a possibility that the reliability of the semiconductor element 8 may deteriorate and that the semiconductor element 8 may be exposed from the resin. .
【０００６】また、固定上金型１と枠状金型２で基板６
を挟む際には、基板６の反り返りが生じていなくても、
挟まれた後の時間経過で加熱された基板６が膨張変形し
た場合には、図９に示すように、基板６に皺が発生し、
上記と同様の問題を生じてしまう。Further, the fixed upper mold 1 and the frame-shaped mold 2 form the substrate 6
When the substrate 6 is sandwiched, even if the substrate 6 is not warped,
When the substrate 6 heated after being sandwiched is expanded and deformed as shown in FIG. 9, wrinkles are generated on the substrate 6,
The same problem as described above will occur.
【０００７】本発明は、上記のような従来技術の問題点
を解決するために提案されたものであり、その目的は、
金型に基板を供給してから圧縮成形するまでの間に、金
型温度による基板の反り返りや皺の発生を防止すること
ができる樹脂封止装置を提供することにある。また、本
発明の他の目的は、金型温度による基板の反り返りや皺
の発生を防止することによって、信頼性の高い成形品を
製造できる樹脂封止方法を提供することにある。The present invention has been proposed to solve the above-mentioned problems of the prior art, and its purpose is to:
It is an object of the present invention to provide a resin sealing device capable of preventing the substrate from warping or wrinkling due to the mold temperature between the time of supplying the substrate to the mold and the time of compression molding. Another object of the present invention is to provide a resin sealing method capable of producing a highly reliable molded product by preventing the substrate from warping or wrinkling due to the mold temperature.
【０００８】[0008]
【課題を解決するための手段】上記のような目的を達成
するため、請求項１記載の発明は、部材を樹脂封止する
ための圧縮金型に対向配置された上部金型に、前記部材
を搭載した基板をセットする樹脂封止装置において、前
記上部金型における前記圧縮金型の対向面に、前記基板
を伸張する方向に引っ張る引張部が設けられていること
を特徴とする。In order to achieve the above-mentioned object, the invention according to claim 1 is characterized in that the above-mentioned member is provided in an upper mold disposed opposite to a compression mold for resin-sealing the member. In a resin sealing device for setting a substrate on which is mounted, a pulling portion for pulling the substrate in a direction of stretching the substrate is provided on a surface of the upper mold facing the compression mold.
【０００９】また、請求項４記載の発明である樹脂封止
方法は、圧縮金型に対向配置された上部金型に、部材を
搭載した基板をセットして、前記基板が伸張する方向に
引っ張り、前記基板に搭載された部材に対して、前記圧
縮金型によって樹脂を圧縮成形することを特徴とする。According to a fourth aspect of the resin sealing method of the present invention, a substrate on which a member is mounted is set in an upper mold which is arranged to face a compression mold, and the substrate is pulled in a direction in which the substrate extends. A resin is compression-molded on the member mounted on the substrate by the compression mold.
【００１０】以上のような請求項１及び４記載の発明で
は、上部金型に基板をセットしてから圧縮成形するまで
の間、基板を引っ張ることによって伸張させることがで
きるので、金型によって加熱されても、基板の反りや皺
の発生が防止される。In the inventions according to claims 1 and 4 as described above, since the substrate can be stretched by pulling it between the setting of the substrate in the upper mold and the compression molding, heating by the mold is performed. Even if this happens, the warp and wrinkles of the substrate are prevented.
【００１１】請求項２記載の発明は、部材を樹脂封止す
るための圧縮金型に対向配置された上部金型に、前記部
材を搭載した基板をセットする樹脂封止装置において、
前記上部金型における前記圧縮金型の対向面に、前記基
板を吸着する吸着部が設けられていることを特徴とす
る。According to a second aspect of the present invention, there is provided a resin sealing device for setting the substrate on which the member is mounted in an upper mold which is arranged to face a compression mold for resin-sealing the member.
A suction portion that suctions the substrate is provided on a surface of the upper mold facing the compression mold.
【００１２】また、請求項５記載の発明である樹脂封止
方法は、圧縮金型に対向配置された上部金型に、部材を
搭載した基板をセットして、前記基板を前記上部金型に
おける前記圧縮金型の対向面に吸着し、前記基板に搭載
された部材に対して、前記圧縮金型によって樹脂を圧縮
成形することを特徴とする。Further, in the resin sealing method according to the invention of claim 5, the substrate on which the member is mounted is set in the upper mold opposite to the compression mold, and the substrate is set in the upper mold. It is characterized in that the resin is adsorbed on the opposing surface of the compression mold and the resin mounted on the substrate is compression-molded by the compression mold.
【００１３】以上のような請求項２及び５記載の発明で
は、上部金型に基板をセットする際から圧縮成形するま
での間、基板を上部金型に吸着して平らにすることがで
きるので、金型によって加熱されても、基板の反りや皺
の発生が防止される。In the inventions according to claims 2 and 5 as described above, the substrate can be attracted to and flattened by the upper mold from the time of setting the substrate in the upper mold to the compression molding. Even if the substrate is heated by the mold, the substrate is prevented from warping or wrinkling.
【００１４】請求項３記載の発明は、請求項１又は請求
項２記載の樹脂封止装置において、前記上部金型におけ
る前記圧縮金型の対向面に、前記基板の端部を支持する
支持部が設けられていることを特徴とする。以上のよう
な請求項３記載の発明では、基板端部を支持する支持部
によって、上部金型からの脱落が防止される。According to a third aspect of the present invention, in the resin sealing device according to the first or second aspect, a supporting portion for supporting an end portion of the substrate on a surface of the upper die facing the compression die. Is provided. In the invention according to the third aspect as described above, the supporting portion supporting the end portion of the substrate prevents the dropping from the upper mold.
【００１５】[0015]
【発明の実施の形態】次に、本発明の実施の形態（以
下、実施形態と呼ぶ）について、図面を参照して具体的
に説明する。
〔第１の実施形態〕まず、請求項１、３、４記載の発明
に対応する実施形態を、図１及び図２を参照して説明す
る。なお、上述の従来技術で示した部材に対応する部材
は、同一の符号を付す。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention (hereinafter referred to as embodiments) will be specifically described with reference to the drawings. [First Embodiment] First, an embodiment corresponding to the invention described in claims 1, 3, and 4 will be described with reference to FIGS. 1 and 2. It should be noted that members corresponding to the members shown in the above-mentioned conventional art are designated by the same reference numerals.
【００１６】（構成）まず、本実施形態の構成を説明す
る。すなわち、本実施形態においては、図１に示すよう
に、請求項に記載の上部金型である固定上金型１に、一
対の支持部２１が対向配置されている。支持部２１は、
それぞれ支持部駆動機構２２によって固定上金型１に昇
降可能に設けられている。そして、支持部２１は、固定
上金型１の下部において、基板６の両端部を支持するク
ランプ爪２１ａを有している。(Structure) First, the structure of this embodiment will be described. That is, in the present embodiment, as shown in FIG. 1, a pair of support portions 21 are arranged opposite to the fixed upper mold 1 which is the upper mold described in the claims. The support portion 21 is
Each of them is provided on the fixed upper die 1 so as to be able to move up and down by a supporting portion drive mechanism 22. The support portion 21 has, under the fixed upper mold 1, clamp claws 21a that support both end portions of the substrate 6.
【００１７】また、図２に示すように、固定上金型１に
は、クランプ爪２１ａの近傍に、位置決めピン２３が設
けられている。この位置決めピン２３は、固定上金型１
に形成された垂直方向の筒穴１ａ内を昇降可能に設けら
れ、その下端にテーパ状の引張部２３ａを有している。
引張部２３ａは、固定上金型１の下面から露出してお
り、基板６に形成された穴６ａに挿通可能に設けられて
いる。一方、位置決めピン２３の上端には、筒穴１ａに
形成された突出部１ｂに当接することにより、位置決め
ピン２３の脱落を防止するストッパ２３ｂが設けられて
いる。さらに、位置決めピン２３は、筒穴１ａ内に設け
られたばね２４によって、下方に付勢されている。Further, as shown in FIG. 2, the fixed upper mold 1 is provided with a positioning pin 23 near the clamp claw 21a. This positioning pin 23 is used for the fixed upper mold 1.
It is provided so as to be capable of moving up and down in the vertical cylindrical hole 1a formed in the vertical direction, and has a tapered pulling portion 23a at its lower end.
The pulling portion 23a is exposed from the lower surface of the fixed upper mold 1 and is provided so as to be inserted into the hole 6a formed in the substrate 6. On the other hand, a stopper 23b is provided at the upper end of the positioning pin 23 to prevent the positioning pin 23 from coming off by coming into contact with the protruding portion 1b formed in the cylindrical hole 1a. Further, the positioning pin 23 is biased downward by a spring 24 provided inside the cylindrical hole 1a.
【００１８】（作用）以上のような本実施形態の作用は
以下の通りである。まず、図示しない基板搬送機構によ
って、固定上金型１の下部に、基板６が供給される。そ
して、支持部駆動機構２２を作動させて支持部２１を上
昇させると、クランプ爪２１ａが基板６の端部を引っ掛
けた状態で持ち上げるので、固定上金型１の下面に基板
６がセットされる。このとき、クランプ爪２１ａによっ
て基板６に加わる力は、固定上金型１にセットされた基
板６が、熱膨張しても自由に延びられる程度とする。(Operation) The operation of this embodiment as described above is as follows. First, the substrate 6 is supplied to the lower part of the fixed upper mold 1 by a substrate transfer mechanism (not shown). Then, when the support portion drive mechanism 22 is operated to raise the support portion 21, the clamp claws 21a lift the end portion of the substrate 6 in a hooked state, so that the substrate 6 is set on the lower surface of the fixed upper mold 1. . At this time, the force applied to the substrate 6 by the clamp claws 21a is set to such an extent that the substrate 6 set in the fixed upper mold 1 can freely extend even if it thermally expands.
【００１９】同時に、基板６に設けられた穴６ａに、位
置決めピン２３の引張部２３ａが入り、穴６ａの端部を
付勢することによって、基板６が外側（基板６が伸張す
る方向）に引っ張られる。そして、固定上金型１に対し
て、枠状金型２を上昇させることによって基板６を挟み
込み、さらに、加熱溶融した樹脂７を、圧縮金型４を上
昇させることによって基板６方向に押し潰し、キャビテ
ィ内に充満させて樹脂成形を行なう。At the same time, the pulling portion 23a of the positioning pin 23 is inserted into the hole 6a provided in the substrate 6, and the end portion of the hole 6a is urged to move the substrate 6 to the outside (the direction in which the substrate 6 extends). Be pulled. Then, the substrate 6 is sandwiched by raising the frame-shaped die 2 with respect to the fixed upper die 1, and the resin 7 that has been heated and melted is further crushed toward the substrate 6 by raising the compression die 4. , The cavity is filled and resin molding is performed.
【００２０】このように、基板６を固定上金型１にセッ
トしてから圧縮成形を行なうまでの間に、あらかじめ加
熱された固定上金型１、枠状金型２及び圧縮金型４から
の熱により加熱された基板６が延びて、その穴６ａが外
側に移動する。しかし、これと同時に、位置決めピン２
３がばね２４の付勢力により下降し、その引張部２３ａ
のテーパ面が基板６の穴６ａをさらに外側に引っ張るの
で、基板６が伸張する。従って、基板６の反りや皺の発
生を防止できる。As described above, from the time when the substrate 6 is set in the fixed upper mold 1 to the time when compression molding is performed, the preheated fixed upper mold 1, frame-shaped mold 2 and compression mold 4 The substrate 6 heated by the heat is extended, and the hole 6a is moved to the outside. However, at the same time, the positioning pin 2
3 is lowered by the urging force of the spring 24, and its pulling portion 23a
Since the tapered surface of 1 pulls the hole 6a of the substrate 6 further outward, the substrate 6 extends. Therefore, it is possible to prevent warpage and wrinkles of the substrate 6.
【００２１】（効果）以上のような本実施形態によれ
ば、基板６を樹脂成形金型に供給してから圧縮成形する
までの間に、基板６の反り返りや皺の発生を防止できる
ので、圧縮成形後の基板６や、基板６に搭載された半導
体素子８の位置が均一となり、半導体素子８の信頼性が
向上して、樹脂から半導体素子８が露出するなどの封止
不良を防止できる。特に、位置決めピン２３の構造は単
純なため、故障が少なく、製造コストを低く抑えること
ができる。(Effects) According to the present embodiment as described above, it is possible to prevent the substrate 6 from warping and wrinkling between the time when the substrate 6 is supplied to the resin molding die and the time when it is compression molded. The positions of the substrate 6 after compression molding and the semiconductor element 8 mounted on the substrate 6 become uniform, the reliability of the semiconductor element 8 is improved, and a sealing failure such as the semiconductor element 8 being exposed from resin can be prevented. . In particular, since the positioning pin 23 has a simple structure, there are few failures and the manufacturing cost can be kept low.
【００２２】〔第２の実施形態〕次に、請求項２、３、
５記載の発明に対応する実施形態を、図３を参照して説
明する。なお、上述の従来技術で示した部材に対応する
部材は、同一の符号を付す。[Second Embodiment] Next, claims 2, 3,
An embodiment corresponding to the invention described in 5 will be described with reference to FIG. It should be noted that members corresponding to the members shown in the above-mentioned conventional art are designated by the same reference numerals.
【００２３】（構成）まず、本実施形態の構成を説明す
る。すなわち、本実施形態においては、図３に示すよう
に、固定上金型１の下面に複数の通気孔１０及びレール
１１が設けられている。通気孔１０は、それぞれ固定上
金型１の内部に形成された流路１０ａに合流し、この流
路１０ａが図示しない吸引機構に接続されている。レー
ル１１は、基板６の両端に沿ってこれを支持する支持部
である。(Structure) First, the structure of the present embodiment will be described. That is, in this embodiment, as shown in FIG. 3, a plurality of ventilation holes 10 and rails 11 are provided on the lower surface of the fixed upper mold 1. The vent holes 10 merge with a flow channel 10a formed inside the fixed upper mold 1, and the flow channel 10a is connected to a suction mechanism (not shown). The rails 11 are support portions that support the board 6 along both ends thereof.
【００２４】（作用効果）以上のような本実施形態の作
用効果は以下の通りである。まず、図示しない基板搬送
機構によって、固定上金型１の下部に基板６が供給さ
れ、レール１１によって基板６の端部が支持される。す
ると、固定上金型１の熱により、基板６が加熱される
が、このときに吸引機構を作動させて、通気孔１０から
空気を吸引することにより、基板６を固定上金型１の下
面に密着させる。(Operational Effects) The operational effects of this embodiment as described above are as follows. First, the substrate 6 is supplied to the lower portion of the fixed upper mold 1 by a substrate transfer mechanism (not shown), and the end of the substrate 6 is supported by the rail 11. Then, the substrate 6 is heated by the heat of the fixed upper mold 1, and at this time, the suction mechanism is operated to suck the air from the ventilation hole 10 to fix the substrate 6 to the lower surface of the fixed upper mold 1. In close contact with.
【００２５】そして、固定上金型１に対して、枠状金型
２を上昇させることによって基板６を挟み込み、圧縮金
型４を上昇させることによって、樹脂７を加熱溶融させ
て基板６方向に押し潰し、キャビティ内に樹脂７を充満
させることによって、樹脂成形を行なう。Then, by raising the frame-shaped die 2 with respect to the fixed upper die 1, the substrate 6 is sandwiched, and by raising the compression die 4, the resin 7 is heated and melted to the substrate 6 direction. Resin molding is performed by crushing and filling the cavity with resin 7.
【００２６】このように、基板６を固定上金型１にセッ
トしてから圧縮成形を行なうまでの間に、基板６が固定
上金型１の下面に密着しているので、基板６が反った
り、皺が発生することを防止できる。従って、上記の第
１の実施形態と同様に、製品の信頼性を高めることがで
きる。また、機構部を固定上金型１に設ける必要がない
ので、より構成を単純化することができる。As described above, since the substrate 6 is in close contact with the lower surface of the fixed upper mold 1 between the setting of the substrate 6 on the fixed upper mold 1 and the compression molding, the substrate 6 is warped. It is possible to prevent wrinkles and wrinkles. Therefore, the reliability of the product can be improved as in the first embodiment. Further, since it is not necessary to provide the mechanism part on the fixed upper mold 1, the structure can be further simplified.
【００２７】〔他の実施形態〕本発明は上記のような実
施形態に限定されるものではない。例えば、第１の実施
形態における位置決めピン２３の先端は、必ずしもテー
パ状とする必要はなく、突出量に応じて基板６を伸張す
る方向に穴６ａを付勢する傾斜面を有していればよい。
駆動源等によって位置決めピン２３を昇降可能に設け、
基板６の供給時には、位置決めピン２３を上昇させて引
張部２３ａを固定上金型１内に退避させておき、クラン
プ爪２１ａによる支持後に、位置決めピン２３を下降さ
せて引張部２３ａを突出させて穴６ａに挿入させるよう
にすれば、引張部２３ａが基板６の供給の邪魔にならず
セット動作がスムーズとなる。基板６のプリヒート後
に、位置決めピン２３を下降させて引張部２３ａによる
伸張を行なってもよい。[Other Embodiments] The present invention is not limited to the above embodiments. For example, the tip of the positioning pin 23 in the first embodiment does not necessarily have to be tapered, and may have an inclined surface that biases the hole 6a in the direction of extending the substrate 6 according to the amount of protrusion. Good.
The positioning pin 23 is provided to be movable up and down by a drive source,
When the substrate 6 is supplied, the positioning pin 23 is raised to retract the tension portion 23a into the upper fixed mold 1, and after the clamp claw 21a is supported, the positioning pin 23 is lowered to project the tension portion 23a. If it is inserted into the hole 6a, the pulling portion 23a does not interfere with the supply of the substrate 6 and the setting operation becomes smooth. After the substrate 6 is preheated, the positioning pin 23 may be lowered to be stretched by the pulling portion 23a.
【００２８】また、図４に示すように、第１の実施形態
における支持部２１を角度可変に設け、クランプ爪２１
ａを基板６の穴６ｂに係合するように形成することによ
って、枠状金型２側に形成された傾斜面に当接した際に
支持部２１が傾斜して、クランプ爪２１ａが穴６ｂを基
板６が伸張する方向に引っ張る引張部として機能するよ
うに構成してもよい。Further, as shown in FIG. 4, the support portion 21 in the first embodiment is provided with a variable angle, and the clamp claw 21 is provided.
By forming a so as to engage with the hole 6b of the substrate 6, the support portion 21 tilts when coming into contact with the tilted surface formed on the frame-shaped mold 2 side, and the clamp claw 21a has the hole 6b. May be configured to function as a pulling portion that pulls in the direction in which the substrate 6 extends.
【００２９】また、本発明によれば、基板６に対する加
熱がどの段階で行なわれるかを問わず、基板６の伸張や
吸着が可能となる。例えば、固定上金型１にセットされ
る前工程で既にプリヒートされている場合、固定上金型
１にセットされると同時にプリヒートされる場合、固定
上金型１にセットされた後にプリヒートされる場合のい
ずれであっても、基板６が固定上金型１へセットされた
状態で、伸張若しくは吸着されているので、反りや皺の
発生が防止される。さらに、引張部、吸着部、金型は、
上述の機能を発揮できるものであれば、その具体的構成
は自由であり、上記の実施形態には限定されない。例え
ば、引張部を、ローラ、挟持爪等によって構成すること
もできる。また、上部金型を固定とせずに可動としても
よく、枠状金型を可動とせずに固定としてもよい。Further, according to the present invention, the substrate 6 can be stretched and adsorbed regardless of at which stage the substrate 6 is heated. For example, in the case where it is already preheated in the previous step of being set in the fixed upper mold 1, when it is preheated at the same time when it is set in the fixed upper mold 1, it is preheated after being set in the fixed upper mold 1. In any case, since the substrate 6 is stretched or adsorbed with the substrate 6 set in the fixed upper mold 1, warpage or wrinkling is prevented. Furthermore, the tension part, the adsorption part, and the mold are
The specific configuration is not limited as long as it can exhibit the above-mentioned functions, and is not limited to the above-described embodiment. For example, the pulling portion can be configured by a roller, a holding claw, or the like. Further, the upper mold may be movable without being fixed, and the frame mold may be fixed without being movable.
【００３０】[0030]
【発明の効果】以上、説明したように、本発明によれ
ば、金型に基板を供給してから圧縮成形するまでの間
に、金型温度による基板の反り返りや皺の発生を防止す
ることができる樹脂封止装置を提供することができる。
また、本発明によれば、金型温度による基板の反り返り
や皺の発生を防止することによって、信頼性の高い成形
品を製造できる樹脂封止方法を提供することができる。As described above, according to the present invention, it is possible to prevent the warp of the substrate and the generation of wrinkles due to the temperature of the mold between the time of supplying the substrate to the mold and the time of compression molding. It is possible to provide a resin sealing device capable of performing the above.
Further, according to the present invention, it is possible to provide a resin sealing method capable of manufacturing a highly reliable molded product by preventing the substrate from warping or wrinkling due to the mold temperature.
【図１】本発明の樹脂封止装置の第１の実施形態を示す
縦断面図である。FIG. 1 is a vertical sectional view showing a first embodiment of a resin sealing device of the present invention.
【図２】図１の実施形態における位置決めピンを示す拡
大断面図である。FIG. 2 is an enlarged cross-sectional view showing a positioning pin in the embodiment of FIG.
【図３】本発明の樹脂封止装置の第２の実施形態を示す
縦断面図である。FIG. 3 is a vertical cross-sectional view showing a second embodiment of the resin sealing device of the present invention.
【図４】本発明の樹脂封止装置の他の実施形態における
クランプ爪を示す拡大断面図である。FIG. 4 is an enlarged sectional view showing a clamp claw in another embodiment of the resin sealing device of the present invention.
【図５】一般的な樹脂成形金型を示す縦断面図である。FIG. 5 is a vertical sectional view showing a general resin molding die.
【図６】図４の樹脂成形金型への基板据付時に、基板が
上方へ反っている状態を示す縦断面図である。6 is a vertical cross-sectional view showing a state where the substrate is warped upward when the substrate is installed in the resin molding die of FIG.
【図７】図４の樹脂成形金型による基板据付時に、基板
が下方へ反っている状態を示す縦断面図である。7 is a vertical cross-sectional view showing a state where the substrate is warped downward when the substrate is installed by the resin molding die shown in FIG.
【図８】図４の樹脂成形金型による基板挟持時に、基板
が下方へ反っている状態を示す縦断面図である。8 is a vertical cross-sectional view showing a state where the substrate is warped downward when the substrate is clamped by the resin molding die of FIG.
【図９】図４の樹脂成形金型による基板挟持時に、基板
に皺が発生している状態を示す縦断面図である。9 is a vertical cross-sectional view showing a state in which wrinkles are generated on the substrate when the substrate is sandwiched by the resin molding die of FIG.
１…固定上金型 １ａ…筒穴 １ｂ…突出部 ２…枠状金型 ３，５…駆動部 ４…圧縮金型 ６…基板 ６ａ，６ｂ…穴 ７…樹脂 ８…半導体素子 １０…通気孔 １０ａ…流路 １１…レール ２１…支持部 ２１ａ…クランプ爪 ２２…支持部駆動機構 ２３…位置決めピン ２３ａ…引張部 ２３ｂ…ストッパ ３０…樹脂成形金型 1 ... Fixed upper mold 1a ... Cylinder hole 1b ... projection 2 ... Frame-shaped mold 3, 5 ... Drive unit 4 ... compression mold 6 ... Substrate 6a, 6b ... holes 7 ... Resin 8 ... Semiconductor element 10 ... Vent 10a ... Channel 11 ... Rail 21 ... Supporting part 21a ... Clamp claw 22 ... Support drive mechanism 23 ... Locating pin 23a ... tensile part 23b ... Stopper 30 ... Resin molding die
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 4F202 AD03 AG03 AH37 CA09 CB01 CB17 CK52 CK75 CL02 CQ01 CQ06 CQ07 4F204 AA36 AH37 FA01 FB01 FB12 FJ14 FJ29 FQ01 5F061 AA01 BA04 CA22 DA01 ─────────────────────────────────────────────────── ─── Continued front page F-term (reference) 4F202 AD03 AG03 AH37 CA09 CB01 CB17 CK52 CK75 CL02 CQ01 CQ06 CQ07 4F204 AA36 AH37 FA01 FB01 FB12 FJ14 FJ29 FQ01 5F061 AA01 BA04 CA22 DA01
Claims (5)
向配置された上部金型に、前記部材を搭載した基板をセ
ットする樹脂封止装置において、 前記上部金型における前記圧縮金型の対向面に、前記基
板を伸張する方向に引っ張る引張部が設けられているこ
とを特徴とする樹脂封止装置。1. A resin sealing device for setting a substrate on which the member is mounted in an upper mold, which is arranged to face a compression mold for resin-sealing a member, wherein the compression mold in the upper mold. 2. A resin encapsulation device, characterized in that a pulling portion for pulling the substrate in the extending direction is provided on the opposing surface of.
向配置された上部金型に、前記部材を搭載した基板をセ
ットする樹脂封止装置において、 前記上部金型における前記圧縮金型の対向面に、前記基
板を吸着する吸着部が設けられていることを特徴とする
樹脂封止装置。2. A resin sealing device for setting a substrate on which the member is mounted in an upper mold which is arranged to face a compression mold for resin-sealing the member, wherein the compression mold in the upper mold. A resin encapsulation device, characterized in that an adsorbing portion for adsorbing the substrate is provided on a surface facing the substrate.
向面に、前記基板の端部を支持する支持部が設けられて
いることを特徴とする請求項１又は請求項２に記載の樹
脂封止装置。3. The resin according to claim 1, wherein a support portion that supports an end portion of the substrate is provided on a surface of the upper die facing the compression die. Sealing device.
部材を搭載した基板をセットして、 前記基板が伸張する方向に引っ張り、 前記基板に搭載された部材に対して、前記圧縮金型によ
って樹脂を圧縮成形することを特徴とする樹脂封止方
法。4. The upper mold, which is arranged to face the compression mold,
A resin sealing method comprising: setting a substrate on which a member is mounted, pulling the substrate in a direction in which the substrate extends, and compression-molding a resin on the member mounted on the substrate by the compression mold.
部材を搭載した基板をセットして、 前記基板を前記上部金型における前記圧縮金型の対向面
に吸着し、 前記基板に搭載された部材に対して、前記圧縮金型によ
って樹脂を圧縮成形することを特徴とする樹脂封止方
法。5. The upper mold, which is arranged to face the compression mold,
A substrate on which a member is mounted is set, the substrate is adsorbed to an opposing surface of the compression mold in the upper mold, and a resin mounted on the substrate is compression-molded by the compression mold. A resin sealing method characterized by the above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001370673A JP3682019B2 (en) | 2001-12-04 | 2001-12-04 | Resin sealing device and resin sealing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001370673A JP3682019B2 (en) | 2001-12-04 | 2001-12-04 | Resin sealing device and resin sealing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003174047A true JP2003174047A (en) | 2003-06-20 |
| JP3682019B2 JP3682019B2 (en) | 2005-08-10 |
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ID=19179858
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001370673A Expired - Fee Related JP3682019B2 (en) | 2001-12-04 | 2001-12-04 | Resin sealing device and resin sealing method |
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| Country | Link |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI495020B (en) * | 2006-05-15 | 2015-08-01 | Sumitomo Heavy Industries | And the drop prevention mechanism of the molded article |
-
2001
- 2001-12-04 JP JP2001370673A patent/JP3682019B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI495020B (en) * | 2006-05-15 | 2015-08-01 | Sumitomo Heavy Industries | And the drop prevention mechanism of the molded article |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3682019B2 (en) | 2005-08-10 |
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