TWI495020B - And the drop prevention mechanism of the molded article - Google Patents

Description

Fall prevention mechanism of molded product

The present invention relates to the technical field of resin sealing devices.

A resin sealing mold for sealing a molded article such as a semiconductor wafer with a resin by a mold has various forms. For example, even in the method of supplying a molded article, the molded article is supplied to the lower mold side, and the molded article is supplied to the upper die side.

Among the above-mentioned conventional techniques, the resin sealing device 1 described in Patent Document 1 is known as a device in which the molded article is supplied to the upper mold side.

In the resin sealing device 1, the air-suction discharge hole 16 and the communication hole 17 are used, and the gas-permeable member 18 allows the sealed front substrate (molded article) 30 supplied to the upper mold 10 to be held on the surface of the upper mold 10 via the suction force. In addition to this, a drop prevention mechanism that can be held by the clamp front member 30 with the clamp member (holding member) 13 interposed therebetween is provided.

The sealed front substrate 30 that is adsorbed and held is supplied with resin, and is sealed with resin when the lower mold 20 abuts on the upper mold 10 . In addition, reference numeral 15 is a sealing member for decompressing and holding the periphery of the front substrate 30 after the upper mold 10 and the lower mold 20 are in contact with each other.

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2005-225133

In the resin sealing device, in order to allow the supplied resin to be uniformly supplied around the semiconductor wafer, voids or the like are not formed, and generally, the periphery of the molded article is depressurized at the time of sealing. Further, in order to allow the input resin to be melted or the like, it is used in a state where the mold is heated (for example, about 180 ° C). At this time, the resin sealing device 1 described in Patent Document 1 is configured such that the power for operating the clamp member 13 that holds the front substrate 30 is passed through the mounting bar 19 and the elastic member 14 that penetrate the vertical direction of the upper die 10. When externally obtained, the mounting rod 19 penetrates through the through portion of the upper mold 10 and requires a seal with good precision. Of course, it must also be heat resistant. As a result, the structure of the upper mold is complicated, and the above-described manufacturing cost is increased, and the pressure reduction reliability is also lowered due to an increase in the sealing portion.

On the other hand, if the above-described drop prevention mechanism (the clamp member 13, the mounting bar 19, and the elastic member 14) is not used, the molded article can be held on the upper mold surface only by the suction force, but it is caused by some reason. When the adsorption cannot be performed satisfactorily, it may cause the expensive molded article (product such as a semiconductor wafer) to fall and be damaged.

Accordingly, an object of the present invention is to provide a fall prevention mechanism that can reliably prevent a molded article from falling down with a simple structure and that does not reduce the reliability of pressure reduction.

The present invention is a fall prevention mechanism for a molded article to be supplied to a mold surface of a resin sealing device. To solve the above problems, the fall prevention mechanism is configured to provide the molded article between the holding position and the liberating position by the movable motion. a holding member that is in a state of being held and released; a fixing pin that supports the above-described holding structure to form the movement with respect to the upper mold; and a power transmission that can directly transmit power for moving the holding member from the lower mold side to the holding member structure.

As described above, the holding member is moved (for example, a repetitive motion) by the power received from the lower mold side, and the reversal motion can cause the molded article to be in a holding state or a liberated state. In other words, the power can be transmitted without passing through the vertical direction of the upper mold. Therefore, it is not necessary to separately provide a sealing member for decompressing the upper mold, and the reliability of pressure reduction at the time of sealing is not lowered. Further, the structure of the upper mold itself is not complicated, and therefore the resin sealing device can be constructed at low cost.

Further, in the above aspect of the invention, the power transmission structure may include: a first acting member that can directly receive power from the outside to move the holding member from the holding position to the liberation position; and the holding member When the second acting member that has moved from the liberation position to the holding position is not transmitted to the first acting member, the holding member is placed at the holding position by the second acting member.

In this way, it is sufficient that the external power required is only one type (one direction) of power (the power that can move the holding member from the holding position to the held position). Therefore, for example, it is possible to simplify the structure of the drop prevention mechanism while the lower die mechanism is to be in contact with the power of the upper mold mechanism.

When the present invention is applied, it is possible to prevent the molded article from falling. In addition, it is not necessary to newly install a sealing member for maintaining the pressure reduction.

[Best Embodiment of the Invention]

Hereinafter, an example of an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

Fig. 1 is a structural diagram of a resin sealing device 100 including a drop preventing mechanism 130 according to an embodiment of the present invention.

The resin sealing device 100 is composed of an upper mold mechanism 101 and a lower mold mechanism 201. The upper mold mechanism 101 and the lower mold mechanism 201 are formed to be contactable and separated from each other by, for example, a pressurizing mechanism (not shown).

The upper mold mechanism 101 is composed of: an upper mold base 120; an upper film 110 fixed to a lower side of the upper mold base 120 (on the side of the lower mold mechanism 201); and a pressure reducing sealing member disposed to surround the upper mold 110 150 is composed. Further, on the side of the lower mold mechanism 201 of the upper mold 110, a fall prevention mechanism 130 (described later in detail) that can prevent the molded article 300 supplied to the surface of the upper mold 110 by a transport mechanism (not shown) from falling down is provided. Further, although not shown, an adsorption hole (adsorption mechanism) capable of adsorbing and holding the molded article 300 is formed on the surface of the upper mold 110 (the surface on the side of the lower mold mechanism 201).

On the other hand, the lower mold mechanism 201 is composed of: a lower mold base 220; a bottom mold 212 fixed to a substantially central portion of the lower mold base 220; disposed around the bottom mold 212 and detachable to the lower mold base 220 A frame mold 214 that moves up and down; and a clamp spring 216 that can move the frame mold 214 up and down. In other words, the frame mold 214 is formed with a through hole through which the bottom mold 212 can pass, and the bottom mold 212 is formed to be movable up and down in a state in which the bottom mold 212 penetrates the through hole. Further, the lower mold 210 is constituted by the bottom mold 212 and the frame mold 214.

Next, the drop prevention mechanism 130 provided in the upper mold 110 will be described with reference to Fig. 2 .

2 is an enlarged view of a part of the falling prevention mechanism 130 of the first drawing, and (A) to (D) are sequential steps of the holding mechanism 130 holding the molded article 300. Further, the position of the holding member 132 shown in the second (A) or second (D) diagram is "holding position (position at which the molded article can be held)", and the second (B) or second (C) The position shown in the figure is "the liberation position (the position of the molded product cannot be maintained)".

The fall prevention mechanism 130 is provided with a holding member 132 that can hold and eject the molded product between the holding position and the liberation position by the reverse rotation, and supports the holding member 132 so as to be rotatable relative to the upper mold 110. A latch (support member) 134; and a power transmission structure 140 that transmits power for rotating the holding member 132. The holding member 132 has a shape in which the first crank portion 132B is formed on the distal end side of the arm portion 132C, and the second crank portion 132D is provided on the rear end side. The more distal end portion of the first crank portion 132B is a claw portion 132A that constitutes the directly held product 300. Further, the rear end side of the second crank portion 132D is configured as a base portion 132E for external power receiving. Further, the holding member 132 is supported and fixed by the fixing pin 134 at the second crank portion 132D so as to be rotatable relative to the upper mold 110.

The power transmission structure 140 includes a first acting member 136 and a second acting member 138. The first acting member 136 is a member that can move the holding member 132 from the holding position to the liberating position. On the other hand, the second acting member 138 is a movable member that can move from the liberated position to the holding position. The component of action. In the present embodiment, the first acting member 136 is a push pin 136A that is partially protruded from the surface of the upper mold 110 (toward the lower mold 210 side); and the first one disposed on the upper portion of the push pin 136A. The elastic body 136B is composed of. The first elastic body 136B abuts against the base portion 132E of the holding member 132 while abutting against the head of the push pin 136A. Further, the elastic modulus of the first elastic body 136B is set to be larger than the elastic modulus of the second elastic body 138 described below (it is difficult to deform). In other words, the push pin 136A, the first elastic body 136B, and the base portion 132E can be configured to transmit the push pin 136 based on the external power (in the present embodiment, the reaction force received from the transport device 400). 132 is rotated from the holding position to the liberation position (rotating in the direction indicated by the arrow symbol B). Further, a second elastic body 138 as a second acting member is disposed on the arm portion 132C of the holding member 132. The second elastic body 138 abuts against the upper mold 110 while abutting against the arm portion 132C of the holding member 132. As a result, the second elastic body 138 is formed to move and relax when the holding member 132 is repeatedly overlapped between the holding position and the liberating position. That is, when the holding member 132 is in the holding position, the second elastic body 138 is in the most relaxed state, and the first acting member 136 is compressed while the holding member 132 is rotated from the holding position to the liberation position. On the other hand, when the transmission of the external force to the first acting member 136 is released, the elastic force of the second elastic body 138 itself can hold the holding member 132 back from the liberation position (rotation in the direction indicated by the arrow A).

Further, as described above, the power transmission structure 140 receives external power from the side of the lower mold mechanism 201 (on the lower mold 210 side), and does not have a member that penetrates the vertical direction of the upper mold 110. As a result, it is not necessary to seal the other through portion, and the reliability of the pressure reduction is not lowered when the inside of the mold is depressurized at the time of sealing.

Further, various elastic members can be used for the elastic member. For example, when rubber is used, it can be inexpensively formed, and when the spring is used, a fall prevention mechanism having high durability can be formed.

Next, the operation of the drop prevention mechanism 130 will be described.

As shown in FIG. 2(A), the molded article 400 conveys and supplies the molded article such as a semiconductor wafer to the surface of the upper mold 110. At this time, the holding member 132 is still in the holding position. In this state, the claw portion 132A becomes an obstacle so that the molded article 300 cannot be received.

Next, as shown in Fig. 2(B), as the transport mechanism 400 is raised again, a portion of the upper portion of the transport mechanism 400 is pushed up to push the latch 136A. With this push-up operation, the holding member 132 is rotated by the push pin 136A, the first elastic body 136B, and the base portion 132E from the holding position to the liberation position (direction indicated by an arrow B). At this time, since the elastic modulus of the first elastic body 136B is set to be larger than the elastic modulus of the second elastic body 138, the force is greater than the strength of the second elastic body 138 to maintain the holding member 132 at the holding position, and therefore The holding member 132 can be moved to the liberation position. Further, even when the elastic coefficients of the first elastic body 136B and the second elastic body 138 are the same, the distance between each elastic body and the fixing pin 134 for rotatably supporting the holding member 132 is transmitted (from the fixing pin 134 to each elastic body) The change in the distance from the position of the connection can still achieve the same effect.

Further, the transport mechanism 400 is continuously raised, but the degree of increase in the transport mechanism 400 is continuously compressed according to the first elastic body 136B (the first elastic body 136B has room for compression).

When the molded article 300 reaches the surface of the upper mold 110, the molded article 300 is adsorbed and held on the surface of the upper mold 110 by an adsorption mechanism (not shown). Then, as shown in the second (D) diagram, when the lowering of the transport mechanism 400 cuts off the power transmission to the push pin 136A, the molded article 300 is maintained in a state of being adsorbed and held on the surface of the upper mold 110, and is located at the liberation position. The holding member 132 is returned to the holding position by the second elastic body 138. In this manner, the molded article 300 can be prevented from falling by the drop preventing mechanism 130 while being held by the suction mechanism.

Further, the vertical movement of the transport mechanism 400 can be configured to receive power from the lower mold mechanism 201, for example, and it is not necessary to separately provide a power source for the transport mechanism 400 to move up and down.

Next, another embodiment of the fall prevention mechanism will be described using Figs. 3 and 4 . Fig. 3 and Fig. 4 are enlarged views of the portion of the fall prevention mechanism. The same or similar parts as those of the drop prevention mechanism 130 shown in FIG. 2 are denoted by the same reference numerals, and the description of the repetitive configuration and function will be omitted.

The fall prevention mechanism 130' shown in FIG. 3 is different from the fall prevention mechanism 130 in that the second elastic body 138 serving as the second acting member is disposed not on the arm portion 132C of the holding member 132 but in the arm portion 132C. Base 132E. Here, the first elastic member 136B and the second elastic body 138 are disposed in the vertical direction with the base portion 132E sandwiching the holding member 132, and the second elastic body 138 abuts against the base portion 132E of the holding member 132 while abutting thereon. Mode 110. As a result, the holding member 132 can be rotated relative to the upper mold 110. When the size or thickness of the upper mold 110 is taken into consideration, the above configuration can be employed.

Next, in the fall prevention mechanism 130" shown in Fig. 4, the holding member 132 does not reciprocately move between the holding position and the liberation position by the rotation, but is formed by the reverse movement formed by the sliding to maintain and liberate the molded article 300. .

The holding member 132 has a claw portion 132A that is held by the molded product 300. Further, a middle portion of the arm portion 132C is formed with a groove 132F which is notched in the oblique direction. A roller 136C provided in the push pin 136A is formed in the groove 132F, and the roller 136C is formed to be rollable along the groove 132F. Further, the push pin 136A and the roller 136C are configured as the first acting member 136. Further, the holding member 132 is supported by the slider (support member) 134 to slide on the upper mold 110. Further, an elastic body 138 serving as a second acting member is abutted on the portion 132C. The elastic body 138 also abuts against the upper mold 110.

In the fall prevention mechanism 130", when the push pin 136A is pushed up by the rise of the transport mechanism 400 (which may be caused by the rise of the transport mechanism 400 itself or by the lower die mechanism 201), the roller 136C may roll. In the groove 132F, a component force in the direction indicated by the arrow symbol A is generated in the holding member. At this time, since the holding member 132 is configured to be slidable in the upper mold 110 by the slider 134, the rise of the push pin 136A causes the holding. The member 132 slides from the holding position to the liberation position. On the other hand, when the conveying mechanism 400 is lowered, the holding member is pushed in the direction indicated by the arrow symbol B due to the elastic force of the elastic body 138, so that the holding member slides back to the holding position. position.

After the molded article 300 is held, the sealing resin is externally introduced, and then the upper mold mechanism 101 and the lower mold mechanism 201 are closed, thereby completing the resin sealing.

Further, the example of the repetitive motion is exemplified by the rotation and the sliding, but the present invention is not limited thereto. For example, the holding member may be repeatedly moved by using a cam or the like.

[Industrial availability]

The present invention can be widely applied to a sealing device that supplies a molded article to an upper mold without a sealing method.

100. . . Resin sealing device

101. . . Upper mold mechanism

110. . . Upper mold

120. . . Upper mold base

130. . . Fall prevention mechanism

132. . . Holding member

132A. . . Claw

132B. . . First crank

132C. . . Arm

132D. . . 2nd crank

132E. . . Base

134. . . Fixed latch

136A. . . Push latch

136B. . . First elastomer

138. . . Second elastomer

140. . . Power transmission structure

150. . . Pressure reducing sealing member

201. . . Lower mold mechanism

210. . . Lower die

212. . . Counter

214. . . Frame mode

216. . . Clamping spring

220. . . Lower mold base

Fig. 1 is a structural view of a resin sealing device including a drop preventing mechanism according to an embodiment of the present invention.

Fig. 2 is an enlarged view of a portion of the drop prevention mechanism.

Fig. 3 is another embodiment of the fall prevention mechanism.

Fig. 4 is still another embodiment of the fall prevention mechanism.

Fig. 5 is a resin sealing device described in Patent Document 1.

100. . . Resin sealing device

101. . . Upper mold mechanism

110. . . Upper mold

120. . . Upper mold base

130. . . Fall prevention mechanism

150. . . Pressure reducing sealing member

201. . . Lower mold mechanism

210. . . Lower die

212. . . Counter

214. . . Frame mode

216. . . Clamping spring

220. . . Lower mold base

300. . . Molded product

Claims (5)

A fall prevention mechanism for a molded article is a fall prevention mechanism of a molded article supplied to a surface of a mold of a resin sealing device, wherein the drop prevention mechanism is disposed on a bottom side of the upper mold and faces a lower mold, Providing a holding member that moves between the holding position and the liberating position to hold the molded article in a held and liberated state; and supports the holding member as a supporting member that can form the movement with respect to the upper mold; The holding member transmits the power for the movement directly from the lower mold side to the power transmission structure of the holding member. The fall prevention mechanism of the molded article according to the first aspect of the invention, wherein the power transmission structure has a first power that can directly receive the power from the outside and move the holding member from the holding position to the liberation position. And a second acting member that can move the holding member from the liberation position to the holding position, and when the power from the outside is not transmitted to the first acting member, positioning the holding member by the second acting member Hold the position above. The falling prevention mechanism of the molded article according to the second aspect of the invention, wherein the second acting member is an elastic body. Falling down the molded product as described in item 3 of the patent application scope The stopper mechanism is characterized in that at least a part of the first acting member is made of an elastic body, and an elastic modulus of the first acting member is larger than a modulus of elasticity of the second acting member. The fall prevention mechanism of the molded article according to any one of the second to fourth aspect, wherein the at least one portion of the first acting member is formed to protrude from the upper die toward the lower die side. The power transmitted to the holding member by the power transmission structure is a reaction force of the first acting member caused by the upper surface of the conveying device of the molded article abutting on the first acting member.