JP3671712B2 - Electronic component built-in module - Google Patents

Electronic component built-in module Download PDF

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Publication number
JP3671712B2
JP3671712B2 JP444199A JP444199A JP3671712B2 JP 3671712 B2 JP3671712 B2 JP 3671712B2 JP 444199 A JP444199 A JP 444199A JP 444199 A JP444199 A JP 444199A JP 3671712 B2 JP3671712 B2 JP 3671712B2
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terminals
terminal
case
electronic component
module
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JP2000208655A (en
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力宏 丸山
孝敏 小林
英司 望月
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Fuji Electric Co Ltd
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Fuji Electric Device Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]

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  • Wire Bonding (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は複数の端子が設けられた電子部品内蔵モジュールに関し、特にワイヤボンディングによって内部回路と接続される端子を有する電子部品内蔵モジュールに関する。
【０００２】
【従来の技術】
ＩＧＢＴ(Insulated Gate Bipolar Transistor)モジュール及びＩＰＭ(Intelligent Power Module)の端子半田付けレス構造品（ワイヤボンディングで端子と内部基板の配線を行う方式）では、端子がケースに確実に固定されていることが求められる。端子が浮いていたりすると、端子に対してワイヤボンディングを行う際に、接続不良を起こす可能性が高くなるためである。そこで従来は、端子におけるワイヤボンディングすべき領域の両側面を階段状にし、突出した部分（食い付き部）を樹脂製のケースに埋め込むことで、端子を固定していた。
【０００３】
図９は、従来の端子の固定構造の例を示す図である。（Ａ）が上面図であり、（Ｂ）がＣ−Ｃ断面図である。この図に示すように、端子６１〜６３と樹脂製のケース５１との食い付きをよくするために、端子６１〜６３をケース５１に埋め込むとともに、端子６１〜６３の両側面を階段状にし、食い付き部６１ａ，６１ｂ、６２ａ，６２ｂ，６３ａ，６３ｂが形成されている。食い付き部６１ａ，６１ｂ、６２ａ，６２ｂ，６３ａ，６３ｂは、樹脂製のケース５１に埋め込まれている。また、端子６１〜６３の上面はケース５１から露出しており、この部分にワイヤボンディングが行われる。
【０００４】
このように、端子６１〜６３に食い付き部６１ａ，６１ｂ、６２ａ，６２ｂ，６３ａ，６３ｂを設け、その食い付き部６１ａ，６１ｂ、６２ａ，６２ｂ，６３ａ，６３ｂがケース５１に食い付くようにすることで、端子６１〜６３がケース５１に固定される。
【０００５】
なお、このような構造の端子付きケースを製造するには、ケースの金型に端子の一端を挿入した状態で、金型に樹脂を流し込めばよい。
【０００６】
【発明が解決しようとする課題】
ところで、端子間の距離は、なるべく狭いことが望まれる。それは、端子間の距離が狭ければ、電子部品を内蔵したモジュールの小型化を図ることができるとともに、端子に接続するコネクタを小さくすることもできるからである。
【０００７】
しかし、端子と端子との間には絶縁距離が必要であるとともに、ある程度の幅の食い付き部が必要であるため、端子間の距離を狭めるのには限界があった。
図９の例では、絶縁距離として０．８ｍｍ確保している。また、食い付き部の幅を０．３ｍｍとしている。なお、ワイヤボンディングを行うには、端子の露出面の幅はある程度以上必要であり、図の例では１．５ｍｍである。この場合、ある端子の露出面から隣接する端子の露出面までの距離は、０．８＋０．３＋０．３＝１．４ｍｍとなる。
【０００８】
このような端子間距離を狭めるには、絶縁距離、もしくは食い付き部の幅を狭めることが考えられるが、絶縁距離を狭めれば、電気的に動作させた場合の信頼性が低下する。また、食い付き部の幅を狭めれば、端子がしっかりと固定されなくなり、ワイヤボンディングの確実性が低下する。
【０００９】
本発明はこのような点に鑑みてなされたものであり、端子間の絶縁距離を保ちつつ、確実に固定された端子が狭い間隔で配置された電子部品内蔵モジュールを提供することを目的とする。
【００１０】
【課題を解決するための手段】
本発明では上記課題を解決するために、複数の端子が設けられた電子部品内蔵モジュールにおいて、ワイヤボンディングすべき領域を含む固定対象部分の側面から側方に向けて突出した凸部が設けられ、向かい合う前記側面の互いの前記凸部同士が正対しないように配置された複数の端子部材と、前記複数の端子部材の前記凸部を覆うことによって前記複数の端子部材を固定するケース部材と、を有することを特徴とする電子部品内蔵モジュールが提供される。
【００１１】
このような電子部品内蔵モジュールによれば、端子部材に設けられた凸部がケース部材に覆われることでしっかりと固定されている。さらに、複数の端子は、向かい合う側面の互いの凸部同士が正対しないように配置されているため、端子部材間の最短距離は、ある端子部材の凸部の先端と隣接する端子部材の側面との距離となる。
【００１２】
【発明の実施の形態】
以下、本発明の実施の形態を図面を参照して説明する。
ここでは、本発明をパワーモジュールに適用した場合の実施の形態を説明する。なお、本発明の特徴を最もよく示す図は図１であるが、以下の説明では、パワーモジュールの全体構成から順に説明する。
【００１３】
図２は、本発明を適用したパワーモジュールを示す図である。この図は、パワーモジュール１０の上蓋を外した状態の上面図である。また、ケース１１内部はシリコーンゲルで封止されている。
【００１４】
パワーモジュール１０は、ケース１１の内部から外部へ複数の端子１２が取り出されている。端子１２は、パワーモジュール１０に接続するケーブルのコネクタに合致するような間隔で配置されている。端子１２の一方の端部は、パワーモジュール１０の内部に露出しており、ワイヤボンディングで形成されたアルミワイヤ１３によって、回路基板１４上の配線パターン１５に接続されている。その配線パターン１５は、回路基板１４に搭載された半導体素子１６の電極に、アルミワイヤ１３のワイヤボンディングによって接続されている。
【００１５】
図３は、図２に示したパワーモジュールの正面図である。これは、図２の下方からパワーモジュール１０を見た場合の形状を示している。この図に示すように、複数の端子１２ａ〜１２ｏが狭い間隔で配置されている。端子１２ａ〜１２ｏの上方に飛び出した部分が、コネクタに接続すべき部分である。
【００１６】
図４は、図２のＡ−Ａ部分断面図である。端子１２ａは、Ｌ字型に曲げられている。端子１２ａの底辺の右側の部分は、上面のみがケース１１から露出している。その露出面に、アルミワイヤ１３ａがワイヤボンディングによって取り付けられている。アルミワイヤ１３ａの他方の端部は、回路基板１４ａ上の配線パターン１５ａに接続されている。これにより、パワーモジュール１０の端子１２ａと内部の回路とが電気的に接続される。
【００１７】
図１は、端子のワイヤボンディング部の拡大図である。この図は、端子のボンディング部分を上方から見たときの拡大図である。また、アルミワイヤは省略している。
【００１８】
端子１２ａ〜１２ｃには、露出面が設けられており、その幅は、１．５ｍｍである。端子１２ａ〜１２ｃ側面には、凸部１２ａａ，１２ａｂ，１２ｂａ，１２ｂｂ，１２ｃａ，１２ｃｂが設けられている。凸部１２ａａ，１２ａｂ，１２ｂａ，１２ｂｂ，１２ｃａ，１２ｃｂは、上から見た場合には半円形をしており、半径は０．３ｍｍである。この凸部１２ａａ，１２ａｂ，１２ｂａ，１２ｂｂ，１２ｃａ，１２ｃｂは、端子１２ａ〜１２ｃの左右に１つずつ設けられている。
【００１９】
一方の凸部１２ａａ，１２ｂａ，１２ｃａは端部から比較的離れた位置の左側に設けられており、他方の凸部１２ａｂ，１２ｂｂ，１２ｃｂは端部に近い部分の右側に設けられている。すなわち、隣り合った端子の向かい合う側面同士では、必ず凸部同士が正対しないように配置されている。なお、２つの凸部１２ａａ，１２ａｂ，１２ｂａ，１２ｂｂ，１２ｃａ，１２ｃｂに挟まれた領域がワイヤボンディング領域１７となる。
【００２０】
このような複数の端子１２ａ〜１２ｃは、露出面同士の間隔が１．１ｍｍとなるように配置されている。すなわち、端子同士の最短距離は、凸部の先端から隣接する端子の側面までの距離となり、その距離は０．８ｍｍである。従って、十分な絶縁距離が保たれている。
【００２１】
図５は、図１のＢ−Ｂ断面図である。端子１２ａ〜１２ｃの凸部１２ａａ，１２ｂａ，１２ｃａの断面形状は、下面に近づくに従って突出量が大きくなるような形をしている。このような形状は、コイニングによって成形されている。
【００２２】
以上のような形状の端子１２ａ〜１２ｃをケースに固定するには、端子１２ａ〜１２ｃの凸部１２ａａ，１２ｂａ，１２ｃａが設けられた部分を、ケース１１を成型するための金型に挿入する。そして、金型に樹脂を流し込めば、凸部１２ａａ，１２ｂａ，１２ｃａの上まで樹脂が流れ込む。その結果、端子の凸部が樹脂に食い込んだ状態となる。そのまま樹脂が固まってケース１１となれば、投錨効果が得られ、端子１２ａ〜１２ｃはケース１１に対して密着した状態でしっかりと固定される。
【００２３】
このように、本発明によれば、複数の端子を狭い間隔で並べることができる。すなわち、隣り合った端子同士の凸部が互いに正対しないように配置されているため、端子間の距離は、凸部の先端から隣接する端子の側面までの距離が絶縁距離を満たしていればよいこととなり、従来に比べ端子間距離を短くできる。本実施の形態と図１０に示した従来の技術とを比較すると、端子間の間隔（露出面間の距離）が１．４ｍｍから１．１ｍｍとなり、２割近く間隔が狭まっている。これにより、端子に接続するコネクタの小型化や、モジュール自身の小型化を図ることができる。例えば、１０本の端子が並んでいれば、０．３×９＝２．７ｍｍの小型化が図れる。
【００２４】
また、端子の側面の限られた領域に凸部を設けるようにしたことで、端子を製造するための材料費が節約できる。
なお、端子の断面形状は、図５に示した以外にも考えられる。
【００２５】
図６は、端子の固定構造の第１の変形例を示す図である。ここでは、断面図のみを示している。この例では、ケース２１にはめ込まれた端子２２〜２４の側面を斜面とすることで、凸部２２ａ，２３a，２４ａが形成されている。また、ケース２１は、凸部２２ａ，２３a，２４ａを包み込むように形成されている。このような、凸部２２ａ，２３a，２４ａを、位置をずらして端子２２〜２４の両側に設けることで端子２２〜２４をケース２１に固定できる。
【００２６】
図７は、端子の固定構造の第２の変形例を示す図である。ここでは、断面図のみを示している。この例では、ケース３１にはめ込まれた端子３２〜３４の側面に、同じ厚みの凸部３２ａ，３３a，３４ａを設けている。また、端子３２〜３４は、上面がケース３１の表面よりも低くなるように深く埋め込まれ、凸部３２ａ，３３a，３４ａがケース３１で覆われている。ただし、ワイヤボンディングすべき領域は、ケース３１の樹脂に覆われずに露出している。このような凸部３２ａ，３３a，３４ａを、位置をずらして端子３２〜３４の両側に設けることで端子３２〜３４をケース３１に固定できる。
【００２７】
図８は、端子の固定構造の第３の変形例を示す図である。ここでは、断面図のみを示している。この例では、ケース４１にはめ込まれた端子４２〜４４の側面に階段状の凸部４２ａ，４３a，４４ａが設けられている。また、この凸部４２ａ，４３a，４４ａは、ケース４１の樹脂で覆われている。このような凸部４２ａ，４３a，４４ａを、位置をずらして両側に設けることで端子４２〜４４をケース４１に固定できる。
【００２８】
以上のように、様々な形状の凸部が考えられる。これは、断面形状に限らない。すなわち、上から見た場合の形状も、半円である必要はない。長方形や、その他の複雑な形でもよい。さらに、凸部の数も、必ずしも両側に１つずつである必要はなく、端子の両側に複数の凸部を設けてもよい。
【００２９】
【発明の効果】
以上説明したように本発明では、端子部材に設けられた凸部がケース部材に覆われることでしっかりと固定されているとともに、複数の端子部材が、向かい合う側面の互いの凸部同士が正対しないように配置されているため、端子間の最短距離は、ある端子の凸部の先端と隣接する端子の側面との距離となり、端子間の距離を狭めることが可能となる。
【図面の簡単な説明】
【図１】端子のワイヤボンディング部の拡大図である。
【図２】本発明を適用したパワーモジュールを示す図である。
【図３】図２に示したパワーモジュールの正面図である。
【図４】図２のＡ−Ａ部分断面図である。
【図５】図１のＢ−Ｂ断面図である。
【図６】端子の固定構造の第１の変形例を示す図である。
【図７】端子の固定構造の第２の変形例を示す図である。
【図８】端子の固定構造の第３の変形例を示す図である。
【図９】従来の端子の固定構造の例を示す図である。（Ａ）が上面図であり、（Ｂ）がＣ−Ｃ断面図である。
【符号の説明】
１０ パワーモジュール
１１ ケース
１２，１２ａ〜１２ｏ 端子
１２ａａ，１２ａｂ，１２ｂａ，１２ｂｂ，１２ｃａ，１２ｃｂ 凸部
１３，１３ａ アルミワイヤ
１４，１４ａ 回路基板
１５，１５ａ 配線パターン
１６ 半導体素子[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component built-in module provided with a plurality of terminals, and more particularly to an electronic component built-in module having terminals connected to an internal circuit by wire bonding.
[0002]
[Prior art]
In IGBT (Insulated Gate Bipolar Transistor) module and IPM (Intelligent Power Module) terminal solderless structure (wire bonding between terminal and internal board), the terminal is securely fixed to the case. Desired. This is because if the terminal is floating, there is a high possibility that a connection failure will occur when wire bonding is performed on the terminal. Therefore, conventionally, the terminals are fixed by making both side surfaces of the region to be wire-bonded in the terminal stepped and embedding the protruding portions (biting portions) in a resin case.
[0003]
FIG. 9 is a diagram illustrating an example of a conventional terminal fixing structure. (A) is a top view and (B) is a CC cross-sectional view. As shown in this figure, in order to improve the biting between the terminals 61 to 63 and the resin case 51, the terminals 61 to 63 are embedded in the case 51, and both side surfaces of the terminals 61 to 63 are stepped. Biting portions 61a, 61b, 62a, 62b, 63a, 63b are formed. The biting portions 61a, 61b, 62a, 62b, 63a, 63b are embedded in a resin case 51. Further, the upper surfaces of the terminals 61 to 63 are exposed from the case 51, and wire bonding is performed on this portion.
[0004]
In this way, the terminals 61 to 63 are provided with the biting portions 61a, 61b, 62a, 62b, 63a, 63b, and the biting portions 61a, 61b, 62a, 62b, 63a, 63b bite the case 51. As a result, the terminals 61 to 63 are fixed to the case 51.
[0005]
In order to manufacture a case with a terminal having such a structure, a resin may be poured into a mold while one end of the terminal is inserted into the mold of the case.
[0006]
[Problems to be solved by the invention]
By the way, it is desirable that the distance between the terminals is as small as possible. This is because if the distance between the terminals is small, the module incorporating the electronic component can be miniaturized and the connector connected to the terminals can be made small.
[0007]
However, since an insulation distance is required between the terminals and a biting portion having a certain width is required, there is a limit in reducing the distance between the terminals.
In the example of FIG. 9, an insulation distance of 0.8 mm is secured. Further, the width of the biting portion is set to 0.3 mm. In addition, in order to perform wire bonding, the width of the exposed surface of the terminal is required to some extent, and is 1.5 mm in the example in the figure. In this case, the distance from the exposed surface of a certain terminal to the exposed surface of an adjacent terminal is 0.8 + 0.3 + 0.3 = 1.4 mm.
[0008]
In order to reduce the distance between the terminals, it is conceivable to reduce the insulation distance or the width of the biting portion. However, if the insulation distance is reduced, the reliability when electrically operated is lowered. Moreover, if the width of the biting portion is narrowed, the terminal is not firmly fixed, and the reliability of wire bonding is lowered.
[0009]
The present invention has been made in view of such a point, and an object thereof is to provide an electronic component built-in module in which terminals that are securely fixed are arranged at a narrow interval while maintaining an insulation distance between the terminals. .
[0010]
[Means for Solving the Problems]
In the present invention, in order to solve the above-mentioned problem, in the electronic component built-in module provided with a plurality of terminals, a convex portion protruding from the side surface of the portion to be fixed including the region to be wire-bonded is provided, and the case member for fixing the plurality of terminal members by covering a plurality of terminal members the convex portions of each other facing the side is arranged so does not face, the convex portion of the plurality of terminal members, An electronic component built-in module is provided.
[0011]
According to such an electronic component built-in module, the convex portion provided on the terminal member is firmly fixed by being covered by the case member. Furthermore, since the plurality of terminals are arranged so that the convex portions on the opposite side surfaces do not face each other, the shortest distance between the terminal members is the side surface of the terminal member adjacent to the tip of the convex portion of a certain terminal member. And the distance.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
Here, an embodiment when the present invention is applied to a power module will be described. The best illustration of the features of the present invention is shown in FIG. 1, but in the following description, the entire configuration of the power module will be described in order.
[0013]
FIG. 2 is a diagram showing a power module to which the present invention is applied. This figure is a top view of the power module 10 with the top cover removed. The inside of the case 11 is sealed with silicone gel.
[0014]
The power module 10 has a plurality of terminals 12 taken out from the inside of the case 11 to the outside. The terminals 12 are arranged at intervals so as to match the connectors of the cable connected to the power module 10. One end of the terminal 12 is exposed to the inside of the power module 10 and is connected to the wiring pattern 15 on the circuit board 14 by an aluminum wire 13 formed by wire bonding. The wiring pattern 15 is connected to the electrode of the semiconductor element 16 mounted on the circuit board 14 by wire bonding of an aluminum wire 13.
[0015]
FIG. 3 is a front view of the power module shown in FIG. This shows the shape when the power module 10 is viewed from below in FIG. As shown in this figure, the plurality of terminals 12a to 12o are arranged at a narrow interval. Portions protruding above the terminals 12a to 12o are portions to be connected to the connector.
[0016]
4 is a partial cross-sectional view taken along line AA of FIG. The terminal 12a is bent in an L shape. Only the upper surface of the portion on the right side of the bottom side of the terminal 12 a is exposed from the case 11. An aluminum wire 13a is attached to the exposed surface by wire bonding. The other end of the aluminum wire 13a is connected to the wiring pattern 15a on the circuit board 14a. Thereby, the terminal 12a of the power module 10 and an internal circuit are electrically connected.
[0017]
FIG. 1 is an enlarged view of a wire bonding portion of a terminal. This figure is an enlarged view when the bonding portion of the terminal is viewed from above. Also, aluminum wires are omitted.
[0018]
The terminals 12a to 12c are provided with exposed surfaces and have a width of 1.5 mm. Protrusions 12aa, 12ab, 12ba, 12bb, 12ca, 12cb are provided on the side surfaces of the terminals 12a-12c. The convex portions 12aa, 12ab, 12ba, 12bb, 12ca, and 12cb are semicircular when viewed from above, and have a radius of 0.3 mm. The convex portions 12aa, 12ab, 12ba, 12bb, 12ca, and 12cb are provided on the left and right sides of the terminals 12a to 12c, respectively.
[0019]
One convex portion 12aa, 12ba, 12ca is provided on the left side of the position relatively far from the end portion, and the other convex portion 12ab, 12bb, 12cb is provided on the right side of the portion close to the end portion. In other words, the side surfaces of adjacent terminals facing each other are arranged so that the convex portions do not face each other. A region sandwiched between the two convex portions 12aa, 12ab, 12ba, 12bb, 12ca, and 12cb is a wire bonding region 17.
[0020]
Such a plurality of terminals 12a to 12c are arranged such that the interval between the exposed surfaces is 1.1 mm. That is, the shortest distance between the terminals is the distance from the tip of the convex portion to the side surface of the adjacent terminal, and the distance is 0.8 mm. Therefore, a sufficient insulation distance is maintained.
[0021]
5 is a cross-sectional view taken along the line BB in FIG. The cross-sectional shapes of the protrusions 12aa, 12ba, and 12ca of the terminals 12a to 12c are such that the protruding amount increases as the distance from the lower surface decreases. Such a shape is formed by coining.
[0022]
In order to fix the terminals 12a to 12c having the above shapes to the case, the portions of the terminals 12a to 12c provided with the convex portions 12aa, 12ba and 12ca are inserted into a mold for molding the case 11. And if resin is poured into a metal mold | die, resin will flow in on convex part 12aa, 12ba, 12ca. As a result, the convex portion of the terminal is in a state of being bitten into the resin. If the resin is solidified as it is to form the case 11, a throwing effect is obtained, and the terminals 12 a to 12 c are firmly fixed in a state of being in close contact with the case 11.
[0023]
Thus, according to the present invention, a plurality of terminals can be arranged at a narrow interval. That is, since the convex portions of adjacent terminals are arranged so as not to face each other, the distance between the terminals is as long as the distance from the tip of the convex portion to the side surface of the adjacent terminal satisfies the insulation distance. As a result, the distance between the terminals can be shortened as compared with the prior art. When this embodiment is compared with the conventional technique shown in FIG. 10, the distance between terminals (distance between exposed surfaces) is 1.4 mm to 1.1 mm, and the distance is narrowed by nearly 20%. Thereby, size reduction of the connector connected to a terminal and size reduction of the module itself can be achieved. For example, if 10 terminals are arranged, the size can be reduced to 0.3 × 9 = 2.7 mm.
[0024]
Further, by providing the convex portion in a limited region on the side surface of the terminal, the material cost for manufacturing the terminal can be saved.
In addition, the cross-sectional shape of the terminal can be considered other than that shown in FIG.
[0025]
FIG. 6 is a diagram illustrating a first modification of the terminal fixing structure. Here, only a sectional view is shown. In this example, convex portions 22a, 23a, and 24a are formed by making the side surfaces of the terminals 22 to 24 fitted in the case 21 into inclined surfaces. The case 21 is formed so as to wrap the convex portions 22a, 23a, and 24a. The terminals 22 to 24 can be fixed to the case 21 by providing the convex portions 22a, 23a, and 24a on both sides of the terminals 22 to 24 while shifting the positions.
[0026]
FIG. 7 is a diagram showing a second modification of the terminal fixing structure. Here, only a sectional view is shown. In this example, convex portions 32 a, 33 a, and 34 a having the same thickness are provided on the side surfaces of the terminals 32 to 34 fitted into the case 31. Further, the terminals 32 to 34 are embedded deeply so that the upper surface is lower than the surface of the case 31, and the convex portions 32 a, 33 a, 34 a are covered with the case 31. However, the region to be wire-bonded is exposed without being covered with the resin of the case 31. The terminals 32 to 34 can be fixed to the case 31 by providing such convex portions 32 a, 33 a, and 34 a on both sides of the terminals 32 to 34 while shifting their positions.
[0027]
FIG. 8 is a diagram showing a third modification of the terminal fixing structure. Here, only a sectional view is shown. In this example, stepped convex portions 42 a, 43 a, 44 a are provided on the side surfaces of the terminals 42 to 44 fitted into the case 41. Further, the convex portions 42 a, 43 a, 44 a are covered with the resin of the case 41. The terminals 42 to 44 can be fixed to the case 41 by providing such convex portions 42 a, 43 a, 44 a on both sides while shifting their positions.
[0028]
As described above, convex portions having various shapes are conceivable. This is not limited to the cross-sectional shape. That is, the shape when viewed from above need not be a semicircle. It may be a rectangle or other complex shapes. Furthermore, the number of convex portions is not necessarily one on each side, and a plurality of convex portions may be provided on both sides of the terminal.
[0029]
【The invention's effect】
As described above, according to the present invention, the convex portions provided on the terminal member are firmly fixed by being covered with the case member, and the convex portions on the side surfaces facing each other are facing each other. Therefore, the shortest distance between the terminals is the distance between the tip of the convex portion of a certain terminal and the side surface of the adjacent terminal, and the distance between the terminals can be reduced.
[Brief description of the drawings]
FIG. 1 is an enlarged view of a wire bonding portion of a terminal.
FIG. 2 is a diagram showing a power module to which the present invention is applied.
FIG. 3 is a front view of the power module shown in FIG. 2;
4 is a partial cross-sectional view taken along the line AA in FIG. 2;
5 is a cross-sectional view taken along the line BB in FIG.
FIG. 6 is a diagram showing a first modification of the terminal fixing structure.
FIG. 7 is a diagram showing a second modification of the terminal fixing structure.
FIG. 8 is a diagram showing a third modification of the terminal fixing structure.
FIG. 9 is a diagram showing an example of a conventional terminal fixing structure. (A) is a top view and (B) is a CC cross-sectional view.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Power module 11 Case 12, 12a-12o Terminal 12aa, 12ab, 12ba, 12bb, 12ca, 12cb Convex part 13, 13a Aluminum wire 14, 14a Circuit board 15, 15a Wiring pattern 16 Semiconductor element

Claims (4)

複数の端子が設けられた電子部品内蔵モジュールにおいて、
ワイヤボンディングすべき領域を含む固定対象部分の側面から側方に向けて突出した凸部が設けられ、向かい合う前記側面の互いの前記凸部同士が正対しないように配置された複数の端子部材と、
前記複数の端子部材の前記凸部を覆うことによって前記複数の端子部材を固定するケース部材と、
を有することを特徴とする電子部品内蔵モジュール。In the electronic component built-in module provided with a plurality of terminals,
Convex portion protruding toward the side from the side of the fixed target portion including the region to be wire bonding is provided, a plurality of terminal members the convex portions of another of the side is arranged so does not face opposite the ,
A case member for fixing the plurality of terminal members by covering the convex portions of the plurality of terminal members;
An electronic component built-in module comprising: 前記複数の端子部材は、ワイヤボンディングすべき領域を挟むような位置に前記凸部が設けられていることを特徴とする請求項１記載の電子部品内蔵モジュール。2. The electronic component built-in module according to claim 1, wherein the plurality of terminal members are provided with the convex portions at positions sandwiching a region to be wire-bonded. ワイヤボンディングすべき領域側を上面としたとき、前記凸部の上面の高さが、ワイヤボンディングすべき領域よりも低いことを特徴とする請求項１記載の電子部品内蔵モジュール。2. The electronic component built-in module according to claim 1, wherein the height of the upper surface of the convex portion is lower than the region to be wire-bonded when the region to be wire-bonded is the upper surface. 前記凸部は、突出した先端に近づくほど厚みが薄くなることを特徴とする請求項３記載の電子部品内蔵モジュール。4. The electronic component built-in module according to claim 3, wherein the convex portion has a thickness that decreases as it approaches the protruding tip. 5.
JP444199A 1999-01-11 1999-01-11 Electronic component built-in module Expired - Lifetime JP3671712B2 (en)

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JP3715590B2 (en) * 2002-06-17 2005-11-09 三菱電機株式会社 Insert molding case and semiconductor device
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CN105940489B (en) 2014-01-17 2019-04-05 富士电机株式会社 Semiconductor module
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