JP3669348B2 - Electronic component crimping apparatus and electronic component crimping method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component crimping apparatus and an electronic component crimping method for crimping an electronic component to a substrate.
[0002]
[Prior art]
As a method for bonding an electronic component to a substrate, a method by pressure bonding is known. In this method, bonding is performed by applying a pressing force to the electronic component by the crimping head. Here, in order to obtain good pressure bonding quality, it is necessary to control the pressing load acting on the electronic component in the pressure bonding process according to a predetermined control target value. For this reason, the pressure bonding apparatus is provided with a mechanism for controlling the pressing load when the pressure bonding head presses the electronic component.
[0003]
Conventionally, two types of methods described below have been used as methods for controlling the pressing load. First, in the first method, a pressing force acting between the electronic component and the crimping head when the crimping head is lowered is detected by a load detection means such as a load cell, and this detected load matches a predetermined control target value. In this way, the load detection control system controls the lowering operation of the crimping head. In the second method, a pressing force generating mechanism for generating a pressing force by a fluid pressure such as air pressure is provided in the crimping head, and the pressing head is kept at a predetermined pressing height while always generating a pressing force that matches the control target value. This is a descending position control system that descends to the vertical position.
[0004]
[Problems to be solved by the invention]
However, the above-described pressing load control method has the following advantages and disadvantages. First, although the load detection method has an advantage that a wide load control range can be ensured, a load search that sequentially detects load values in the process of lowering the crimping head is performed, so the crimping head is lowered at high speed. Therefore, it was difficult to shorten the tact time of the crimping operation.
[0005]
In the lowering position control method, the crimping head set to a constant load state can be lowered at high speed and the tact time can be shortened. However, a single crimping device is intended to cover a wide load range. In this case, it is necessary to prepare a plurality of crimping heads corresponding to the load range in advance and replace the crimping heads appropriately according to the target part. As described above, the conventional electronic component crimping apparatus has a problem that it can cope with a wide load range and that it is difficult to realize an efficient crimping operation by shortening the tact time.
[0006]
Then, an object of this invention is to provide the electronic component crimping apparatus and the electronic component crimping method which can respond | correspond to a wide load range, and can perform an efficient crimping | compression-bonding operation | work.
[0007]
[Means for Solving the Problems]
The electronic component crimping apparatus according to claim 1 is a crimping head that presses an electronic component, an elevating unit that moves the crimping head up and down, a load detection unit that detects a crimping load acting on the crimping head, and the load detection unit. A control unit for controlling the elevating means based on the load detection signal , and a load detection signal connection / disconnection unit provided between the load detection unit and the control unit for connecting / disconnecting the load detection signal as necessary, The pressure head includes a pressing force generation unit that generates a pressing force that presses the electronic component with fluid pressure, and a fluid pressure control unit that controls the fluid pressure.
[0008]
The electronic component crimping method according to claim 2 includes a crimping head that presses the electronic component, an elevating unit that moves the crimping head up and down, a load detection unit that detects a crimping load acting on the crimping head, and the load detection unit. A control unit that controls the elevating means based on a load detection result of the load, a pressing force generating means that is provided in the crimping head and generates a pressing force that presses the electronic component by fluid pressure, and a fluid that controls the fluid pressure An electronic component crimping method using an electronic component crimping apparatus including a pressure control unit, wherein a pressing load acting on the crimping head is detected by a load detection unit, and the lifting unit is controlled by a control unit based on a load detection result While detecting the load while pressing the electronic component, and controlling the fluid pressure and applying a predetermined pressing force to the electronic component by the crimping head. And a lowered position control compression sealing lowering control to pressure bonding head by the controller descending means, selectively used depending on the magnitude of the pressing force required crimping of the electronic component.
[0009]
The electronic component crimping method according to claim 3 is the electronic component crimping method according to claim 2, wherein when the load detection crimping method is used, the fluid pressure is controlled by the fluid pressure control means. Set it as small as possible without causing problems.
[0010]
The electronic component crimping method according to claim 4 is the electronic component crimping method according to claim 2, wherein when the load detection crimping method is used, the fluid pressure is controlled by the fluid pressure control means. Set it large enough that it will not interfere with use.
[0011]
According to the present invention, a load detecting unit that detects a crimping load acting on a crimping head that presses an electronic component, a control unit that controls the raising and lowering of the crimping head based on a load detection result of the load detecting unit, and the crimping head Provided with a pressure generating means for generating a pressing force that presses an electronic component with fluid pressure, and selectively using a load detection pressing method and a descending position control pressing method according to a target load range. Thus, it is possible to cope with a wide load range and perform an efficient crimping operation.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. 1 is a side view of an electronic component crimping apparatus according to an embodiment of the present invention, FIG. 2 is a sectional view of a crimping head of the electronic component crimping apparatus according to an embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. FIG. 4, FIG. 5, FIG. 6, FIG. 7 are explanatory views of an electronic component crimping method according to an embodiment of the present invention.
[0013]
First, the structure of the electronic component crimping apparatus will be described with reference to FIG. In FIG. 1, a substrate holder 2 is provided on a moving plate 1 a of the movable table 1. A substrate 3 is placed on the substrate holder 2, and a supply unit 4 for electronic components 5 is disposed on a moving plate 1 a on the side of the substrate 3. By driving the movable table 1, the substrate 3 and the supply unit 4 move in a horizontal plane. An electronic component 5 is held by a crimping tool 6 above the movable table 1. The crimping tool 6 is mounted on a crimping head 7, and the crimping head 7 is further detachably mounted on the first lifting block 10 (lifting unit).
[0014]
A slider 11 is fixed to the back surface of the first lifting block 10, and the slider 11 is fitted to a vertical guide rail 12 disposed on the front surface of the first frame 13 so as to be slidable in the vertical direction. . Further, an inverted L-shaped projecting portion 14 is provided on the upper portion of the first lifting block 10. A load cell, which is a load detecting means to be described later, abuts on the lower surface of the overhanging portion 14.
[0015]
A second lifting block 20 is provided above the first lifting block 10. A slider 21 is provided on the back surface of the second lifting block 20, and the slider 21 is fitted to a vertical guide rail 22 disposed on the front surface of the second frame 23 so as to be slidable in the vertical direction. . An inverted L-shaped projecting portion 24 is provided at the lower portion of the second lifting block 20. A load cell 26 is disposed on the upper surface of the overhang portion 24, and the load cell 26 is in contact with the lower surface of the overhang portion 14. Also on the lower surface of the second lifting block 20 and the cylinder 25 is mounted downward, the rod 25a of the cylinder 25 is in contact with the upper surface of the projecting portion 1 4. A predetermined pressure of air is supplied to the cylinder 25 by a pressure source 34.
[0016]
A bracket 30 having a U-shaped cross section is fixed to the upper portion of the second frame 23. A motor 31 is disposed on the bracket 30, and the rotation shaft of the motor 31 is connected to a vertical feed screw 27. The feed screw 27 is screwed into a nut 28 built in the second lifting block 20. The second elevating block 20 moves up and down by causing the control unit 32 to rotate the motor 31 forward and backward.
[0017]
Then, when the second lifting block 20 moves up and down, the first lifting block 10 suspended on the second lifting block 20 is lifted and lowered via the load cell 26, whereby the crimping head 7 is lifted and lowered. That is, the motor 31, the feed screw 27, the nut 28, and the second elevating block 20 are elevating means for elevating and lowering the first elevating block 10 (elevating part) to which the crimping head 7 is attached. The motor 31 includes an encoder 31a, and a pulse signal from the encoder 31a is sent to the control unit 32. In the control of the motor 31 by the control unit 32, the height position of the crimping head 7 can be detected by counting the pulse signals.
[0018]
Therefore, in the pressure-bonding operation in which the pressure-bonding head 7 is lowered and the electronic component 5 held by the pressure-bonding tool 6 is pressed and pressure-bonded to the substrate, the above-mentioned lifting means is controlled by the control unit 32 while detecting the height position of the pressure-bonding head 7. By controlling according to the above, the pressure-bonding head 7 can be lowered to a desired height position.
[0019]
Next, the structure of the crimping head 7 will be described with reference to FIG. As shown in FIG. 2, the pressure-bonding head 7 includes a taper shank 9 that is detachably attached to the first lifting block 10, and a head main body 8 is coupled to the lower portion of the taper shank 9. The head body 8 is provided with a circular cylinder chamber 8a, and a piston 8b is fitted in the cylinder chamber 8a. A tool holder 8c provided below the head main body 8 is coupled to the lower surface of the piston 8b, and the crimping tool 6 is replaceably attached to the tool holder 8c.
[0020]
A tension spring 8d as an urging means for urging the piston 8b upward is coupled to the upper surface of the piston 8b, and an upward urging force is always applied to the piston 8b by the tension spring 8d. An air hole 8e is provided in the side surface of the cylinder chamber 8a. By supplying pressurized air from the air hole 8e into the cylinder chamber 8a, the piston 8b is pressed downward against the urging force of the tension spring 8d. Is done. This pressing force is transmitted to the crimping tool 6 through the tool holder 8c coupled to the piston 8b, and presses the electronic component 5 in the crimping operation. That is, the pressure-bonding head 7 is provided with a pressing force generating means for generating a pressing force that presses the electronic component 5 with a fluid pressure of pressurized air.
[0021]
FIG. 2A shows an air supply OFF state in which the inside of the cylinder chamber 8a is not pressurized. In this state, the tool holder 8c is pulled upward by the urging force of the tension spring 8d, and the upper surface of the tool holder 8c comes into contact with the lower surface of the head main body 8. In contrast, FIG. 2B shows an air supply ON state in which the inside of the cylinder chamber 8a is pressurized. At this time, by setting the air pressure to a pressure that generates a pressing force exceeding the urging force of the tension spring 8d, the piston 8b moves downward against the urging force of the tension spring 8d, and the cylinder chamber 8a Contact the bottom.
[0022]
In FIG. 1 again, the crimping head 7 is connected to a pressure source 34 via an on / off valve 36 and an electropneumatic regulator 35. By operating the on / off valve 36 and the electropneumatic regulator 35 by the control unit 32, the pressure of the air supplied to the crimping head 7 can be controlled. The controller 32 and the electropneumatic regulator 35 serve as fluid pressure control means for controlling the fluid pressure of the pressing force generating means provided in the crimping head 7.
[0023]
Here, functions of the cylinder 25 and the load cell 26 will be described with reference to FIGS. 3A shows a state in which the second lifting block 20 is raised, and FIG. 3B shows a state in which the second lifting block 20 is lowered and the electronic component 5 is being thermocompression bonded to the substrate 3. The balance of the power of each part is shown. The cylinder 25 is supplied with air of a predetermined pressure from the pressure source 34, and therefore the cylinder 25 presses the first lifting block 10 downward with a predetermined pressing force F0. In the state shown in FIG. 3A, the sum F0 + W of the pressing force F0 and the load W corresponding to the weight of the crimping head 7 and the like is balanced with the load f applied to the load cell 26. That is, in the state where the second lifting block 20 is in the raised position, the detected load value f0 of the load cell 26 is equal to the sum of the pressing force F0 of the cylinder 25 and the weight W of the crimping head 7.
[0024]
In contrast, in the state shown in FIG. 3B, the crimping head 7 receives a reaction force F equal to the crimping load from the electronic component 5, and the above-mentioned sum F0 + W is applied to the reaction force F of the crimping load and the load cell 26. It is balanced with the sum F + f of the load f to be applied. That is, the reaction force F of the crimping load acting on the crimping head 7 can be detected by the load cell 26 and is represented by F0 + W−f. In order to control the crimping load F, since F0 + W is a constant value, the control unit 32 monitors the detected load value f of the load cell 26 and controls the driving of the motor 31 to move the second lifting block 20 up and down. Can be controlled.
[0025]
That is, the load cell 26 serves as a load detection unit that detects a load acting on the crimping head 7, and the control unit 32 controls the lifting unit based on the load detection result of the load detection unit. Here, the load cell 26 is connected to the control unit 32 via a switch 33 as a load detection signal connecting / disconnecting means, and the control unit 32 operates the switch 33 to detect the load from the load cell 26 by the control unit 32. The signal can be connected and disconnected as necessary. The load detection signal connecting / disconnecting means may be hardware or software.
[0026]
The electronic component crimping apparatus is configured as described above. Next, an electronic component crimping method using the electronic component crimping apparatus will be described. Here, the two types of crimping methods described below can be selected and used according to the magnitude of the pressing force required for crimping the target electronic component.
[0027]
First, the load detection pressure bonding method will be described with reference to FIGS. In this crimping method, in the crimping operation in which the crimping head 7 is lowered and the electronic component 5 is pressed against the substrate 3, the pressing load acting on the crimping head 7 is detected by the load cell 26, and the motor is based on the load detection result. When the electronic component 5 is pressure-bonded to the substrate 3 while being controlled by the control unit 32 and the pressing force required for the electronic component to be pressure-bonded is relatively small (for example, 150 gf to 1.5 kgf). Used.
[0028]
In FIG. 4, the switch 33 interposed between the load cell 26 and the control unit 32 is set to ON so that the control unit 32 can take in the load detection signal of the load cell 26. Therefore, in the process of lowering the first elevating block 10 and the second elevating block 20, the electronic component 5 is controlled by controlling the rotation of the motor 31 while detecting the reaction force of the pressing load acting on the crimping head 7. It is possible to always maintain a load for pressing the substrate 3 on the substrate 3 at a predetermined pressure load. This crimping method has an advantage that the crimping load can be controlled with high accuracy, although the high-speed crimping is difficult because the load search is repeated in the crimping process.
[0029]
FIG. 5 shows a state of the pressure-bonding head 7 when the electronic component 5 is pressed against the substrate 3 in the pressure-bonding operation by the load detection pressure-bonding method. Here, the air pressure in the cylinder chamber 8a can be set at two different pressure levels. In the example shown in FIG. 5A, the air pressure P1 supplied into the cylinder chamber 8a by the electropneumatic regulator 35 is set to a pressure smaller than the pressing force corresponding to the urging force of the tension spring 8d, and the tool holder 8c. The upper surface of the head is kept in contact with the lower surface of the head main body 8. Thereby, the reaction force of the pressing load when the electronic component 5 is pressed against the substrate 3 to be bonded is transmitted from the upper surface of the tool holder 8 c to the head main body 8 and detected by the load cell 26. That is, in this case, the electropneumatic regulator 35 sets the air pressure to a value that does not hinder the use of the load detection pressure bonding method.
[0030]
On the other hand, in the example shown in FIG. 5B, the air pressure P2 supplied into the cylinder chamber 8a by the electropneumatic regulator 35 is sufficient for the pressing load required for crimping the target electronic component 5. The pressure is set to a level with a margin (in the normal case, the maximum pressure that can be supplied by the pressure source 34). As a result, the piston 8b is pressed against the bottom surface of the cylinder chamber 8a against the urging force of the tension spring 8d with a strong force, and the rigid-type pressure-bonding head in which the tool holder 8c and the head body 8 are integrally manufactured in the pressure-bonding process. Shows similar characteristics. For this reason, the reaction force of the pressing load when the electronic component 5 is pressed against the substrate 3 to be bonded is transmitted from the tool holder 8c to the head body 8 and detected by the load cell 26 as in the above example. That is, in this case, the electropneumatic regulator 35 sets the air pressure so large that it does not hinder the use of the load detection pressure bonding method.
[0031]
Next, the lowered position control pressure bonding method will be described with reference to FIGS. In this pressure bonding method, in the pressure bonding operation in which the pressure bonding head 7 is moved down to press the electronic component 5 against the substrate 3, the pressure of the air supplied to the pressure bonding head 7 is controlled and the pressure bonding head 7 applies the electronic component 5 to the electronic component 5. While the predetermined pressing force is applied, the elevating means is controlled by the control unit 32 to lower the pressure-bonding head 7, and the required pressure is larger than the range that can be covered by the above-described pressure-bonding method ( For example, it is used for 1.5 kgf to 30 kgf). This crimping method does not perform a load search in the crimping process, and therefore has an advantage that the crimping operation can be performed at high speed and high productivity can be obtained.
[0032]
In FIG. 6, the switch 33 interposed between the load cell 26 and the control unit 32 is switched to OFF so that the control unit 32 does not take in the load detection signal of the load cell 26. That is, the load detection signal is ignored. In the process of lowering the first elevating block 10 and the second elevating block 20, the control unit 32 controls the motor 31 so that the pressure-bonding head 7 holding the electronic component 5 is a predetermined on the substrate 3. Lower until reaching the height position (mounting height).
[0033]
FIG. 7 shows a state of the pressure-bonding head 7 when the electronic component 5 is pressed against the substrate 3 in the pressure-bonding operation by the lowered position control pressure-bonding method. Here, the air pressure P <b> 3 supplied into the cylinder chamber 8 a is set according to the crimping load required for crimping the electronic component 5. That is, in this case, in the cylinder chamber 8a, the piston 8b floats in a state where the reaction force of the pressing load from the electronic component 5 and the pressing force by the air pressure P3 are balanced. Therefore, a pressing load corresponding to the preset air pressure P3 always acts on the electronic component 5.
[0034]
As described above, the electronic component crimping apparatus according to the present embodiment can perform two types of crimping methods, that is, a load detection crimping method and a lowered position control crimping method, without exchanging the crimping head with a single device. It is a thing. Accordingly, it is possible to appropriately use the load detection crimping method and the lowered position control crimping method according to the characteristics such as the pressing load and load accuracy required for the electronic component to be crimped. Therefore, it is possible to cope with a wide load range and perform an efficient crimping operation.
[0035]
【The invention's effect】
According to the present invention, a load detecting unit that detects a crimping load acting on a crimping head that presses an electronic component, a control unit that controls the raising and lowering of the crimping head based on a load detection result of the load detecting unit, and the crimping head Provided with a pressure generating means for generating a pressing force that presses the electronic component with fluid pressure, so that the load detection pressing method and the lowered position control pressing method are selectively used according to the target load range. Thus, it is possible to cope with a wide load range and perform an efficient crimping operation.
[Brief description of the drawings]
FIG. 1 is a side view of an electronic component crimping apparatus according to an embodiment of the present invention. FIG. 2 is a sectional view of a crimping head of an electronic component crimping apparatus according to an embodiment of the present invention. FIG. 4 is an explanatory diagram of an electronic component crimping method according to an embodiment of the present invention. FIG. 5 is an explanatory diagram of an electronic component crimping method according to an embodiment of the present invention. 6 is an explanatory diagram of an electronic component crimping method according to an embodiment of the present invention. FIG. 7 is an explanatory diagram of an electronic component crimping method according to an embodiment of the present invention.
3 Substrate 5 Electronic component 6 Crimping tool 7 Crimping head 10 First lifting block 20 Second lifting block 26 Load cell 31 Motor 32 Controller 35 Electropneumatic regulator

Claims (4)

A crimping head that presses the electronic component, an elevating unit that raises and lowers the crimping head, a load detection unit that detects a crimping load acting on the crimping head, and the elevation unit based on a load detection signal of the load detection unit A control unit for controlling, a load detection signal connecting / disconnecting unit provided between the load detecting unit and the control unit, for connecting / disconnecting the load detection signal as necessary, and the pressure-bonding head provided with the electron by fluid pressure. An electronic component crimping apparatus comprising: a pressing force generating unit that generates a pressing force for pressing a component; and a fluid pressure control unit that controls the fluid pressure. A crimping head that presses the electronic component, an elevating unit that raises and lowers the crimping head, a load detection unit that detects a crimping load acting on the crimping head, and the elevation unit based on the load detection result of the load detection unit Crimping of an electronic component comprising a control unit for controlling, a pressing force generating means for generating a pressing force for pressing the electronic component by fluid pressure, and a fluid pressure control means for controlling the fluid pressure. An electronic component crimping method using an apparatus, comprising: a load detection crimping method in which a pressing load acting on the crimping head is detected by a load detection unit and the electronic component is crimped while controlling the elevating unit based on a load detection result by a control unit And the control means controls the lifting means while applying a predetermined pressing force to the electronic component by the crimping head by controlling the fluid pressure. Electronic component bonding method which comprises using a lowered position control compression sealing lowering the head, selectively depending on the magnitude of the pressing force required crimping of the electronic component. 3. The electronic component crimping according to claim 2, wherein in the case of using the load detection crimping method, the fluid pressure control means sets the fluid pressure as small as not to hinder the use of the load detection crimping method. Method. 3. The electronic component pressure bonding according to claim 2, wherein when the load detection pressure bonding method is used, the fluid pressure is set by the fluid pressure control means so as not to hinder the use of the load detection pressure bonding method. Method.

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