JP3760898B2 - Electronic component crimping apparatus and electronic component crimping method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component crimping apparatus and an electronic component crimping method for crimping an electronic component to a substrate.
[0002]
[Prior art]
As a method for bonding an electronic component to a substrate, a method by pressure bonding is known. In this method, bonding is performed by applying a pressing force to the electronic component by the crimping head. Here, in order to obtain good pressure bonding quality, it is necessary to control the pressing load acting on the electronic component in the pressure bonding process according to a predetermined control target value. For this reason, the pressure bonding apparatus is provided with a mechanism for controlling the pressing load when the pressure bonding head presses the electronic component.
[0003]
As a method for controlling the pressing load, a pressing force acting between the electronic component and the crimping head when the crimping head is lowered is detected by a load detection means such as a load cell, and the detected load is a predetermined control target value. There is known a method for controlling the lowering operation of the crimping head so as to meet the above.
[0004]
[Problems to be solved by the invention]
However, although the above-described load detection method has an advantage that a wide load control range can be ensured, a load search that sequentially detects the load value in the process of lowering the crimping head is performed. Therefore, it is difficult to shorten the tact time of the crimping operation and an efficient crimping operation cannot be realized.
[0005]
Then, an object of this invention is to provide the electronic component crimping apparatus and the electronic component crimping method which can respond | correspond to a wide load range, and can perform an efficient crimping | compression-bonding operation | work.
[0006]
[Means for Solving the Problems]
The electronic component crimping apparatus according to claim 1, further comprising: a crimping head that presses the electronic component; an elevating unit on which the crimping head is detachably mounted; and an encoder that detects a height position of the crimping head. Elevating means for elevating the part, fluid pressure control means for controlling the fluid pressure, load detecting means for detecting a load acting on the crimping head, a load detection result of the load detecting means, or an encoder of the crimping head by the encoder A load detecting unit configured to control the elevating unit based on a detection result of a height position and to switch between loading and ignoring the load detection result by the control unit interposed between the load detecting unit and the control; and a signal disengaging means, as the pressure bonding head, with a pressing force generating means for generating a pressing force for pressing the electronic component by compression springs or the fluid pressure crimping In the case where a pressure-bonding head that does not include a head and a pressing force generation unit is selectively used and a pressure-bonding head that includes the pressing force generation unit is used, the control unit The load detection result is ignored.
[0007]
The claim 2 electronic component crimping apparatus according an electronic component crimping apparatus according to claim 1, pressure bonding head having the pressing force generating unit, the pressing force generating means for generating the pressing force of the different load ranges A first pressure-bonding head and a second pressure-bonding head.
[0008]
The electronic component crimping method according to claim 3 includes a crimping head that presses the electronic component, an elevating unit to which the crimping head is detachably mounted, and an encoder that detects a height position of the crimping head. Elevating means for elevating the part, fluid pressure control means for controlling the liquid pressure, load detecting means for detecting a load acting on the pressure bonding head, a load detection result of the load detection means or the pressure detection head of the pressure bonding head by the encoder an electronic component bonding method according to the electronic component bonding device and a control unit for controlling said lift means based on a detection result of the height position, the pressing force for pressing the electronic component by the compression spring or the fluid pressure A pressure-bonding head having a pressing force generating means and a pressure-bonding head not having a pressing force generating means are selectively used, and a pressure-bonding head having the pressing force generating means is used. The case ignore the control unit the load detection result, also in the case of using a compression bonding head is not provided with the pressing force generating unit is the control unit fetches a load signal of the load detecting means.
[0009]
Electronic components bonding method according to claim 4, wherein is an electronic component bonding method according to claim 3, wherein, in the crimp head with the pressing force generating unit, the pressing force generation for generating a pressing force of the different loads range using the first bonding head and a second crimping head having means to select択的.
[0010]
According to the present invention, by using a compression bonding head without a bonding head and the pressing force generating means having a pressing force generating means for generating a pressing force for pressing the electronic component by compression spring or fluid pressure selectively, A wide load range can be accommodated and an efficient crimping operation can be performed.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. 1 is a side view of an electronic component crimping apparatus according to an embodiment of the present invention, FIGS. 2, 3 and 4 are cross-sectional views of a crimping head of the electronic component crimping apparatus according to an embodiment of the present invention, and FIG. FIG. 6, FIG. 7, FIG. 8 are explanatory views of an electronic component crimping method according to an embodiment of the present invention.
[0012]
First, the structure of the electronic component crimping apparatus will be described with reference to FIG. In FIG. 1, a substrate holder 2 is provided on a moving plate 1 a of the movable table 1. A substrate 3 is placed on the substrate holder 2, and a supply unit 4 for electronic components 5 is disposed on a moving plate 1 a on the side of the substrate 3. By driving the movable table 1, the substrate 3 and the supply unit 4 move in a horizontal plane. An electronic component 5 is held by a crimping tool 6 above the movable table 1. The crimping tool 6 is mounted on a crimping head 7, and the crimping head 7 is further detachably mounted on the first lifting block 10 (lifting unit).
[0013]
A slider 11 is fixed to the back surface of the first lifting block 10, and the slider 11 is fitted to a vertical guide rail 12 disposed on the front surface of the first frame 13 so as to be slidable in the vertical direction. . Further, an inverted L-shaped projecting portion 14 is provided on the upper portion of the first lifting block 10. A load cell, which is a load detection means to be described later, abuts on the lower surface of the overhanging portion 14.
[0014]
A second lifting block 20 is provided above the first lifting block 10. A slider 21 is provided on the back surface of the second lifting block 20, and the slider 21 is fitted to a vertical guide rail 22 disposed on the front surface of the second frame 23 so as to be slidable in the vertical direction. . An inverted L-shaped projecting portion 24 is provided at the lower portion of the second lifting block 20. A load cell 26 is disposed on the upper surface of the overhang portion 24, and the load cell 26 is in contact with the lower surface of the overhang portion 14. A cylinder 25 is mounted downward on the lower surface of the second lifting block 20, and the rod of the cylinder 25 is in contact with the upper surface of the overhanging portion 24. A predetermined pressure of air is supplied to the cylinder 25 by a pressure source 34.
[0015]
A bracket 30 having a U-shaped cross section is fixed to the upper portion of the second frame 23. A motor 31 is disposed on the bracket 30, and the rotation shaft of the motor 31 is connected to a vertical feed screw 27. The feed screw 27 is screwed into a nut 28 built in the second lifting block 20. The second elevating block 20 moves up and down by causing the control unit 32 to rotate the motor 31 forward and backward.
[0016]
Then, when the second lifting block 20 moves up and down, the first lifting block 10 suspended on the second lifting block 20 is lifted and lowered via the load cell 26, whereby the crimping head 7 is lifted and lowered. That is, the motor 31, the feed screw 27, the nut 28, and the second elevating block 20 are elevating means for elevating and lowering the first elevating block 10 (elevating part) to which the crimping head 7 is attached. The motor 31 includes an encoder 31a, and a pulse signal from the encoder 31a is sent to the control unit 32. In the control of the motor 31 by the control unit 32, the height position of the crimping head 7 can be detected by counting the pulse signals.
[0017]
Therefore, in the pressure-bonding operation in which the pressure-bonding head 7 is lowered and the electronic component 5 held by the pressure-bonding tool 6 is pressed and pressure-bonded to the substrate, the above-mentioned lifting means is controlled by the controller 32 while detecting the height position of the pressure-bonding head 7. By controlling according to the above, the pressure-bonding head 7 can be lowered to a desired height position.
[0018]
Next, the crimping head 7 will be described. In the electronic component crimping apparatus according to the present embodiment, various types of crimping heads having mounting compatibility can be used depending on the size and characteristics of the electronic component to be crimped. First, with reference to FIG. 2, a pneumatic pressure bonding head provided with a pressing force generating means for pressing an electronic component with air pressure will be described. As shown in FIGS. 2A and 2B, here, two types of crimping heads 71 (first crimping heads) and crimping heads 72 (second crimping heads) corresponding to different pressing force ranges are used. Be able to.
[0019]
The crimping heads 71 and 72 are provided with tapered shanks 91 and 92 for detachably mounting on the first lifting block 10. Here, the taper shanks 91 and 92 have the same size and are compatible with the first lifting block 10. Head main body portions 81 and 82 having different sizes are coupled to the lower portions of the taper shanks 91 and 92.
[0020]
The head main body portions 81 and 82 are provided with circular cylinder chambers 81a and 82a, and pistons 81b and 82b are fitted in the cylinder chambers 81a and 82a. The crimping head 71 is used for electronic parts having a relatively small pressing load value required for crimping such as small parts, and the sizes of the cylinder chamber 81a and the piston 81b can cover these pressing load ranges. Is set to an appropriate size.
[0021]
On the other hand, the crimping head 72 is used for an electronic component having a large pressing load value required for crimping, and the cylinder chamber 82a and the piston 82b are sized so as to cover these load ranges. Set to Although the head main body portions 81 and 82 have different horizontal sizes in order to cover different pressing load ranges, the height direction dimensions are set to be the same in order to ensure mounting compatibility.
[0022]
Tool holders 81c and 82c provided below the head main body portions 81 and 82 are coupled to the lower surfaces of the pistons 81b and 82b. Crimping tools 61 and 62 are detachably attached to the tool holders 81c and 82c. The Air holes 81e and 82e are provided in the side surfaces of the cylinder chambers 81a and 82a. By supplying pressurized air from the air holes 81e and 82e into the cylinder chambers 81a and 82a, the pistons 81b and 82b are pressed downward. Is done. This pressing force is transmitted to the crimping tools 61 and 62 via the tool holders 81c and 82c coupled to the pistons 81b and 82b, and presses the electronic component in the crimping process.
[0023]
That is, the crimping heads 71 and 72 are each provided with a pressing force generating means for generating a pressing force for pressing the electronic component 5 by the fluid pressure of the pressurized air. The crimping head 72 has a load range different from that of the crimping head 71. A pressing force generating means for generating a pressing force is provided.
[0024]
Referring now to FIG. 3, a description will be given of a third compression bonding head 73 of the head Der rigid type without a pressing force generating unit I. The crimping head 73 has a structure in which a head main body 83 and a tool holder 83c are fixedly coupled to a lower part of a taper shank 93 similar to the taper shanks 91 and 92 shown in FIG. A crimping tool 63 is replaceably attached to the tool holder 83c. Since the pressure-bonding head 73 does not include a pressing force generating means, a load detection pressure-bonding method described later is used in the pressure-bonding operation.
[0025]
Referring now to FIG. 4, a description of a fourth spring built-in crimp head 74 with a pressing force generating means I bonding head der of. A head body 84 having substantially the same structure as the head body 82 is coupled to the lower portion of the taper shank 94. The head body 84 is provided with a circular cylinder chamber 84a, and a piston 84b is fitted in the cylinder chamber 84a. A compression spring 84d is coupled to the upper surface of the piston 84b, and the piston 84b is pressed against the bottom surface of the cylinder chamber 84a by the urging force F of the compression spring 84d. When the electronic component 5 is pressed against the substrate 3 in the crimping operation, the biasing force F becomes a crimping load. In the application using the pneumatic pressure bonding head shown in FIG. 2, the pressure bonding head 74 is used only for a target that allows a rougher pressure bonding accuracy.
[0026]
As described above, in the electronic component crimping apparatus shown in the present embodiment, as the crimping head 7, the first crimping head provided with the pressing force generating means by the air pressure, and the pressing force in the load range different from the first crimping head. A plurality of pressure-bonding heads including a second pressure-bonding head provided with a pressing force generating means for generating the pressure is selectively used.
[0027]
In FIG. 1 again, the crimping head 7 is connected to a pressure source 34 via an on / off valve 36 and an electropneumatic regulator 35. By controlling the on / off valve 36 and the electropneumatic regulator 35 by the control unit 32, air having a desired pressure is supplied to the crimping head 7. The controller 32 and the electropneumatic regulator 35 serve as fluid pressure control means for controlling the fluid pressure of the pressing force generating means provided in the crimping head 7. When a pneumatic pressure bonding head is not used as the pressure bonding head 7, the on / off valve 36 is closed.
[0028]
Here, the functions of the cylinder 25 and the load cell 26 will be described with reference to FIGS. FIG. 5A shows a state where the second lifting block 20 is raised, and FIG. 5B shows a state where the second lifting block 20 is lowered and the electronic component 5 is thermocompression bonded to the substrate 3. The balance of the power of each part is shown. The cylinder 25 is supplied with air of a predetermined pressure from the pressure source 34, and therefore the cylinder 25 presses the first lifting block 10 downward with a predetermined pressing force F0. In the state shown in FIG. 5A, the sum F0 + W of the pressing force F0 and the load W corresponding to the weight of the crimping head 7 and the like is balanced with the load f applied to the load cell 26. That is, in the state where the second lifting block 20 is in the raised position, the detected load value f0 of the load cell 26 is equal to the sum of the pressing force F0 of the cylinder 25 and the weight W of the crimping head 7.
[0029]
On the other hand, in the state shown in FIG. 5B, the crimping head 7 receives a reaction force F equal to the crimping load from the electronic component 5, and the aforementioned sum F0 + W is applied to the reaction force F of the crimping load and the load cell 26. It is balanced with the sum F + f of the load f to be applied. That is, the reaction force F of the crimping load acting on the crimping head 7 can be detected by the load cell 26 and is represented by F0 + W−f. In order to control the crimping load F, since F0 + W is a constant value, the control unit 32 monitors the detected load value f of the load cell 26 and controls the driving of the motor 31 to move the second lifting block 20 up and down. Can be controlled.
[0030]
That is, the load cell 26 serves as a load detection unit that detects a load acting on the crimping head 7, and the control unit 32 controls the lifting unit based on the load detection result of the load detection unit. Here, the load cell 26 is connected to the control unit 32 via a switch 33 as a load detection signal connecting / disconnecting means, and the control unit 32 operates the switch 33 to detect the load from the load cell 26 by the control unit 32. The signal can be connected and disconnected. The load detection signal connecting / disconnecting means may be hardware or software.
[0031]
The electronic component crimping apparatus is configured as described above. Next, an electronic component crimping method using the electronic component crimping apparatus will be described. Here, depending on the characteristics of the electronic component to be crimped, that is, the crimping method suitable for electronic components that require more precise pressing load control when crimping quality is more important, and the accuracy of the pressing load during crimping A crimping method suitable for an electronic component, which is not required so much and for which shortening of the tact time of the crimping operation is more important for the purpose of improving productivity, can be used properly by the method described below.
[0032]
First, a crimping method that places importance on the crimping quality will be described with reference to FIG. In this crimping method, the above-described rigid crimping head 73 is used as the crimping head 7. Then, in a pressure-bonding operation in which the pressure-bonding head 73 is lowered and the electronic component 5 is pressed against the substrate 3, a pressure load acting on the pressure-bonding head 73 is detected by the load cell 26, and the motor 31 is controlled by the control unit based on the load detection result. The electronic component 5 is pressure-bonded to the substrate 3 while being controlled by 32, and the pressing force required for the electronic component to be pressure-bonded is relatively small (for example, 150 gf to 1.5 kgf) and highly accurate pressure bonding. Used when load control is required.
[0033]
In FIG. 6, the switch 33 interposed between the load cell 26 and the control unit 32 is set to ON so that the control unit 32 can capture the load detection signal of the load cell 26. Therefore, in the process of lowering the first lifting block 10 and the second lifting block 20, the electronic component 5 is controlled by controlling the rotation of the motor 31 while detecting the reaction force of the load acting on the crimping head 73. The load pressed against the substrate 3 can always be held at a predetermined pressure bonding load. This crimping method has an advantage that the crimping load can be controlled with high accuracy, although the high-speed crimping is difficult because the load search is repeated in the crimping process.
[0034]
Next, a crimping method with an emphasis on productivity will be described with reference to FIGS. In this pressure bonding method, the above-described pneumatic pressure bonding heads 71 and 72 are used as the pressure bonding head 7 according to the required pressing load. In this pressure bonding method, in the pressure bonding operation in which the pressure bonding heads 71, 72 are moved down to press the electronic component 5 against the substrate 3, the pressure of the air supplied to the pressure bonding heads 71, 72 is controlled. 72. While the predetermined pressing force is applied to the electronic component 5 by 72, the elevating means is controlled by the control unit 32 to lower the crimping heads 71 and 72, and the necessary pressing force is covered by the above-described crimping method. It is used when larger than possible range (for example, 1.5 kgf to 30 kgf) and higher productivity is required.
[0035]
In FIG. 6, the switch 33 interposed between the load cell 26 and the control unit 32 is switched to OFF so that the control unit 32 does not take in the load detection signal of the load cell 26. That is, the load detection signal is ignored. In the process of lowering the first elevating block 10 and the second elevating block 20, the pneumatic pressure bonding head 72 holding the electronic component 5 is controlled on the substrate 3 by controlling the motor 31 by the control unit 32. It is lowered until it reaches a predetermined height position (mounting height).
[0036]
FIG. 7 shows a state of the pressure-bonding head 72 when the electronic component 5 is pressed against the substrate 3 in the pressure-bonding operation by the lowered position control pressure-bonding method. Here, the air pressure P supplied into the cylinder chamber 82 a is set in accordance with the pressing load required for crimping the electronic component 5. That is, in this case, in the cylinder chamber 82a, the piston 82b floats in a state where the reaction force of the pressing load from the electronic component 5 and the pressing force by the air pressure P are balanced. Accordingly, a pressing load corresponding to the preset air pressure P always acts on the electronic component 5.
[0037]
If the target electronic component is such that rough crimping load accuracy is allowed, the spring built-in crimping head 74 can be used as described above. Accordingly, there is an advantage that the crimping operation can be performed at a high speed, and air is not consumed for each crimping operation, and a low-cost mounting operation is realized.
[0038]
As described above, the electronic component crimping apparatus according to the present embodiment includes a plurality of pneumatic crimping heads having different pressing load ranges, a plurality of rigid crimping heads, and a spring built-in crimping head. The crimping head is used for a single crimping apparatus. Accordingly, various crimping methods including a load detection crimping method and a descending position control crimping method can be appropriately used according to characteristics such as a pressing load and load accuracy required for the electronic component to be crimped. . Therefore, it is possible to cope with a wide load range and perform an efficient crimping operation.
[0039]
【The invention's effect】
According to the present invention, by using a compression bonding head without a bonding head and the pressing force generating means having a pressing force generating means for generating a pressing force for pressing the electronic component by compression spring or fluid pressure selectively, A wide load range can be accommodated and an efficient crimping operation can be performed.
[Brief description of the drawings]
FIG. 1 is a side view of an electronic component crimping apparatus according to an embodiment of the present invention. FIG. 2 is a sectional view of a crimping head of an electronic component crimping apparatus according to an embodiment of the present invention. FIG. 4 is a sectional view of a crimping head of an electronic component crimping apparatus according to an embodiment of the present invention. FIG. 5 is a sectional view of an electronic component crimping apparatus according to an embodiment of the present invention. FIG. 6 is an explanatory diagram of an electronic component crimping method according to an embodiment of the present invention. FIG. 7 is an explanatory diagram of an electronic component crimping method according to an embodiment of the present invention. Explanatory drawing of electronic component crimping method of one embodiment [Explanation of symbols]
3 Substrate 5 Electronic Component 6 Crimping Tool 7 Crimping Head 10 First Lifting Block 20 Second Lifting Block 26 Load Cell 31 Motor 32 Control Unit 35 Electropneumatic Regulators 71 and 72 Crimping Head (Pneumatic Type)
73 Crimping head (rigid body type)
74 Crimp head (Built-in spring type)

Claims (4)

A pressure-bonding head that presses an electronic component, a lifting unit to which the pressure- bonding head is detachably mounted, a lifting unit that has an encoder that detects a height position of the pressure-bonding head, and lifts the lifting unit, and a fluid pressure. Based on a fluid pressure control means for controlling, a load detection means for detecting a load acting on the crimping head, a load detection result of the load detection means or a detection result of a height position of the crimping head by the encoder. And a pressure detection head for connecting and disconnecting the load detection result by the control unit between the load detection unit and the control. as, without a bonding head and the pressing force generating means having a pressing force generating means for generating a pressing force for pressing the electronic component by compression springs or the fluid pressure pressure When the head is selectively used and the pressure-bonding head provided with the pressing force generating means is used, the control unit ignores the load detection result by switching the load detection signal connecting / disconnecting means. Electronic component crimping device. The crimping head provided with the pressing force generating means includes a first pressing head and a second pressing head provided with pressing force generating means for generating pressing forces in different load ranges. Electronic component crimping device. A pressure-bonding head that presses an electronic component, a lifting part to which the pressure- bonding head is detachably mounted, a lifting / lowering unit that has an encoder that detects a height position of the pressure-bonding head, and lifts the lifting / lowering part; Based on a fluid pressure control means for controlling, a load detection means for detecting a load acting on the crimping head, a load detection result of the load detection means or a detection result of a height position of the crimping head by the encoder. a electronic component a crimping process according to the electronic component bonding device and a control unit for controlling the means, crimp with a pressing force generating means for generating a pressing force for pressing the electronic component by compression springs or the fluid pressure When a pressure-bonding head that does not include a head and a pressing force generation unit is selectively used and a pressure-bonding head that includes the pressing force generation unit is used, the controller detects the load detection result. Ignoring, also electronic components crimping method characterized in that said control unit fetches a load signal of the load detecting means in the case of using a compression bonding head is not provided with the pressing force generating unit. The first pressure bonding head and the second pressure bonding head each having a pressing force generation means for generating a pressing force in a different load range are selectively used as the pressure bonding head including the pressing force generation means. Item 4. The electronic component crimping method according to Item 3.

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