JP3628707B2 - 集積回路パッケージを冷却する装置 - Google Patents

集積回路パッケージを冷却する装置 Download PDF

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Publication number
JP3628707B2
JP3628707B2 JP51376497A JP51376497A JP3628707B2 JP 3628707 B2 JP3628707 B2 JP 3628707B2 JP 51376497 A JP51376497 A JP 51376497A JP 51376497 A JP51376497 A JP 51376497A JP 3628707 B2 JP3628707 B2 JP 3628707B2
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JP
Japan
Prior art keywords
pcb
heat
heat slug
integrated circuit
metal layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP51376497A
Other languages
English (en)
Japanese (ja)
Other versions
JPH11512880A (ja
JPH11512880A5 (enExample
Inventor
ワトソン，ジェフ・アール
ゴーシュ，マイケル・エヌ
ノベル，ジム・ヴィ
アスパンディアル，ライヨー・エフ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of JPH11512880A publication Critical patent/JPH11512880A/ja
Publication of JPH11512880A5 publication Critical patent/JPH11512880A5/ja
Application granted granted Critical
Publication of JP3628707B2 publication Critical patent/JP3628707B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP51376497A 1995-09-29 1996-09-30 集積回路パッケージを冷却する装置 Expired - Fee Related JP3628707B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/535,974 US5617294A (en) 1995-09-29 1995-09-29 Apparatus for removing heat from an integrated circuit package that is attached to a printed circuit board
US08/535,974 1995-09-29
PCT/US1996/015751 WO1997012504A1 (en) 1995-09-29 1996-09-30 Method for surface mounting a heatsink to a printed circuit board

Publications (3)

Publication Number Publication Date
JPH11512880A JPH11512880A (ja) 1999-11-02
JPH11512880A5 JPH11512880A5 (enExample) 2004-09-30
JP3628707B2 true JP3628707B2 (ja) 2005-03-16

Family

ID=24136586

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51376497A Expired - Fee Related JP3628707B2 (ja) 1995-09-29 1996-09-30 集積回路パッケージを冷却する装置

Country Status (6)

Country Link
US (2) US5617294A (enExample)
EP (1) EP0852897B1 (enExample)
JP (1) JP3628707B2 (enExample)
AU (1) AU7251896A (enExample)
DE (1) DE69615038T2 (enExample)
WO (1) WO1997012504A1 (enExample)

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US5972737A (en) * 1993-04-14 1999-10-26 Frank J. Polese Heat-dissipating package for microcircuit devices and process for manufacture
JP2844558B2 (ja) * 1995-06-29 1999-01-06 信越ポリマー株式会社 チップ状半導体素子装着用の配線回路基板およびその製造方法
US5825625A (en) * 1996-05-20 1998-10-20 Hewlett-Packard Company Heat conductive substrate mounted in PC board for transferring heat from IC to heat sink
US6046905A (en) 1996-09-30 2000-04-04 Intel Corporation Dual spring clip attachment mechanism for controlled pressure interface thermal solution on processor cartridges
EP0907307A1 (en) * 1997-10-03 1999-04-07 STMicroelectronics S.r.l. Heat sink for surface mount power packages
US5960535A (en) * 1997-10-28 1999-10-05 Hewlett-Packard Company Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink
US6043984A (en) 1998-07-06 2000-03-28 Intel Corporation Electrical assembly that includes a heat sink which is attached to a substrate by a clip
US6060777A (en) 1998-07-21 2000-05-09 Intel Corporation Underside heat slug for ball grid array packages
US6031727A (en) * 1998-10-26 2000-02-29 Micron Technology, Inc. Printed circuit board with integrated heat sink
US6201695B1 (en) 1998-10-26 2001-03-13 Micron Technology, Inc. Heat sink for chip stacking applications
US6067231A (en) * 1998-11-10 2000-05-23 Acer Peripherals, Inc. Heat-dissipating structure for an electrical device
US6173883B1 (en) * 1998-11-17 2001-01-16 Motorola, Inc. Method and apparatus for increasing heat transfer that is restricted in thermally isolated pockets of a medium
GB2345576A (en) * 1999-01-05 2000-07-12 Ericsson Telefon Ab L M Heat-sink of ICs and method of mounting to PCBs
US20040055152A1 (en) * 1999-01-05 2004-03-25 James Fraivillig Bonding of a multi-layer circuit to a heat sink
SE513786C2 (sv) 1999-03-09 2000-11-06 Ericsson Telefon Ab L M Metod för framställning av mönsterkort samt anordning för värmeavledning framställt enligt metoden
US6337228B1 (en) 1999-05-12 2002-01-08 Amkor Technology, Inc. Low-cost printed circuit board with integral heat sink for semiconductor package
SE516533C2 (sv) * 1999-06-30 2002-01-29 Ericsson Telefon Ab L M Mönsterkort med metallpluggar för bortledning av värme
US6888722B2 (en) * 1999-12-30 2005-05-03 Intel Corporation Thermal design for minimizing interface in a multi-site thermal contact condition
US6249434B1 (en) 2000-06-20 2001-06-19 Adc Telecommunications, Inc. Surface mounted conduction heat sink
US6445588B1 (en) 2001-01-02 2002-09-03 Motorola, Inc. Apparatus and method for securing a printed circuit board to a base plate
US6411516B1 (en) * 2001-06-15 2002-06-25 Hughes Electronics Corporation Copper slug pedestal for a printed circuit board
US6882762B2 (en) * 2001-09-27 2005-04-19 Intel Corporation Waveguide in a printed circuit board and method of forming the same
US6918437B2 (en) * 2002-03-21 2005-07-19 Delphi Technologies, Inc. Heatsink buffer configuration
JP4159861B2 (ja) * 2002-11-26 2008-10-01 新日本無線株式会社 プリント回路基板の放熱構造の製造方法
US7741566B2 (en) * 2003-05-07 2010-06-22 Merix Corporation Microelectronic substrates with thermally conductive pathways and methods of making same
EP1480269A1 (en) * 2003-05-13 2004-11-24 Agilent Technologies Inc Printed Circuit Board with improved cooling of electrical component
GB0413420D0 (en) * 2004-06-15 2004-07-21 Radstone Technology Plc Heat management in printed wiring boards
SE529673C2 (sv) * 2004-09-20 2007-10-16 Danaher Motion Stockholm Ab Kretsarrangemang för kylning av ytmonterade halvledare
CN101066008A (zh) * 2004-11-30 2007-10-31 Lm爱立信电话有限公司 改进了散热的印刷电路板组件
US7718927B2 (en) * 2005-03-15 2010-05-18 Medconx, Inc. Micro solder pot
DE102005049872B4 (de) * 2005-10-18 2010-09-23 Continental Automotive Gmbh IC-Bauelement mit Kühlanordnung
US20070289313A1 (en) * 2006-06-15 2007-12-20 Mohinder Singh Bhatti Thermosiphon with thermoelectrically enhanced spreader plate
DE102008016458A1 (de) * 2008-03-31 2009-10-01 Osram Gesellschaft mit beschränkter Haftung Leiterplatte
US7821117B2 (en) * 2008-04-16 2010-10-26 Freescale Semiconductor, Inc. Semiconductor package with mechanical stress isolation of semiconductor die subassembly
US7787249B2 (en) * 2009-02-03 2010-08-31 Honeywell International Inc. Systems and methods for printed board assembly isolated heat exchange
JP5800778B2 (ja) * 2011-11-25 2015-10-28 三菱電機株式会社 接合方法および半導体装置の製造方法
JP2014093414A (ja) * 2012-11-02 2014-05-19 Hitachi Automotive Systems Ltd 電子制御装置
US20140190727A1 (en) * 2013-01-10 2014-07-10 Starlite Led Usa Method of fabricating flexible metal core printed circuit board
US9763317B2 (en) * 2013-03-14 2017-09-12 Cisco Technology, Inc. Method and apparatus for providing a ground and a heat transfer interface on a printed circuit board
JP6141072B2 (ja) * 2013-04-02 2017-06-07 三菱電機株式会社 半導体装置の製造方法
TW201505532A (zh) * 2013-07-26 2015-02-01 Jitboundary United Production Inc 高散熱電路板組
EP3316292B1 (en) * 2015-06-26 2021-04-28 Kaneka Corporation Heat transfer structure and manufacturing method therefor
TWI578416B (zh) * 2015-09-18 2017-04-11 旭德科技股份有限公司 封裝載板及其製作方法
US10504813B2 (en) * 2016-09-30 2019-12-10 Astec International Limited Heat sink assemblies for surface mounted devices
US10269678B1 (en) 2017-12-05 2019-04-23 Nxp Usa, Inc. Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereof
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Also Published As

Publication number Publication date
EP0852897A4 (en) 1998-12-16
JPH11512880A (ja) 1999-11-02
US5779134A (en) 1998-07-14
US5617294A (en) 1997-04-01
DE69615038D1 (de) 2001-10-11
EP0852897B1 (en) 2001-09-05
EP0852897A1 (en) 1998-07-15
AU7251896A (en) 1997-04-17
WO1997012504A1 (en) 1997-04-03
DE69615038T2 (de) 2002-06-20

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