JP3614592B2 - Method for forming partition wall of display panel - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for forming partition walls of a display panel, and more specifically, a plasma provided with partition walls (ribs) for spatially separating pixels or maintaining a distance between a front plate and a back plate. The present invention relates to a method for forming partition walls of a display panel such as a display panel (PDP), a plasma addressing liquid crystal display panel, or a field emission display panel.
[0002]
[Prior art]
This type of thin flat display panel is used in various fields. Among them, the PDP is excellent in visibility and capable of high-speed display, and thus is suitable for high-definition display and is a display panel that has attracted attention in recent years.
[0003]
This PDP is a self-luminous display panel in which a pair of substrates on which electrodes are arranged in a matrix are arranged to face each other at a minute interval and a discharge space is formed inside by sealing the periphery.
[0004]
In such a matrix display type PDP, a partition wall having a height of about 100 to 200 μm is provided so as to partition the discharge space. For example, in a surface discharge type PDP suitable for color display using a phosphor, linear barrier ribs are provided at equal intervals along the display line direction. The arrangement interval of the partition walls is, for example, about 200 μm for a 21-inch size color PDP. The barrier ribs prevent discharge coupling between cells and crosstalk of color reproduction.
[0005]
As a conventional method for forming such a partition wall, a screen printing method, a sand blasting method, a liquid honing method, and the like are known.
The screen printing method is a method in which a partition wall pattern is formed by repeatedly printing a partition shape pattern ten or more times. This screen printing method has the advantage that there is no waste of materials and the production cost is low, but when you want to form a partition across a large screen like a large display exceeding 40 inches, When the pitch and width of the partition walls are narrow, the production accuracy, repeatability, and plate life of the screen plate become problems.
[0006]
The sand blasting method is a method in which minute cutting particles are placed in an air stream, collide with a partition wall material layer on which a masking pattern has been formed in advance, and a portion not covered with the masking pattern is cut to form a partition. This sandblasting method has a problem in that it is a wasteful partition wall material that is removed by cutting and a high cost due to a photolithography process, but it is excellent in that high manufacturing accuracy can be obtained as compared with the screen printing method.
[0007]
The liquid honing method is a method of cutting by spraying a liquid such as water. The process is almost the same as the above-described sandblasting method and has the same advantages as the sandblasting method.
[0008]
Among these various partition wall forming methods, when aiming at increasing the size or reducing the size and definition of a thin flat display panel, high accuracy is required, and therefore sand blasting or liquid honing is often used.
[0009]
Taking a color PDP as an example, an example of a conventional barrier rib forming method when the sandblast method is used will be described.
In order to form the barrier rib, first, a base layer, an address electrode, and an insulating layer are sequentially formed on the back plate, and a barrier rib material layer made of glass paste having a predetermined thickness is formed thereon, and the barrier rib material layer is formed on the barrier rib material layer. Then, a masking pattern having a partition shape is formed by photolithography. Next, a partition medium is formed by spraying a cutting medium from above with a sandblasting device and cutting a portion of the partition wall material layer that is not covered with the masking pattern, and then firing the partition layer to form a partition.
[0010]
On the other hand, in a field emission display panel or a monochromatic PDP with a rough dot pitch, it is common to arrange several hundred μm glass beads as spacers on both substrates in order to maintain the distance between the front plate and the back plate. is there. In principle, it is not always necessary to spatially separate each pixel, but it is better to use a plasma display that is equivalent to a partition wall. Therefore, partition walls may be formed even in such a display panel.
[0011]
[Problems to be solved by the invention]
The above sandblasting method is an effective method for forming a partition wall of a thin flat display panel, but has the following problems.
[0012]
FIG. 13 is an explanatory view showing a conventional partition wall forming method when the sand blasting method is used, FIG. 13 (a) is a plan view of a masking pattern, FIG. 13 (b) is a side view of a partition wall material layer in sand blasting, FIG. 13C is a side view of the partition wall layer after sandblasting, and FIG. 13D is a side view of the partition wall after firing.
In the following description, the partition wall material layer means a planar film such as a glass paste that is a partition wall material, the partition wall layer means that the planar film is cut by a sandblasting method, etc. It means what baked the partition layer.
[0013]
As shown in these drawings, in the prior art, first, a strip-shaped masking pattern as shown in FIG. 13A is first formed on the partition wall material layer, and a cutting medium is sprayed by the sandblast method to cover the masking pattern. Cut the unbroken part. When the sandblasting method is used, as shown in FIG. 13B, the portion 29a facing the outside of the partition formation range is side-etched (side cut), and the partition layer 29 is formed in a state of being removed. . As described above, the partition wall layer 29 after the sandblasting is deeply side-cut as shown in FIG.
[0014]
After that, the partition wall layer 29 is fired to form the partition walls. As shown in FIG. 13D, when the partition wall layer 29 is fired to form the partition walls 31, the partition wall material (rib material) is used. In the conventional strip-shaped barrier rib layer, the ribs are pulled in the longitudinal direction (arrow direction) due to the shrinkage of the rib material at the time of firing in the conventional band-shaped partition layer, and the side cut portion 29a causes reverse taper. The tip of the wall warps and protrudes beyond the original height of the bulkhead. The increase in height due to this warping is usually about 10 μm to 30 μm.
[0015]
For this reason, as shown in FIG. 14, when the front plate 11 and the back plate 21 are overlapped and assembled into a panel in a later step, a gap is generated between the front plate 11 and the partition wall 31. In the case of a PDP, because of this gap, so-called “discharge coupling” occurs in which the discharge partitioned by the barrier ribs affects the adjacent cells, resulting in erroneous discharge, resulting in a display different from the actual display. Leading to a decline.
[0016]
This problem occurs not only in the straight partition walls but also in the lattice partition walls and the mask protection dummy mask when the partition wall thickness is large and the shrinkage during firing cannot be ignored.
[0017]
The present invention was made in consideration of such circumstances, and prevents the front end portion of the partition wall layer from being warped during firing, whereby the front plate and the partition wall are overlapped when the front plate and the back plate are overlapped. The present invention provides a method for forming a partition wall of a display panel in which no gap is formed between them.
[0018]
[Means for Solving the Problems]
In the first partition wall forming method of the present invention, a partition wall material layer is formed on a substrate, a plurality of strip-shaped masking patterns are formed in parallel on the partition wall material layer, and a cutting medium is sprayed through the masking pattern. The partition wall material layer is cut to form a plurality of strip-shaped partition layers, and the partition walls are baked to form the partition walls, before the firing, in the vicinity of the longitudinal ends of the partition wall layers A partition forming method for a display panel, comprising a step of forming a notch perpendicular to the longitudinal direction of the partition layer on the upper surface of the portion.
[0019]
FIG. 1 is an explanatory view showing the principle of the first partition wall forming method of the present invention. FIG. 1 (a) is a side view of a partition wall layer after sandblasting, and FIG. 1 (b) is a side view of the partition wall after firing. FIG. 1C is a side view of the partition wall in a state where the front plate and the back plate are overlapped. The feature of the first partition wall forming method of the present invention is that, as shown in these drawings, before firing the partition wall layer 29, a notch 52 is formed on the upper surface in the vicinity of the end in the longitudinal direction of the partition wall layer 29. There is to do. When the partition wall layer 29 is baked to form the partition wall 31, the partition wall 31 contracts particularly in the longitudinal direction. By forming such a notch 52, the partition wall layer 29 is pulled in the longitudinal direction during firing. The force can be blocked, and the tip of the partition wall 31 can be prevented from warping. Therefore, as shown in FIG. 1C, when the front plate 11 and the back plate 21 are overlapped and assembled into a panel, no gap is generated between the front plate 11 and the partition wall 31. The notch 52 can be easily formed by providing a slit-like cut in the masking pattern.
[0020]
In the second partition wall forming method of the present invention, a partition wall material layer is formed on a substrate, a plurality of strip-shaped masking patterns are formed in parallel on the partition wall material layer, and a cutting medium is sprayed through the masking pattern. The partition wall material layer is cut to form a plurality of strip-like partition walls, and the partition walls are baked to form the partition walls. Is a partition wall forming method for a display panel, characterized in that a masking pattern meandering is used, thereby forming a partition wall layer having a meandering end portion in the longitudinal direction.
[0021]
2A and 2B are explanatory views showing the principle of the second partition wall forming method of the present invention. FIG. 2A is a plan view of the partition wall layer after sandblasting, and FIG. 2B is a plan view of the partition wall after firing. FIG. 2 (c) is a side view of the partition wall in a state where the front plate and the back plate are overlapped. As shown in these drawings, the second partition wall forming method of the present invention is characterized in that the partition wall layer 29 is formed by meandering the longitudinal end portion. When the partition wall layer 29 is baked to form the partition wall 31, the partition wall 31 is greatly contracted particularly in the longitudinal direction, but the meandering portion is extended to relieve the tensile stress in the longitudinal direction of the partition wall layer 29 during firing. And the tip of the partition wall 31 can be prevented from warping. Therefore, as shown in FIG. 2C, when the front plate 11 and the back plate 21 are overlapped and assembled into a panel, no gap is generated between the front plate 11 and the partition wall 31.
[0022]
According to the first partition wall forming method and the second partition wall forming method of the present invention as described above, by forming a notch in the upper surface of the partition wall layer in the vicinity of the end in the longitudinal direction, By wobbling the vicinity of the end of the direction, the end of the partition wall is prevented from warping due to shrinkage during firing, and a flat panel display with higher adhesion between the front plate and the partition wall than before is manufactured. Can do. The PDP produced based on the present invention has higher sealing performance in the direction straddling the barrier ribs than before, and can eliminate discharge coupling (crosstalk) between discharge cells defined by the barrier ribs.
[0023]
DETAILED DESCRIPTION OF THE INVENTION
In the present invention, as a substrate, a glass substrate in which an underlayer, an address electrode, and an insulating layer are previously formed, which is generally called a back plate in the field of color PDP, can be applied.
[0024]
Formation of the partition wall material layer on the substrate can be performed by a method such as screen printing or blade coating.
As the partition wall material used for the partition wall material layer, a paste formed by mixing an inorganic powder and an organic bonding agent (binder) can be used. For example, a glass paste can be given as a glass powder applied as an inorganic powder.
[0025]
The masking pattern is formed by so-called photolithography, in which a photoresist is applied on the partition wall material layer, or a photosensitive dry film is applied, and then the photoresist or the photosensitive dry film is exposed and developed using a mask. be able to.
[0026]
The partition material layer can be cut by a sand blast method or a liquid honing method. In the case of using the sand blasting method, a sand blasting apparatus is used to blow an abrasive as a cutting medium having a size of several tens of μm on an air flow, thereby cutting a portion of the partition wall material layer not covered with the masking pattern. .
[0027]
The partition wall layer can be fired by a method usually used in this field. The firing temperature may be a temperature corresponding to the material of the partition wall layer and the size of the partition wall layer. That is, for example, if glass paste is used as the material of the partition wall layer, the resin component in the glass paste is burned off, and at the same time, the glass powder in the glass paste is fired at a temperature at which the glass powder can be softened and fused together. For example, if a PDP partition layer of about 20 inches to 40 inches is fired using glass paste, the firing temperature is generally in the range of 500 to 600 ° C.
[0028]
In the present invention, the notch can be formed by providing a slit-like cut in the masking pattern.
After forming the notch, the tip may be removed from the notch and the portion may be tapered. That is, after the cutout portion is formed, the portion located on the end side in the longitudinal direction from the cutout portion is removed, thereby forming a taper portion having a hem extending near the end portion in the longitudinal direction of the partition wall layer. May be.
[0029]
As for the removal of the cutout portion, the cutout portion may be mechanically removed, or the size of the slit-like cutout of the masking pattern is appropriately set, and thereby the masking pattern is removed from above. When cutting the partition wall material layer by spraying a cutting medium on the substrate, it may be set such that a portion located on the end side in the longitudinal direction from the notch is automatically lifted off.
[0030]
In addition, the partition wall layer shrinks greatly in the longitudinal direction by firing, but also shrinks in the short side direction. Therefore, before firing the barrier rib layer, the upper surface of the portion near the edge in the short direction of the barrier rib layer located on the outermost side of the barrier rib layer arranged in parallel on the substrate is parallel to the longitudinal direction of the barrier rib layer. It is desirable to form two notches.
[0031]
In this case, after the second cutout portion is formed, the portion located on the short side end side of the cutout portion is removed, and thereby the outermost partition wall in the short side end portion vicinity. You may make it form the taper part which spreads in a part in a part.
[0032]
【Example】
Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings. However, this does not limit the present invention.
In this embodiment, an AC drive type surface discharge type PDP for color display will be described as an example of a thin flat display panel.
[0033]
FIG. 3 is an explanatory diagram showing the configuration of an AC drive type surface discharge type PDP for color display. Based on this figure, the method for forming the partition of the display panel of the present invention will be described.
As shown in this figure, first, a pair of display sustain electrodes X and Y are arranged for each matrix display line L on the inner surface of a front plate 11 made of glass. The sustain electrodes X and Y are composed of a transparent electrode 41 and a bus electrode 42 for preventing a voltage drop due to the electric resistance of the transparent electrode 41. The sustain electrodes X and Y are covered with a dielectric layer 17, and a protective film 18 of MgO is formed on the surface of the dielectric layer 17.
In the following description, when the front plate 11 is simply used, the sustain electrodes X and Y, the dielectric layer 17 and the protective film 18 are already formed.
[0034]
On the inner surface of the back plate 21 made of the other glass, the striped address electrodes A are disposed on the base layer 22, and the insulating layer 24 is formed thereon. On the insulating layer 24, barrier ribs 31 for partitioning address discharge cells are formed so as to sandwich each address electrode A. Red, blue, and green phosphor layers 28R, 28G, and 28B are separately applied to the grooves between the barrier ribs 31 so as to cover the barrier rib surfaces including the address electrodes A.
In the following description, when the back plate 21 is simply used, the base layer 22, the address electrode A, and the insulating layer 24 are already formed.
[0035]
The front plate 11 and the back plate 21 formed in this way are overlapped with each other and assembled into a panel, whereby the PDP 1 is manufactured. In the discharge space 30 between the front plate 11 and the back plate 21, a mixed gas of Ne + Xe is sealed.
[0036]
At the time of display, a region where the sustain electrodes X and Y intersect with the address electrode A is a matrix display region. In this case, one pixel (pixel) for display is composed of three sub-pixels arranged in the line L direction.
[0037]
The partition wall 31 divides the discharge space 30 into sub-pixels and keeps the interval between the discharge spaces 30 constant. The partition wall 31 cuts off the influence on adjacent cells during address discharge, and crosstalks light. To prevent.
[0038]
4 (a) to 4 (d) are explanatory views showing a method of forming a PDP partition wall using a sandblast method. As shown in these drawings, the partition walls are formed by the following steps.
[0039]
(A) Partition wall material layer forming step (see FIG. 4 (a))
First, the back plate 21 is prepared, and a partition wall material layer 51 having a predetermined thickness is formed on the back plate 21. This partition material layer 51 is a planar film. The partition wall material layer 51 can be formed on the substrate by a method such as a screen printing method, a blade coating method, or a green sheet method.
[0040]
In the screen printing method and the blade coating method, as a material for the partition layer, a paste obtained by mixing an inorganic powder and an organic bonding agent (binder) can be used. For example, a glass paste can be given as a glass powder applied as an inorganic powder.
In the green sheet method, a material (green sheet) in which an inorganic powder and an organic bonding agent are formed in a plastic sheet shape is attached to a substrate with a pressure roll, and preliminarily fired at 300 to 400 ° C. to remove organic components. This is a method of forming the partition wall material layer. The machinability is improved by removing organic components.
[0041]
(B) Pattern forming step (see FIG. 4B)
A photoresist is applied on the partition wall material layer 51, or a photosensitive dry film is applied, and a masking pattern 54 having a partition shape is formed by photolithography. The masking pattern 54 is a belt-like pattern when viewed in plan.
[0042]
(C) Cutting process (see FIG. 4 (c))
With a sandblasting device 70, a cutting medium (abrasive) having a size of several tens of μm is sprayed on an air flow, and a portion of the partition wall material layer 51 not covered with the masking pattern 54 is cut to form a partition wall layer.
(D) Firing step (see FIG. 4 (d))
The partition wall 31 is formed by firing at a high temperature of 500 to 600 ° C. to burn off the resin component in the partition wall layer (glass paste) and at the same time soften the glass powder in the glass paste and fuse them together.
[0043]
In such a method for forming partition walls of a display panel of the present invention, the first partition wall forming method and the second partition wall forming method of the present invention will be described in detail below.
5A and 5B are explanatory views showing a first partition wall forming method according to the present invention. FIG. 5A is a plan view of the partition wall layer after sandblasting, and FIG. 5B is a side view of the partition wall layer after sandblasting. And shows the AA cross section of FIG.
[0044]
As shown in these drawings, in the first partition wall forming method of the present invention, the notch portions 52 are provided on the upper surfaces of the end portions of the plurality of strip-shaped partition wall layers 29, respectively. Thereafter, the partition wall layer is fired in a firing step, and distortion due to shrinkage during the firing is absorbed by the notch portion 52 to prevent the end portion of the partition wall from being warped.
[0045]
This notch is formed as follows.
6A and 6B are explanatory views showing a method of forming a notch, FIG. 6A is a plan view of a masking pattern, FIG. 6B is a side view of a partition wall material layer in sandblasting, and FIG. FIG. 6D is a side view of the partition wall after firing, and FIG. 6D is a side view of the partition wall after firing.
[0046]
As shown in these drawings, as a method of providing the cutout portions 52 on the upper surfaces of the end portions of the partition wall layer 29, when forming the masking pattern 54, slit-like cuts 53 are formed at positions corresponding to the cutout portions 52. A masking pattern 54 containing is formed. That is, a slit-like cut 53 is provided at a position corresponding to the notch 52 of the masking pattern 54. After that, when the sandblasting is performed on the partition wall material layer 51, the slit-like cut 53 is slightly cut, and the notch 52 is formed in the partition wall layer 29. When the partition wall layer 29 is baked, the partition wall 31 is greatly contracted particularly in the longitudinal direction. However, by forming such a notch 52, the tensile force in the longitudinal direction of the partition wall layer 29 during firing can be blocked. Further, it is possible to prevent the tip portion of the partition wall 31 from warping.
In addition, as a method of providing the notch portion 52, the partition wall layer 29 may be mechanically notched after the cutting step.
[0047]
FIG. 7 is an explanatory view when the tip part is removed from the notch part, FIG. 7A is a side view of the partition wall layer after the sandblasting, and FIG. It is a side view of the partition layer which shows the state which removed the part.
[0048]
As shown in these drawings, after the formation of the notch 52, the portion located on the end side in the longitudinal direction from the notch 52, that is, the tip of the notch 52 is removed, whereby the partition layer A taper portion 55 that spreads at the bottom may be formed in the vicinity of the end portion in the longitudinal direction of 29, that is, in the tip portion of the partition wall layer 29. By providing the taper portion 55 at the tip portion of the partition wall layer 29, the tip portion of the partition wall does not warp even when contracted after firing.
[0049]
The taper portion 55 can be formed by mechanically removing the tip portion from the notch portion 52.
In the case of forming the taper portion 55 having the skirt broadened by removing the tip portion of the partition wall layer 29, the tip portion can be removed without the notch portion 52, but by providing the notch portion 52, the partition layer The tip portion can be easily separated without destroying 29.
[0050]
The tapered portion 55 may be formed by setting the size of the slit-shaped cut 53 of the masking pattern 54 so that the tip portion is naturally lifted off from the cutout portion 52.
[0051]
FIG. 8 is an explanatory view for lifting off the tip portion from the notch, FIG. 8 (a) is a plan view of a masking pattern, FIG. 8 (b) is a side view of a partition wall material layer in sandblasting, FIG. 8 (c) is a side view of the partition wall layer showing a state where the tip portion is lifted off from the notch, and FIG. 8 (d) is a side view of the partition wall layer after the sandblasting is completed.
[0052]
As shown in these drawings, in order to form the tapered portion 55 at the tip portion of the partition wall layer 29, the partition mask material 54 is provided with a slit-shaped cut 53 having an appropriate size in the vicinity of the end portion. Form on layer 51 and sandblast. When the side cut from the outside progresses by sandblasting and reaches the slit-like cut 53, the portion protruding into the air by the side cut is lifted off, and a tapered portion 55 is formed at the tip of the partition wall layer 29. The end has a forward taper.
[0053]
As described above, the taper portion 55 appropriately sets the size of the slit-like cut 53 of the masking pattern 54, whereby the tip portion is automatically lifted off from the notch portion 52 during sandblasting. In this way, it can be formed.
[0054]
FIG. 9 is an explanatory view showing a state in which the front plate and the back plate are overlapped through the partition obtained by firing the partition layer, and FIG. 9A is a side view of the partition after firing, FIG. b) is a side view of the partition wall in a state where the front plate and the back plate are overlapped.
[0055]
As shown in these figures, when the taper portion 55 having a skirt spread is formed at the tip end portion of the partition wall layer 29, the tip end portion of the partition wall 31 does not warp even when the partition wall layer 29 is baked. When the face plate 11 and the back plate 21 are overlapped, there is no gap between the front plate 11 and the partition wall 31.
[0056]
10A and 10B are explanatory views showing a method for protecting the end portion of the partition wall layer by the notch portion. FIG. 10A is a plan view of the partition wall layer with the notch portion formed, and FIG. It is a side view of the partition layer in the state where a notch was formed.
[0057]
As shown in these drawings, a protective partition layer 58 is provided for protecting the end portions of the plurality of strip-shaped partition layers, and a protective partition layer notch 59 is formed on the outer upper surface of the protective partition layer 58. Is provided. In addition, the outer partition wall layer 60 positioned on the outermost side of the partition wall layers arranged in parallel on the substrate is formed wider than the other partition wall layers 29. Then, a second notch 61 for the outer partition wall layer is formed in parallel with the longitudinal direction of the outer partition wall layer 60 on the upper surface of the outer partition wall layer 60 in the vicinity of the end in the short direction. That is, the notch 61 is provided on the outer upper surface of the outer partition layer 60. The notches 59 and 61 can be formed by providing slit-like cuts 53 in the masking pattern.
The notches 59 and 61 can absorb distortion due to shrinkage during firing and prevent the end from warping.
[0058]
11A and 11B are explanatory views showing a method of protecting the end portion of the partition wall layer by using the tapered portion. FIG. 11A is a plan view of the partition layer in a state where the tapered portion is formed, and FIG. It is a side view of the partition layer of the formed state.
[0059]
As shown in these drawings, a protective partition layer 58 is provided for protecting the end portions of the plurality of strip-shaped partition layers, and a protective partition layer taper portion 62 is provided on the outer upper surface of the protective partition layer 58. Provide. In addition, the outer partition wall layer 60 positioned on the outermost side of the partition wall layers arranged in parallel on the substrate is formed wider than the other partition wall layers 29. Then, a taper portion 63 for the outer partition wall layer is formed in parallel with the longitudinal direction of the outer partition wall layer 60 on the upper surface of the outer partition wall layer 60 in the vicinity of the end in the short direction. That is, the tapered portion 63 is provided on the outer upper surface of the outer partition wall layer 60.
[0060]
This is because, after forming the above-mentioned cutout portion 59 and the second cutout portion 61 for the protective partition layer, the portions located on the end side in the short side direction from the cutout portions 59 and 61 are respectively removed. As a result, tapered portions 62 and 63 having hems are formed in the vicinity of the end portion in the short direction of the protective partition wall layer 58 and in the vicinity of the end portion in the short direction of the outer partition wall layer 60, respectively.
[0061]
The tapered portions 62 and 63 may be mechanically removed from the cutout portion 59 and the tip portion of the cutout portion 61, and the size of the slit-like cut 53 of the masking pattern 54 may be reduced from that of the cutout portion 59. You may make it remove by setting so that the front-end | tip part of the notch part 61 may be lifted off automatically.
The taper portions 62 and 63 can absorb distortion due to shrinkage during firing and prevent the end portions of the partition walls from warping.
[0062]
12A and 12B are explanatory views showing a second partition wall forming method of the present invention. FIG. 12A is a plan view of a masking pattern, and FIG. 12B is a plan view of the partition walls after firing.
As shown in these drawings, in this partition wall forming method, a partition wall material layer for forming the partition wall 31 is formed on the entire surface on a substrate, and a strip-shaped mask corresponding to the partition wall layer is formed on the partition wall material layer. When the pattern 54 is formed, as shown in FIG. 12A, a masking pattern 54 in which the portion in the vicinity of the end in the longitudinal direction of the partition wall meanders is formed, whereby the portion in the vicinity of the end in the longitudinal direction meanders. The partition layers are formed, and these partition layers are baked at a high temperature of 500 to 600 ° C., and the resin component in the partition layer (glass paste) is burned off, and at the same time, the glass powder in the glass paste is softened and melted mutually. By partitioning, the partition wall 31 is formed.
In this way, the meandering portion is provided at the end portion of the strip-like partition wall layer, the stress due to the shrinkage after firing is relaxed by the loosening of the meandering portion, and the end portion of the partition wall 31 is prevented from warping.
[0063]
【The invention's effect】
As described above, according to the present invention, before firing the partition wall layer, a notch that is orthogonal to the longitudinal direction of the partition wall layer is formed on the upper surface in the vicinity of the longitudinal end of the partition wall layer. Therefore, it is possible to prevent the portion undercut by sandblasting from warping during firing. As a result, a gap generated when the front plate and the back plate are overlapped can be eliminated, and deterioration of display quality of the thin flat display panel can be prevented.
[Brief description of the drawings]
FIG. 1 is an explanatory diagram showing the principle of a first partition forming method of the present invention.
FIG. 2 is an explanatory view showing the principle of a second partition forming method of the present invention.
FIG. 3 is an explanatory diagram showing a configuration of an AC drive type surface discharge type PDP;
FIG. 4 is an explanatory view showing a method for forming a PDP partition wall using a sandblast method.
FIG. 5 is an explanatory view showing a first partition wall forming method of the present invention.
FIG. 6 is an explanatory view showing a method for forming a notch.
FIG. 7 is an explanatory diagram in the case where the tip portion is removed from the notch portion.
FIG. 8 is an explanatory diagram for lifting off a tip portion from a notch.
FIG. 9 is an explanatory view showing a state in which a partition layer is fired and a front plate and a back plate are superposed.
FIG. 10 is an explanatory view showing a method for protecting the end portion of the partition wall layer by the notch portion.
FIG. 11 is an explanatory view showing a method of protecting the end portion of the partition wall layer by using a tapered portion.
FIG. 12 is an explanatory view showing a second partition wall forming method of the present invention.
FIG. 13 is an explanatory view showing a conventional partition wall forming method when the sandblast method is used.
FIG. 14 is an explanatory view showing a conventional panel formation state when a partition wall is formed using a sand blast method.
[Explanation of symbols]
1 PDP
11 Front plate
17 Dielectric layer
18 Protective film
21 Back plate
22 Underlayer
24 Insulating layer
28R, 28G, 28B phosphor layer
29 Bulkhead layer
30 Discharge space
31 Bulkhead
41 Transparent electrode
42 bus electrodes
51 Bulkhead material layer
52 Notch
53 slit-shaped cut
54 Masking Pattern
55 Taper
58 Protective barrier layer
59 Notch for protective barrier layer
60 Outer partition layer
61 Second notch for outer partition layer
62 Tapered part for protective partition layer
63 Tapered portion for outer partition wall layer
70 Sandblasting equipment
A Address electrode
L line
X, Y sustain electrode

Claims (8)

A partition wall material layer is formed on the substrate, a partition wall forming masking pattern is formed on the partition wall material layer, and the partition wall material layer is cut by blowing a cutting medium through the masking pattern to form the partition wall layer. And a method of firing the partition layer to form the partition,
A method for forming a partition wall of a display panel, comprising a step of forming a notch portion in the width direction of the partition wall layer on the upper surface in the vicinity of the end of the partition wall layer before firing. 2. The method for forming a partition wall of a display panel according to claim 1, wherein the notch is formed by providing a slit-like cut in the masking pattern. 2. The taper portion having a hem extending in the vicinity of the end portion of the partition wall layer is formed by removing a portion located on an edge side of the notch portion after the notch portion is formed. Partition wall forming method for display panels. 4. The method for forming a partition wall of a display panel according to claim 3, wherein the tapered portion is formed by mechanically removing a portion located on the edge side of the notch portion. The taper portion is set so that the size of the slit-shaped cut of the masking pattern is automatically lifted off when the partition wall material layer is cut at a portion positioned on the edge side in the longitudinal direction from the notch portion. 4. The method for forming a partition wall of a display panel according to claim 3, wherein the partition wall is formed by: A partition wall material layer is formed on the substrate, a partition wall forming masking pattern is formed on the partition wall material layer, and the partition wall material layer is cut by blowing a cutting medium through the masking pattern to form the partition wall layer. And a method of firing the partition layer to form the partition,
Before the firing, a step of forming a first notch in the width direction of the partition wall layer on the upper surface in the vicinity of the end of the partition wall layer, and the partition wall layer positioned on the outermost side of the partition wall layer formed in parallel Forming a second cutout portion parallel to the longitudinal direction of the partition wall on the upper surface of the vicinity of the end portion in the short direction of the display panel. After the formation of the second notch, the portion positioned on the end side in the shorter direction than the notch is removed, so that the skirt is formed near the end portion in the short direction of the partition wall layer located on the outermost side. 7. The method for forming a partition wall of a display panel according to claim 6, wherein a taper portion having a spread is formed. A partition wall material layer is formed on the substrate, a plurality of strip-shaped masking patterns are formed in parallel on the partition wall material layer, and a plurality of cutting media are blown through the masking pattern to cut the partition wall material layer. A method of forming a partition wall by forming a strip-shaped partition layer and firing the partition layer,
As the masking pattern, a masking pattern in which a portion in the vicinity of the end in the longitudinal direction of the partition is meandered, thereby forming a partition layer in which the portion in the vicinity of the end in the longitudinal direction is meandered is formed. Method.

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